Sony RCD-W10 - Cd/cdr Recorder/player User manual

RCD-W10
US Model
Canadian Model
SERVICE MANUAL
COMPACT DISC RECORDER
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-874-152-02
2003L16-1
© 2003.12
SPECIFICATIONS
Ver 1.1 2003. 12
Model Name Using Similar Mechanism NEW
CD Section CD Mechanism Type CDM66C-30B61B
Base Unit Type BU-30BBD61B
Optical Pick-up Type A-MAX.3
Model Name Using Similar Mechanism NEW
CD-R/CD-RW CD Mechanism Type CDM65-RBD1
Section Base Unit Type RBD1
Optical Pick-up Type KRM-220CAA
DECK A (the CD player section)
System Compact disc digital audio
system
Laser Semiconductor laser (λ=
780 nm)
Emission duration:
continuous
Frequency response 20 Hz – 20,000 Hz (±0.5
dB)
DECK B (the CD-R and CD-RW
recording section)
System Compact disc digital audio
system
Laser Semiconductor laser (λ=
780 nm)
Emission duration:
continuous
Playable discs CD, CD-R, CD-RW
Recordable discs CD-R, CD-RW (for music
use)
Frequency response 20 Hz - 20,000 Hz (±0.5
dB)
General
Power requirements
North American model: 120 V AC, 60 Hz
Power consumption 25 W
Dimensions (approx.) (w/h/d) incl. projecting parts
and control 430 ×108 ×399 mm
( 17 ×4
3
/
8
×15
3
/
4
inch)
Mass (approx.) 6.0 kg
(13 lbs 4 oz)
Supplied accessories
Design and specifications are subject to change
without notice.
• Audio connecting cords
Phono jack ×2 (red/white) ↔
Phono jack ×2 (red/white) (2)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
Inputs
ANALOG IN
(Phono jacks) Impedance: 47 kilohms
Rated input: 500 mVrms
Minimum input
250 mVrms
DIGITAL OPTICAL IN
(Square optical connector jack)
Optical wavelength:
660 nm
Outputs
ANALOG OUT
(Phono jacks) Impedance: 47 kilohms
Rated output: 2 Vrms
Load impedance: over
10 kilohms
DIGITAL OPTICAL OUT
(Square optical connector jack)
Wavelength: 660 nm
Output level: –18 dBm
PHONES
(Phono jack) Load impedance: 32 ohms
Output level: 12mW

2
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
The following caution label is located inside the apparatus.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
otherthanthosespecified hereinmay resultin hazardousradiation
exposure.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
RCD-W10
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND INTHE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,screws,
and all other exposed metal parts forAC leakage. Check leakage as
described below.
LEAKAGE
TheAC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operatedAC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
SAFETY CHECK-OUT
To Exposed Metal
Parts on Set
0.15 µF1.5 kΩ
AC
Voltmeter
(0.75V)
Earth Ground
Fig.A. Using an AC voltmeter to check AC leakage.
MODEL IDENTIFICATION
— BACK PANEL —
Parts No.
PARTS No. MODEL
4-238-401-5π
4-238-401-6π
US
Canadian

