Samsung GT-C3303 User manual

GSM TELEPHONE
GT-C3303
1. Safety Precautions
2. Specification
3. Product Function
4. Exploded View and Parts list
5. MAIN Electrical Parts List
6. Level 1Repair
7. Level 2Repair
8. Level 3Repair
9. Reference data
Notice :
All functionality, features, specifications and other
product information provided in this document inclu
ding, but not limited to, the benefits, design, pricing,
components, performance, availability, and capabiliti
-es of the product are subject to change without
notice or obligation. Samsung reserves the right to
make changes to this document and the product
described herein, at anytime, without obligation on
Samsung to provide notification of such change.
GSM TELEPHONE CONTENTS

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1. Safety Precautions
1-1
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1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because
specipicty of cellular phone is sensitive for surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

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2. Specification
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2-1
2-1. GSM General Specification
GSM 850 EGSM 900 DCS1800 PCS1900
Freq. Band[MHz]
Uplink/Downlink
824~849
869~894
880~915
925~960
1710~1785
1805~1880
1850~1910
1930~1990
ARFCN range 128~25 0~124 & 975~1023 512~885 512~810
Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz
Mod. Bit rate/
Bit Period
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot
Period/Frame
Period
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm
~5dBm
33dBm
~5dBm
30dBm
~0dBm
30dBm
~0dBm
Power Class 4
(max +33dBm)
4
(max +33dBm)
1
(max +30dBm)
1
(max +30dBm)
Sensitivity -102dBm -102dBm -100dBm -100dBm
TDMA Mux 8 8 8 8
Cell Radius 35Km 35Km 2Km 2Km

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Specification
2-2
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TX Power
control level
GSM850
GSM900
533±2
dBm
631±2
dBm
729±2
dBm
827±2
dBm
925±2
dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3 dBm
18 7±3 dBm
19 5±3 dBm
TX Power
control level DCS1800
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level PCS1900
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
2-2. GSM Tx Power Class

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3. Product Function
3-1
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Main Function
－UMTS, EDGE, GPRS
－64 Poly Melody
－BT 2.1
－USB 2.0
－WAP2.0, JAVA, MPEG4
－MMS /SMS
－Weight: 93.3g(
with standard battery :Product 73.3 g, Battery 20.0 g))
－Camera: VGA, CMOS
－LCD :2.4"TFT (QVGA)
－Size: 103.9 x 56.5 x 12.9 mm
－GPRS/EDGE :Class 10
－Battery: 1000 mAH
－Memory: 256MB/1G/256 MUXED
－Band: GSM 850/900/1800/1900
－BB: STE PNX4908
－RF: Skyworks SKY77548
－Dual Speaker

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4. Exploded View and Parts List
4-1
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4-1. Cellular phone Exploded View
QRE01
QST01
QFR01
QMO01
QSP01
QMP01
QLC01
QCK02
QKP01
QME01
QSP02
QCR67
QBA01
QBC00
QME03
QVO01
QRF06

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Exploded View and Parts List
4-2
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Design LOC Description SEC CODE
QCR67 SCREW-MACHINE 6001-002083
QMO01 MOTOR LINEAR VIBRATION-GT-C3300_MOTOR GH31-00501A
QBA01 INNER BATTERY PACK-1000MAH,BLK,ENG,EU GH43-03184A
QME01 DOME SHEET-GT-C3300 GH59-09280A
QME03 TOUCH/PANEL-GT-C3300 GH59-09281A
QSP02 MODULE-SPK+INT B( GT-C3300) GH59-09366A
QSP01 MODULE-SPK+INT A( GT-C3300) GH59-09367A
QST01 PMO ACCE-STYLUS PEN GH72-58591A
QMP01 A/S ASSY-PBA MAIN (COMM) GH82-05003A
QLC01 ASSY LCD-2.4" TN QVGA GT-C3300 ASS'Y GH96-04549A
QFR01 ASSY CASE-FRONT GH98-16378A
QBC00 ASSY COVER-BATT_NON_CAM GH98-17418A
QKP01 ASSY KEYPAD-SWA GH98-17540A
QRE01 ASSY CASE-REAR_NONCAM GH98-17444A
QRF06 PMO COVER-USB GH72-58587A
QVO01 PMO KEY-VOLUME GH72-58597A
QCK02 PMO KEY-HOLD GH72-58598A
4-2. Cellular phone Parts list

