Sony XDCAM EX PMW-EX30 User manual

SOLID-STATE MEMORY RECORDER
PMW-EX30
SERVICE MANUAL
1st Edition

PMW-EX30
!警告
このマニュアルは，サービス専用です。
お客様が，このマニュアルに記載された設置や保守，点検，修理などを行うと感電や火災，
人身事故につながることがあります。
危険をさけるため，サービストレーニングを受けた技術者のみご使用ください。
!WARNING
This manual is intended for qualified service personnel only.
To reduce the risk of electric shock, fire or injury, do not perform any servicing other than that
contained in the operating instructions unless you are qualified to do so. Refer all servicing to
qualified service personnel.
!WARNUNG
Die Anleitung ist nur für qualifiziertes Fachpersonal bestimmt.
Alle Wartungsarbeiten dürfen nur von qualifiziertem Fachpersonal ausgeführt werden. Um die
Gefahr eines elektrischen Schlages, Feuergefahr und Verletzungen zu vermeiden, sind bei
Wartungsarbeiten strikt die Angaben in der Anleitung zu befolgen. Andere als die angegeben
Wartungsarbeiten dürfen nur von Personen ausgeführt werden, die eine spezielle Befähigung
dazu besitzen.
!AVERTISSEMENT
Ce manual est destiné uniquement aux personnes compétentes en charge de l’entretien. Afin
de réduire les risques de décharge électrique, d’incendie ou de blessure n’effectuer que les
réparations indiquées dans le mode d’emploi à moins d’être qualifié pour en effectuer d’autres.
Pour toute réparation faire appel à une personne compétente uniquement.
WARNING
This unit has no power switch.
When installing the unit, incorporate a readily accessible
disconnect device in the fixed wiring, or connect the
power cord to a socket-outlet which must be provided
near the unit and easily accessible, so that the user can
turn off the power in case a fault should occur.
WARNUNG
Dieses Gerät hat keinen Netzschalter.
Beim Einbau des Geräts ist daher im Festkabel
ein leicht zugänglicher Unterbrecher einzufügen,
oder das Netzkabel muß mit einer in der Nähe
des Geräts befindlichen, leicht zugänglichen
Wandsteckdose verbunden werden, damit sich bei
einer Funktionsstörung die Stromversorgung zum Gerät
jederzeit unterbrechen läßt.
警告
本機は電源スイッチを備えていません。
万一，異常が起きた際に，お客様が電源を切ることが
できるように，設置の際には，機器近くの固定配線内
に専用遮断装置を設けるか，機器使用中に，容易に抜
き差しできるコンセントに電源プラグを接続してださ
い。

PMW-EX30
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type
recommended by the manufacturer.
Dispose of used batteries according to the
manufacturer’s instructions.
Vorsicht!
Explosionsgefahr bei unsachgemäßem Austausch
der Batterie.
Ersatz nur durch denselben oder einen vom
Hersteller empfohlenen ähnlichen Typ. Entsorgung
gebrauchter Batterien nach Angaben des
Herstellers.
ATTENTION
Il y a danger d’explosion s’il y a remplacement
incorrect de la batterie.
Remplacer uniquement avec une batterie du même
type ou d’un type équivalent recommandé par le
constructeur.
Mettre au rebut les batteries usagées conformément
aux instructions du fabricant.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Lithiumbatteri - Eksplosjonsfare.
Ved utskifting benyttes kun batteri som
anbefalt av apparatfabrikanten.
Brukt batteri returneres
apparatleverandøren.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ
som rekommenderas av apparattillverkaren.
Kassera använt batteri enligt gällande
föreskrifter.
VAROITUS
Paristo voi räjähtää jos se on virheellisesti
asennettu.
Vaihda paristo ainoastaan laitevalmistajan
suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden
mukaisesti.
注意
指定以外の電池に交換すると，破裂する危険があり
ます。
使用済の電池は，説明書に従って処理してください。
1 (P)

