RF-Star RF-BM-ND08CI User manual

RF-BM-ND08CI
Bluetooth 5.0 Low Energy Module
Version 1.2
Shenzhen RF-star Technology Co., Ltd.
Sep. 22th, 2020

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Nordic BLE Module List
➢nRF51 Series
Chipset
Core
Flash
(Byte)
RAM
(KB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(M)
Photo
nRF51822
M0
256K
16
4
RF-BM-ND01
PCB
15  24.8
100
RF-BM-ND02
PCB
13.5  16.2
80
RF-BM-ND02I
IPEX
13.5  16.2
150
nRF51802
M0
256K
16
4
RF-BM-ND01C
PCB
15  24.8
100
RF-BM-ND02C
PCB
13.5  16.2
80
RF-BM-ND02CI
IPEX
13.5  16.2
80
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

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➢nRF52 Series
Chipset
Core
Flash
(KB)
RAM
(KB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(M)
Photo
nRF52832
M4F
512
64
4
RF-BM-ND04
PCB
15  24.8
100
RF-BM-ND04I
IPEX
15  24.8
100
RF-BM-ND08
PCB
15.2  11.2
80
RF-BM-ND08I
IPEX
15.2  11.2
100
Contact me
nRF52810
M4
192
24
4
RF-BM-ND04C
PCB
15  24.8
100
RF-BM-ND04CI
IPEX
15  24.8
100
RF-BM-ND08C
PCB
15.2  11.2
80
RF-BM-ND08CI
IPEX
15.2  11.2
100
Contact me
nRF52811
M4
192
24
4
RF-BM-ND04A
PCB
15  24.8
100

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RF-BM-ND08A
PCB
15.2  11.2
80
nRF52833
M4
512
128
8
RF-BM-ND07
Chip /
IPEX
12.2  17
300
nRF52840
M4F
1024
256
8
RF-BM-ND05
PCB
15  24.8
550
RF-BM-ND05I
IPEX
15  24.8
550+
RF-BM-ND06
PCB
20.5  24
550
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

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1 Device Overview
1.1 Description
RF-BM-ND04C is an RF module based on Nordic BLE SoC nRF52810QFAA with ARM® Cortex®-M4 32-bit processor.
It integrates a 32.768 kHz and a 32 MHz crystal, an LC filter, an antenna matching and a meander line inverted-F PCB
antenna. It supports Bluetooth 5.0 LE, including the high-speed 2 Mbps feature and ANT and 2.4 GHz proprietary
protocols for simple programming. The module has numerous digital peripherals and interfaces such as PDM, PWM,
UART, SPI, I2C and 12-bit ADC. It features low power consumption, small size, robust connection distance, and rigid
reliability. 1.27-mm pitch stamp stick package for easy assembling and cost-effective PCB design. RF-BM-ND04C is
pin-to-pin compatible with RF-BM-ND04 / ND04I / ND04CI / ND05 / ND05I.
1.2 Key Features
•RF
- Bluetooth 5.0 low energy
- ANT
- 2.4 GHz proprietary
•TX power: -20 to +4 dBm
•ARM® Cortex®-M4 32-bit processor, 64 MHz
•Supply voltage range 1.7 V ~ 3.6 V
•Memory
- 192 kB flash
- 24 kB RAM
•Support for concurrent multi-protocol
•Peripherals
- 12-bit, 200 ksps ADC
- 29 GPIOs
- 4-channel PWM
- Digital microphone interface (PDM)
- SPI master / slave
- I2C master / slave
- UART (CTS / RTS)
•Programmable peripheral interconnect (PPI)
•Quadrature decoder (QDEC)
•AES HW encryption
•Transmission range: 80 m
•Dimension: 15.2 mm x 11.2 mm x (2.1 ± 0.1) mm
1.3 Applications
•Mouse and keyboard
•Mobile HID
•Remote controls
•Wearables
•Virtual reality headsets
•Health and medical
•Industrial lighting
•Retail
•Commercial
•Beacons

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-ND08CI
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-ND08CI where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-ND08CI
RF
BM
ND
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset Manufacturer
Nordic Semiconductor
-
-
08CI
Module Version
nRF52810 Third IPEX Version
nRF52810
QFAA
GPIO
Debug
Reset
LC Filter
Power Supply
1.7 V ~ 3.6 V
Antenna
Matching
32.0 MHz
32.768 kHz
IPEX
Connector
Half-hole
Interface
Antenna
Switch