3
RCD-W10
TABLE OF CONTENTS
1. SERVICING NOTE·····················································4
2. GENERAL···································································5
3. DISASSEMBLY ··························································6
3-1. Case (409538) ······························································· 7
3-2. Loading Panel (1CD) ···················································· 7
3-3. Loading Panel (CDR) ··················································· 8
3-4. Front Panel Section······················································· 8
3-5. DISPLAY Board ··························································· 9
3-6. CDR Mechanism Deck (CDM65-RBD1)····················· 9
3-7. Tray ············································································· 10
3-8. CDR Board ································································· 10
3-9. Holder (MG) SubAssy, Dust Cover ··························· 11
3-10. Optical Pick-Up (KRM-220CAA)······························ 11
3-11. Motor Assy (Loading)(M201) ···································· 12
3-12. Cam (CH)···································································· 12
3-13. CD Mechanism Deck (CDM66C-30B61B)················ 13
3-14. Tray (66) ····································································· 14
3-15. BD Board ···································································· 15
3-16. Optical Block Section ················································· 15
3-17. MAIN Board ······························································· 16
4. TEST MODE···································································· 18
5. ELECTRICAL ADJUSTMENTS ······························· 21
CD SECTION ............................................................. 21
CD-R/RW SECTION.................................................. 22
6. DIAGRAMS······································································ 53
6-1. Block Diagrams – CD-R Section – ··························· 54
– CD Section – ······························· 55
– POWER/DISPLAY Section –······ 56
6-2. Printed Wiring Board – BD Section – ························ 57
6-3. Schematic Diagram – BD Section – ···························58
6-4. Printed Wiring Board – CD-R Section (Side A) – ······59
6-5. Printed Wiring Board – CD-R Section (Side B) – ······60
6-6. Schematic Diagram – CD-R Section (1/4) – ··············61
6-7. Schematic Diagram – CD-R Section (2/4) – ··············62
6-8. Schematic Diagram – CD-R Section (3/4) – ··············63
6-9. Schematic Diagram – CD-R Section (4/4) – ··············64
6-10. Printed Wiring Board – MAIN Section (Side A) – ·····65
6-11. Printed Wiring Board – MAIN Section (Side B) – ····· 66
6-12. Schematic Diagram – MAIN Section (1/2) – ············· 67
6-13. Schematic Diagram – MAIN Section (2/2) – ············· 68
6-14. Printed Wiring Board – DISPLAY Section – ············· 69
6-15. Schematic Diagram – DISPLAY Section – ················70
6-16. IC Block Diagrams ····················································· 71
6-17. IC Pin Function Description ·······································74
7. EXPLODED VIEWS ······················································ 84
7-1. Case Section·································································· 84
7-2. Front Panel Section ······················································· 85
7-3. Chassis Section ····························································· 86
7-4. CDR Mechanism Deck Section (CDM65-RBD1) ········ 87
7-5. CD Mechanism Deck Section (CDM66C-30B61B)····· 88
7-6. Base Unit Section (BU-30BBD61B) ···························· 89
8. ELECTRICAL PARTS LIST ······································· 90
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

4
RCD-W10 SECTION 1
SERVICING NOTE
NOTES ON HANDLINGTHE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repain parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The emission check enables continuous checking of the S curve.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD sectionadjustment” and check
that the S curve waveform is output three times.
Message
C12/
Cannot Copy
C13/
Rec Error
C14/
TOC Error
C41/
Cannot Copy
C71/
Din Unlock
Explanation
You are trying to record a disc that
cannot be played back in DECK-A
or with an external device, such as
CD-ROM or VIDEO CD.
• Remove the disc, and then insert a
music CD for playback.
Recording has not been completed
successfully because of vibration.
• Relocate the unit in a place free of
vibration and restart the recording
again.
The disc you try to record is
excessively dirty (such as oil-
stained or finger marked) or
scratched. Or the disc is not
normal.
• Replace the disc with another one
and restart the recording again.
The unit did not read the TOC
information.
• Insert other discs.
The sound source you are trying to
record is a copy of a commercial
music software. Or you are trying
to record on a CD-R/CD-RW
digitally.
• Because of the restriction of the
Serial Copy Management System,
you cannot record a copy of a
commercial music software.
Neither can you record a CD-R/
CD-RW digitally.
If this message is displayed
momentarily, this is not an error. It
is caused by the digital signal
during recording.
During recording of a digital sound
source, the connecting cable has
been disconnected or the player of
the sound source has turned off.
• Connect the cable or turn on the
digital player.
Self-diagnosis Function
When the self-diagnosis function is activated to
prevent the player from malfunctioning, three
character service numbers in a combination
with a message appears in the display. In this
case, check the following table.

5
RCD-W10
SECTION 2
GENERAL
36
41 2 5 978 q;
qa
qs
qd
qf
qgqhqjqkqlw;wd wawfwjwk
e;
wl
wgwh ws
1 POWER button
2 Hbutton
3 OPEN/CLOSE Abutton
4 CD SYNCHRO NORMAL button
5 CD SYNCHRO HIGH button
6 OPEN/CLOSE Abutton
7 Hbutton
8 INPUT button
9 FINALIZE button
q; ERASE button
qa SBM button and indicator
qs REC zbutton
qd Xbutton
qf REC LEVEL knob
qg xbutton
qh PLAY MODE button
qj TIME button
qk DISPLAY button
ql YES button
w; l AMS L knob
wa CLEAR button
ws MENU/NO button
wd l AMS L knob
wf CLEAR button
wg PLAY MODE button
wh TIME button
wj xbutton
wk PHONES jack
wl Xbutton
e; PHONE LEVEL knob

