Sony ICD-B25 Operating Instructions (primary... User manual

1
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
E Model
Tourist Model
ICD-B25
IC RECORDER
Recording media Built-in flash memory, Monaural recording
Recording time 127 minutes (SP)/339 minutes (LP)
Frequency response SP: 250 Hz - 7,300 Hz
LP: 300 Hz - 3,500 Hz
Speaker approx. 3.2 cm (1 5/16 in.) dia.
Power output 300 mW
Input/Output • Earphone jack (minijack) for 16 - 300 ohms
earphone/headphones
•Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Playback speed control FAST +30%, SLOW –15%
Power requirements Two LR03 (sizeAAA) alkaline batteries: 3V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
44.5 ×105.3 ×14.0 mm (1 13/16 ×4 1/4 ×9/16 in.)
Mass (incl. batteries) 68 g (2.4 oz)
Optional accessories Electret Condenser Microphone ECM-Z60,
ECM-T115, ECM-DM5P
Connecting cord RK-G64
Your dealer may not handle some of the above listed optional accessories.
Please ask the dealer for detailed information.
Design and specifications are subject to change without notice.
SPECIFICATIONS
Ver 1.0 2002. 03
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-873-644-01
2002C0400-1
© 2002. 03

2
TABLE OF CONTENTS
1. GENERAL
Index to Parts and Controls ..................................................... 3
2. DISASSEMBLY
2-1. Upper Lid Sub Block Assy.................................................. 4
2-2. F-sw Board .......................................................................... 4
2-3. Main Board ......................................................................... 5
3. DIAGRAMS
3-1. IC Pin Description............................................................... 6
3-2. Block Diagram .................................................................... 8
3-3. Printed Wiring Board – Main Section – ............................ 10
3-4. Schematic Diagram – Main Section (1/3) – ...................... 12
3-5. Schematic Diagram – Main Section (2/3) – ...................... 13
3-6. Schematic Diagram – Main Section (3/3) – ...................... 14
3-7. Schematic Diagram – F-sw Section – ............................... 15
3-8. Printed Wiring Board – F-sw Section – ............................ 16
3-9. Printed Wiring Board – P-sw Section – ............................ 18
3-10. Schematic Diagram – P-sw Section – ............................... 19
4. EXPLODED VIEWS
4-1. Case Section ...................................................................... 21
4-2. Main Board Section .......................................................... 22
5. ELECTRICAL PARTS LIST ........................................ 23
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
ICD-B25
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0SUR LES
DIAGRAMMESSCHÉMATIQUES ET LALISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
•UNLEADED SOLDER
Boardsrequiring useof unleaded solderare printedwith the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:Some printedcircuit boards may not comeprinted with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleadedsolder meltsat a temperature about 40°Chigher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

3
ICD-B25
SECTION 1
GENERAL This section is extracted
from instruction manual.

4
ICD-B25
2-2. F-SW BOARD
Note : This set can be disassemble according to the following sequence.
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. UPPER LID SUB BLOCK ASSY
1 screw (B1.7x10)
6 upper lid sub block ass
y
case assy
4 claw
3 claws
5
2
screw (B1.7x7)
7 screws (B1.7x2.5)
8 speaker
1 CN703
case assy
3 F-SW board
2
Set Upper Lid Sub Block Assy F-SW Board Main Board