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Table of Contents
Nordic BLE Module List ................................................................................................................................................... 1
➢nRF51 Series ....................................................................................................................................................... 1
➢nRF52 Series ....................................................................................................................................................... 2
1 Device Overview............................................................................................................................................................. 4
1.1 Description............................................................................................................................................................ 4
1.2 Key Features ....................................................................................................................................................... 4
1.3 Applications.......................................................................................................................................................... 4
1.4 Functional Block Diagram .............................................................................................................................. 5
1.5 Part Number Conventions.............................................................................................................................. 5
Table of Contents................................................................................................................................................................ 6
Table of Figures................................................................................................................................................................... 7
Table of Tables..................................................................................................................................................................... 7
2 Module Configuration and Functions ...................................................................................................................... 8
2.1 Module Parameters........................................................................................................................................... 8
2.2 Module Pin Diagram ......................................................................................................................................... 9
2.3 Pin Functions....................................................................................................................................................... 9
3 Specifications .................................................................................................................................................................11
3.1 Recommended Operating Conditions .....................................................................................................11
3.2 Handling Ratings..............................................................................................................................................11
3.3 Power Consumption .......................................................................................................................................11
4 Application, Implementation, and Layout.............................................................................................................12
4.1 Module Photos..................................................................................................................................................12
4.2 Recommended PCB Footprint....................................................................................................................12
4.3 Antenna................................................................................................................................................................12
4.4 Schematic Diagram.........................................................................................................................................13
4.5 Basic Operation of Hardware Design ......................................................................................................14
4.6 Trouble Shooting..............................................................................................................................................14
4.6.1 Unsatisfactory Transmission Distance........................................................................................14
4.6.2 Vulnerable Module..............................................................................................................................15
4.6.3 High Bit Error Rate .............................................................................................................................15

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4.7 Electrostatics Discharge Warnings ...........................................................................................................15
4.8 Soldering and Reflow Condition.................................................................................................................16
4.9 Optional Packaging.........................................................................................................................................17
5 Revision History ............................................................................................................................................................18
6 Contact Us.......................................................................................................................................................................19
Table of Figures
Figure 1. Functional Block Diagram of RF-BM-ND08CI ............................................................................ 5
Figure 2. Part Number Conventions of RF-BM-ND08CI............................................................................ 5
Figure 3. Pin Diagram of RF-BM-ND08CI ....................................................................................................... 9
Figure 4. Photos of RF-BM-ND08CI ................................................................................................................12
Figure 5. Recommended PCB Footprint of RF-BM-ND08CI (mm)......................................................12
Figure 6. Specification of Antenna Seat .........................................................................................................12
Figure 7. Specification of IPEX Wire................................................................................................................13
Figure 8. Antenna Output Mode Change .......................................................................................................13
Figure 9. Schematic Diagram of RF-BM-ND08CI.......................................................................................13
Figure 10. Recommended Reflow for Lead Free Solder .........................................................................16
Figure 11. Optional Packaging Mode ..............................................................................................................17
Table of Tables
Table 1. Parameters of RF-BM-ND08CI........................................................................................................... 8
Table 2. Pin Functions of RF-BM-ND08CI....................................................................................................... 9
Table 3. Recommended Operating Conditions of RF-BM-ND08CI .....................................................11
Table 4. Handling Ratings of RF-BM-ND08CI..............................................................................................11
Table 5. Power Consumption..............................................................................................................................11
Table 6. Temperature Table of Soldering and Reflow................................................................................16