6
RCD-W10 SECTION 3
DISASSEMBLY
Note : Disassemble the unit in the order as shown below.
LOADING PANEL (1CD)
LOADING PANEL (CDR)
DISPLAY BOARD
CD MECHANISM DECK (CDM66C-30B61B)
CDR MECHANISM DECK (CDM65-RBD1)
CDR BOARD
HOLDER (MG) SUB ASSY, DUST COVER
TRAY
CASE (409538)
FRONT PANEL SECTION
SET
MOTOR ASSY (LOADING) (M201)
OPTICAL PICK-UP (KRM-220CAA)
TRAY (66)
BD BOARD
CAM (CH)
MAIN BOARD
OPTICAL BLOCK
SECTION

7
RCD-W10
Note : Follow the disassembly procedure in the numerical order given.
3-1. Case (409538)
3-2. Loading Panel (1CD)
4 case (409538)
3 two screws
(case 3 TP2 3 x 8
)
1 two screws
(case 3 TP2 3 x 8)
2 two screws
(case 3 TP2 3 x 8)
front panel side
1 Rotate the hole to the direction of arrow.
CD mechanism deck (CDM66C-30B61B)
4
2
3 two hooks
4 loading panel (1CD)

8
RCD-W10
3-3. Loading Panel (CDR)
3-4. Front Panel Section
1 Slide the lever to the direction of arrow.
2
4
front panel side
CD mechanism deck (CDM65-RBD1)
lever
3 two hooks
5 l oading panel (CDR)
7 t wo claws
8 front panel section
1 c onnector
(2 core) (CN900
)
2 connector
(3 core) (CN690)
4 connector
(2 core) (CN920)
5 three screws
(+BVTP 3
× 8)
6 four screws
(+BVTP 3
× 8)
3 flexible flat cable
(21core) (CN671)

9
RCD-W10
3-5. DISPLAY Board
3-6. CDR Mechanism Deck (CDM65-RBD1)
6 twelve screws
(+BVTP 2.6 × 8)
3 four screws
(+BVTP 2.6 × 8
)
5 three screws
(+BVTP 2.6 × 8)
2 two knobs (AMS)
1 knob (AMS)
9 CD-EJECT board
7 c law
8 Remove the soldering.
HARNESS
PROCESSING
q; flexible flat cable
(21core) (CN700)
qa DISPLAY board
4 CD-SW board
POWER-SW board
3 four screws (+BVTP 3 × 8)
2 flexible flat cable
(11core) (CN630)
1 connector
(4P) (CN631)
4 CDR mechanism deck
(CDM65-RBD1)

10
RCD-W10
3-8. CDR Board
3-7.Tray
1 Slide the lever (cam (CH)) to the direction of arrow.
4 t ray
2 Pull the tray while pressing the claw of
the chassis in the direction of the arrow.
3 Pull the tray while pressing the claw of the chassis and the claw
of the tray in the direction of the arrow.
front panel side
lever (cam (CH))
claw
claw
claw
chassis
chassis
tray
7 c law
6 c law
8 c onnector
(2 core) (CN104)
3 flexible flat cable
(32core) (CN101)
4 flexible flat cable
(11core) (CN102)
5 flexible flat cable
(11core) (CN103)
9 CDR board
2 bottom plate
1 four screws
(+BVTP 2.6
× 8)

11
RCD-W10
3-9. Holder (MG) Sub Assy, Dust Cover
3-10. Optical Pick-Up (KRM-220CAA)
4 three s crews
(+BVTP 2.6
× 8)
3 holder (MG)
sub assy
1 two claws
2 two claws
5 dust cove
r
5 flexible flat cable
(32core) (from optical device
)
1 two step screws
2 two screws
((2X9) (G with), +p tappin)
6 optical pick-up
(KRM-220CAA)
3 two insulators (main)
4 two insulators (main)

12
RCD-W10
3-11. Motor Assy (Loading)(M201)
3-12. Cam (CH)
1 Slide the cam (CH) to the direction of arrow.
2 Remove the belt (loading) from the
pulley of the motor assy.
3 t wo claws
4 m otor assy
(loading) (M201)
1
1
1
1
6 screw
(+PTPWH 2.6
× 8)
5 holder (BU) sub assy
cam (CH) claw
1
2
4
3
A
qa
q;
Slide the cam (CH) to the
direction of arrow
A while
pressing the claw.
qs cam (CH)
7 g ear (C)
9 g ear (B)
8 claw

13
RCD-W10
3-13. CD Mechanism Deck (CDM66C-30B61B)
3 three screws (+BVTP 3 × 8)
2 flexible flat cable
(23core) (CN101)
1 connector
(5P) (CN680)
4 CD mechanism deck
(CDM66C-30B61B)

