Rockwell Automation 871C-D NP Series User manual

871C Miniature Inductive Sensors with IO-Link Interface
871C-D*NP*-**, 871C-DM*NP*-**, 871C-M*NP*-**, 871C-MM*NP*-**
User Manual

Important User Information
Read this document and the documents listed in the additional resources section about installation,
configuration, and operation of this equipment before you install, configure, operate, or maintain this product.
Users are required to familiarize themselves with installation and wiring instructions in addition to
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Activities including installation, adjustments, putting into service, use, assembly, disassembly, and
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If this equipment is used in a manner not specified by the manufacturer, the protection provided by the
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The examples and diagrams in this manual are included solely for illustrative purposes. Because of the many
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damage, or economic loss. Attentions help you identify a hazard, avoid a hazard, and recognize the consequence.
IMPORTANT
Identifies information that is critical for successful application and understanding of the product.
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Rockwell Automation Publication 871C-UM001A-EN-P - September 2015 iii
Table of Contents
1. Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Correction Factors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Wiring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
3. Miniature Inductive Sensor with IO-Link Overview . . . . . . . . . . . . 8
What Is IO-Link? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Why IO-Link? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
How Does IO-Link Work?. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
IO-Link Data Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Accessing IO-Link Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Start-up of the I/O System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Assigning Device Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Rockwell Automation Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Premier Integration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
871C IO-Link Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Automatic Device Configuration (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
4. Setting up the 871C for IO-Link Mode. . . . . . . . . . . . . . . . . . . . . . . . 16
Example: Set Up of the Hardware. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
5. Creating a Project . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6. Configuring IO-Link Master. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7. Connecting the 871C to the IO-Link Master . . . . . . . . . . . . . . . . . . 27
8. Registering the 871C IODD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
9. Reviewing the 1734-4IOL IO-Link AOP . . . . . . . . . . . . . . . . . . . . . . . 43
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Common Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Identification Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Parameter Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Diagnosis Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Controller Tags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Other Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Automatic Device Configuration (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
10. Setting up the Sensor with Studio 5000. . . . . . . . . . . . . . . . . . . . . 55
Sample Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
11. Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Appendix A—Installing the Add-on Profile. . . . . . . . . . . . . . . . . . . . . 71
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
Performing the Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
Appendix B—Device Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
Parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Process Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77

iv Rockwell Automation Publication 871C-UM001A-EN-P - September 2015
Table of Contents
Appendix C—Error Codes and Events . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Appendix D—Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80

Rockwell Automation Publication 871C-UM001A-EN-P - September 2015 1
Chapter 1
Product Overview
Product Description The 871C miniature inductive sensor reliably detects the presence of ferrous
(iron) metals. Due to its small size, the 871C is targeted for small spaces in
applications where a typical inductive-proximity switch would not fit.
The IO-Link interface enables consistent communication for diagnosing and
parameterizing through to the sensor level and makes the intelligence that is
already integrated in every 871C inductive sensor fully available to the user. This
provides particular advantages in the service area (fault elimination,
maintenance, and device replacement) during commissioning (identification,
and configuration) and during operation (continuous parameter monitoring and
online diagnosis).
The 871C sensor operates as a standard discrete sensor on pin four (black) or
communicates via IO-Link on the same pin when connected to an IO-Link
master.
Operating Modes The sensor can operate in two modes:
Standard IO (SIO) Mode: The sensor default operation-mode. This mode of
operation is active when the sensor is connected to digital input devices such as a
PLC input module, a distribution box, or input terminal connection.
IO-Link Mode: This mode is automatically activated when the sensor is
connected to an IO-Link enabled master device. Upon entering this mode, the
yellow light-emitting diode (LED) on the sensor stays solid to indicate that 
IO-Link communication has been successfully established with the master. The
sensor transmits more parameter and diagnostic information that can be accessed
via the PLC process data. No user intervention is required to enable this
functionality within the sensor.
Features •10…30V DC operating voltage
•Stainless steel housing
•Smooth and threaded barrels
•IP67 rated
•Cable, three-pin pico, and pico six-inch lead connection styles
•High switching frequency

2 Rockwell Automation Publication 871C-UM001A-EN-P - September 2015
Product Overview
•IO-Link communication protocol helps minimize downtime and increase
productivity.
•IO-Link sensors are forward/backward compatible with standard sensors:
the same sensors and same cables that are used in IO-Link and 
non-IO-Link applications.
•IO-Link provides
–Remote detection of the health of the sensor
–Margin status (low alarm)
–Timer function
–Counter-function

