RF-Star RF-BM-ND09A User manual

RF-BM-ND09A
Bluetooth 5.0 Low Energy Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Nov. 2nd, 2020

RF-BM-ND09A
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Shenzhen RF-star Technology Co., Ltd. Page 1 of 19
Nordic BLE Module List
➢nRF51 Series
Chipset
Core
Flash
(kB)
RAM
(kB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(m)
Photo
nRF51822
M0
256
16
4
RF-BM-ND01
PCB
15  24.8
100
RF-BM-ND02
PCB
13.5  16.2
80
RF-BM-ND02I
IPEX
13.5  16.2
100
Contact me
nRF51802
M0
256
16
4
RF-BM-ND01C
PCB
15  24.8
100
RF-BM-ND02C
PCB
13.5  16.2
80
RF-BM-ND02CI
IPEX
13.5  16.2
100
Contact me
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

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➢nRF52 Series
Chipset
Core
Flash
(kB)
RAM
(kB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(m)
Photo
nRF52832
M4F
512
64
4
RF-BM-ND04
PCB
15  24.8
100
RF-BM-ND04I
IPEX/Half
-hole
15  24.8
100
RF-BM-ND08
PCB/Half-
hole
15.2  11.2
80
RF-BM-ND08I
IPEX/Half
-hole
15.2  11.2
100
Contact me
nRF52810
M4
192
24
4
RF-BM-ND04C
PCB
15  24.8
100
RF-BM-ND04CI
IPEX/Half
-hole
15  24.8
100
RF-BM-ND08C
PCB/Half-
hole
15.2  11.2
80
RF-BM-ND08CI
IPEX/Half
-hole
15.2  11.2
100
Contact me
nRF52811
M4
192
24
4
RF-BM-ND04A
PCB
15  24.8
100

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RF-BM-ND08A
PCB/Half-
hole
15.2  11.2
80
nRF52833
M4
512
128
8
RF-BM-ND07
Chip/IPE
X/Pad
12.2  17
300
nRF52840
M4F
1024
256
8
RF-BM-ND05
PCB
15  24.8
500
RF-BM-ND05I
IPEX/Half
-hole
15  24.8
500
RF-BM-ND06
PCB/Pad
20.5  24
500
nRF52805
M4
192
24
4
RF-BM-ND09
Pad
7  7
100
M4
192
24
4
RF-BM-ND09A
PCB/Pad
7  9
80
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

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1 Device Overview
1.1 Description
RF-BM-ND09A is an RF BLE module based on Nordic Semiconductor nRF52805 with ARM® Cortex®-M4 32-bit
processor, clocked at 64 MHz. It has 192 kB Flash and 24 kB RAM and integrates a range of analog and digital interfaces
such as a 2-channel 12-bit ADC, SPI, UART, I2C and QDEC. The high-performance onboard PCB antenna makes the
module achieve more applications with a relatively long transmission range, as well as the pad antenna interface. The
TX power has up to +4 dBm and the sensitivity (1 Mbps Bluetooth Low Energy) is -97 dBm. The Bluetooth high-
throughput 2 Mbps makes ND09A transfer data faster and more efficiently, improve coexistence and reduce interference.
RF-BM-ND09A is in a DFN package for small PCB designs, ideal for cost-constrained applications.
1.2 Key Features
•RF features
- Bluetooth® 5.0 low energy: 2 Mbps, 1 Mbps
- 2.4 GHz proprietary: 2 Mbps, 1 Mbps
•TX power: -20 dBm to +4 dBm, configuration in 4 dB
steps
•Receiving sensitivity: -97 dBm in 1 Mbps BLE mode
•ARM® Cortex®-M4 32-bit processor, 64 MHz
•On-air compatible with nRF52, nRF51, nRF24L, and
nRF24AP series
•Supply voltage range 1.7 V ~ 3.6 V
•Memory
- 192 kB flash
- 24 kB RAM
•Rich peripherals
- 12-bit, 200 ksps ADC
- 10 GPIOs
- PWM
- SPI master/slave
- I2C master/slave
- I2S
- UART (CTS/RTS)
•Transmission Range: 80 m
•Dimension: 7.0 mm x 9.0 mm x 2.0 mm
1.3 Applications
•Proprietary protocol devices
•Network processor
•Beacons
•Smart Home sensors
•Presenters / Stylus
•Health monitoring
•Drug delivery
•Asset tags
•Toys
•Retail tags and labels

