Quectel Smart LTE Module Series Supplement

SC650T Hardware
Design
Smart LTE Module Series
Rev: SC650T_Hardware_Design_V1.1
Date: 2019-03-01
Status: Preliminary
www.quectel.com

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About the Document
History
Revision
Date
Author
Description
1.0
2019-02-26
Arsene
Initial

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Contents
About the Document................................................................................................................................ 2
Contents.................................................................................................................................................... 3
Table Index ............................................................................................................................................... 6
Figure Index.............................................................................................................................................. 8
1Introduction..................................................................................................................................... 13
1.1. Safety Information ..................................................................................................................14
2Product Concept ............................................................................................................................. 15
2.1. General Description................................................................................................................15
2.2. Key Features..........................................................................................................................16
2.3. Evaluation Board.................................................................................................................... 19
3Application Interfaces..................................................................................................................... 20
3.1. General Description................................................................................................................20
3.2. Pin Assignment....................................................................................................................... 21
3.3. Pin Description .......................................................................................................................22
3.4. Power Supply.........................................................................................................................39
3.4.1. Power Supply Pins.......................................................................................................39
3.4.2. Decrease Voltage Drop................................................................................................39
3.4.3. Reference Design for Power Supply............................................................................40
3.5. Turn on and off Scenarios ......................................................................................................41
3.5.1. Turn on Module Using the PWRKEY........................................................................... 41
3.5.2. Turn off Module............................................................................................................43
3.6. VRTC Interface....................................................................................................................... 43
3.7. Power Output ......................................................................................................................... 44
3.8. Battery Charge and Management .......................................................................................... 45
3.9. USB Interface.........................................................................................................................47
3.10. UART Interfaces..................................................................................................................... 49
3.11. (U)SIM Interfaces ................................................................................................................... 51
3.12. SD Card Interface...................................................................................................................53
3.13. GPIO Interfaces...................................................................................................................... 55
3.14. I2C Interfaces.........................................................................................................................59
3.15. I2S Interface...........................................................................................................................59
3.16. SPI Interfaces......................................................................................................................... 60
3.17. ADC Interfaces.......................................................................................................................61
3.18. Vibrator Drive Interface...........................................................................................................61
3.19. LCM Interfaces.......................................................................................................................62
3.20. Touch Panel Interfaces...........................................................................................................66
3.21. Camera Interfaces..................................................................................................................67
3.21.1. Design Considerations................................................................................................. 71

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3.21.2. Flashlight Interfaces.....................................................................................................73
3.22. Sensor Interfaces ...................................................................................................................74
3.23. Audio Interfaces ..................................................................................................................... 74
3.23.1. Reference Circuit Design for Microphone Interfaces ...................................................76
3.23.2. Reference Circuit Design for Earpiece Interface.......................................................... 77
3.23.3. Reference Circuit Design for Headphone Interface .....................................................78
3.23.4. Reference Circuit Design for Loudspeaker Interface................................................... 78
3.23.5. Audio Interfaces Design Considerations......................................................................78
3.24. Emergency Download Interface .............................................................................................79
3.25. LED Driver Interfaces.............................................................................................................79
4Wi-Fi and BT.................................................................................................................................... 81
4.1. Wi-Fi Overview....................................................................................................................... 81
4.1.1. Wi-Fi Performance.......................................................................................................81
4.2. BT Overview...........................................................................................................................83
4.2.1. BT Performance........................................................................................................... 84
5GNSS................................................................................................................................................ 85
5.1. GNSS Performance................................................................................................................ 85
5.2. GNSS RF Design Guidelines .................................................................................................86
6Antenna Interfaces.......................................................................................................................... 87
6.1. Main/Rx-diversity Antenna Interfaces.....................................................................................87
6.1.1. Main and Rx-diversity Antenna Interfaces Reference Design......................................88
6.1.2. Reference Design of RF Layout................................................................................... 89
6.2. Wi-Fi/BTAntenna Interface .................................................................................................... 91
6.3. GNSS Antenna Interface........................................................................................................91
6.3.1. Recommended Circuit for Passive Antenna ................................................................ 92
6.3.2. Recommended Circuit for Active Antenna ................................................................... 92
6.4. Antenna Installation................................................................................................................93
6.4.1. Antenna Requirements................................................................................................93
6.4.2. Recommended RF Connector for Antenna Installation................................................94
7Electrical, Reliability and Radio Characteristics .......................................................................... 96
7.1. Absolute Maximum Ratings.................................................................................................... 96
7.2. Power Supply Ratings............................................................................................................96
7.3. Operation and Storage Temperatures.....................................................................................97
7.4. Current Consumption .............................................................................................................97
7.5. RF Output Power....................................................................................................................99
7.6. RF Receiving Sensitivity....................................................................................................... 100
7.7. Electrostatic Discharge......................................................................................................... 101
8Mechanical Dimensions................................................................................................................ 102
8.1. Mechanical Dimensions of the Module................................................................................. 102
8.2. Recommended Footprint......................................................................................................104
8.3. Top and Bottom View of the Module..................................................................................... 105

