RF-Star RF-WM-3200B1 User manual

RF-WM-3200B1
Low Power Wi-Fi Module
Version 1.1
Shenzhen RF-star Technology Co., Ltd.
Jan. 19th, 2020

RF-WM-3200B1
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Shenzhen RF-star Technology Co., Ltd. Page 1 of 35
Wi-Fi Module List
Chipset
Core
RAM
(KB)
Tx
Power
(dBm)
Model
FLASH
(Byte)
Antenna
Dimension
(mm)
Distance
(m)
Photo
CC3235S
M4
256
18
RF-WM-
3235A1S
4M
PCB
20.5 25.0
100
M4
256
18
RF-WM-
3235B1S
4M
Half-hole
20.5 17.5
100
CC3235SF
M4
256
18
RF-WM-
3235A1
4M +
1M embedded
PCB
20.5 25.0
100
M4
256
18
RF-WM-
3235B1
4M +
1M embedded
Half-hole
20.5 17.5
100
CC3200
M4
256
17
RF-WM-
3200B1
1M
Chip
20 31
100
RF-WM-
3200B1I
1M
IPEX
20 31
150
Conta
ct Me
RF-WM-
3200B2
16M
Chip
20 31
100
RF-WM-
3200B3
1M
Half-hole
20.5 17.5
100
CC3220
M4
256
17
RF-WM-
3220B1
4M
Chip /
IPEX
20 31
100
RTL8710AF
M3
512
17
RF-WM-
10AFB1
1M
IPEX
20 23
100
RTL8711AF
M3
512
17
RF-WM-
11AFB1
1M
IPEX
20 23
100
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.
3. All modules with PCB / Chip antenna and IPEX connector are dispatched with PCB / Chip antenna only by default. If
IPEX connector is needed, pls check with me before quotation.

RF-WM-3200B1
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1 Device Overview
1.1 Description
RF-WM-3200B1 is a low power Wi-Fi SoC module which is based on TI SimpleLink Wi-Fi SoC CC3200, which has a
built-in ARM CortexTM-M4 core processor, and variety of peripherals including parallel camera interface, I2S, SD/MMC,
UART, SPI, I2C, ADC and GPIOs. The subsystem of RF-WM-3200B1 includes an IEEE 802.11 b/g/n radio, baseband,
and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. The module
supports station, access point, and Wi-Fi Direct™ modes. The device also supports WPA2 personal and enterprise
security and WPS 2.0. The Wi-Fi Internet-on-a-chip includes embedded TCP and UDP protocols. The
power-management subsystem includes integrated DC-DC converters supporting a wide range of supply voltages. This
subsystem enables low-power consumption modes, such as the hibernate with RTC mode requiring less than 7 μA of
current. The module design provides 3 options for antenna integration, including surface mounted chip antenna, an
IPEX interface for connecting an external antenna, and a RF pad for soldering onto the base board and routing to an
on-board antenna. RF-WM-3200B1 is pin-2-pin compatible with RF-WM-3220B1 series.
1.2 Key Features
•Wi-Fi CERTIFIEDTM Chip
•Application microcontroller subsystem:
- Arm®Cortex® -M4 core at 80 MHz
- Embedded memory
➢256 KB RAM
➢External serial flash bootloader, and
peripheral drivers in ROM
- 32- Channel Direct Memory Access (µDMA)
- Hardware crypto engine for advanced fast
security, including
➢AES, DES, and 3DES
➢SHA2 and MD5
➢CRC and Checksum
- 8-bit parallel cameral interface
- 1 multichannel audio serial port (McASP)
interface with support for two I2S channels
- 1 SD/MMC interface
- 2 UARTs
- 1 SPI
- 1 I2C
- 4 general-purpose timers with 16-bit PWM
mode
- 1 watchdog timer
- 4-channel 12-bit ADCs
- Up to 27 individually programmable,
multiplexed GPIO pins
•Dedicated external SPI interface for serial flash
•Wi-Fi network processor subsystem
- Featuring Wi-Fi internet-on-a-chipTM
- Dedicated ARM MCU
➢Completely offloads Wi-Fi and internet
protocol from the Application
microcontroller
- Wi-Fi and internet protocols in ROM
- 802.11 b/g/n radio, baseband, medium
access control (MAC), Wi-Fi driver, and