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-ND09A
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-ND08A where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-ND09A
RF
BM
ND
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset Manufacturer
Nordic Semiconductor
-
-
09A
Module Version
nRF52805 Version
nRF52805
GPIO
Debug
Matching &
LPF
32.0 MHz
PAD
Antenna
Interface
Power Supply
1.7 V ~ 3.6 V
Power Filter
Reset
PCB
Antenna

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Table of Contents
Nordic BLE Module List ................................................................................................................................................... 1
➢nRF51 Series ....................................................................................................................................................... 1
➢nRF52 Series ....................................................................................................................................................... 2
1 Device Overview............................................................................................................................................................. 4
1.1 Description............................................................................................................................................................ 4
1.2 Key Features.................................................................................................................................................... 4
1.3 Applications.......................................................................................................................................................... 4
1.4 Functional Block Diagram .............................................................................................................................. 5
1.5 Part Number Conventions.............................................................................................................................. 5
Table of Contents................................................................................................................................................................ 6
Table of Figures................................................................................................................................................................... 7
Table of Tables..................................................................................................................................................................... 7
2 Module Configuration and Functions ...................................................................................................................... 8
2.1 Module Parameters........................................................................................................................................... 8
2.2 Module Pin Diagram ......................................................................................................................................... 9
2.3 Pin Functions....................................................................................................................................................... 9
3 Specifications .................................................................................................................................................................11
3.1 Recommended Operating Conditions .....................................................................................................11
3.2 Handling Ratings..............................................................................................................................................11
4 Application, Implementation, and Layout.............................................................................................................12
4.1 Module Photos..................................................................................................................................................12
4.2 Recommended PCB Footprint....................................................................................................................12
4.3 Schematic Diagram.........................................................................................................................................13
4.4 Antenna................................................................................................................................................................13
4.4.1 Antenna Design Recommendation ..............................................................................................13
4.5 Basic Operation of Hardware Design ......................................................................................................14
4.6 Trouble Shooting..............................................................................................................................................15
4.6.1 Unsatisfactory Transmission Distance........................................................................................15
4.6.2 Vulnerable Module..............................................................................................................................15
4.6.3 High Bit Error Rate .............................................................................................................................15

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4.7 Electrostatics Discharge Warnings ...........................................................................................................16
4.8 Soldering and Reflow Condition.................................................................................................................16
4.9 Optional Packaging.........................................................................................................................................17
5 Revision History ............................................................................................................................................................18
6 Contact Us.......................................................................................................................................................................19
Table of Figures
Figure 1. Functional Block Diagram of RF-BM-ND09A.............................................................................. 5
Figure 2. Part Number Conventions of RF-BM-ND09A ............................................................................. 5
Figure 3. Pin Diagram of RF-BM-ND09A (Bottom view)............................................................................ 9
Figure 4. Photos of RF-BM-ND09A..................................................................................................................12
Figure 5. Recommended PCB Footprint of RF-BM-ND09A (mm)........................................................12
Figure 6. Schematic Diagram of RF-BM-ND09A ........................................................................................13
Figure 7. Recommendation of Antenna Layout ...........................................................................................14
Figure 8. Recommended Reflow for Lead-Free Solder ...........................................................................17
Figure 9. Optional Packaging Mode.................................................................................................................17
Table of Tables
Table 1. Parameters of RF-BM-ND09A ............................................................................................................ 8
Table 2. Pin Functions of RF-BM-ND09A ........................................................................................................ 9
Table 3. Recommended Operating Conditions of RF-BM-ND09A.......................................................11
Table 4. Handling Ratings of RF-BM-ND09A ...............................................................................................11
Table 5. Temperature Table of Soldering and Reflow................................................................................16