5
ICD-B25
2-3. MAIN BOARD
3 screw (B1.7x10)
2 speaker
1 Removal the solders.
6 MAIN board
4 claw
5 claw
case ass
y

6
ICD-B25
3-1. IC PIN DESCRIPTION
• IC712 MB90523APFF-G-122-BND (SYSTEM CONTROL)
Pin No. Pin Name I/O Pin Description
1RTCCE O Real-time clock chip enable signal output
2BEEP O Beep signal output
3XFLMRE O Flash memory read enable signal output
4XFLMWE O Flash memory write enable signal output
5FLMRB I Flash memory R/B signal input
6DSPPWR O DSP power supply signal output
7ADASYSCK O ADA codec system clock signal output
8VCC — Power supply pin
9DSPSYSCK O DSP system clock signal output
10 XZRST O Zephy reset signal output (Not used in this set.)
11 DSPACK O DSP I/F acknowledge signal output
12 XDIFEN O DSP I/F enable signal output
13 DCOMDT O DSP I/F command/data signal output
14 SIN1 I DSP I/F serial data signal input
15 SOT1 O DSP I/F serial data signal output
16 SCK1 O DSP I/F serial clock signal output
17 to 32 SEG00 to 15 O LCD segment signal output
33 VSS — Ground pin
34 C — C (Connect to power supply pin.)
35 SIN2 I Zephyr/RTC I/F serial data signal input
36 SOT2 O Zephyr/RTC I/F serial data signal output
37 SCK2 O Zephyr/RTC I/F serial clock signal output
38 DVCC — Digital power supply pin
39 DVSS — Digital ground pin
40 ZIFACK O Zephyr I/F acknowledge signal output (Not used in this set.)
41 SIPCS O Serial parallel converter IC I/F chip enable signal output
42 AVCC — Analog power supply pin
43 AVRH — A/D reference voltage H (Connect toVCC.)
44 AVRL — A/D reference voltage L (Connect to ground.)
45 AVSS — Analog ground pin
46 BATT I Battery level detection A/D signal input
47 KEYIN0 I Key A/D signal input 0
48 KEYIN1 I Key A/D signal input 1
49 SPEED I Speed switch A/D signal input
50 XVORSW I VOR switch signal input (Low: VOR switch ON)
51 HPJACK I Headphone jack ON/OFF signal input (Fixed at “L” in this set.)
52 FLMSEL I Flash memory select A/D signal input
53 KEYPUP O Key pull-up signal output
54 VCC — Power supply pin
55 FLMALE O Flash memory address latch enable signal output (AND: OE)
56 FLMCLE O Flash memory command enable signal output (AND: CDE)
57 XVORIN I VOR signal input
58 XDSPRST O DSP reset signal output
59 to 62 COM0 to 3 O LCD common signal output
63 VSS — Ground pin
64 to 72 SEG16 to 24 O LCD segment signal output
73 SUBXTAL O Sub clock oscillation pin (Not used in this set.)
74 SUBCLK I Sub clock oscillation signal input (32.768 kHz)
SECTION 3
DIAGRAMS

ICD-B25
77
Pin No. Pin Name I/O Pin Description
75 to 81 SEG25 to 31 O LCD segment signal output
82 to 85 V0 to 3 — LCD driver reference power supply pin
86 XHSTBY I Hardware standby signal input
87 MD2 I Operation mode signal input 2
88 MD1 I Operation mode signal input 1 (Connect to VCC.)
89 MD0 I Operation mode signal input 0
90 XRESET I Reset signal input
91 VSS — Ground pin
92 XTALIN I Main oscillation signal input (4.096 MHz)
93 XTAL O Main oscillation signal output (4.096 MHz)
94 VCC — Power supply pin
95 WAKEUP I Wake up signal input
96 DSPIFREQ I DSP voice I/F request signal input
97 ZIFREQ I USB microcomputer (zephyr) I/F request signal input
98 RTCINTR I Real-time clock interruption request signal input
99 VBUSOFF I USBVbus ON/OFF detection signal input (H=OFF)
100 HOLDSW I Hold switch signal input (High: HOLD)
101 XFLMCEO O Flash memory chip enable 0 signal output
102 XFLMRST/CE1 O Flash memory reset signal/chip enable 1 signal output (Not used in this set.)
103 to 110 FLMIO00 to 07 I/O Flash memory data bus
111 to 118 FLMIO08 to 15 I/O Flash memory data bus (Not used in this set.)
119 VSS — Ground pin
120 XFLMWP O Flash memory write protect signal output

