Sony RCD-W2000ES - Cd/cdr Recorder User manual

RCD-W2000ES
US Model
SERVICE MANUAL
COMPACT DISC RECORDER
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-961-002-02
2003L02-1
© 2003.12
SPECIFICATIONS
Ver 1.1 2003. 12
Model Name Using Similar Mechanism RCD-W500C
CD Section CD Mechanism Type CDM53L-30B61M
Base Unit Type BU-30BBD61M
Optical Pick-up Type A-MAX.4T
Model Name Using Similar Mechanism RCD-W500C
CD-R/CD-RW CD Mechanism Type CDM65-RBD2
Section Base Unit Type RBD2
Optical Pick-up Type KRM-220CAA
DECK A (the CD player section)
System Compact disc digital audio system
Laser Semiconductor laser
(λ= 780 nm)
Emission duration: continuous
Playable discs CD, CD-R, CD-RW
Frequency response 20 Hz – 20,000 Hz (±0.5 dB)
Signal to Noise Ratio Over 100 dB during play
Wow and flutter Below measurable limit
DECK B (the CD-R and CD-RW recording section)
System Compact disc digital audio system
Laser Semiconductor laser
(λ= 780 nm)
Emission duration: continuous
Playable discs CD, CD-R, CD-RW
Recordable discs CD-R, CD-RW (for Audio)
Frequency response 20 Hz - 20,000 Hz (±0.5 dB)
Signal to Noise Ratio Over 100 dB during play
Wow and flutter Below measurable limit
Inputs
ANALOG IN Impedance: 47 kilohms
(Phono jacks) Rated input: 500 mVrms
Minimum input: 250 mVrms
DIGITAL OPTICAL IN
(Square optical connector jack) Optical wavelength: 660 nm
DIGITAL COAXIAL IN
(Phono jack) Impedance: 75 ohms
Rated output: 0.5 Vp-p, ±20 %
Outputs
ANALOG OUT 1, OUT 2 Rated output: 2 Vrms
(Phono jacks) Load impedance: over 10 kilohms
DIGITAL OPTICAL OUT 1, OUT 2
(Square optical connector jack) Wavelength: 660 nm
Rated output: –18 dBm
DIGITAL COAXIAL OUT 1, OUT 2
(Phono jacks) Rated output: 0.5 Vp-p, ±20 %
Load impedance: 75 ohms
PHONES Load impedance: 32 ohms
(Stereo phone jack) Rated output: 28mW
General
Power requirements 120 VAC, 60 Hz
Power consumption 28 W
Dimensions (approx.) (w/h/d) incl. projecting parts and control
430 x 110 x 400 mm
(17 x 4 3/8x 15 3/4inch)
Mass (approx.) 7.9 kg (17 lbs 7 oz)
Supplied accessories
• Audio connecting cords
Phono plug x 2 (red/white) yPhono plug x 2 (red/white) (2)
• Remote commander (remote) (1)
• R6 (size AA) batteries (2)
Design and specifications are subject to change without notice.

2
RCD-W2000ES
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTSWITH SONY PARTS WHOSE PART NUMBERS AP-
PEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
After correcting the original service problem, perform the fol-
lowing safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth ground
and from all exposed metal parts to any exposed metal part having
a return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The “limit” indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
SAFETY CHECK-OUT
To Exposed Metal
Parts on Set
0.15 µF1.5 kΩ
AC
Voltmeter
(0.75 V)
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