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9Storage, Manufacturing and Packaging...................................................................................... 106
9.1. Storage................................................................................................................................. 106
9.2. Manufacturing and Soldering................................................................................................ 107
9.3. Packaging............................................................................................................................. 108
10 Appendix A References................................................................................................................ 110

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Table Index
TABLE 1: SC650T-NA FREQUENCY BANDS .................................................................................................. 15
TABLE 2: SC650T-EM FREQUENCY BANDS.................................................................................................. 15
TABLE 3: SC650T KEY FEATURES................................................................................................................. 16
TABLE 4: I/O PARAMETERS DEFINITION....................................................................................................... 22
TABLE 5: PIN DESCRIPTION........................................................................................................................... 22
TABLE 6: POWER DESCRIPTION................................................................................................................... 44
TABLE 7: PIN DEFINITION OF CHARGING INTERFACE............................................................................... 45
TABLE 8: PIN DEFINITION OF USB INTERFACE........................................................................................... 47
TABLE 9: USB TRACE LENGTH INSIDE THE MODULE................................................................................. 49
TABLE 10: PIN DEFINITION OF UART INTERFACES..................................................................................... 49
TABLE 11: PIN DEFINITION OF (U)SIM INTERFACES................................................................................... 51
TABLE 12: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 54
TABLE 13: SD CARD SIGNAL TRACE LENGTH INSIDE THE MODULE........................................................ 55
TABLE 14: PIN DEFINITION OF GPIO INTERFACES..................................................................................... 55
TABLE 15: PIN DEFINITION OF I2C INTERFACES......................................................................................... 59
TABLE 16: PIN DEFINITION OF I2S INTERFACE ........................................................................................... 60
TABLE 17: PIN DEFINITION OF SPI INTERFACES ........................................................................................ 60
TABLE 18: PIN DEFINITION OF ADC INTERFACES....................................................................................... 61
TABLE 19: PIN DEFINITION OF VIBRATOR DRIVE INTERFACE .................................................................. 61
TABLE 20: PIN DEFINITION OF LCM INTERFACES....................................................................................... 62
TABLE 21: PIN DEFINITION OF TOUCH PANEL INTERFACES..................................................................... 66
TABLE 22: PIN DEFINITION OF CAMERA INTERFACES............................................................................... 67
TABLE 23: MIPI TRACE LENGTH INSIDE THE MODULE............................................................................... 71
TABLE 24: PIN DEFINITION OF FLASHLIGHT INTERFACES........................................................................ 73
TABLE 25: PIN DEFINITION OF SENSOR INTERFACES............................................................................... 74
TABLE 26: PIN DEFINITION OF AUDIO INTERFACES................................................................................... 74
TABLE 27: PIN DEFINITION OF LED DRIVER INTERFACES......................................................................... 80
TABLE 28: WI-FI TRANSMITTING PERFORMANCE....................................................................................... 81
TABLE 29: WI-FI RECEIVING PERFORMANCE.............................................................................................. 82
TABLE 30: BT DATA RATE AND VERSIONS.................................................................................................... 84
TABLE 31: BT TRANSMITTING AND RECEIVING PERFORMANCE ............................................................. 84
TABLE 32: GNSS PERFORMANCE................................................................................................................. 85
TABLE 33: PIN DEFINITION OF MAIN/RX-DIVERSITYANTENNAINTERFACES......................................... 87
TABLE 34: SC650T-NA MODULE OPERATING FREQUENCIES.................................................................... 87
TABLE 35: SC650T-EM MODULE OPERATING FREQUENCIES................................................................... 88
TABLE 36: PIN DEFINITION OF WI-FI/BTANTENNA INTERFACE ................................................................ 91
TABLE 37: WI-FI/BT FREQUENCY................................................................................................................... 91
TABLE 38: PIN DEFINITION OF GNSS ANTENNA.......................................................................................... 92
TABLE 39: GNSS FREQUENCY....................................................................................................................... 92
TABLE 40: ANTENNA REQUIREMENTS.......................................................................................................... 93
TABLE 41: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 96