Rockwell Automation Publication 871C-UM001A-EN-P - September 2015 3
Product Overview
Specifications

These products have been tested to comply with IO-Link test specification IEC 61131-9, note environmental EMC and Physical Layer
testing have not been performed with the device running in IO-Link mode.
3 mm Smooth Barrel and
4 mm Threaded Barrel
4 mm Smooth Barrel and
5 mm Threaded Barrel
Certifications UL Listed and CE Marked for all applicable directives
Environmental
Operating Environment NEMA 1, 2, 3, 4, 12, 13; IP67 (IEC 529)
Operating Temperature [C (F)] -25…+70° (-13…+158°)
Vibration 10…55 Hz, 1 mm amplitude, 3 planes
Shock 30 g, 11 ms
Electrical
Load Current 100 mA <200 mA
Leakage Current 0.1 mA
Operating Voltage 10…30V DC
Voltage Drop 2V
Repeatability 5%
Hysteresis 10% typical
Protection Type False pulse, transient noise, reverse polarity, and short circuit
IO-Link
Protocol IO-Link V1.0
Interface Type IO-Link
Mode COM 2 (38.4 kBaud)
Cycle Time 10.4 ms, minium
SIO (standard I/O) Supported (pin 4 for either IO-Link or SIO)
Mechanical
Housing Material Stainless steel barrel, polyester face
LED (SIO mode) Yellow: Output energized
LED (IO-Link Mode) Solid yellow: Sensor in IO-Link mode
Connection Type Cable, pico QD, or pico with lead

4 Rockwell Automation Publication 871C-UM001A-EN-P - September 2015
Product Overview
To determine the sensing distance for materials other than standard mild steel, a
correction factor is used. The correction factors can be used as a general guideline
for determining the de-rated sensing distance, if applicable.
Correction Factors
Sensor Type/
Target Material
Smooth Smooth or Threaded Threaded
3 mm Dia.,
0.6 mm Sr
3 mm Dia.,
1.0 mm Sr
4 mm Dia.,
0.8mm Sr
4 mm Dia.,
1.5mm Sr
5 mm Dia.,
1 mm Sr
5 mm Dia.,
1.5 mm Sr
Steel 111111
Copper 0.5 0.45 0.45 0.4 0.45 0.4
Aluminum 0.55 0.5 0.5 0.4 0.5 0.4
Brass 0.65 0.6 0.55 0.5 0.55 0.5
Stainless Steel 304 0.8 0.8 0.8 0.75 0.8 0.75

Rockwell Automation Publication 871C-UM001A-EN-P - September 2015 5
Installation
Chapter 2
Installation
User Interface LED Status
Standard IO Operation
IO-Link Operation
Mounting Securely mount the sensor on a firm, stable surface, or support for reliable
operation. A mounting subject to excessive vibration or shifting could cause
intermittent operation. Once securely mounted, the sensor can be wired per the
wiring instructions in the next section.
The user might need to adjust the sensor in the mounting due to the location of
the target in relation to the sensor face. The 871C offers margin indication
through the yellow LED. The LED blinks when the target is 80% of the
maximum sensing distance or farther from the sensor face. It is recommended
the user adjust the sensor to be closer to the target.
LED Color State Condition
Yellow
OFF Output is OFF
Solid Sensor output is triggered ON
Blinking (margin indication) Target is 80…100% of the maximum
sensing range
LED Color State Condition
Yellow OFF Power is OFF
Solid Sensor is connected to IO-Link master
IMPORTANT
When the sensor is connected to IO-Link, the LED will not indicate margin
status. The margin status is shown as a process bit in Studio 5000 tag.

6 Rockwell Automation Publication 871C-UM001A-EN-P - September 2015
Installation
Dimensions The following illustration shows the relevant device dimensions.
Cable Style
Pico Style [mm (in.)]
Barrel
Diameter Thread Size Shielded
Thread Length [mm (in.)]
A B C
3.0 —
Yes
3.0 (0.12) 22.0 (0.87) —
4.0 — 4.0 (0.16) 25.0 (0.98) —
4.0 M4 x 0.5 4.0 (0.16) 22.0 (0.87) 19.0 (0.75)
5.0 M5 x 0.5 5.0 (0.20) 25.0 (0.98) 20.0 (0.79)
Barrel
Diameter Thread Size Shielded
[mm (in.)]
A B C
4.0 — Yes 4.0 (0.16) 38.0 (1.50) 19.0 (0.75)
5.0 M5 x 0.5 5.0 (0.20) 38.0 (1.50) 23.0 (0.90)
A
B
2 m (6.5 ft)
LED
A
B
2 m (6.5 ft)
LED
C
A
B
C
LED
A
B
C
LED