ICD-B25
88
3-2. BLOCK DIAGRAM
3
4
1 3 5
16
422 4 1
13
6
11
8
13 7
11
2
3
12
8
5
6
10
38
35
37
34
36
59
72
7
8
9
16
17
19
18
5
3
101
56
55
120
4
96
13
12
14
15
16
57
52
49
95
53
47
48
100
29
31
33
27
28
42
43
9
4
14
15
9 6 3
3
1
6
7 6
1
58
11
36 4
3
2
35
37
41
1
98
74
7
6
1
46
2
51
86
90 1
92
93
15
20
17
8
9
10
11
103
ı
110
59
62
ı
12
37
•
64
72
ı
75
81
ı
•
17
32
ı
•
29
32
ı
41
44
ı
•
9
8
VIN+
VIN-
VOUT
2
3
VIN
CE
VOUT
IC505
+2.9V REG
2
3
VIN
CE
VOUT
IC506
+2.9V REG
5 2
3
VIN
CE
VOUT
IC502
+3.1V REG
DC-DC
CONVERTER
(3.2V)
DC-DC
CONVERTER
SI
SO
SCLK
CE
INTR
32KOUT
S701 - 705
3 1
+
-
17
• Signal Path
: PB
: REC
MIC101
MIC
MIC
J101
IC101
MIC AMP
Q101
MIC
SENS
IC102
ALC AMP
IN OUT
INPUT OUT1
IC103
VOR CONTROL
IC107
A/D, D/A CONVERTER
VIN VOUT
PDWN
XTI
BCK
FS
DIN
DOUT
IC109
DSP
SCK1
SI1
SO1
SIEN1
SOEN1
P3
P2
SI2
SO2
SIEN2
SOEN2
SCK2
CLKIN
/RESET
IC105
IC106
IC712
SYSTEM CONTROL
IC104, 108
CLOCK GEN
CLKIN
CLKIN
CE
CE
Q0
Q0
IC706
FLASH MEMORY
Q702
+B
SW
ZVCC
Q705, 706
WAKE-UP
SW
IO1
ı
IO8
VCC
R/B
RE
CE
CLE
ALE
WE
WP
DSPIFREQ
DCOMDT
XDIFEN
SIN1
SOT1
SCK1
XVORIN
FLMIO00
ı
FLMIO07
FLMRB
XFLMRE
XFLMCE0
FLMCLE
FLMALE
XFLMWE
XFLMWP
FLMSEL
SPEED
WAKEUP
KEYPUP
KEYIN0
KEYIN1
HOLDSW
DSPSYSCK
DSPPWR
ADASYSCK
XDSPRST
DSPACK
SOT2
SIN2
SCK2
SIPCS
RTCCE
RTCINTR
SUBCLK
BATT
HPJACK
XHSTBY
XRESET
XTALIN
XTAL
COM0
COM3
SEG00
ı
SEG31
ı
X701
4.096MHz
LCD101
LIQUID
CRYSTAL
DISPLAY
PANEL
RESET
IC710
Q707
SW
IC716
REAL-TIME CLOCK
X702
32.768kHz
Q710
SW
IC715
SI/PO DRIVER
DATA
CLOCK
XFLMPWR
MICSENSE LMUTE
XSPPWR
XHPPWR
HPMUTE
XREDLED
XGRNLED
APOWER
ADAPWR
XLIGHT
XBATTEN
IC112
AMP
VIN- VOUT
Q106
LPF
SW
Q107, 108
LPF
SW
Q102
MUTE
Q105
BUFFER
IC110
POWER AMP
STNBY
IN2
IN1
INV
OUT
Q103
SW
D703
OPR
SP101
SPEAKER
J102
EAR
IC504 IC508, Q503
VOLTAGE
DETECTOR
IC507
DECODER
Q504
AVCC
DSPVCC
MICVCC
ADAVCC
ZVCC
SVCC
D701, 702
(BACK LIGHT)
AVCC
RF
AVCC
SOT2
OSCIN
OSCOUT
BEEP
S706, 707
S722
S726
S721, 723 - 725
MAIN BOARD
P-SW BOARD
F-SW BOARD (2/2)
F-SW BOARD (1/2)
DRY BATTERY
SIZE"AAA"
(IEC DESIGNATION LR03)
2PCS,3V
RED (REC)
GRN (PB)
RV101
VOL
SLOW NORMAL FAST
S702
PLAY SPEED
3.1V
2.9V
2.9V
2.3V
3V
5
5

ICD-B25
99
• Waveforms
1.3Vp-p
1
IC712 od (XTAL)
0.5V/div 50nsec/div
4.096MHz
2
IC716 8(OSCOUT)
0.2V/div 10µsec/div
32.768kHz
0.8Vp-p
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
•All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise
specified.
•f: internal component.
•C: panel designation.
•A: B+ Line.
•Power voltage is dc 3V and fed with regulated dc power
supply from battery terminal.
•Voltagesaretakenwitha VOM (Inputimpedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
E: PB
a: REC
*IC109 on main board are not replaceable.
•The voltages and Waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
Common Note on Printed Wiring Boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•f: internal component.
•: Pattern from the side which enables seeing.
Lead layout of conventional IC CSP (chip size package)
surface
Caution:
Pattern face side: Partson thepattern faceside seen from
(SIDE B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) theparts face are indicated.
*IC109 on main board are not replaceable.
•Lead Layouts