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TABLE 42: SC650T MODULE POWER SUPPLY RATINGS ............................................................................ 96
TABLE 43: OPERATION AND STORAGE TEMPERATURES.......................................................................... 97
TABLE 44: SC650T-NA CURRENT CONSUMPTION....................................................................................... 98
TABLE 45: SC650T-EM CURRENT CONSUMPTION...................................................................................... 98
TABLE 46: SC650T-NA RF OUTPUT POWER................................................................................................. 99
TABLE 47: SC650T-EM RF OUTPUT POWER................................................................................................. 99
TABLE 48: SC650T-NA RF RECEIVING SENSITIVITY X`............................................................................. 100
TABLE 49: SC650T-EM RF RECEIVING SENSITIVITY................................................................................. 100
TABLE 50: ESD CHARACTERISTICS (TEMPERATURE: 25°C , HUMIDITY: 45%)....................................... 101
TABLE 51: RECOMMENDED THERMAL PROFILE PARAMETERS............................................................. 107
TABLE 52: REEL PACKAGING....................................................................................................................... 109
TABLE 53: RELATED DOCUMENTS...............................................................................................................110
TABLE 54: TERMS AND ABBREVIATIONS.....................................................................................................110

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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 18
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 21
FIGURE 3: VOLTAGE DROP SAMPLE............................................................................................................. 39
FIGURE 4: STAR STRUCTURE OF POWER SUPPLY.................................................................................... 40
FIGURE 5: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 40
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT................................................................... 41
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 42
FIGURE 8: TIMING OF TURNING ON MODULE............................................................................................. 42
FIGURE 9: TIMING OF TURNING OFF MODULE ........................................................................................... 43
FIGURE 10: RTC POWERED BY COIN CELL................................................................................................. 43
FIGURE 11: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT................................................... 46
FIGURE 12: USB 2.0 INTERFACE REFERENCE DESIGN............................................................................. 48
FIGURE 13: USB TYPE-C INTERFACE REFERENCE DESIGN..................................................................... 48
FIGURE 14: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART5) ............................... 50
FIGURE 15: RS232 LEVEL MATCH CIRCUIT (FOR UART5).......................................................................... 51
FIGURE 16: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 52
FIGURE 17: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 53
FIGURE 18: REFERENCE CIRCUIT FOR SD CARD INTERFACE................................................................. 54
FIGURE 19: REFERENCE CIRCUIT FOR VIBRATOR CONNECTION........................................................... 62
FIGURE 20: REFERENCE CIRCUIT DESIGN FOR LCM0 INTERFACE......................................................... 64
FIGURE 21: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE......................................................... 65
FIGURE 22: REFERENCE DESIGN OF LCM EXTERNAL BACKLIGHT DRIVING CIRCUIT......................... 65
FIGURE 23: REFERENCE CIRCUIT DESIGN FOR TOUCH PANEL INTERFACES....................................... 67
FIGURE 24: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERAAPPLICATIONS.................................... 70
FIGURE 25: REFERENCE CIRCUIT DESIGN FOR FLASHLIGHT INTERFACES.......................................... 73
FIGURE 26: REFERENCE CIRCUIT DESIGN FOR ANALOG ECM-TYPE MICROPHONE........................... 76
FIGURE 27: REFERENCE CIRCUIT DESIGN FOR MEMS-TYPE MICROPHONE........................................ 76
FIGURE 28:REFERENCE CIRCUIT DESIGN FOR DIGITAL MICROPHONE................................................. 77
FIGURE 29: REFERENCE CIRCUIT DESIGN FOR EARPIECE INTERFACE................................................ 77
FIGURE 30: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE ........................................... 78
FIGURE 31: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE....................................... 78
FIGURE 32: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE..................... 79
FIGURE 33: REFERENCE CIRCUIT DESIGN FOR LED INTERFACES......................................................... 80
