RF-Star RF-WM-3235A1S User manual

RF-WM-3235A1S
2.4 GHz & 5 GHz Dual-Band Wi-Fi Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Jun. 18th, 2020

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Wi-Fi Module List
Chipset
Core
RAM
(KB)
Tx
Power
(dBm)
Model
FLASH
(Byte)
Antenna
Dimension
(mm)
Distance
(m)
Photo
CC3235S
M4
256
18
RF-WM-
3235A1S
4M
PCB
20.5 25.0
100
M4
256
18
RF-WM-
3235B1S
4M
Half-hole
20.5 17.5
100
CC3235SF
M4
256
18
RF-WM-
3235A1
4M +
1M embedded
PCB
20.5 25.0
100
M4
256
18
RF-WM-
3235B1
4M +
1M embedded
Half-hole
20.5 17.5
100
CC3200
M4
256
17
RF-WM-
3200B1
1M
Chip
20 31
100
RF-WM-
3200B1I
1M
IPEX
20 31
150
Conta
ct Me
RF-WM-
3200B2
16M
Chip
20 31
100
RF-WM-
3200B3
1M
Half-hole
20.5 17.5
100
CC3220
M4
256
17
RF-WM-
3220B1
4M
Chip /
IPEX
20 31
100
RTL8710AF
M3
512
17
RF-WM-
10AFB1
1M
IPEX
20 23
100
RTL8711AF
M3
512
17
RF-WM-
11AFB1
1M
IPEX
20 23
100
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.
3. All modules with PCB / Chip antenna and IPEX connector are dispatched with PCB / Chip antenna only by default. If
IPEX connector is needed, pls check with me before quotation.

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1 Device Overview
1.1 Description
RF-WM-3235A1S is an RF module based on TI lower-power SoC CC3235S with built-in dual-band Wi-Fi connectivity.
It integrates a 40 MHz crystal, 32.768 kHz RTC clock, RF filters, diplexer, and two physical separated on-chip MCUs:
Arm®Cortex®-M4 MCU with a user-dedicated 256 KB of RAM, an external plug-in 4 MB Flash, network processor for
running Wi-Fi and Internet logical layers. It features 802.11 a/b/g/n: 2.4 GHz and 5 GHz support, 2.4 GHz Coexistence
with Bluetooth low energy radio, improved fast scan, hostless mode for offloading template packet transmissions and
application features of small size, robust connection distance, and rigid reliability.
1.2 Key Features
•Multiple-core architecture, system-on-chip
(SoC)
•802.11 a/b/g/n: 2.4 GHz and 5 GHz
•Coexistence with 2.4 GHz Radios
•Application microcontroller subsystem:
- Arm®Cortex® -M4 core at 80 MHz
User-dedicated memory:
➢256 KB RAM
- an external plug-in 4 MB Flash
- 27 I/O pins with flexible multiplexing options
➢UART, I2S, I2C, SPI, SD, ADC, 8-bit
parallel interface
➢Timers and PWM
•Wi-Fi network processor subsystem:
- Wi-Fi® core:
- 802.11 a/b/g/n 2.4 GHz and 5 GHz
- Modes:
➢Access Point (AP)
➢Station (STA)
➢Wi-Fi Direct®(only supported on 2.4 GHz)
- Security:
➢WEP
➢WPA™/WPA2™PSK
➢WPA2 Enterprise
- Internet and application protocols:
➢HTTPs server, mDNS, DNS-SD, DHCP
➢IPv4 and IPv6 TCP/IP stack
➢16 BSD sockets
•Multilayered security features:
- Separate execution environments
- Networking security
- Device identity and key
- Hardware accelerator cryptographic engines
(AES, DES, SHA/MD5, CRC)
- Application-level security (encryption,
authentication, access control)
- Initial secure programming
- Software tamper detection
- Secure boot
- Certificate signing request (CSR)
- Unique per device key pair
•Application throughput:
- UDP: 16 Mbps
- TCP: 13 Mbps
- Peak: 72 Mbps
•Power-Management Subsystem:
- Integrated DC/DC converters support a wide
range of supply voltage:

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➢Single wide-voltage supply, VBAT: 2.3 V ~
3.6 V
- Advanced low-power modes:
➢Shutdown: 1 µA, hibernate: 4.5 µA
➢Low-power deep sleep (LPDS): 120 µA
➢Idle connected (MCU in LPDS): 710 µA
➢RX traffic (MCU active): 59 mA
- TX traffic (MCU active): 223 mA
1.3 Applications
•HVAC Systems & Thermostat
•Video Surveillance, Video Doorbells, and
Low-Power Camera
•Building Security Systems & E-locks
•Appliances
•Asset Tracking
•Factory Automation
•Medical and Healthcare
•Grid Infrastructure
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-WM-3235A1S
CC3235S
PCB Antenna
Combiner
GPIOs
VCC
GND
40.0 MHz
32.768 kHz
Reset
Power
Management
System
BPF
BPF
5.0 GHz
2.4 GHz

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1.5 Part Number Conventions
The part numbers are of the form of RF-WM-3235A1S where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-WM-3235A1S
RF
WM
3235
Company Name
RF-STAR
Wireless Type
Wi-Fi Module
Chipset
TI CC3235S
-
-
A1S
Module Version
CC3235S Antenna Version

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Table of Contents
Wi-Fi Module List................................................................................................................................................................ 1
1 Device Overview............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features....................................................................................................................................................... 2
1.3 Applications.......................................................................................................................................................... 3
1.4 Functional Block Diagram.............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 4
Table of Contents................................................................................................................................................................ 5
Table of Figures................................................................................................................................................................... 6
Table of Tables..................................................................................................................................................................... 7
2 Module Configuration and Functions...................................................................................................................... 8
2.1 Module Parameters........................................................................................................................................... 8
2.2 Module Pin Diagram......................................................................................................................................... 9
2.3 Pin Functions....................................................................................................................................................... 9
3 Specifications.................................................................................................................................................................12
3.1 Absolute Maximum Ratings.........................................................................................................................12
3.2 Recommended Operating Conditions .....................................................................................................12
3.3 Current Consumption Summary................................................................................................................12
3.3.1 Current Consumption Summary (2.4 GHz RF Band)...........................................................12
3.3.2 Current Consumption Summary (5 GHz RF Band)...............................................................14
3.4 TX Power Control for 2.4 GHz Band........................................................................................................16
3.5 TX Power Control for 5 GHz Band............................................................................................................17
3.6 WLAN Receiver Characteristics.................................................................................................................17
3.7 WLAN Transmitter Characteristics............................................................................................................18
4 Application, Implementation, and Layout.............................................................................................................20
4.1 Module Photos..................................................................................................................................................20
4.2 Recommended PCB Footprint....................................................................................................................20
4.3 Schematic Diagram.........................................................................................................................................21
4.4 Basic Operation of Hardware Design ......................................................................................................21
4.5 Trouble Shooting..............................................................................................................................................23

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4.5.1 Unsatisfactory Transmission Distance........................................................................................23
4.5.2 Vulnerable Module..............................................................................................................................23
4.5.3 High Bit Error Rate.............................................................................................................................23
4.6 Electrostatics Discharge Warnings...........................................................................................................23
4.7 Soldering and Reflow Condition.................................................................................................................24
4.8 Optional Packaging.........................................................................................................................................25
5 Revision History............................................................................................................................................................26
6 Contact Us.......................................................................................................................................................................27
Table of Figures
Figure 1. Functional Block Diagram of RF-WM-3235A1S......................................................................... 3
Figure 2. Part Number Conventions of RF-WM-3235A1S........................................................................ 4
Figure 3. Pin Diagram of RF-WM-3235A1S................................................................................................... 9
Figure 4. TX Power and IBAT vs TX Power Level Settings (1 DSSS)................................................16
Figure 5. TX Power and IBAT vs TX Power Level Settings (6 OFDM)...............................................16
Figure 6. TX Power and IBAT vs TX Power Level Settings (54 OFDM)............................................17
Figure 7. Photos of RF-WM-3235A1S............................................................................................................20
Figure 8. Recommended PCB Footprint of RF-WM-3235A1S (Top View) (mm)...........................20
Figure 9. Schematic Diagram of RF-WM-3235A1S...................................................................................21
Figure 10. Recommendation of Antenna Layout.........................................................................................22
Figure 11. Recommended Reflow for Lead Free Solder .........................................................................25
Figure 12. Optional Packaging Mode..............................................................................................................25