3
RCD-W2000ES
TABLE OF CONTENTS
1. SERVICING NOTE .......................................................... 4
2. GENERAL .......................................................................... 5
3. DISASSEMBLY
3-1. Case ...................................................................................... 7
3-2. D-Audio Board, Front Panel ................................................ 7
3-3. Power SW, HP, RM, LED, CD SW and Display Boards ..... 8
3-4. Deck A (CDM53L-30B61M), Deck B (CDM65-RBD2) .... 8
3-5. Deck B Tray ......................................................................... 9
3-6. CDR Board .......................................................................... 9
3-7. Motor ASSY (Loading) (M201) ........................................ 10
3-8. Holder (MG) Sub ASSY, Dust Cover ................................ 10
3-9. Optical Pick-Up (KRM-220CAA) ..................................... 11
3-10.Cam (CH) ........................................................................... 11
3-11.Deck A Fitting Base (Magnet) ASSY ................................. 12
3-12.Clamp Motor Board, Motor (Clamp) ASSY (M701) ......... 12
3-13.Fitting Base (Guide) ASSY, Bracket (Chassis) .................. 13
3-14.Tray (SUB) ......................................................................... 13
3-15.Chassis (Mold B) ............................................................... 14
3-16.Load Motor Board, Motor (Loading) ASSY(M702) ......... 14
3-17.Stocker Section .................................................................. 15
3-18.Slider (Selection), Tension Spring (Shutter),
Slider (Shutter) ................................................................... 15
3-19.Gear (Gear A), Gear (Gear B), Gear (U/D Slider) ............. 16
3-20.Gear (Chucking) ................................................................. 17
3-21.BD Board ........................................................................... 17
3-22.Optical Block Section ........................................................ 18
4. TEST MODE ...................................................................... 19
5. ELECTRICAL ADJUSTMENT ................................... 22
6. DIAGRAMS
6-1. Circuit Boards Location .................................................... 53
6-2. Block diagrams – BD Section – ........................................ 54
Block diagrams – CD-R Section – .................................... 55
Block diagrams – Main Section – ..................................... 56
Block diagrams – Display/Power Section – ..................... 57
6-3. Printed Wiring Board – BD Section – ............................... 58
6-4. Schematic Diagram – BD Section – ................................ 59
6-5. Printed Wiring Board – Senser/Motor/SW Section – ....... 60
6-6. Schematic Diagram – Senser/Motor/SW Section – ......... 61
6-7. Printed Wiring Board – CD-R Section (Side A) – ............ 62
Printed Wiring Board – CD-R Section (Side B) – ............ 63
6-8. Schematic Diagram – CD-R (1/4) Section – ..................... 64
6-9. Schematic Diagram – CD-R (2/4) Section – ..................... 65
6-10. Schematic Diagram – CD-R (3/4) Section – ..................... 66
6-11. Schematic Diagram – CD-R (4/4) Section – ..................... 67
6-12. Printed Wiring Board – MAIN Section (Side A) – ........... 68
Printed Wiring Board – MAIN Section (Side B) – ........... 69
6-13. Schematic Diagram – MAIN (1/2) Section – ................... 70
6-14. Schematic Diagram – MAIN (2/2) Section – ................... 71
6-15. Printed Wiring Board – D-Audio Section – ...................... 72
6-16. Schematic Diagram – D-Audio Section – ........................ 73
7-17. Printed Wiring Board – LED, HP Section –...................... 74
7-18. Schematic Diagram – LED, HP Section – ....................... 75
7-19. Printed Wiring Board – Display, Power Section – ............ 76
7-20. Schematic Diagram – Display, Power Section – ............... 77
7-21. IC Block Diagrams ............................................................ 78
7-22. IC Pin Functions ................................................................ 72
7. EXPLODED VIEWS
7-1. Case Section ........................................................................ 94
7-2. Front Panel Section ............................................................. 95
7-3. Chassis Section ................................................................... 96
7-4. Overall Section (CDM53L-30B61M) ................................. 97
7-5. Chassis (Mold) ASSY Section (CDM53L-30B61M) ......... 98
7-6. Chassis Section (CDM53L-30B61M) ................................ 99
7-7. Base Unit Section (BU-30BBD61M) ............................... 100
7-8. CDM65-RBD2 .................................................................. 101
8. ELECTRICAL PARTS LIST ............................... 102

4
RCD-W2000ES
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repain parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
The emission check enables continuous checking of the S curve.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output three times.
SELF-DIAGNOSIS FUNCTION
When the self-diagnosis function is activated to prevent the player
from malfunctioning, three character service numbers in a combi-
nation with a message appears in the display. In this case, check the
following table.
Message Explanation
C12/ You are trying to record a disc that cannot be
Cannot Copy played back in DECK-A or with an external
device, such as CD-ROM or VIDEO CD.
• Remove the disc, and then insert a music CD
for playback.
C13/ Recording has not been completed successfully
Rec Error because of vibration.
• Relocate the unit in a place free of vibration
and restart the recording again.
The disc you try to record is excessively dirty
(such as oilstained or finger marked) or
scratched. Or the disc is not normal.
• Replace the disc with another one and restart
the recording again.
C14/ The unit did not read the TOC information.
TOC Error • Insert other discs.
C41/ The sound source you are trying to record is
Cannot Copy a copy of a commercial music software. Or you
are trying to record on a CD-R/CD-RW
digitally.
• Because of the restriction of the Serial Copy
Management System, you cannot record
copies of commercial music software or
MP3 files on DECK A. Neither can you
digitally record from a CD-R/CD-RW.
• Use analog recording through the ANALOG
IN jack when you record from other units. Or
use Synchro-Recording when you record from
DECK A. (The recording mode is automati
cally changed to analog recording.)
C71/ If this message is displayed
Din Unlock momentarily, this is not an error. It is caused
by the digital signal during recording.
During recording of a digital sound source,
the connecting cable has been disconnected or
the player of the sound source has turned off.
• Connect the cable or turn on the digital player.

5
RCD-W2000ES
SECTION 2
GENERAL
12 3 4 567 890qaqs qd qf
qgqhqjql qkw;wawswdwfwh wgwjwkwle;eaesed
1POWER button
2g(remote sensor)
3DISC 1-5 Abuttons
4CD SYNCHRO NORMAL/HIGH buttons
5MENU/NO button
6Disc tray-Deck B
7YES button
8TIME button-Deck B
9OPEN/CLOSE button-Deck B
0PLAY MODE button -Deck B
qa INPUT button
qs FINALIZE button
qd DUAL MODE button
qf SBM button and indicator
qg REC LEVEL knob
qh REC button -Deck B
qj (stop) button -Deck B
qk X (pause) button -Deck B
ql N (play) button -Deck B
w; DISPLAY button
wa l AMS L/PUSH ENTER-Deck B
ws CLEAR-Deck B
wd Front Panel Display
wf Disc tray-Deck A
wg l AMS L/PUSH ENTER knob -Deck A
wh ALBUM button
wj PLAY MODE button -Deck A
wk (stop) button -Deck A
wl X (pause) button -Deck A
e; N (play) button -Deck A
ea TIME button -Deck A
es PHONES jack
ed PHONE LEVEL knob
Parts and Controls
This section is extracted from
instruction manual.