FIGURE 34: REFERENCE CIRCUIT DESIGN FOR MAIN AND RX-DIVERSITY ANTENNA INTERFACES.. 89
FIGURE 35: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB...................................................................... 89
FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ONA 2-LAYER PCB.................................................. 89
FIGURE 37: COPLANAR WAVEGUIDE LINE DESIGN ONA 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND).................................................................................................................................................. 90
FIGURE 38: COPLANAR WAVEGUIDE LINE DESIGN ONA 4-LAYER PCB (LAYER 4 AS REFERENCE

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GROUND).................................................................................................................................................. 90
FIGURE 39: REFERENCE CIRCUIT DESIGN FOR WI-FI/BTANTENNA INTERFACE.................................. 91
FIGURE 40: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA........................................... 92
FIGURE 41: REFERENCE CIRCUIT DESIGN FOR GNSS ACTIVE ANTENNA ............................................. 93
FIGURE 42: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)................................................ 94
FIGURE 43: MECHANICALS OF U.FL-LP CONNECTORS............................................................................. 95
FIGURE 44: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM)........................................................... 95
FIGURE 45: MODULE TOPAND SIDE DIMENSIONS................................................................................... 102
FIGURE 46: MODULE BOTTOM DIMENSIONS (TOP VIEW)....................................................................... 103
FIGURE 47: RECOMMENDED FOOTPRINT (TOP VIEW)............................................................................ 104
FIGURE 48: TOP VIEW OF THE MODULE.................................................................................................... 105
FIGURE 49: BOTTOM VIEW OF THE MODULE............................................................................................ 105
FIGURE 50: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE.............................................. 107
FIGURE 51: TAPE DIMENSIONS................................................................................................................... 108
FIGURE 52: REEL DIMENSIONS................................................................................................................... 109

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OEM/Integrators Installation Manual
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B,
the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter
module(s) are installed and operating. The modules should be transmitting and the evaluation should
confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band
emissions). The host manufacturer must verify that there are no additional unintentional emissions other
than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The
Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on
the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a
second label must be placed on the outside of the final device that contains the following text:
Contains FCC ID: XMR2019SC650TNA ”
“Contains IC: 10224A-19SC650TNA
The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC
ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can

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be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
Industry Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following
two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired operation
of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement."
The device could automatically discontinue transmission in case of absence of information to transmit, or
operational failure. Note that this is not intended to prohibit transmission of control or signaling information
or the use of repetitive codes where required by the technology.
The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for
harmful interference to co-channel mobile satellite systems; The maximum antenna gain permitted for
devices in the bands 5250–5350 MHz and 5470–5725 MHz shall comply with the e.i.r.p. limit; and The
maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p.
limits specified for point-to-point and non point-to-point operation as appropriate.
L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations à
transmettre ou de panne opérationnelle. Notez que ceci n'est pas destiné à interdire la transmission
d'informations de contrôle ou de signalisation ou l'utilisation de codes répétitifs lorsque cela est requis par
la technologie.
Le dispositif utilisédans la bande 5150-5250 MHz est réservéàune utilisation en intérieur afin de réduire
le risque de brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal; Le gain
d'antenne maximal autorisépour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725 MHz doit
être conforme àla norme e.r.p. limite; et Le gain d'antenne maximal autorisé pour les appareils de la
bande 5725-5825 MHz doit être conforme àla norme e.i.r.p. les limites spécifiées pour un fonctionnement