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Table of Tables
Table 1. Parameters of RF-WM-3235A1S....................................................................................................... 8
Table 2. Pin Functions of RF-WM-3235A1S................................................................................................... 9
Table 3. Absolute Maximum Ratings................................................................................................................12
Table 4. Recommended Operating Conditions of RF-WM-3235A1S..................................................12
Table 5. The Table of Current Consumption Summary 2.4 GHz RF Band........................................12
Table 6. The Table of Current Consumption Summary 5 GHz RF Band...........................................14
Table 7. WLAN Receiver Characteristics: 2.4 GHz Band........................................................................17
Table 8. WLAN Receiver Characteristics: 5 GHz Band............................................................................18
Table 9. WLAN Transmitter Characteristics: 2.4 GHz Band...................................................................18
Table 10. WLAN Transmitter Characteristics: 5 GHz Band....................................................................19
Table 11. Temperature Table of Soldering and Reflow .............................................................................24

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-WM-3235A1S
Chipset
CC3235S
Supply Power Voltage
2.7 V ~ 3.6 V, 3.3 V is recommended
Frequency
2.4 GHz, 5 GHz
Transmit Power
+18.0 dBm @ 2.4 GHz (1 DSSS)
+18.1 dBm @ 5 GHz (6 OFDM)
Receiving Sensitivity
-96 dBm @ 2.4 GHz (1 DSSS)
-92 dBm @ 5 GHz (6 OFDM)
GPIO
27
Power Consumption
Shutdown: 1 µA, hibernate: 4.5 µA
Low-power deep sleep (LPDS): 120 µA
Idle connected (MCU in LPDS): 710 µA
RX traffic (MCU active): 59 mA
TX traffic (MCU active): 223 mA
Crystal
40 MHz
Package
LGA packaging
Communication Interface
UART, I2S, I2C, SPI, SD, ADC
Dimension
20.5 mm ×25.0 mm ×2.3 mm
Operating Temperature
-40 ℃~+85 ℃
Storage Temperature
-55 ℃~+125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-WM-3235A1S
2.3 Pin Functions
Table 2. Pin Functions of RF-WM-3235A1S
Pin
Name
Function
Description
1
GND
GND
Ground
2
GND
GND
Ground
3
GPIO10
GPIO
GPIO
4
GPIO11
GPIO
GPIO
5
GPIO14
GPIO
GPIO
6
GPIO15
GPIO
GPIO
7
GPIO16
GPIO
GPIO
8
GPIO17
GPIO
GPIO

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9
GPIO12
GPIO
GPIO
10
GPIO13
GPIO
GPIO
11
GPIO22
GPIO
GPIO
12
JTAG_TDI
TDI
JTAG interface: data input
13
FLASH_MISO
I
Serial flash interface: SPI data in
14
FLASH_CSN
CS
Serial flash interface: SPI chip select
15
FLASH_CLK
CLK
Serial flash interface: SPI clock
16
GND
GND
Ground
17
FLASH_MOSI
O
Serial flash interface: SPI data out
18
JTAG_TDO
TDO
JTAG interface: data output
19
GPIO28
GPIO
GPIO
20
NC
/
No Connect
21
JTAG_TCK
TCK
JTAG interface: clock
22
JTAG_TMS
TMS
JTAG interface: mode select
23
SOP2
SOP
Configuration sense-on-power
24
SOP1
SOP
Configuration sense-on-power and 5 GHz switch control
25
GND
GND
Ground
26
GND
GND
Ground
27
GND
GND
Ground
28
GND
GND
Ground
29
GND
GND
Ground
30
GND
GND
Ground
31
RF_ABG
RF Out
RF BG band: 2.4 GHz TX, RX
RF BG band: 5 GHz TX, RX
32
GND
GND
Ground
33
NC
/
No Connect
34
SOP0
SOP
Configuration sense-on-power and 5 GHz switch control
35
NRESET
RESET
Master chip reset input.Active low input.