6
RCD-W2000ES
SECTION 3
DISASSEMBLY
Note : •Disassemble the unit in the order as shown below.
•This set can be disassemble according to the following sequence.
CaseSet D-audio board, Front panel POWER SW , HP , RM , CD SW , LED and DISPLAY boards
Deck A CD changer mechanism deck (CDM53L-30B61M)
Deck B CD-R/CD-RW mechanism deck (CDM65-RBD2)
Tray (sub) Chassis (mold) B
Gear (gear A),
Gear (gear B),
Gear (U/D slider)
Gear (chucking)
Load motor board,
Motor (loading) assy
Stocker section
Stocker (selection), Tension spring (shutter), Slider (shutter
)
Deck A Fitting base (magnet) assy
BD board
Optical block section
Fitting base (guide) assy, Bracket (chassis)
Deck B tray
CDR board Motor assy (loading) (M201)
Holder (MG) sub assy, Dust cover
Optical pick-up (KRM-220CAA)
Cam (CH)
Clamp motor board, Motor (clamp) assy

7
RCD-W2000ES
Note : Follow the disassembly procedure in the numerical order given.
3-1. CASE
1 Two screws (Flat head)
3 Two screws (Flat head)
4 Screw (Flat head)
2 Two screws (Flat head
)
5 Case
3-2. D-AUDIO BOARD, FRONT PANEL
A
6
White lever
Insert a screwdriver to the square hole on the bottom,
and slide the white lever in the arrow
A direction to
open the tray.
Then remove the loading panel.
(CD-R/CD-RW Recorder (deck B) only.)
7 Loading panel
qd Screw (+BVTT 3X6)
qf Four screws (BV /RING)
ql Front panel
qa Connector (CN920)
qs Tw o Screws
(+BVTP 3X8)
0 Connector (CN901)
8 Connector (CN340)
4 Six screws
(+BVTP 3X8)
3 Connector (CN301)
5 D-AUDIO board
9 Wire (Flat type) (CN671)
2 Wire (Flat type)
(CN551)
qg Claw
qg Claw
1 Connector (CN561)
qh
qj
qk

8
RCD-W2000ES
3-3. POWER SW, HP, RM, LED, CD SW AND DISPLAY BOARDS
1 Three knobs
2 Tw o screws (+BVTP 2.6x8)
4 Tw o screws
(+BVTP 2.6x8)
3 POWER SW board
6 Nineteen screw
s
(+BVTP 2.6x8)
5 HP board
0 CD SW board
qa DISPLAY board
7 Hook
8 RM board
9 LED board
3-4. DECK A (CDM53L-30B61M), DECK B (CDM65-RBD2)
3 Wire (Flat type)
(CN655)
9 Wire (Flat type)
(CN701)
4 Connector
(CN641)
8 Connector
(CN713)
1 Wire (Flat type)
(CN670)
2 Wire (Flat type)
(CN660)
qd Wire (Flat type)
(CN580)
qj Wire (Flat type)
(CN110)
qk Connector
(CN111)
qa Wire (Flat type)
0 Wire
(Flat type)
7
5
Tw o screws (+BVTP 3x8)
6 Tw o screws (+BVTP 3x8)
qf Tw o screws
(+BVTP 3x8)
qg Tw o screws
(+BVTP 3x8)
qh
qs
Deck A CD changer mechanism deck
(CDM53L-30B61M)
ql Deck B
CD-R/CD-RW mechanism dec
k
(CDM65-RBD2)

9
RCD-W2000ES
3-5. DECK B TRAY
1 Slide the lever (cam (CH)) to the direction of arrow.
4 t ray
2 Pull the tray while pressing the claw of
the chassis in the direction of the arrow.
3 Pull the tray while pressing the claw of the chassis and the claw
of the tray in the direction of the arrow.
front panel side
lever (cam (CH))
claw
claw
chassis
chassis
3-6. CDR BOARD
7 c law
6 c law
8 c onnector
(2pin) (CN104)
3 flexible flat cable
(32core) (CN101)
4 flexible flat cable
(11core) (CN102)
5 flexible flat cable
(11core) (CN103)
9 CDR board
2 bottom plate
1 four screws
(+BVTP 2.6
× 8)

10
RCD-W2000ES
3-7. MOTOR ASSY (LOADING) (M201)
1 Slide the cam (CH) to the direction of arrow.
2 Remove the belt (loading) from the
pulley of the motor assy.
3 t wo claws
4 m otor assy
(loading) (M201)
3-8. HOLDER (MG) SUB ASSY, DUST COVER
4 three s crews
(+BVTP 2.6
× 8)
3 holder (MG) sub assy
1 two claws
2 two claws
5 dust cover