Renesas RL78 Series User manual

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All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
Renesas Demonstration Kit (RDK) for RL78
User’s Manual: Hardware
RENESAS MCU
RL78 Family
Release 1.0

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Disclaimer
ByusingthisRenesasDemonstrationKit(RDK),theuseracceptsthefollowingterms.TheRDKisnotguaranteedtobe
errorfree, and theUser assumes the entire risk as to the resultsandperformanceof the RDK. The RDK is provided by
Renesason an “as is”basis withoutwarrantyof any kind whether express or implied, including butnot limited to the
implied warranties of satisfactoryquality, fitness for a particular purpose, title and non-infringement of intellectual
propertyrightswithregardtotheRDK.Renesasexpresslydisclaimsallsuchwarranties.Renesasoritsaffiliatesshallin
noeventbeliableforanylossofprofit,lossofdata,lossofcontract,lossofbusiness,damagetoreputationorgoodwill,
any economic loss, anyreprogramming or recall costs (whether the foregoing losses are direct or indirect) nor shall
Renesasoritsaffiliatesbeliableforanyotherdirectorindirectspecial,incidentalorconsequentialdamagesarisingout
of or in relationto the use of this RDK,even if Renesasor its affiliateshave been advised of thepossibility of such
damages.
Precautions
This Renesas Demonstration Kit is only intended for use in a laboratory environment underambienttemperature and
humidity conditions. A safe separation distance should be used between this and any sensitive equipment. Its use
outside the laboratory, classroom, study area or similarsuch area invalidates conformity with the protection
requirements ofthe Electromagnetic Compatibility Directive and could lead to prosecution.
The product generates,uses, and can radiate radio frequencyenergy and may cause harmful interferenceto radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If this
equipment causes harmful interference to radio or television reception, which can be determined by turning the
equipment off or on, you are encouraged to try to correct the interference by one or more of the following measures:
•Ensure attached cables do not lie across the equipment
•Reorient the receiving antenna
•Increasethe distance between the equipmentand the receiver
•Connect the equipment into an outlet ona circuitdifferent from that which the receiver is connected
•Power down the equipmentwhen not in use
•Consult the dealer or an experienced radio/TV technician for help NOTE: It is recommended that wherever
possible shielded interfacecables are used.
Theproductispotentiallysusceptibleto certainEMCphenomena.Tomitigate againstthemitis recommendedthatthe
following measures be undertaken:
•The user is advised that mobile phones should not be used within 10m of the product when in use.
•The useris advised to take ESD precautions when handling the equipment.
TheRenesasDemonstrationKitdoesnotrepresentanidealreferencedesignforanendproductanddoesnotfulfillthe
regulatory standards for an end product.

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Table of Contents
Chapter 1. Preface................................................................................................................ 1
Chapter 2. Purpose............................................................................................................... 2
Chapter 3. Power Supply ...................................................................................................... 5
3.1. Requirements................................................................................................................. 5
3.2. Power–Up Behavior ....................................................................................................... 5
Chapter 4. Board Layout....................................................................................................... 6
4.1. Component Layout......................................................................................................... 6
4.2. Board Dimensions.......................................................................................................... 7
Chapter 5. Block Diagram..................................................................................................... 8
Chapter 6. User Circuitry..................................................................................................... 10
6.1. Switches....................................................................................................................... 10
6.2. Debug LCD Module...................................................................................................... 10
6.3. LEDs ............................................................................................................................ 11
6.4. Serial EPROM.............................................................................................................. 11
6.5. MicroSD Memory Card Slot.......................................................................................... 11
6.6. Audio (Audio Out, Mic, Speaker, Volume Potentiometer)............................................. 12
6.7. Serial port..................................................................................................................... 12
6.8. 3-Axis Accelerometer................................................................................................... 12
6.9. Digital Temp Sensor..................................................................................................... 12
6.10. Potentiometer............................................................................................................. 13
6.11. Infrared Emitter & Detector......................................................................................... 13
6.12. TRIAC ........................................................................................................................ 13

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6.13. FET ............................................................................................................................ 14
6.14. Oscillator Sources...................................................................................................... 14
6.15. Reset Circuit............................................................................................................... 15
6.16. Total Phase Beagle Debug Header............................................................................ 15
Chapter 7. Mode Switch...................................................................................................... 16
Chapter 8. Programming Methods...................................................................................... 17
Chapter 9. Headers............................................................................................................. 18
9.1. PMODTM Interfaces...................................................................................................... 18
9.2. Application Header (WIFI Module) ............................................................................... 18
9.3. Expansion Headers...................................................................................................... 19
Chapter 10. Code Development.......................................................................................... 21
10.1. Overview.................................................................................................................... 21
10.2. Memory Map .............................................................................................................. 22
Chapter 11. Component Placement.................................................................................... 23
Chapter 12. Additional Information...................................................................................... 24
12.1. Hardware Partner Information.................................................................................... 24
Renesas Contact Information.............................................................................................. 33
1.1....................................................................................................................................... 34

