Siemens SL10 Operator's manual

Information and Communication Products
Communication Devices
SL10
Level 2.5
Repair Documentation
V 1.3
V1.3 Page 1 of 31 ICP CD ST
D. Schnoor
08/98

Information and Communication Products
Communication Devices
Table of Contents
1 INTRODUCTION................................................................................................................................................3
2 TCXO
...................................................................................................................................................................................4
3 FUSE 1A
...................................................................................................................................................................................9
4 CONNECTOR X1 - LOWER MMI
.................................................................................................................................................................................13
5 CONNECTOR X2 - UPPER MMI + FLEXIBLE CABLE
.................................................................................................................................................................................18
6 RINGER
.................................................................................................................................................................................24
31ΜH COIL
.................................................................................................................................................................................2
8 FLEXIBLE CABLE MICROPHONE
.................................................................................................................................................................................32
V1.3 Page 2 of 31 ICP CD ST
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Information and Communication Products
Communication Devices
1 Introduction
This manual is intended to hel you carry out SL10 re airs on level 2.5, meaning limited
com onent re airs. Failure highlights are documented and should be re aired in the local
worksho s.
It must be noted that all re airs have to be carried out in an environment set u according to
the ESD (Electrostatic Discharge Sensitive Devices) regulations defined in international
standards.
If you have any questions regarding the re air rocedures or s are arts do not hesitate to
contact our technical su ort team in Kam -Lintfort, Germany:
Tel.: +49 2842 95 4666
Fax: +49 2842 95 4302
e-mail: dominik.schnoor@klf.siemens.de
V1.3 Page 3 of 31 ICP CD ST
D. Schnoor
08/98

Information and Communication Products
Communication Devices
2 TCXO
2.1 Affected Units
2.1.1 Type SL10
2.1.2 Affected IMEIs / Date Codes All / All
2.1.3 Affected SW-Versions All
2.1.4 Fault Code for LSO reporting 3TCX
2.2 Fault Description
2.2.1 Fault Symptoms for customers
Network Search
Handset not logging into network
2.2.2 Fault Symptom on GSM-Tester
Frequency error in synchronized mode >90 Hz
No location u date ossible
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The TCXO (Tem erature Com ensated Crystal Oscillator) is res onsible for generating the
13 MHz reference frequency of the handset.
If it is defective, the handset cannot synchronize to the base station anymore.
2.3 Priority
........ Mandatory
........ Re air
........ O tional
........ Not Yet Defined
2.4 Repair Documentation
2.4.1 Description of procedure
2.4.1.1 Diagnosis
Check the out ut frequency of the TCXO using the level-2 testing
rogram for SL10.
Set the „Simulator“ o tion in the S611.INI file to 0 and restart
the rogram. Start the test. When the rogram says „Check ower and
hase of external antenna with your GSM-Tester“, switch the CMD to
„LOCAL“ mode and enter the „MODULE TEST“.
On the CMD dis lay you can see the frequency error of the handset.
(Make sure that the CMD is on channel 124, ower level 5!)
If the frequency error is higher than 2kHz, the TCXO has to be
re laced.
2.4.1.2 Repair by component change
Use hot air blower to remove defective TCXO.
Avoid excessive heat!
Watch surrounding com onents!
Resolder new TCXO afterwards.
2.4.1.3 Repair by SW-Booting
Not ossible!
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2.4.1.4 Test
Retest handset after re air as described above.
The frequency error must now be < 2kHz.
2.4.2 List of needed material
2.4.2.1 Components
TCXO
Part-Number: L36145-G300-Y17
2.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
2.4.2.3 Special Tools
None
2.4.2.4 Working materials
Desolder Wick / Braid
Solder
V1.3 Page 6 of 31 ICP CD ST
D. Schnoor
08/98

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2.4.3 Drawings
V1.3 Page 7 of 31 ICP CD ST
D. Schnoor
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Figure 1 SL10 Board TCXO Side

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V1.3 Page 8 of 31 ICP CD ST
D. Schnoor
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Figure 2 TCXO (Z601) Placement (Top View)