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point àpoint et non point àpoint, selon le cas
CAN ICES-3(B)/ NMB-3(B)
Radiation Exposure Statement
This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm between the radiator &
your body.
This radio transmitter [10224A-19SC650TNA] has been approved by Innovation, Science and Economic
Development Canada to operate with the antenna types listed below, with the maximum permissible gain
indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated
for any type listed are strictly prohibited for use with this device.
Frequency Bands
Antenna type
Maximun Gain（dBi）
2.4G WIFI/BT
Dipole
5.38
5G WIFI
Dipole
5.05
LTE B5
Dipole
2.53
LTE B26
Dipole
3.19
LTE B2/25
Dipole
1.59
LTE B14
Dipole
4.45
LTE B4/66
Dipole
2
LTE B7
Dipole
3
LTE B12
Dipole
3.95
LTE B13
Dipole
4.45

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1Introduction
This document defines the SC650T module and describes its air interface and hardware interface which
are connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details as well as other related information of SC650T module. Associated with application
note and user guide, customers can use SC650T module to design and set up mobile applications easily.

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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating SC650T module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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2Product Concept
2.1. General Description
SC650T is a series of Smart LTE module based on Qualcomm platform and Android operating system,
and provides industrial grade performance. Its general features are listed below:
Support worldwide LTE-FDD
Support short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and BT4.2 LE standards
Integrate GPS/GLONASS/BeiDou satellite positioning systems
Support multiple audio and video codecs
Built-in high performance AdrenoTM 506 graphics processing unit
Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces
SC650T includes models such as SC650T-NA and SC650T-EM.
The following table shows the supported frequency bands of SC650T.
Table 1: SC650T-NA Frequency Bands
Type
Frequency Bands
LTE-FDD
B2/B4/B5/B7/B12/B13/B14/B25/B26/B66
Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT4.2 LE
2402MHz~2480MHz
GNSS
GPS: 1575.42MHz±1.023MHz
GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz
Table 2: SC650T-EM Frequency Bands
Type
Frequency Bands

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LTE-FDD
B1/B3/B7/B20/B28
Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT4.2 LE
2402MHz~2480MHz
GNSS
GPS: 1575.42MHz±1.023MHz
GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz
SC650T is an SMD type module which can be embedded into applications through its 323 pins (including
152 LCC pads and 171 LGA pads). With a compact profile of 43.0mm ×44.0mm ×2.85mm, SC650T can
meet almost all requirements for M2M applications such as smart metering, smart home, security, routers,
wireless POS, mobile computing devices, PDA phone, tablet PC, etc.
2.2. Key Features
The following table describes the detailed features of SC650T module.
Table 3: SC650T Key Features
Features
Details
Application Processor
SC650T
Octa-core ARM Cortex-A53 64-bit CPU @2.0GHz (high performance)
One quad-core with 1MB L2 cache
One quad-core with 512KB L2 cache
Modem system
Hexagon DSP v56 core up to 850MHz
768KB L2 cache
GPU
SC650T
AdrenoTM 506 with 64-bit addressing, designed for 650MHz
Memory
16GB eMMC + 2GB LPDDR3 (default)
32GB eMMC + 4GB LPDDR3 (optional)
Operating System
Android OS 9.0
Power Supply
VBAT Supply Voltage: 3.55V~4.4V
Typical 3.8V
Transmitting Power
Class 3 (23dBm±2dB) for LTE-FDD bands
LTE Features
Support 3GPP R8 Cat 4
Support 1.4 to 20MHz RF bandwidth
Support Multiuser MIMO in DL direction