14
RCD-W10
3-14.Tray (66)
8 tray (66)
3 hook
7 hook
6 hoo
k
4 hook
2
5
1
Turn the cam to the
direction of arrow.

15
RCD-W10
3-15. BD Board
3-16. Optical Block Section
1 Remove soldering from the four points.
3 BD board
2 flexible flat cable
(16core)
1 floating screw
4 optical block section
3 shaft (BU holder)
2
Rotate the cam (66) in the direction of 2 to move
the shaft (BU holder) upper.
cam (66)

16
RCD-W10
3-17. MAIN Board
4 connector
(2 core) (CN900)
2 c onnector
(3 core) (CN690)
1 flexible flat cable
(21core) (CN671)
3 flexible flat cable
(11core) (CN630)
5 flexible flat cable
(4core) (CN631)
7 flexible flat cable
(23core) (CN660)
6 connector
(5core) (CN680)
qa two screws (+BVTT 3 × 6)
q; three screws (+BVTP 3 × 8
)
8 s crew (+BVTP 3 × 8)
qs four screws (+BVTT 3 × 6)
qd Remove the soldering.
qg MAIN board
qf power transformer
9 bracket (TR)

17
RCD-W10
MEMO

18
RCD-W10 SECTION 4
TEST MODE
Setting theTest Mode
Procedure:
1. Press the POWER button to POWER on.
2. Press the l AMS L (DECKA), [SBM] and l AMS
L (DECK B) buttons in order without releasing the button.
3. Turn the l AMS L (DECK B) knob to select the menu.
4. Press the l AMS L (DECK B) knob to execute the test
mode.
Releasing theTest Mode
Procedure 1:
1. Turn the l AMS L (DECK B) knob to select the Ship
Mode.
2. Press the l AMS L (DECK B) knob to execute the Ship
Mode.
3. Press the POWER button to POWER off.
Procedure 2:
1. Press the l AMS L (DECKA), [SBM] and l AMS
L (DECK B) buttons in order without releasing the button.
2. Press the POWER button to POWER off.
Contents of test mode
No. Display Function
1SYS Version System version display
2CDR Version CDR version display
3BU Test Deck A BU test mode
4SERVICE Deck A Service mode
5Ship Mode CD Shipment mode
6FL ALL ON Fluorescent indicator tube test
7FL ALL OFF Fluorescent indicator tube test
8FL ITIMATSU Fluorescent indicator tube test
9LED CHECK LED check
10 KEY CHECK Keyboard check
11 RM CHECK Remote commander check
12 CDR History CDR error history display
13 Play Speed Deck A x4 speed
SystemVersion Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “SYSVersion”, and press the l AMS L
(DECK B) knob.
2. The system version is displayed.
3. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
4. Press the POWER button to POWER off.
CDRVersion Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “CDRVersion”, and press the l AMS L
(DECK B) knob.
2. The CDR version is displayed.
3. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
4. Press the POWER button to POWER off.
BU Test Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “BU Test”, and press the l AMS L
(DECK B) knob.
2. “bdt S CURVE” is displayed. This test mode is used in the Elec-
trical Adjustment section.
3. Turn the l AMS L (DECK B) knob. “bdt RAM READ”,
“bdt RAMWRITE”, “bdt COMOUT”, “bdt FB TUNE” and “bdt
ERR RATE” are displayed.
4. To exit from this mode, press the MENU/NO button and turn
the l AMS L (DECK B) knob to display “bdt ERR
RATE”.
5. Press the l AMS L (DECK A), [SBM] and l AMS
L (DECK B) buttons in order without releasing the button.
6. Press the POWER button to POWER off.
Service Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “SERVICE”, and press the l AMS L
(DECK B) knob.
2. “SERVICE MODE” is displayed.
3. Press the ERASE button, the “SLED OUT” is displayed and
the sled moves to the outermost position.
4. Press the FINALIZE button, the “SLED IN” is displayed and
the sled moves to the innermost position.
5. Press the l AMS L (DECK B) knob, then “SERVICE
MODE” is displayed again.
6. To exit from this mode, press the l AMS L (DECKA),
[SBM] and l AMS L (DECK B) buttons in order with-
out releasing the button.
7. Press the POWER button to POWER off.
Note: Always move the pick-up to the most inside position when
exiting from this mode.
Ship Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob.
2. “Push POWER!” is displayed.
3. Press the POWER button to POWER off.
FL ALL ON Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “FL ALL ON”, and press the l AMS L
(DECK B) knob.
2. All segments of fluorescent indicator tube and LED turn on.
3. Press the MENU/NO button, then “FL ALL ON” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.