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36
VBAT_RESET
RESET
VBAT reset input.Active low input.
37
VBAT1
Power
Power Supply: 2.7 V ~ 3.6 V, recommend to 3.3 V
38
GND
GND
Ground
39
NC
/
No Connect
40
VBAT2
Power
Power Supply
41
NC
/
No Connect
42
GPIO30
GPIO
GPIO
43
GND
GND
Ground
44
GPIO0
GPIO
GPIO
45
NC
/
No Connect
46
GPIO1
GPIO
GPIO
47
GPIO2
GPIO
Analog input (1.5 V max.) or GPIO
48
GPIO3
GPIO
Analog input (1.5 V max.) or GPIO
49
GPIO4
GPIO
Analog input (1.5 V max.) or GPIO
50
GPIO5
GPIO
Analog input (1.5 V max.) or GPIO
51
GPIO6
GPIO
GPIO
52
GPIO7
GPIO
GPIO
53
GPIO8
GPIO
GPIO
54
GPIO9
GPIO
GPIO
55
GND
/
Thermal ground
56
GND
/
Thermal ground
57
GND
/
Thermal ground
58
GND
/
Thermal ground
59
GND
/
Thermal ground
60
GND
/
Thermal ground
61
GND
/
Thermal ground
62
GND
/
Thermal ground
63
GND
/
Thermal ground

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3 Specifications
3.1 Absolute Maximum Ratings
Table 3. Absolute Maximum Ratings
Identification
Condition
Min.
Typ.
Max.
Unit
Supply Voltage
VBAT and VIO
-0.5
3.3
3.8
V
VIO ~ VBAT (differential)
VBAT and VIO should be tied together
V
RF Pins
/
-0.5
1.8
2.1
V
Operating Temperature
/
-40
25
85
℃
Storage Temperature
/
-55
25
125
℃
3.2 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 4. Recommended Operating Conditions of RF-WM-3235A1S
Items
Condition
Min.
Typ.
Max.
Unit
Supply Voltage
VBAT, VIO (shorted to VBAT)
2.7
3.3
3.6
V
Ambient thermal slew
/
-20
/
20
℃
Notes:
(1) Operating temperature is limited by crystal frequency variation.
(2) To ensure WLAN performance, ripple on the supply must be less than ±300 mV.
(3) The minimum voltage specified includes the ripple on the supply voltage and all other transient dips. The brownout
condition is also 2.3 V, and care must be taken when operating at the minimum specified voltage.
3.3 Current Consumption Summary
3.3.1 Current Consumption Summary (2.4 GHz RF Band)
Table 5. The Table of Current Consumption Summary 2.4 GHz RF Band
When measured on the RF-WM-3235A1S reference design with TA= 25 ℃, VBAT= 3.6 V with DC/DC enabled unless
otherwise noted.
Parameter
Test Conditions
Typ.
Unit
MCU ACTIVE
NWPACTIVE
TX
1 DSSS
TX power level = 0
272
mA
TX power level = 4
190
mA

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6 OFDM
TX power level = 0
248
mA
TX power level = 4
182
mA
54 OFDM
TX power level = 0
223
mA
TX power level = 4
160
mA
RX
1 DSSS
59
mA
54 OFDM
59
mA
NWP idle connected
15.3
mA
MCU SLEEP
NWPACTIVE
TX
1 DSSS
TX power level = 0
269
mA
TX power level = 4
187
mA
6 OFDM
TX power level = 0
245
mA
TX power level = 4
179
mA
54 OFDM
TX power level = 0
220
mA
TX power level = 4
157
mA
RX
1 DSSS
56
mA
54 OFDM
56
mA
NWP idle connected
12.2
mA
MCU LPDS
NWPACTIVE
TX
1 DSSS
TX power level = 0
266
mA
TX power level = 4
184
mA
6 OFDM
TX power level = 0
242
mA
TX power level = 4
176
mA
54 OFDM
TX power level = 0
217
mA
TX power level = 4
154
mA
RX
1 DSSS
53
mA
54 OFDM
53
mA
NWP LPDS
120 µA at 64 KB
135 µA at 256 KB
135
µA