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Chapter 1. Preface
Cautions
This document may be, wholly or partially, subject to change without notice.
Allrightsreserved.TheRDKdesign,documentation,anddemosoftwareareintendedtoimproveunderstandingand
time-to-market for RL78-based designs. Duplication of the design, documentation, and demonstration software is
encouraged.
Trademarks
All brandor product namesused in this manual are trademarks orregistered trademarksof their respective
companies or organizations.
Copyright
© 2011 Renesas Electronics America, Inc. All rights reserved.
© 2011 Renesas Electronics Corporation. All rights reserved.
© 2011 Renesas Solutions Corporation. All rights reserved.
© 2011 Renesas Electronics Europe. All rights reserved.
Website: http://www.renesas.com/
Glossary
ADC Analog to Digital Converter
CPU Central Processing Unit
DAC Digitalto Analog Converter
EMC Electromagnetic compatibility
ESD Electrostatic Discharge
I/O Input / Output
LCD Liquid Crystal Display
LED Light Emitting Diode
MCU Microcontroller Unit
NC No Connection
PC Program Counter
PMOD Peripheral Module
RAM Random Access Memory
ROM Read-Only Memory
RDK Renesas Demonstration Kit
SDRAM Synchronous Dynamic Random Access
Memory

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Chapter 2. Purpose
This RDK is an evaluation and demonstration tool for Renesas RL78 low-power microcontrollers. The goal is to provide
the user with a powerful debug and demonstration platform targeted at common applications. A set of human/machine
interfaces are tightlyintegrated withthe featuresof theRL78 and the software demonstration programs providing the
user with an accessible platform to rapidly evaluate and customize.
Target Applications and Features:
Audio
•Stereo audio driver connected to the PWM interface
•Amplified on-board speaker and external audio jack.
•On-board microphone to demonstrate sampling, FFT/FPU capabilities
•Volume Control Potentiometer
User Interface
•Graphical LCD
•User pushbutton switches and a reset switch.
•On-board LEDs
Communications
•RS-232 Interface
•I2C, SPIwith Debug through the Beagle connector from Total Phase
•Application Header to support severalexternal WiFi modules.
•PMOD connectionsto support a variety of generic PMOD devices (WiFi, Bluetooth, RF, and much more).
Memory Storage
•Micro SD card slot
•512KB Serial EEPROM
•512KB On-chip Flash Memory

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Digital Sensors
•3 – Axis Accelerometer
•Temperature Sensor
•Ambient Light Sensor
Power Control
•FET Circuit for DC output
•TRIAC Circuit for AC output
User Code and Application Debugging
•On-board debugger for high-quality source code debugging (TK interface)
•User circuit breadboard area

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Renesas Online
The Renesas RDK online experienceis complementedby the online Renesasecosystem.
•Renesas Interactive: www.RenesasInteractive.com
oFree Online Learning
•Renesas Rulz: www.RenesasRulz.com
oOnline community
oOnline user forums
ohttp://www.renesasrulz.com/community/demoboards/rdkrl78g13 - Online support site for this RDK
•University Program: www.RenesasUniversity.com
oSupport for Professors and Students
oSupport for University Kits (QSKs)
•Renesas Microcontroller Samples (America Customers)
oFree of charge
oRequest directly from www.America.Renesas.com/samples
Developand submit your sample programs to demonstrate these featuresto the online
community: www.RenesasRulz.com/community/renesas_products/rl78

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Chapter 3.Power Supply
3.1. Requirements
This RDK getsits power from the debugger mini USB connection or optionally from a regulated 5V power supply. The
optionalpowerjackisacenterpositiveconnectorusinga2.1mmbarrel.Analternatepowerheaderislocatednexttothe
power jack (J5).
The RDK PCB can also be loaded with an optional 5.5V super cap (C73), part number EEC-S0HD334H.
Warning: The RDK is neither under nor over-voltage protected. Use a 5V REGULATED center positive supply.
3.2. Power–Up Behavior
When the RDK ispurchased it hasthe Theremin Demo pre-programmed into the Renesas microcontroller. The code
exercises the user LCD, Speaker andAccelerometer on the RDK. The LCDpowers up withX and Y axis lines on the
LCD. Switch 3 turns the speaker ON. The program takes samples from the accelerometer and changes the tone
frequency and volume of the speaker asthe board is tilted left, right, front, and back. The name of the factory demo
project is “RL78Theremin”.

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Chapter 4. Board Layout
4.1. Component Layout
The following diagram shows the top layer component layout.
Figure 4-1: Board Layout