Rockwell Automation Publication 871C-UM001A-EN-P - September 2015 7
Installation
Pico with Lead Style
Wiring
Rockwell Automation® recommends the use of the 889 Series of cordsets and
patchcords for quick-disconnect (QD) model sensors. All external wiring must
conform to the National Electric Code and all applicable local codes.
Barrel Diameter Shielded
[mm (in.)]
A B C
3.0 Yes 3.0 (0.12) 22.0 (0.87) —
4.0 4.0 (0.16) 22.0 (0.87) 19.0 (0.74)
A
B
LED
152 mm
(6.00 in.)
AB
C
LED
152 mm
(6.00 in.)
Pin Signal Description
1 +10…30V DC Device supply
3GND
GND for device
4LOADIO-Link/Output/SIO
BU
BK
1
4
3
BN +
-
4
31
DC

8 Rockwell Automation Publication 871C-UM001A-EN-P - September 2015
Miniature Inductive Sensor with IO-Link Overview
Chapter 3
Miniature Inductive Sensor with 
IO-Link Overview
What Is IO-Link? The IO-Link technology is an open point-to-point communication standard and
was launched as (IS) IEC 61131-9. IO-Link is now the first globally standardized
technology for sensor and actuator communication with a field bus system. This
technology provides benefits to both OEMs and End Users.
IO-Link provides communications-capable sensors to the control level by a cost-
effective point-to-point connection. IO-Link provides a point-to-point link
between the I/O module and sensor that is used for transferring detailed
diagnostics, device identity information, process data, and parameterization.
IO-Link communication is based on a master-slave structure in which the master
controls the interface access to the sensor. Using the intelligence that is
integrated into the sensor provides the user with new commissioning methods.
Benefits range from reduced installation time during startup to increased
diagnostics over the lifetime of the machine. Benefits of IO-Link technology
include:
•Reduced inventory and operating costs
•Increased uptime/productivity
•Simplified design, installation, set-up and maintenance
•Enhanced flexibility and scalability
•Detailed diagnostic information for preventative maintenance
Why IO-Link? IO-Link Offers a Full Range of Advanced Features and Functions
Seamless Integration
•Forward and backward compatible, sensor catalog numbers remain the
same
•No special cables required
•Connectivity options remain the same
•Access IO-Link functionality by simply connecting an IO-Link enabled
device to an IO-Link master

Rockwell Automation Publication 871C-UM001A-EN-P - September 2015 9
Miniature Inductive Sensor with IO-Link Overview
Real-time Diagnostics and Trending
•Real-time monitoring of the entire machine down to the sensor level
•Optimized preventative maintenance—identify and correct issues before
failures can occur
•Detect sensor malfunctions/failure
Sensor Health Status
•Real-time monitoring ensures that sensors are operating correctly
Device Profiles and Automatic Device Configuration
•“Golden” device configurations are stored in the IO-Link master module
•Within minutes instead of hours, modify sensor parameters to produce
different finished goods
Descriptive tags
•Faster programming during initial setup
•More efficient troubleshooting process data tags are named based on the
information they provide
•Easily monitor sensor data though intuitive tag names
How Does IO-Link Work? IO-Link delivers data over the same standard field cabling used today. By
connecting an IO-Link sensor to an IO-Link master, the field-device data and
diagnostics are accessible. So go beyond detecting products on the machine—
now the health of the machine can be MONITORED as it runs.
Pin Signal Remark
1L+24V
2outDepends on sensor
3L-Ground
4C/Q
Communication/
switching signal
IMPORTANT
The response time of an IO-Link system may not be fast enough for high-speed
applications. In this case, it may be possible to monitor/configure the sensor
through IO-Link on pin 4 of the sensor while connecting pin 2 (if the sensor
offers a second output) of the sensor to a standard input card.