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supplicant
- TCP/IP stack
➢Industry-standard BSD socket APIs
➢8 simultaneous TCP or UDP sockets
➢2 simultaneous TLS and SSL sockets
- Powerful crypto engine for fast, secure Wi-Fi
and internet connections with 256-bits AES
encryption for TIS and SSL connections
- Station, AP, and Wi-Fi direct®modes
- WPA2 personal and enterprise security
- SimpleLink connection manager for
autonomous and fast Wi-Fi connections
- SmartConfigTM technology, AP mode, and
WPS2 for easy and flexible Wi-Fi
provisioning
- TX power
➢18.0 dBm @ 1 DSSS
➢14.5 dBm @ 54 OFDM
- RX sensitivity
➢-95.7 dBm @ 1 DSSS
➢-74.0 dBm @ 54 OFDM
- Application throughput
➢UDP: 16 Mbps
➢TCP: 13 Mbps
•Power-Management Subsystem:
- Integrated DC/DC converters support a wide
range of supply voltage:
➢VBAT wide-voltage supply: 2.7 V ~ 3.6 V
➢VIO is always tied with VBAT
➢Preregulated 1.85 V mode
- Advanced low-power modes:
➢Hibernate: 4 µA
➢Low-power deep sleep (LPDS): 250 µA
➢RX traffic (MCU active): 59 mA @ 54
OFDM
➢TX traffic (MCU active): 229 mA @ 54
OFDM, maximum power
➢Idle connected (MCU in LPDS): 825 µA @
DTIM = 1
1.3 Applications
•Cloud connectivity
•Home automation
•Home appliances
•Access control
•Security systems
•Smart energy
•Internet gateway
•Industrial control
•Smart plug
•Smart metering
•Wireless audio
•IP network sensor nodes

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-WM-3200B1
1.5 Part Number Conventions
The part numbers are of the form of RF-WM-3200B1 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-WM-3200B1
GPIO
s
Reset
Band-Pass Filter
40.0 MHz
32.768 kHz
CC3200
Half-hole Interface
IPEX Connector
Power Supply
2.7 V ~ 3.6 V
Antenna
Matching
Chip Antenna
Antenna Switch
RF
WM
3200
Company Name
RF-Star
Wireless Type
Wi-Fi Module
Chipset Model
TI CC3200
-
-
B1
Module Version
The First Version

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Table of Contents
Wi-Fi Module List................................................................................................................................................................ 1
1 Device Overview............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features....................................................................................................................................................... 2
1.3 Applications.......................................................................................................................................................... 3
1.4 Functional Block Diagram.............................................................................................................................. 4
1.5 Part Number Conventions.............................................................................................................................. 4
Table of Contents................................................................................................................................................................ 5
Table of Figures................................................................................................................................................................... 6
Table of Tables..................................................................................................................................................................... 7
2 Module Configuration and Functions...................................................................................................................... 8
2.1 Module Parameters........................................................................................................................................... 8
2.2 Module Pin Diagram......................................................................................................................................... 9
2.3 Pin Functions....................................................................................................................................................... 9
3 Specifications.................................................................................................................................................................15
3.1 Absolute Maximum Ratings.........................................................................................................................15
3.2 Recommended Operating Conditions .....................................................................................................15
3.3 RF Parameters.................................................................................................................................................16
3.3.1 Current Consumption........................................................................................................................16
3.3.2 RF Configuration.................................................................................................................................19
3.3.3 Transmission Distance Test............................................................................................................19
3.4 WLAN Characteristics....................................................................................................................................20
3.4.1 WLAN Receiver Characteristics....................................................................................................20
3.4.2 WLAN Transmitter Characteristics...............................................................................................21
4 Application, Implementation, and Layout.............................................................................................................22
4.1 Module Photos..................................................................................................................................................22
4.2 Recommended PCB Footprint....................................................................................................................22
4.3 Antenna................................................................................................................................................................23
4.4 Module Operation............................................................................................................................................24
4.4.1 SOP Configuration..............................................................................................................................24