ICD-B25
1010
3-3. PRINTED WIRING BOARD — MAIN SECTION — : Uses unleaded solder.
D703 G-2
IC101 E-4
IC102 D-6
IC103 C-5
IC104 E-7
IC105 G-4
IC106 F-8
IC107 F-5
IC108 F-6
IC109 E-8
IC110 F-10
IC112 F-7
Q101 D-5
Q102 B-13
Q103 B-12
Q105 B-10
Q106 F-7
Q107 D-13
Q108 E-13
• Semiconductor
Location
Ref.No. Location
1
A
B
C
D
E
F
G
H
I
J
23456789101112131415
1-680-349- (12)
12
MAIN BOARD (SIDE A)
C114
C117
IC103
C104
C105
C139
C102
C142
C144
C110
R105 C175
R766
C153
Q103 Q102
C160
C168
C161
C169
R155
C150
R121R139
R159
C145
C149
R153
R157
Q107
Q105
Q108
R765
R767
R170
R171
R169
R106 R107
C103 R109C101
C115
C127
IC108
C163 C173
C162
C171 R187
C121
R762 R178
C118
C119
R787
R786
FB105
D703D703
OPR
R161
IC105
C120
R165
FB104
C112
IC102
IC107
Q101
R114
FB102 FB101
C108 C107R102
R104
R103
R110
R108
C116R116
C109
R112
R183
R185R184
C128
C164
R142
C124
C155
C126
C123 C122
R118
R186 C165
R140 R129 R764
R122 R141
R111
C111
C156
C152 RB103 RB102
RB101
C157
C154
C170C167
C151
C141
C140
C125
C131
*IC109
CSP
(CHIP SIZE PACKAGE)
IC110
C129
Q106
IC104
C106
R117 R113
R730
R166 R150 R152
R133R181
R158
R189
R143
C132
R182
R146 R147
C137 C135
R179 R167 R144
R115C113
R101
J101
J102
EAR
TP115
TP704
TP114
TP712
TP711
TP710
TP120
TP110
TP709 TP123
TP117 TP708
TP101
TP108
TP122
TP713
TP116
TP705
TP119
TP112 TP113
TP702 TP701
TP706
TP118
TP121
TP111
GDS
BCE
GDS
GDS
IC112
IC106
GDS
SDG
31
45
2
54 132
345 21
654
1
1
12
24
13
32
321
4
1
C
9
18
E
B
10
65
19
54
132
IC101
321
45
TP703
1
4
8
5
RV101
VOL
-1
L
-2
R
FAST
NORMAL
SLOW
S702 PLAY SPEED
-1
-2
MIC

ICD-B25
11 11
: Uses unleaded solder.
D701 F-13
IC706 E-8
IC710 F-6
IC712 E-4
IC715 C-3
IC716 E-14
Q702 E-9
Q705 G-12
Q706 G-13
Q707 C-3
Q710 D-9
• Semiconductor
Location
Ref.No. Location
(Page 17)
(Page 18) (Page 18)
1
A
B
C
D
E
F
G
H
I
J
23456789101112131415
1-680-349- (12)
12
MAIN BOARD (SIDE B)
C172
X701
C753
R717
X702
IC716
R703
C747
R724
R723
R721
R771
CN703
R774 R778 R776
Q706
Q705
C757
R711
C709
C727
C728
C750
MIC101
MIC
C740
C739
Q702
C748
R794
R716 R757 C749
Q707
R763
C744
C743
C742
R732
R799
IC706
R168
D701
C759
R770
R718
R760 R758
R719
C763
R731 R734
R726 R729
R725
R188
C726
R714
R756
C754
C746
R754
R759
R722
C755
R172
R720
R798
Q710
R769
C758
R701
R702
W707 W702 W703
TP104
TP103 TP107
TP105
TP106
TP102
GDS
SDG
1
3
25 48
24 1
12091
90 1
61
60 3130
136 30 25 10
15
20 5
IC710
IC712
2
B
C
E
B
C
E
G
D
S
115
1630
F-SW BOARD
CN501
1
P–SW BOARD
2
W705 W704 W701 W706
P–SW BOARD
3
1
5
10
6
IC715
18
169
SP101
SPEAKER
LCD101
LIQUID CRYSTAL DISPLAY PANEL
CN702