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NWP idle connected
710
µA
MCU
SHUTDOWN
MCU shutdown
1
µA
MCU
HIBERNATE
MCU hibernate
4.5
µA
Peak calibration current
VBAT = 3.6 V
420
mA
VBAT = 3.3 V
450
mA
VBAT = 2.7 V
670
mA
Notes:
(1) TX power level = 0 implies maximum power. TX power level = 4 implies output power backed off approximately 4
dB.
(2) The RF-WM-3235A1S system is a constant power-source system. The active current numbers scale based on the
VBAT voltage supplied.
(3) Typical numbers assume a VSWR of 1.5 : 1.
(4) DTIM = 1.
(5) LPDS current does not include the external serial flash. The RF-WM-3235A1S device can be configured to retain 0
KB, 64 KB, 128 KB, 192 KB, or 256 KB of SRAM in LPDS. Each 64 KB block of MCU retained SRAM increases LPDS
current by 4 µA.
(6) The complete calibration can take up to 17 mJ of energy from the battery over a period of 24 ms. Calibration is
performed sparingly, typically when coming out of HIBERNATE and only if temperature has changed by more than
20 °C. The calibration event can be controlled by a configuration file in the serial flash.
3.3.2 Current Consumption Summary (5 GHz RF Band)
Table 6. The Table of Current Consumption Summary 5 GHz RF Band
When measured on the RF-WM-3235A1S reference design with TA= 25 °C, VBAT = 3.6 V with DC/DC enabled unless
otherwise noted.
Parameter
Test Conditions
Typ.
Unit
MCU ACTIVE
NWPACTIVE
TX
6 OFDM
318
mA
54 OFDM
293
mA
RX
54 OFDM
67
mA

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NWP idle connected
15.3
mA
MCU SLEEP
NWPACTIVE
TX
6 OFDM
315
mA
54 OFDM
290
mA
RX
54 OFDM
64
mA
NWP idle connected
12.2
mA
MCU LPDS
NWPACTIVE
TX
6 OFDM
312
mA
54 OFDM
287
mA
RX
54 OFDM
61
mA
NWP LPDS
120 µA at 64 KB
135 µA at 256 KB
135
µA
NWP idle connected
710
µA
MCU
SHUTDOWN
MCU shutdown
1
µA
MCU
HIBERNATE
MCU hibernate
4.5
µA
Peak calibration current
VBAT = 3.6 V
290
mA
VBAT = 3.3 V
310
mA
VBAT = 2.7 V
310
mA
Notes:
(1) Measurements taken at maximum TX power.
(2) The RF-WM-3235A1S system is a constant power-source system. The active current numbers scale based on the
VBAT voltage supplied.
(3) Typical numbers assume a VSWR of 1.5 : 1.
(4) DTIM = 1.
(5) LPDS current does not include the external serial flash. The RF-WM-3235A1S device can be configured to retain 0
KB, 64 KB, 128 KB, 192 KB, or 256 KB of SRAM in LPDS. Each 64 KB block of MCU retained SRAM increases LPDS
current by 4 µA.
(6) The complete calibration can take up to 17 mJ of energy from the battery over a period of 24 ms. Calibration is
performed sparingly, typically when coming out of HIBERNATE and only if temperature has changed by more than 20°C.