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4.4.2 Module Operation...............................................................................................................................24
4.4.2.1 Pin Application Sample........................................................................................................24
4.5 Basic Operation of Hardware Design ......................................................................................................28
4.6 Trouble Shooting..............................................................................................................................................29
4.6.1 Unsatisfactory Transmission Distance........................................................................................29
4.6.2 Vulnerable Module..............................................................................................................................29
4.6.3 High Bit Error Rate.............................................................................................................................30
4.7 Electrostatics Discharge Warnings...........................................................................................................30
4.8 Soldering and Reflow Condition.................................................................................................................30
4.9 Optional Packaging.........................................................................................................................................31
5 Certification.....................................................................................................................................................................32
5.1 RoHS....................................................................................................................................................................32
6 Revision History............................................................................................................................................................33
7 Contact Us.......................................................................................................................................................................34
Table of Figures
Figure 1. Functional Block Diagram of RF-WM-3200B1............................................................................ 4
Figure 2. Part Number Conventions of RF-WM-3200B1........................................................................... 4
Figure 3. Pin Diagram of RF-WM-3200B1 ...................................................................................................... 9
Figure 4. TX Power and IBAT vs TX Power Level Settings (1 DSSS)................................................18
Figure 5. TX Power and IBAT vs TX Power Level Settings (6 OFDM)...............................................18
Figure 6. TX Power and IBAT vs TX Power Level Settings (54 OFDM)............................................19
Figure 7. Photos of RF-WM-3200B1...............................................................................................................22
Figure 8. Recommended PCB Footprint of RF-WM-3200B1 (mm).....................................................22
Figure 9. Optional Antenna..................................................................................................................................23
Figure 10. Reference Schematic Diagram of RF-WM-3200B1.............................................................24
Figure 11. Pin Application Example of RF-WM-3200B1...........................................................................25
Figure 12. Recommendation of Antenna Layout.........................................................................................29
Figure 13. Recommended Reflow for Lead Free Solder.........................................................................31
Figure 14. Optional Packaging Mode..............................................................................................................31
Figure 15. RoHS certificate.................................................................................................................................32

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Table of Tables
Table 1. Parameters of RF-WM-3200B1.......................................................................................................... 8
Table 2. Pin Functions of RF-WM-3200B1...................................................................................................... 9
Table 3. Absolute Maximum Ratings................................................................................................................15
Table 4. Recommended Operating Conditions of RF-WM-3200B1.....................................................15
Table 5. Table of Current Consumption..........................................................................................................16
Table 6. WLAN Receiver Characteristics.......................................................................................................20
Table 7. WLAN Transmitter Characteristics..................................................................................................21
Table 8. Optional Antenna Configuration .......................................................................................................23
Table 9. Temperature Table of Soldering and Reflow................................................................................30

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-WM-3200B1
Chipset
CC3200
Supply Power Voltage
2.7 V ~ 3.6 V, 3.3 V is recommended
Frequency
2.4 GHz
Protocol
802.11 b/g/n
Transmit Power
+18.0 dBm @ 1 DSSS
+14.5 dBm @ 54 OFDM
Receiving Sensitivity
-95.7 dBm @ 1 DSSS
-74.0 dBm @ 54 OFDM
GPIO
29
Power Consumption
Hibernate: 4 µA
Low-power deep sleep (LPDS): 250 µA
Idle connected (MCU in LPDS): 825 µA @ DTIM = 1
RX traffic (MCU active): 59 mA @ 54 OFDM
TX traffic (MCU active): 229 mA @ 54 OFDM, maximum power
Crystal
40 MHz, 32.768 KHz
Package
SMT packaging, half-hole packaging
Communication Interface
UART, I2S, I2C, SPI, SD/MMC, ADC, DMA, PWM, McASP, Camera interface
Dimension
31.0 mm ×20.0 mm
Operating Temperature
-40 ℃～+85 ℃
Storage Temperature
-55 ℃～+125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-WM-3200B1
2.3 Pin Functions
Table 2. Pin Functions of RF-WM-3200B1
Pin
Chip Pin
Name
Function
1
GND
Ground
2
RF_OUT
RF output interface
3
50
GPIO00
GPIO0
UART0_CTS
McAXR1
GT_CCP00
GSPI_CS
UART1_RTS
UART0_RTS
McAXR0

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4
53
GPIO30
GPIO30
UART0_TX
McACLK
McAFSX
GT_CCP05
GSPI_MISO
5
55
GPIO01
GPIO1
UART0_TX
pCLK Pixel (PIXCLK)
UART1_TX
GT_CCP01
6
57
GPIO02
ADC_CH0
GPIO2
UART0_RX
UART1_RX
GT_CCP02
7
58
GPIO03
ADC_CH1
GPIO3
UART1_TX
pDATA7 (CAM_D3)
8
59
GPIO04
ADC_CH2
GPIO4
UART1_RX
pDATA6 (CAM_D2)
9
60
GPIO05
ADC_CH3
GPIO5
pDATA5 (CAM_D1)
McAXR1