ICD-B25
1212
3-4. SCHEMATIC DIAGRAM — MAIN SECTION (1/3) — • Refer to page 20 for IC Block Diagrams.
IC B/D
IC B/D
IC B/D
IC B/D
IC B/D
IC112
Q101
IC103
C112
IC105
IC107
IC106
IC104
R765
C172
C160
Q107
Q106
C131C129
R139
R140
TP107
TP106
TP105
TP104
TP103
TP102
R716
R141
R171
R170
R169
R766
C161
Q108
C169C168R133
R142
R188
R181
C170
C167
C165
C128
IC108
R122
R172
R178
TP113
TP112
R121
C164
R184
R185
C163C162
R183
C125
C127
R186 C171
R187
C122
C126
C121
R730
TP708
C116
R116
C114
C111
C110
R113
R115
C113
C109
TP108
IC102 R114
C120
C115
R107R106
C105
C104
R112
C108
TP111
IC101
R111
TP121
C107
R109
C106
R108
R104
C101
C103
C102
R103
R105
R102
TP115
FB101
FB102
R101
MIC101
J101
TP114
R118
C118
C173
R117
R168
R110
C117
C123
C124
R189
C119
RB101
TP122
TP101
IC109
RB102 RB103
R129
(Page 14)
(Page 13)

ICD-B25
13 13
3-5. SCHEMATIC DIAGRAM — MAIN SECTION (2/3) — • Refer to page 9 for Waveform.
IC710
TP706
C757
C727
R767
C726
Q702
R711
C709 IC706
R722
C728
R720
R726
C763
R725
R754
C740
C750
C742
C739
C749
R758 R760
R759C744
C743
R757
TP704
TP703
C755
R719
R718
R714
X701
R770
CN702
LCD101
IC712
R729
R731
R734
(Page 12)
(Page 14)

ICD-B25
1414
3-6. SCHEMATIC DIAGRAM — MAIN SECTION (3/3) — • Refer to page 9 for Waveform. • Refer to page 20 for IC Block Diagrams.
IC B/D
IC B/D
D701
R143
Q105
D703
Q710
Q102
Q103
J102
Q706
IC716
R762
TP705
C132
FB105
FB104
C156
C157
TP117
TP116
C151R158
C149
C144
C142
C141
R153
C137
TP110
R150
R167
R144
R182
R179C135R146R147
R166
C140
R152
TP120
C145
R155
C150
R159C152
C154
R165 R157
TP123
IC715
C746
C754
R756
Q707
R732
R786
R787
R794
C155
CN703
R798
R799
C748
TP702
TP701
R701
R702
Q705
C758C759
R778
R776
TP710TP709
R723
R721
TP711
TP712
R771
TP713
R724
R703
X702
C753
C747
R763
R764
R717
R769
R774
R161
C153
SP101
C139
IC110
RV101
C175
TP118
S702
(Page 13)
(Page 19)
(Page 15)
(Page 12)

ICD-B25
15 15
3-7. SCHEMATIC DIAGRAM — F-SW SECTION —
Q503
IC505
IC507
SL502
SL501 TP502
TP501
TP505
S705
TP511
C513
R512
C510
IC506
TP510
R704R703
S704S703
R702R701
S702S701
R705
S707S706
TP507
TP509
TP504
R515C514
TP503
R507
R504
L502
R508
R509
Q504
C517
C504
R506
C512
D701
D702
R706
R707
R523
C506
C507
R521
R519
C505
C518
IC504
D502
C509
TP513
TP512
CN501
TP508
TP506
IC502
C503
R524
IC508
(Page 14)

ICD-B25
1616
1
A
B
C
D
E
F
G
H
I
J
23456789101112 13 14 15
F-SW BOARD (SIDE A)
FOLDER
DISPLAY
ERASE
STOP MENU
R704
R702
DRY BATTERY
SIZE"AAA"
(IEC DESIGNATION LR03)
2PCS,3V
R706
TP506
TP511
TP507
TP509
TP508
TP504
TP512
TP513
TP510
TP501
TP502
R707
R701
R506
C512
C510
R504
R507
R519
R509
C513
R512
R508
R515
Q504
C514
R705
R703
S705
A-B
REPEAT
S702
S706
S701 S707
S704 S703
1
1
2
3
6
5
4
2
3
IC507
1-680-351- (12)
12
INDEX
3-8. PRINTED WIRING BOARD — F-SW SECTION — : Uses unleaded solder.
IC507 G-2
Q504 H-2
• Semiconductor
Location
Ref.No. Location