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Cat 4 FDD: Max 150Mbps (DL)/Max 50Mbps (UL)
WLAN Features
2.4GHz/5GHz, support 802.11a/b/g/n/ac, maximally up to 433Mbps
Support AP and STA mode
Bluetooth Features
BT4.2 LE
GNSS Features
GPS/GLONASS/BeiDou
SMS
Text and PDU mode
Point-to-point MO and MT
SMS cell broadcast
LCM Interfaces
Support two groups of 4-lane MIPI_DSI
Support dual LCDs
Support WUXGA up to (1920×1200) at 60fps
Camera Interfaces
Support two groups of 4-lane MIPI_CSI, up to 2.1Gbps per lane
Support 2 cameras (4-lane + 4-lane) or 3 cameras (4-lane + 4-lane + 2-lane )
up to 24MP with dual ISP
Video Codec
SC650T
Video encoding and decoding: up to 4K @30fps, up to 1080P @60fps
Wi-Fi Video: encoding up to 1080P @30fps; decoding up to 1080P @60fps
Audio Interfaces
Audio Input:
Two analog microphone inputs, two digital microphone inputs, integrating
internal bias voltage
Audio Output:
Class AB stereo headphone output
Class AB earpiece differential output
Audio Codec
G711, QCELP, EVRC, EVRC-B, EVRC-WB, AMR-NB, AMR-WB, GSM-EFR,
GSM-FR, GSM-HR
USB Interface
Compliant with USB 3.0 and 2.0 specifications, with transmission rates up to
5Gbps on USB 3.0 and 480Mbps on USB 2.0.
Support USB OTG
Used for AT command communication, data transmission, software debugging
and firmware upgrade
UART Interfaces
4 UART Interfaces: UART5, UART6, UART4 and UART2
UART5 & UART6: 4-wire UART interface with RTS/CTS hardware flow
control, baud rate up to 4Mbps
UART4: 2-wire UART interface
UART2: 2-wire UART interface used for debugging
Vibrator drive interface
Drive ERM vibrator
SD Card Interface
Support SD 3.0
Support SD card hot-plug
(U)SIM Interfaces
2 (U)SIM interfaces
Support USIM/SIM card: 1.8V/2.95V

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Support Dual SIM Dual Standby (supported by default)
I2C Interfaces
Five I2C interfaces, used for peripherals such as TP, camera, sensor, etc.
I2S Interface
Support for I2S peripherals
Flashlight Interface
2 high current Flash and torch LED driver
1A for Flash mode and 300mA for torch mode by default
1.5A for Flash mode and 300mA for torch mode maximally
ADC Interfaces
2 general purpose ADC interfaces
Support up to 15-bit sampling accuracy
SPI Interfaces
2 SPI interfaces, only support master mode
One SPI interface used for peripheral device
One SPI interface used for sensor application, such as fingerprint sensors
Charging Interface
Used for battery voltage detection, fuel gauge, battery temperature detection
Real Time Clock
Supported
Antenna Interfaces
Main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/BT antenna
interfaces
Physical Characteristics
Size: (43.0±0.15)mm ×(44.0±0.15)mm ×(2.85±0.2)mm
Package: LCC + LGA
Weight: approx. 13.0g
Temperature Range
Operating temperature range: -35°C ~ +65°C 1)
Extended temperature range: -40°C ~ +75°C 2)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
Over USB interface
RoHS
All hardware components are fully compliant with EU RoHS directive
1. 1) Within operation temperature range, the module is 3GPP compliant.
2. 2) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to
the normal operating temperature levels, the module will meet 3GPP specifications again.
NOTES

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2.3. Evaluation Board
In order to help customers develop applications with SC650T conveniently, Quectel supplies the
evaluation board, USB to RS232 converter cable, USB Type-C data cable, power adapter, earphone,
antenna and other peripherals to control or test the module. For more details, please refer to document
[1].