10 Rockwell Automation Publication 871C-UM001A-EN-P - September 2015
Miniature Inductive Sensor with IO-Link Overview
Transmission Rates
Three communication rates are specified for the IO-Link device:
•COM 1 = 4.8 kbaud
•COM 2 = 38.4 kbaud
•COM 3 = 230.4 kbaud
An IO-Link device typically supports only one of the specified transmissions
rates, while the IO-Link V1.1 specifications requires an IO-Link master to
support all three communication rates. (See Product Specifications for product
communication rate.)
Transmission Quality
The IO-Link communication system operates at a 24V level. If a transmission
fails, the frame is repeated two more times. If the transmission fails on the second
try, the IO-Link master recognizes a communication failure and signals it to the
controller.
Response Time of the I-O Link System
The device description file (IODD) of the device contains a value for the
minimum cycle time of the device. This value indicates the time intervals at
which the master might address the device. The value has a large influence on the
response time. In addition, the master has an internal processing time that is
included in the calculation of the system response time.
Devices with different minimum cycle times can be configured on one master.
The response time differs for these devices. When configuring the master, you
can specify a fixed cycle time and the device-specific minimum cycle time that is
stored in the IODD. The master then addresses the device that is based on this
specification. The typical response time for a device therefore results from the
effective cycle time of the device and the typical internal processing time of the
master. (See Product Specifications for minimum product cycle time.)
IO-Link Data Types There are four data types available through IO-Link:
Process data →Cyclic data
Value status →Cyclic data
Device data →Acyclic data
Events →Acyclic data

Rockwell Automation Publication 871C-UM001A-EN-P - September 2015 11
Miniature Inductive Sensor with IO-Link Overview
Process Data
The process data of the devices are transmitted cyclically in a data frame in which
the size of the process data is specified by the device. Depending on the device, 
0…32 bytes of process data are possible (for each input and output). The
consistency width of the transmission is not fixed and is thus dependent on the
master.
Some devices can support multiple process data “modes,” which allow the user to
select different cyclic process data themes.
Value Status
The value status indicates whether the process data is valid or invalid. The value
status can be transmitted cyclically with the process data.
Device Data
Device data supports device-specific configurable parameters, identification data,
and diagnostic information. They are exchanged acyclically and at the request of
the IO-Link master. Device data can be written to the device (Write) and also
read from the device (Read).
Events
When an event occurs, the device signals the presence of the event to the master.
The master then reads out the event. Events can be error messages and warnings/
maintenance data. Error messages are transmitted from the device to the
controller via the IO-Link master. The transmission of device parameters or
events occurs independently from the cyclic transmission of process data (see
Appendix C for device-specific events and associated codes).
Accessing IO-Link Data Cyclic Data
In order to exchange the cyclic process data between an IO-Link device and a
controller, the IO-Link data from the IO-Link master is placed on the address
ranges assigned beforehand. The user program on the controller accesses the
process values using these addresses and processes them. The cyclic data exchange
from the controller to the IO-Link device (for example, IO-Link sensor) is
performed in reverse.
Acyclic Data
Acyclic data, such as device parameters or events, are exchanged using a specified
index and subindex range. The controller accesses these using explicit messaging.
The use of the index and subindex ranges allows targeted access to the device data
(for example, for reassigning the device or master parameters during operation).

12 Rockwell Automation Publication 871C-UM001A-EN-P - September 2015
Miniature Inductive Sensor with IO-Link Overview
Start-up of the I/O System If the port of the master is set to IO-Link mode, the IO-Link master attempts to
communicate with the connected IO-Link device. To do so, the IO-Link master
sends a defined signal (wake up pulse) and waits for the IO-Link device to reply.
The IO-Link master initially attempts to communicate at the highest defined
data transmission rate. If unsuccessful, the IO-Link master then attempts to
communicate at the next lower data transmission rate.
If the master receives a reply, the communication begins. Next, it exchanges the
communication parameters. If necessary, parameters that are saved in the system
are transmitted to the device. Then, the cyclic exchange of the process data and
value status begins.
Assigning Device Parameters Setting up a device for a specific application requires changes to parameter
settings. The device parameters and setting values are contained in the IODD of
the device.
IO Device Description (IODD) files contain information about the device
identity, parameters, process data, diagnostic data, and communication
properties. These files are required to establish communication with the sensors
via IO-Link.
The IODD consists of multiple data files; the main file and several optional
language files are in XML-format and graphic files are in PNG format (portable
network graphics). These files adhere to the IO-Link open standard, which
means that they can be used with any IO-Link masters.
IODD files are assigned using Studio 5000 and the 1734-4IOL Add-on Profile
(when using the 1734-4IOL IO-Link master module).
Rockwell Automation
Solution
Overview and Benefits
Rockwell Automation is the only supplier who provides every piece of the
Connected Enterprise solution from top to bottom. Plus, exclusive features, and
Premier Integration between Allen-Bradley® components and an Integrated
Architecture system allow for a seamless connection and commission of control
components. Empowering the ability to reap the benefits of an IO-Link solution
with access to more detailed and customized plant-floor information than other
solutions can offer.