ICD-B25
17 17
1
A
B
C
D
E
F
G
H
I
J
23456789101112131415
F-SW BOARD (SIDE B)
MAIN
BOARD
CN703 1
D702 D701
C506
C504
C517
L502
C507
R523
R524
321
151
3016
45
R521
D502
C505
C509
C503
C518
IC505
CN501
IC502
IC508
IC506
IC504
12
3
45
Q503
S
D
G
123
4
A
K
5
123
45
45
123
1-680-351- (12)
12
(BACK LIGHT)
: Uses unleaded solder.
D502 E-3
D701 E-6
D702 G-6
IC502 H-5
IC504 G-3
IC505 G-4
IC506 F-3
IC508 D-3
Q503 D-3
• Semiconductor
Location
Ref.No. Location
(Page 11)

ICD-B25
1818
1
A
B
C
D
E
F
G
H
2345678910111213
P-SW BOARD (SIDE A)
PAUSE/X
R722R721
W706 W704 W701 W705 W703 W702 W707
R725
R723 R724
R726
S721 S722
S723
S724
S725
ON OFF
– /.
S726
1-680-352- (12)
12
1-680-352- (12)
12
MAIN
BOARD MAIN
BOARD
3 2
+ />
(SELECT)/B • x
PUSH B
PLAY/STOP
(ENTER)
P-SW BOARD (SIDE B)
REC/STOP
HOLD
3-9. PRINTED WIRING BOARD — P-SW SECTION — : Uses unleaded solder.
(Page 11) (Page 11)

ICD-B25
19 19
3-10. SCHEMATIC DIAGRAM — P-SW SECTION —
S726 S725
R724
R723
R726
R725
R722 R721
S724 S723 S722 S721
W707
W702
W703
W705
W701
W704
W706
(Page 14)

ICD-B25
2020
IC102 AN6123MS-TXL
• IC Block Diagrams
GM
5
OUT
3
IN
4
GND
2
DET
1
VCC
DET
5 6 7 84321 910 11 12
192021222324 18 17 16 15 14 13
VCOM
VREF1 VREF2
VIN
AGND
M/S TSC
BCK
FS
DIN
DOUT
FSO
SCKIO XTO XTI HPFD LOOP PDWN AGND VOUT AGND VCC DGND VDD
POWER
SUPPLY
SERIAL
I/O I/F
HPF
DIGITAL FILTER
OVER SAMPLING
DIGITAL FILTER
MODE
CONT
LOOP
BACK
REF V
ANALOG
FRONT END
LPF
OUTPUT AMP
∆-∑MOD
ADC
∆-∑MOD
DAC
CLOCK
4
5
6
2
1
3
CE
GND
Q0
CLK IN
VDD
Q1
11BIT
PLL
1/2
1/4
12 3 5 6 7 8 9
10
16 15 14 13 12 11
CONTROL
CIRCUIT
12 BIT
SHIFT
REGISTER
12 BIT
STORAGE
REGISTER
OUTPUT
BUFFER
(OPEN DRAIN)
VDD Q11 Q10 Q9 Q8 Q7 Q6
Q5 Q4 Q3 Q2 Q1
4
Q0
CLOCK
DATA
VSS
15
24
3
NC VCC
IN A
GND
OUT Y
VDD
VDD
OSCIN
OSCOUT
CE
INTR
32KOUT
SCLK
SO
SI
VSS
32 kHz
OUTPUT
CONTROL COMPARATOR
W
COMPARATOR
D
ADDRESS
REGISTER
I/O
CONTROL
ADDRESS
DECODER
SHIFT
REGISTER
INTERRUPT
CONTROL
OSC
DETECT
VOLTAGE
DETECT
ALARM W REGISTER
(WEEK, MIN, HOUR)
ALARM D REGISTER
(MIN, HOUR)
DIV OSC
DIVIDER
CORRECTION
9
10
8
7
6
2
3
4
5
1
TIMER COUNTER
SEC, MIN, HOUR, WEEK,
DAY, MONTH, YEAR
IC107 PCM3500E-2K
IC108 XC25BS5005MR
IC105, 106 TC7S04FU (TE85R) IC716 RS5C348A-E2
IC715 BU2090FS-E2