RF-CC2540A1
www.szrfstar.com V1.1 - May, 2020
Shenzhen RF-star Technology Co., Ltd. Page 4 of 19
Table of Contents
TI CC254X BLE Module List .......................................................................................................................................... 1
1 Device Overview............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features ....................................................................................................................................................... 2
1.3 Applications.......................................................................................................................................................... 2
1.4 Functional Block Diagram .............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
Table of Figures................................................................................................................................................................... 5
Table of Tables..................................................................................................................................................................... 5
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
2.3 Pin Functions....................................................................................................................................................... 7
3 Specifications ................................................................................................................................................................... 9
3.1 Recommended Operating Conditions ....................................................................................................... 9
3.2 Handling Ratings................................................................................................................................................ 9
3.3 Receiver RF Parameters ................................................................................................................................ 9
3.4 Transceiver RF Parameters.........................................................................................................................10
4 Application, Implementation, and Layout.............................................................................................................12
4.1 Module Photos..................................................................................................................................................12
4.2 Recommended PCB Footprint....................................................................................................................12
4.3 Schematic Diagram.........................................................................................................................................13
4.4 Basic Operation of Hardware Design ......................................................................................................13
4.5 Trouble Shooting..............................................................................................................................................15
4.5.1 Unsatisfactory Transmission Distance........................................................................................15
4.5.2 Vulnerable Module..............................................................................................................................15
4.5.3 High Bit Error Rate .............................................................................................................................15
4.6 Electrostatics Discharge Warnings ...........................................................................................................15
4.7 Soldering and Reflow Condition.................................................................................................................16