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Communication Devices
3 Fuse 1A
3.1 Affected Units
3.1.1 Type SL10
3.1.2 Affected IMEIs / Date Codes All / All
3.1.3 Affected SW-Versions All
3.1.4 Fault Code for LSO reporting 3FU1
3.2 Fault Description
3.2.1 Fault Symptoms for customers
Battery charging not ossible
3.2.2 Fault Symptom on GSM-Tester
This fault cannot be detected with a GSM-Tester
3.3 Priority
........ Mandatory
........ Re air
........ O tional
........ Not Yet Defined
V1.3 Page 9 of 31 ICP CD ST
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Information and Communication Products
Communication Devices
3.4 Repair Documentation
3.4.1 Description of procedure
3.4.1.1 Diagnosis
Check the status of the fuse by measuring its resistance with
a multimeter. The fuse is defective if the resistance is higher than 10
ohms.
3.4.1.2 Repair by component change
Use soldering iron to remove defective fuse.
Avoid excessive heat!
Watch surrounding com onents!
Resolder new fuse afterwards.
3.4.1.3 Repair by SW-Booting
Not ossible!
3.4.1.4 Test
Retest handset after re air as described above.
The resistance must now be close to zero.
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3.4.2 List of needed material
3.4.2.1 Components
Fuse
Part-Number: L36145-A820-Y7
3.4.2.2 Jigs and Tools
Soldering Iron
3.4.2.3 Special Tools
Multimeter
3.4.2.4 Working materials
Desolder Wick / Braid
Solder
V1.3 Page 11 of 31 ICP CD ST
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Information and Communication Products
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3.4.3 Drawings
V1.3 Page 12 of 31 ICP CD ST
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Figure 1 SL10 Board 1A Fuse Side
Figure 2 1A Fuse (F1) Placement (Top View)

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Communication Devices
4 Connector X1 - Lower MMI
4.1 Affected Units
4.1.1 Type SL10
4.1.2 Affected IMEIs / Date Codes All / All
4.1.3 Affected SW-Versions All
4.1.4 Fault Code for LSO reporting 3X1C
4.2 Fault Description
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4.2.1 Fault Symptoms for customers
Problems with main keyboard. Either keys or the
keyboard illumination not working ro erly.
4.2.2 Fault Symptom on GSM-Tester
Handset fails test of main keyboard
4.3 Priority
........ Mandatory
........ Re air
........ O tional
........ Not Yet Defined
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Communication Devices
4.4 Repair Documentation
4.4.1 Description of procedure
The connector X1 is connecting the main board of the SL10 with the main
keyboard through a flexible cable.
4.4.1.1 Diagnosis
Visually check the connector. Watch for dry joints.
4.4.1.2 Repair by component change
Resolder dry soldering joints.
If the connector is hysically damaged use hot air blower or wick to remove
defective connector.
Avoid excessive heat!
Watch surrounding com onents!
Resolder new connector afterwards.
4.4.1.3 Repair by SW-Booting
Not ossible!
4.4.1.4 Test
Retest handset after re air.
V1.3 Page 15 of 31 ICP CD ST
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4.4.2 List of needed material
4.4.2.1 Components
Connector X1:
Part-Number: L36195-Z26-C618
4.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
4.4.2.3 Special Tools
None
4.4.2.4 Working materials
Desolder Wick / Braid
Solder
Flux
V1.3 Page 16 of 31 ICP CD ST
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Information and Communication Products
Communication Devices
4.4.3 Drawings
V1.3 Page 17 of 31 ICP CD ST
D. Schnoor
08/98
Figure 1 SL10 Board X1 Connector Side
Figure 2 Connector X1 Placement (Top View)

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5 Connector X2 - Upper MMI + Flexible Cable
5.1 Affected Units
5.1.1 Type SL10
5.1.2 Affected IMEIs / Date Codes All / All
5.1.3 Affected SW-Versions All
5.1.4 Fault Code for LSO reporting Connector X2: 3X2C
Flexible Cable MMI: 3FL2
5.2 Fault Description
5.2.1 Fault Symptoms for customers
V1.3 Page 18 of 31 ICP CD ST
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Information and Communication Products
Communication Devices
Slider key ad does not work ro erly.
Dis lay roblems.
Dis lay or keyboard illumination roblems.
5.2.2 Fault Symptom on GSM-Tester
Handset fails the keyboard, dis lay or illumination test.
5.3 Priority
........ Mandatory
........ Re air
........ O tional
........ Not Yet Defined
5.4 Repair Documentation
5.4.1 Description of procedure
The connection between the main board and the u er MMI is made
through the connector X2 and a flexible cable. The signals of these
connection are:
1) Dis lay signals.
2) Ear hone (louds eaker) signals.
3) Dis lay / Keyboard illumination signals.
5.4.1.1 Diagnosis
Visually check the connector. Watch for dry joints.
Visually check the flexible cable coming from the u er MMI. Watch
for dry joints on the MMI.
5.4.1.2 Repair by component change
Resolder dry soldering joints.
If the connector or flexible cable is hysically damaged use hot air
blower or wick to remove defective connector / cable.
V1.3 Page 19 of 31 ICP CD ST
D. Schnoor
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Information and Communication Products
Communication Devices
Avoid excessive heat!
Watch surrounding com onents!
Resolder new connector/cable afterwards.
5.4.1.3 Repair by SW-Booting
Not ossible!
5.4.1.4 Test
Retest handset after re air an verify ro er function.
V1.3 Page 20 of 31 ICP CD ST
D. Schnoor
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