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Miniature Inductive Sensor with IO-Link Overview
Premier Integration The Studio 5000 Logix Designer™ environment combines design and
engineering elements in one interface, enabling users to access IO and
configuration data across the Integrated Architecture system. A Rockwell
Automation solution, provides a smooth, consistent integration of Allen-Bradley
IO-Link enabled devices into the system.
To simplify the integration of the Rockwell Automation IO-Link devices to the
Rockwell Automation architecture, there is an IO-Link Add-on Profile (AOP)
available for the 1734-4IOL master module. The use of an AOP simplifies the
setup of devices by providing the necessary fields in an organized manner that
allows users to set-up and configure their systems in a quick and efficient manner.

14 Rockwell Automation Publication 871C-UM001A-EN-P - September 2015
Miniature Inductive Sensor with IO-Link Overview
871C IO-Link Features These features are available in the 871C:
Triggered: Is the process data bit that communicates the change in state of the
871C upon the detection of a target. The status of the triggered bit can be viewed
in a Studio 5000 controller tag.
Polarity: Changes the operation of the triggered parameter. It performs the
same function as normally open or normally closed in standard I/O (SIO) mode.
Margin Status: Is the process data bit that communicates the target is within or
beyond 80% of the maximum sensing range of the sensor. The margin status bit
can be viewed in a Studio 5000 controller tag.
Switching Timer Mode: Ability to manipulate the output of the sensor in
relation to timing. It is useful for precision applications where the output must
be precisely triggered at a certain time.
Detection Counter: Counts when a target enters and leaves the sensing field of
the 871C sensor. The detection counter uses a least significant bit and most
significant bit for recording values.
Maximum Temperature: Provides maximum internal sensor temperature over
the sensor lifetime.
Actual Temperature Since Startup: Live internal sensor temperature when
read.

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Miniature Inductive Sensor with IO-Link Overview
Automatic Device
Configuration (ADC)
Replacing damaged sensors is easy. Simply remove the old Allen-Bradley sensor
and connect the new sensor (with the same catalog number) —the controller will
automatically send the configuration to the new sensor.
ADC capability within the sensor and controller enable flexibility and reliability
in your application. When the sensor becomes damaged or fails and needs to be
replaced, replace it with the exact same catalog number of the existing sensor.
When the damaged sensor is removed and the new sensor is plugged in, the
existing
configuration is automatically stored in the sensor through the IO-Link
Master. No additional steps are required on the sensor or in the controller. No
personal computer is required and reteaching the sensor is not required.
Tag Naming for I/O Data: Rockwell Automation system solutions provide tag
names that are based on the Allen-Bradley sensor connected. I/O data is
converted, formatted, and named based on the Allen-Bradley sensor applied.
Reduces commissioning time by the OEM and reduces troubleshooting time by
the end user when searching for sensor data. Consistent naming techniques used.
The Triggered and Margin Status as shown above are examples of consistent tag
names used across all Allen-Bradley sensors. These tag names give insightful and
descriptive meaning to the operation of the sensor output. The tags may change
depending on the type of sensor being used and the functionality within the
sensor.

16 Rockwell Automation Publication 871C-UM001A-EN-P - September 2015
Setting up the 871C for IO-Link Mode
Chapter 4
Setting up the 871C for IO-Link Mode
This chapter shows the physical hardware and software that is required to
configure the 871C through IO-Link and provides a simple guide to setting up
the hardware.
Products required:
Hardware
•871C-* (compatible parts are normally open, PNP)
•CompactLogix or ControlLogix PLC Platform
•POINT I/O Communications Interface: 1734-AENTR
•POINT I/O IO-Link Master Module: 1734-4IOL
•POINT I/O Terminal Base: 1734-TB
•RJ45 network cable for EtherNet/IP connectivity: 
1585J-M8TBJM-1M9*
•889P cordsets (optional): 889P-F3AB-2 (IO-Link maximum acceptable
cable length is 20 m)
Software:
•Studio 5000 environments, version 20 and higher
•Sensor specific IODD
•1734-4IOL IO-Link Add-on Profile (AOP)