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GT_CCP05
10
61
GPIO06
GPIO6
UART0_RTS
pDATA4 (CAM_D0)
UART1_CTS
UART0_CTS
GT_CCP06
11
62
GPIO07
GPIO7
McACLKX
UART1_RTS
UART0_RTS
UART0_TX
12
63
GPIO08
GPIO8
SDCARD_IRQ
McAFSX
GT_CCP06
13
64
GPIO09
GPIO9
GT_PWM05
SDCARD_DATA0
McAXR0
GT_CCP00
14
1
GPIO10
GPIO10
I2C_SCL
GT_PWM06
UART1_TX
SDCARD_CLK
GT_CCP01
15
2
GPIO11
GPIO11

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I2C_SDA
GT_PWM07
pXCLK (XVCLK)
SDCARD_CMD
UART1_RX
GT_CCP02
McAFSX
16
3
GPIO12
GPIO12
McACLK
pVS (VSYNC)
I2C_SCL
UART0_TX
GT_CCP03
17
4
GPIO13
GPIO13
I2C_SDA
pHS (HSYNC)
UART0_RX
GT_CCP04
18
5
GPIO14
GPIO14
I2C_SCL
GSPI_CLK
pDATA8 (CAM_D4)
GT_CCP05
19
6
GPIO15
GPIO15
I2C_SDA
GSPI_MISO
pDATA9 (CAM_D5)
GT_CCP06

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SDCARD_DATA0
20
7
GPIO16
GPIO16
GSPI_MOSI
pDATA10 (CAM_D6)
UART1_TX
GT_CCP07
SDCARD_CLK
21
8
GPIO17
GPIO17
UART1_RX
GSPI_CS
pDATA11 (CAM_D7)
SDCARD_CMD
22
15
GPIO22
GPIO22
McAFSX
GT_CCP04
23
16
JTAG TDI
TDI
GPIO23
UART1_TX
I2C_SCL
24
17
JTAG TDO
TDO
GPIO24
PWM0
UART1_RX
I2C_SDA
GT_CCP06
McAFSX
25
18
GPIO28
GPIO28
26
19
JTAG TCK
TCK

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GT_PWM03
27
20
JTAG TMS
TMS
GPIO29
28
29
ANTSEL1
I/O
29
30
ANTSEL2
I/O
30
32
RESET
Module reset pin, internal pull-up by default, active low
31
45
DCDC_ANA2
GPIO31
UART0_RX
McAFSX
UART1_RX
McAXR0
GSPI_CLK
DCDC_ANA2_SW_P
32
35
SOP0
SOP0
33
34
SOP1
SOP1
34
21
SOP2
GPIO25
GT_PWM02
McAFSX
TCXO_EN
SOP2
35
VCC
Power supply, 2.3 V ~ 3.6 V
36
GND
Ground

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3 Specifications
3.1 Absolute Maximum Ratings
All measurements are referenced at the device pins, unless otherwise indicated. All specifications are over process and
voltage, unless otherwise indicated.
Table 3. Absolute Maximum Ratings
Parameters
Condition
Min.
Typ.
Max.
Unit
Supply Voltage
VBAT and VIO （Chip pin: 37, 39, 44）
2.7
3.3
3.6
V
VIO ~ VBAT (differential) （Chip pin:
10, 54）
0.0
V
Digital Inputs
/
-0.5
VIO + 0.5
V
RF Pins
/
-0.5
2.1
V
Analog Pins (XTAL)
/
-0.5
2.1
V
Operating Temperature
/
-40
25
+85
℃
Storage Temperature
/
-55
25
+125
℃
3.2 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted) (1) (2)
Table 4. Recommended Operating Conditions of RF-WM-3200B1
Items
Condition (3) (4)
Min.
Typ.
Max.
Unit
VBAT, VIO (shorted to VBAT) (Chip
Pin: 10, 37, 39, 44, 54)
Direct battery connection
2.7
3.3
3.6
V
VBAT, VIO (shorted to VBAT) (Chip
Pin: 10, 37, 39, 44, 54)
Preregulated 1.85 V
2.7
1.85
1.9
V
Ambient thermal slew
/
-20
/
20
℃
Notes：
(1) When operating at an ambient temperature of over 75 °C, the transmit duty cycle must remain below 50% to avoid
the auto-protect feature of the power amplifier. If the auto-protect feature triggers, the device takes a maximum of 60
seconds to restart the transmission.
(2) To ensure WLAN performance, ripple on the 2.7 V to 3.3 V supply must be less than ±300 mV.