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-ND08CI
Chipset
nRF52810QFAA
Supply Power Voltage
1.7 V ~ 3.6 V, recommended to 3.3 V
Frequency
2402 MHz ~ 2480 MHz
Transmit Power
-20.0 dBm ~ +4.0 dBm (typical: 0 dBm)
Receiving Sensitivity
-96 dBm
Data Rate
1 Mbps, 2 Mbps
Power Consumption
4.6 mA peak current in TX (@ 0 dBm)
4.6 mA peak current in RX
GPIO
16
Crystal
32 MHz, 32.768 kHz
RAM
24 KB
Flash
192 KB
Package
SMT Packaging
Frequency Error
±20 kHz
Dimension
15.2 mm x 11.2 mm x (2.1 ± 0.1) mm
Type of Antenna
IPEX connector / half-hole antenna interface
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
Top View Bottom View
Figure 3. Pin Diagram of RF-BM-ND08CI
2.3 Pin Functions
Table 2. Pin Functions of RF-BM-ND08CI
Pin
Name
Chip Pin
Pin Type
Description
1
ANT
-
-
Antenna interface
2
GND
GND
GND
Ground
3
VCC
VCC
VCC
Power supply 1.7 V ~ 3.6 V, Recommend 3.3 V
4
P25
P0_25
I/O
5
P17
P0_17
I/O
6
P21 / RST
P0_21 / RESET
I/O
Reset, active low.
7
P13
P0_13
I/O
8
P28
P0_28 / AIN4
I/O
9
P27
P0_27
I/O
10
P26
P0_26
I/O
11
P09
P0_09
I/O
12
P10
P0_10
I/O

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13
P19
P0_19
I/O
14
P20
P0_20
I/O
15
P05
P0_05 / AIN3
I/O
16
P07
P0_07
I/O
17
P06
P0_06
I/O
18
P08
P0_08
I/O
19
P03
P0_03 / AIN1
I/O
Note:
SWD debugging ports are on the bottom side of the module, which is not pull out in the stamp half hole way, please
refer to the module pin diagram for details.

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-ND08CI
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
1.7
3.3
3.6
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-ND08CI
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±4000
V
Moisture Sensitivity Level
2
Charged Device Model
±1000
V
3.3 Power Consumption
Table 5. Power Consumption
Event
Average Current
Testing Conditions / Remark
Sleeping
1.23 µA
EN disconnected
Broadcast
70.33 µA
Broadcast cycle: 200 ms
Broadcast
28.38 µA
Broadcast cycle: 500 ms
Broadcast
14.02 µA
Broadcast cycle: 1000 ms
Broadcast
7.64 µA
Broadcast cycle: 2000 ms
Broadcast
3.49 µA
Broadcast cycle: 5000 ms
Connection
64.72 µA
Connection cycle: 50 ms
Connection
33.80 µA
Connection cycle: 100 ms

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4 Application, Implementation, and Layout
4.1 Module Photos
TBD
Figure 4. Photos of RF-BM-ND08CI
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-BM-ND08CI (mm)
4.3 Antenna
RF-BM-ND08CI module is integrated the IPEX version 1 antenna seat, the specification of antenna seat is as follow:
Figure 6. Specification of Antenna Seat

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The specification of IPEX wire end is as follow:
Figure 7. Specification of IPEX Wire
Antenna output mode change:
The module has two antenna output modes, which are on-board PCB antenna and stamp half-hole output (ANT pin, see
pin function table for details).
The default delivery is the onboard PCB antenna, L1 position (1NH) is welded. If you want to change to a half-hole
antenna output, disconnect the L1 position capacitor. The location of L1 is shown in the figure below.
Figure 8. Antenna Output Mode Change
4.4 Schematic Diagram
TBD
Figure 9. Schematic Diagram of RF-BM-ND08CI

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4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.
If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top
Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital
part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example: USB 3.0.
9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.

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Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The
performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to
the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.
3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the
metal shell.
4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti- static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.

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4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 6. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s
Figure 10. Recommended Reflow for Lead Free Solder

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4.9 Optional Packaging
Figure 11. Optional Packaging Mode
Note: Default tray packaging.

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5 Revision History
Date
Version No.
Description
Author
2020.04.24
V1.0
The initial version is released.
Aroo Wang
2020.05.15
V1.1
Add Nordic module list.
Sunny Li
2020.08.12
V1.2
Add the SWD debugging ports specification.
Sunny Li
2020.09.22
V1.2
Update Nordic BLE module list.
Sunny Li
Note:
1. The document will be optimized and updated from time to time. Before using this document, please make sure it is
the latest version.
2. To obtain the latest document, please download it from the official website: www.szrfstar.com.

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6 Contact Us
SHENZHEN RF-STAR TECHNOLOGY CO., LTD.
Shenzhen HQ:
Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China
Tel.: [phone]
Chengdu Branch:
Add.: No. B3-03, Building No.1, Incubation Park, High-Tech District, Chengdu, Sichuan, China, 610000
Tel.: [phone]
Email: [e-mail], [e-mail]
Web.: www.szrfstar.com