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-ND09A
Chipset
nRF52805
Supply Power Voltage
1.7 V ~ 3.6 V, recommended to 3.3 V
Frequency
2402 MHz ~ 2480 MHz
Transmit Power
-20.0 dBm ~ +4.0 dBm
Receiving Sensitivity
-97 dBm sensitivity in 1 Mbps Bluetooth® low energy mode
GPIO
10
Crystal
32 MHz
RAM
24 kB
Flash
192 kB
Package
DFN
Frequency Error
±20 kHz
Antenna
PCB antenna / PAD interface
Dimension
7.0 mm x 9.0 mm x 2.0 mm (Including shield cover)
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-ND09A (Bottom view)
2.3 Pin Functions
Table 2. Pin Functions of RF-BM-ND09A
Pin
Name
Chip Pin
Pin Type
Description
1
GND
GND
GND
2
GND
GND
GND
3
P0_20
P0_20
Digital I/O
General purpose I/O
4
P0_01
P0_01
Digital I/O
General purpose I/O
5
P0_00
P0_00
Digital I/O
General purpose I/O
6
VCC
VDD
VCC
Power supply 1.7 V ~ 3.6 V, Recommend
3.3 V
7
P0_14
P0_14
Digital I/O
General purpose I/O
8
P0_04
P0_04 / AIN2
Digital I/O
General purpose I/O
9
P0_05
P0_05 / AIN3
Digital I/O
General purpose I/O
10
P0_12
P0_12
Digital I/O
General purpose I/O

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11
P0_16
P0_16
Digital I/O
General purpose I/O
12
P0_18
P0_18
Digital I/O
General purpose I/O
13
P0_21 / RESET
P0_21 / RESET
Digital I/O
General purpose I/O, Configurable as pin
reset
14
SWDCLK
SWDCLK
Debug
Serial wire debug clock input for debugging
and programming
15
SWDIO
SWDIO
Debug
Serial wire debug I/O for debugging and
programming
16
ANT
ANT
RF
Single-ended radio antenna connection
17
GND
GND
-
18
GND
GND
-
19
GND
GND
-
20
GND
GND
-
Note:
SWD debugging ports are on the bottom side of the module, which is not pulled out in the stamp half hole way, please
refer to the module pin diagram for details.

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3 Specifications
3.1 Recommended Operating Conditions
The functional operation does not guarantee performance beyond the limits of the conditional parameter values in the
table below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-ND09A
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
1.7
3.3
3.6
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-ND09A
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±4000
V
Moisture Sensitivity Level
2
Charged Device Model
±750
V

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-BM-ND09A
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-BM-ND09A (mm)

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-BM-ND09A
4.4 Antenna
4.4.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna is a key factor to increase the data rate and transmission range.

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Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.
Figure 7. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power
supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,

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high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example, USB 3.0.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The
performances of ground absorption and reflection of radio waves will be poor when the module is tested close to the
ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is a metal near the antenna or the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in an open-air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of the antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure suitable humidity during installation and application. If
there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.

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4.7 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing the failure.
4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s

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Figure 8. Recommended Reflow for Lead-Free Solder
4.9 Optional Packaging
Figure 9. Optional Packaging Mode
Note: Default tray packaging.

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5 Revision History
Date
Version No.
Description
2020.11.02
V1.0
The initial version is released.
Note:
1. The document will be optimized and updated from time to time. Before using this document, please make sure it is
the latest version.
2. To obtain the latest document, please download it from the official website: www.szrfstar.com.

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6 Contact Us
SHENZHEN RF-STAR TECHNOLOGY CO., LTD.
Shenzhen HQ:
Add.: C601, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China，518057
Tel.: [phone]
Chengdu Branch:
Add.: B3-03, Building No.1, Incubation Park, High-Tech District, Chengdu, Sichuan, China, 610000
Tel.: [phone]
Email: [e-mail], [e-mail]
Web.: www.szrfstar.com