19
RCD-W10
FL ALL OFF Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “FLALL OFF”, and press the l AMS L
(DECK B) knob.
2. All segments of fluorescent indicator tube and LED turn off.
3. Press the MENU/NO button, then “FLALL OFF” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
FL ITIMATSU Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “FL ITIMATSU”, and press the l AMS
L (DECK B) knob.
2. Checkered patterns of segments are displayed.
3. Pressthe MENU/NO button,then “FL ITIMATSU” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
LED Check Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “LED CHECK”, and press the l AMS L
(DECK B) knob.
2. Turn the l AMS L (DECKA) or (DECK B) knob clock-
wise.
3. Press the MENU/NO button, then “LED CHECK” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
KEY Check Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “KEY CHECK”, and press the l AMS L
(DECK B) knob.
2. “Got l keys” is displayed.
3. Press the buttons, and when all the buttons are pressed (without
the POWER button), “Got 27 keys” will be displayed.
4. To exit from this mode, press the l AMS L (DECKA),
[SBM] and l AMS L (DECK B) buttons in order with-
out releasing the button.
5. Press the POWER button to POWER off.
Remote Commander Check
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “RM CHECK”, and press the l AMS L
(DECK B) knob.
2. Press the Hkey on the remote commander, then “Got
PlayCom” is displayed.
3.
Press the MENU/NO button, then “RM CHECK” is displayed again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
CDR History Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “CDR History”, and press the l AMS L
(DECK B) knob.
2. “00 ######## ########” is displayed as the first error hitory.
3. Turn the l AMS L (DECK B) knob to select the error
history. The number of error histories is ten in all.
(Refer to “Contents of CDR error history”.)
4. Press the MENU/NO button, then “CDR History” is displayed
again.
5. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
6. Press the POWER button to POWER off.
Play Speed Selection Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “Play Speed”, and press the l AMS L
(DECK B) knob.
2. “x4 Play” is displayed. If a CD is in the deck A, pressing the
Hbutton executes the 4 times speed playback.
3. Press the xbutton to stop the playback.
4. Press the MENU/NO button, then “Play Speed” is displayed
again.
5. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
6. Press the POWER button to POWER off.
Contents of CDR error history
display(example)
(hexadecimal)
1Order of the error history
00 to 09: ten error histories in all
2Error contents
01: unable to focus on
02: Q code/ATIP discontinuous (several frames preceding)
03: Q code/ATIP unreadable
04: search taking more than sixteen seconds
05: focus failure
06: sled over run
07: not passing by start time to write
08: audio buffer over
09: sync failure
OA: Spindle lock taking more than 8 secouds
example : 05 is focus failure
00 05070D80
000E2E0D
1 2
5 6
3 4

20
RCD-W10
3Operation mode
bit 7: Speed
0: normal speed
1: x4 speed
bit 6 to bit 0: Number of inner condition
01: POWER off condition/during shift to POWER on
02: POWER off and shipment setting/during shift to POWER
off and shipment setting
03: stop condition/during stop
04: during start up of servo
05: during TOC reading and others
06: during CD TEXT reading
07: during standby(waiting for command from the CD sys-
tem)/during search
08: during playback
09: during manual search(playback)
0A:during pause
0B:during manual search(pause)
0C:during OPC
0D:recording standby/during recording pause
(enable to shift to recording)
0E: during recording
0F: unable to record (waiting for shift to being recordable)
10: PMA updating
11: during operation of unfinalize
12: during operation of finalize
13: PMA erasing
14: emergency
15: recording preparation
16: recording end
examples :
4Start time of read in(compression method)
bit 15 to bit 13 : (min)
0: 97 min
1: 96 min
2: 95 min
7: others
bit 12 to bit 7: (sec)
bit 6 to bit 0: (frame)
examples :
0000 1101 1000 0000
0001 0001 0001 0110
0D,80
11,16
7
0(frame)
654 321
34(sec)97(min) 22(frame)
015 14 13 12 11 10 9 8 Start time of read in
97 : 27 : 00
97 : 34 : 22
97(min) 27(sec)
bit
HEX
0000 0111
07
91 1001 0001
7
7
654 321
11 1
0 Operation mode
normal speed, during
standby(waiting for
command from the CD
system)/during search
x4 speed,
during operation of
unfinalize
00
bit
HEX
5Write POWER (integer of mW x 10, available during write
processing)
examples: 00 means unavailable
(when 3operation mode is not recording)
: A3 means 163(decimal), i.e. 16.3 mW
6ATIME (min)/(sec)/(frame)
example: 0E, 2E, 0D means 14 : 46 : 13
Abbreviations:
ATIP : Absolute Time In Pre-groove
OPC : Optimum POWER Control
PMA : Program Memory Area