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The calibration event can be controlled by a configuration file in the serial flash.
3.4 TX Power Control for 2.4 GHz Band
The RF-WM-3235A1S has several options for modifying the output power of the device when required. For 2.4 GHz
band, it is possible to lower the overall output power at a global level using the global TX power level setting.
Figure 3, Figure 4, and Figure 5 show TX Power and IBAT versus TX power level settings for the RF-WM-3235A1S
module at modulations of 1 DSSS, 6 OFDM, and 54 OFDM, respectively.
In Figure 3, the area enclosed in the circle represents a significant reduction in current during transition from TX power
level 3 to level 4. In the case of lower range requirements (14 dBm output power), RF-Star recommends using TX
power level 4 to reduce the current.
Figure 4. TX Power and IBAT vs TX Power Level Settings (1 DSSS)
Figure 5. TX Power and IBAT vs TX Power Level Settings (6 OFDM)

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Figure 6. TX Power and IBAT vs TX Power Level Settings (54 OFDM)
3.5 TX Power Control for 5 GHz Band
5 GHz power control is done via Image Creator where the maximum transmit power is provided (the maximum transmit
power range is 18dBm to 0.125 dBm in 0.125 dBm decrements). Within Image Creator, power control is possible per
channel, region, and modulation rates. In addition, it is possible to enter an additional back-off factor per channel and
modulation rate for further margin to regulatory requirements.
3.6 WLAN Receiver Characteristics
Table 7. WLAN Receiver Characteristics: 2.4 GHz Band
TA= 25°C, VBAT = 2.7 V to 3.6 V. Parameters are measured at the SoC pin on channel 6 (2437 MHz).
Parameter
Test Conditions
Typ.
Unit
Sensitivity
(8% PER for 11b rates, 10% PER for 11g/11n rate) (1)
1 DSSS
-94.5
dBm
2 DSSS
-92.5
11 CCK
-86.5
6 OFDM
-89
9 OFDM
-88.5
18 OFDM
-85
36 OFDM
-79
54 OFDM
-73
MCS7 (GF) (2)
-70
Maximum Input Level (10% PER)
802.11b
-2.5
dBm

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802.11g
-8.5
(1) Sensitivity is 1-dB worse on channel 13 (2472 MHz).
(2) Sensitivity for mixed mode is 1-dB worse.
Table 8. WLAN Receiver Characteristics: 5 GHz Band
TA= 25°C, VBAT = 2.7 V to 3.6 V.
Parameter
Test Conditions
Typ.
Unit
Sensitivity
(10% PER for 11g/11n rates)
6 OFDM
-89
dBm
9 OFDM
-88
18 OFDM
-85
36 OFDM
-78.5
54 OFDM
-72
MCS7 (GF) (1)
-68
Maximum Input Level
802.11a
-17
dBm
Notes:
(1) Sensitivity for mixed mode is 1-dB worse.
3.7 WLAN Transmitter Characteristics
Table 9. WLAN Transmitter Characteristics: 2.4 GHz Band
TA= 25°C, VBAT = 2.7 V to 3.6 V. Parameters measured at SoC pin on channel 6 (2437 MHz).
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Operating Frequency Range
/
2412
2472
MHz
Maximum RMS Output Power Measured at 1
dB from IEEE Spectral Mask or EVM
1 DSSS
16
dBm
2 DSSS
16
11 CCK
16.3
6 OFDM
15.3
9 OFDM
15.3
18 OFDM
15
36 OFDM
14
54 OFDM
12.5
MCS7
11
Transmit Center Frequency Accuracy
/
-25
25
ppm

RF-WM-3235A1S
www.szrfstar.com V1.0 - Jun., 2020
Shenzhen RF-star Technology Co., Ltd. Page 19 of 28
Table 10. WLAN Transmitter Characteristics: 5 GHz Band
TA = 25°C, VBAT = 2.7 V to 3.6 V. Parameters measured at SoC pin are the average of channels 40, 56, 120, and 157.
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Operating Frequency Range
/
5180
5825
MHz
Maximum RMS Output Power
Measured at 1 dB from IEEE
Spectral Mask or EVM
6 OFDM
15.1
dBm
9 OFDM
15.1
18 OFDM
15.1
36 OFDM
13.6
54 OFDM
12
MCS7
11
Transmit Center Frequency
Accuracy
/
-20
20
ppm
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