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3.3 RF Parameters
3.3.1 Current Consumption
Table 5. Table of Current Consumption
When measured on the RF-WM-3200B1 reference design with TA= 25 ℃, VBAT= 3.6 V with DC/DC enabled unless
otherwise noted.
Parameter
Test Conditions(1) (2)
Min.
Typ.
Max.
Unit
MCU ACTIVE
NWP
Active
TX
1 DSSS
TX power level = 0
278
mA
TX power level = 4
194
mA
6 OFDM
TX power level = 0
254
mA
TX power level = 4
185
mA
54 OFDM
TX power level = 0
229
mA
TX power level = 4
166
mA
RX
1 DSSS
59
mA
54 OFDM
59
mA
NWP idle connected (3)
15.3
mA
MCU SLEEP
NWP
Active
TX
1 DSSS
TX power level = 0
275
mA
TX power level = 4
191
mA
6 OFDM
TX power level = 0
251
mA
TX power level = 4
182
mA
54 OFDM
TX power level = 0
226
mA
TX power level = 4
163
mA
RX
1 DSSS
56
mA
54 OFDM
56
mA
NWP idle connected (3)
12.2
mA
MCU LPDS
NWP
Active
TX
1 DSSS
TX power level = 0
272
mA
TX power level = 4
188
mA

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6 OFDM
TX power level = 0
248
mA
TX power level = 4
179
mA
54 OFDM
TX power level = 0
223
mA
TX power level = 4
160
mA
RX
1 DSSS
53
mA
54 OFDM
53
mA
NWP LPDX (4)
0.25
mA
NWP idle connected (3)
0.825
mA
MCU Hibernate (5)
MCU hibernate (6)
4
µA
Peak Calibration Current (7)
VBAT = 3.3 V
450
mA
Notes：
(1) TX power level = 0 implies maximum power. TX power level = 4 implies output power backed off approximately 4
dB.
(2) The CC3200 system is a constant power-source system. The active current numbers scale based on the VBAT
voltage supplied.
(3) DTIM = 1
(4) LPDS current does not include the external serial flash. The LPDS number reported is with retention of 64 KB MCU
SRAM. The CC3200 device can be configured to retain 0 KB, 64 KB, 128 KB, 192 KB or 256 KB SRAM in LPDS. Each
64KB retained increases LPDS current by 4 μA.
(5) Serial flash current consumption in power-down mode during hibernate is not included.
(6) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. Calibration is
performed sparingly, typically when coming out of Hibernate and only if temperature has changed by more than 20°C or
the time elapsed from prior calibration is greater than 24 hours.

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Figure 4. TX Power and IBAT vs TX Power Level Settings (1 DSSS)
Note: The area enclosed in the circle represents a significant reduction in current when transitioning from TX power
level 3 to 4. In the case of lower range requirements (14 dbm output power), TI recommends using TX power level 4 to
reduce the current.
Figure 5. TX Power and IBAT vs TX Power Level Settings (6 OFDM)

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Figure 6. TX Power and IBAT vs TX Power Level Settings (54 OFDM)
3.3.2 RF Configuration
Wireless Mode
Transmission Rate (Modulation)
Tx Power (Typical)
Rx Sensitivity (Typical)
IEEE802.11 B
11 Mbps @ CCK
17.0 dBm
-80 dBm
IEEE802.11 G
54 Mbps @ OFDM
13.0 dBm
-69 dBm
IEEE802.11 N
HT20 @ MCS7
12.0 dBm
-67 dBm
3.3.3 Transmission Distance Test
The transmission distance test was conducted in the outdoor open area, and four RF-WM-3200B1 modules were
divided into two groups for Socket communication. Module A1 operates in STA mode, and module B1 operates in AP
mode, and the simultaneous bidirectional communication test was conducted under the modules with on-board chip
antenna. Module A2 operates in the STA mode, and module B2 operates in the AP mode, and the simultaneous
bidirectional communication test was conducted under the modules with external rod antenna. The test results are as
follows:
Transmission distance: 100 meters, data packet: 100 bytes;