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5. MAIN Electrical Parts List
5-1
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SEC CODE Design LOC Discription
0403-001741 D305 DIODE-TVS
0406-001223 D301 DIODE-TVS
0406-001223 D302 DIODE-TVS
0406-001223 D303 DIODE-TVS
0406-001223 D304 DIODE-TVS
0406-001223 ZD308 DIODE-ZENER
0406-001223 ZD309 DIODE-ZENER
0406-001223 ZD310 DIODE-ZENER
0406-001223 ZD311 DIODE-ZENER
0406-001267 D200 DIODE-TVS
0406-001267 D201 DIODE-TVS
0406-001267 D202 DIODE-TVS
0406-001281 ZD301 DIODE-ZENER
0406-001281 ZD303 DIODE-ZENER
0406-001369 ZD304 DIODE-ZENER
0406-001375 ZD305 DIODE-ZENER
0406-001375 ZD306 DIODE-ZENER
0407-001002 ZD307 DIODE-ZENER
0407-001002 Q300 DIODE-ARRAY
0504-000168 U200 TR-DIGITAL
0505-002088 Q200 FET-SILICON
0601-001905 U301 LED
0801-003139 U306 IC-CMOS LOGIC
0801-003200 UME200 IC-MCP
0801-003265 U311 IC-CMOS LOGIC
1001-001488 U312 IC-ANALOG SWITCH
1001-001580 PAM100 IC-POWER AMP
1001-001593 U308 IC-ANALOG SWITCH
1108-000262 U302 IC-MCP
1201-002856 U101 IC-RF AMP
1201-002864 U319 IC-AUDIO AMP
1201-002887 U307 IC-POWER AMP
1201-002888 U102 IC-POWER AMP
1201-002961 U100 IC-POWER AMP
1203-003924 UCP200 IC-MODEM
1203-004596 TH100 THERMISTOR-NTC
1405-001291 V100 IC-POSI.FIXED REG.
1203-004792 V300 IC-POSI.FIXED REG.
1203-004798 V301 IC-SWITCH VOL. REG.
1203-004802 V302 IC-POSI.FIXED REG.
1203-004818 R310 R-CHIP
2007-000138 R351 R-CHIP
1203-005092 R339 R-CHIP

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Main Electrical Parts List
5-2
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SEC CODE Design LOC Discription
1203-005225 R340 R-CHIP
1203-005554 R213 R-CHIP
1203-005689 R214 R-CHIP
1203-005916 R334 R-CHIP
1204-002746 R230 R-CHIP
1205-003297 R231 R-CHIP
1205-003790 R202 R-CHIP
1404-001221 R203 R-CHIP
2007-000138 R204 R-CHIP
2007-000141 R205 R-CHIP
2007-000148 R211 R-CHIP
2007-000148 R229 R-CHIP
2007-000171 R325 R-CHIP
2007-000174 R313 R-CHIP
2007-001217 R314 R-CHIP
2007-007008 R337 R-CHIP
2007-007014 R346 R-CHIP
2007-007014 R348 R-CHIP
2007-007190 R232 R-CHIP
2007-007190 R233 R-CHIP
2007-007309 R324 R-CHIP
2007-007310 R101 R-CHIP
2007-007317 R102 R-CHIP
2007-007317 R103 R-CHIP
2007-007318 R114 R-CHIP
2007-007468 R224 R-CHIP
2007-007798 R226 R-CHIP
2007-007798 R227 R-CHIP
2007-008045 R228 R-CHIP
2007-008045 R333 R-CHIP
2007-008045 R115 R-CHIP
2007-008045 R338 R-CHIP
2007-008045 R326 R-CHIP
2007-008045 R343 R-CHIP
2007-008046 R350 R-CHIP
2007-008046 R352 R-CHIP
2007-008049 R336 R-CHIP
2007-008055 R344 R-CHIP
2007-002796 R116 R-CHIP
2007-008055 R315 R-CHIP
2007-008055 R317 R-CHIP
2007-008055 R100 R-CHIP
2007-008055 R113 R-CHIP