1
PMW-EX30
Table of Contents
Manual Structure
Purpose of this manual.................................................................. 3
Related manuals ............................................................................ 3
1. Service Overview
1-1. Operating Conditions ...................................................... 1-1
1-2. Power Supply .................................................................. 1-1
1-3. Installation Space ............................................................ 1-2
1-3-1. Outside Dimensions............................................... 1-2
1-3-2. Notes on Installation .............................................. 1-3
1-3-3. Rack Mounting ...................................................... 1-3
1-4. External Connectors ........................................................ 1-4
1-4-1. Signal Inputs and Outputs...................................... 1-4
1-5. Board Location................................................................ 1-5
1-6. Function of Switches on Boards...................................... 1-6
1-7. Circuit Description .......................................................... 1-7
1-8. Service Tools/Measuring Equipment List ..................... 1-13
1-8-1. Service Tools........................................................ 1-13
1-8-2. Measuring Equipment.......................................... 1-13
1-9. Firmware Upgrade......................................................... 1-14
1-10. Recommended Periodic Replacement Parts.................. 1-15
1-11. Servicing Software “ServiceNavi-EX” ......................... 1-15
1-12. Note on Service............................................................. 1-15
1-12-1. Requirements on Replacement of Boards
or Parts ................................................................. 1-15
1-12-2. Note on Replacement of Parts on the Board........ 1-15
1-12-3. Lead-free Solder .................................................. 1-16
1-12-4. Fuse and IC Link Replacement............................ 1-16
1-12-5. Circuit Protection Element................................... 1-17
1-13. Replacing the Flexible Card Wires................................1-17
1-14. Replacing the Coaxial Cable with Connector
(Fine Pitch Coaxial Cable) ............................................ 1-18
1-15. List of Error Numbers on the LCD Display.................. 1-19
2. Replacement of Main Parts
2-1. U Case ............................................................................. 2-1
2-2. Front Panel Assembly...................................................... 2-1
2-3. Rear Panel Assembly....................................................... 2-2
2-4. LCD Assembly ................................................................ 2-2
2-5. Lithium Battery ............................................................... 2-3
2-6. KY-633 Board ................................................................. 2-3
2-7. HP-143 Board.................................................................. 2-4
2-8. EC-64 Board.................................................................... 2-4
2-9. DPR-297 Board ............................................................... 2-5
2-10. AVP-11 Board ................................................................. 2-5
2-11. CP-400 Board.................................................................. 2-6
3. SERVICE Menu
3-1. SERVICE Menu List.......................................................3-1
3-2. SERVICE Menu Outline .................................................3-1
3-2-1. Basic Menu Operations.......................................... 3-1
3-2-2. SERVICE Menu Structure ..................................... 3-2
3-2-3. Displaying the SERVICE Menu ............................ 3-2
3-3. SERVICE Menu Description ......................................... 3-2
3-3-1. INFORMATION Menu ......................................... 3-2
4. Spare Parts
4-1. Notes on Repair Parts...................................................... 4-1
4-2. Exploded Views............................................................... 4-2
4-3. Electrical Parts List ......................................................... 4-6
4-4. Packing Materials & Supplied Accessories................... 4-33
5. Block Diagrams
Overall............................................................................. 5-1

2PMW-EX30
6. Schematic Diagrams
AVP-11 ............................................................................ 6-2
CP-400........................................................................... 6-26
DPR-297........................................................................ 6-28
EC-64 ............................................................................ 6-50
HP-143 .......................................................................... 6-51
KY-633 .......................................................................... 6-52
Frame Wiring................................................................. 6-56
7. Board Layouts
EC-64 .............................................................................. 7-1
HP-143 ............................................................................ 7-1
AVP-11 ............................................................................ 7-2
CP-400............................................................................. 7-5
DPR-297.......................................................................... 7-6
KY-633 ............................................................................ 7-8

3
PMW-EX30
Manual Structure
Purpose of this manual
This is the Service Manual of solid-state memory recorder PMW-EX30.
This manual is intended for use by trained system and service engineers, and pro-
vides the information of maintenance and detailed service (parts replacement, guide-
line for adjustment, schematic diagrams, board layouts, detailed parts list).
Related manuals
In addition to this Manual, the following manuals are provided for this unit.
.Operating Instructions (Supplied with the unit)
This manual is required for the proper operation and application of this unit.
.“Semiconductor Pin Assignments” CD-ROM (Available on request)
This “Semiconductor Pin Assignments” CD-ROM allows you to search for
semiconductors used in Broadcast and Professional equipment.
Part number: 9-968-546-06

1-1
PMW-EX30
Section 1
Service Overview
1-1. Operating Conditions
Operating temperature: 5 dC to 40 dC
Storage temperature: _20 dC to 60 dC
Locations to avoid:
.Areas where the unit will be exposed to direct sunlight of any other strong lights.
.Areas near heat sources.
.Dusty areas or areas subject to vibration.
.Areas with strong magnetic field.
.Areas with much electrical noise.
.Areas with much static electricity.
.Areas that is impossible to find a specified room for installation.
(Refer to Section 1-3. Installation Space.)
.Areas windtight.
1-2. Power Supply
The unit works DC. When repairing or checking the unit, using AC adapter (MPA-AC1) supplied with the
unit is recommended.
Power voltage: 100 to 240 V AC (MPA-AC1)
12 V DC (PMW-EX30)
Power consumption: DC: approx. 12 W

1-2 PMW-EX30
w=210
h=88
d=200
(98)
(142)
(160)
(219.1)
(36)
Unit: mm
1-3. Installation Space
1-3-1. Outside Dimensions

1-3
PMW-EX30
1-3-2. Notes on Installation
w
To avoid an injury, do not install the unit on rickety table.
Ventilation and Installation Space for Servicing
.Do not install the unit with the feet (four parts on the bottom) removed.
.In order to make a unit with good ventilation, ensure sufficient clearance around the unit.
.Be sure to provide 2 cm or more space to both the right and left sides and the top of the unit, and 25 cm
or more space behind the unit.
.Do not install equipment on this unit.
n
Provide 2 cm or more space to both right and left sides of the unit. Providing 20 cm or more space above
the unit is recommended considering service operations.
1-3-3. Rack Mounting
Notes on Rack Mounting
.A rise in temperature inside the rack due to a residual heat by neighboring units will bad effects on the
unit. Check that the temperature inside the rack is within the range of specified operating temperature of
the unit.
.When installing units side by side, leave 1 cm or more of space to the both side of each PMW-EX30.
.Leave 25 cm or more of space to the rear of the unit.
.Use a commercially available rack mount kit.
Select an appropriate shelf taking size and weight of the unit into consideration.
.Never remove the top and bottom panels, handle, or legs of the unit when installing.
.Use adequately long cables for connection of the connector panel, considering that the unit is pulled out
from the rack.
n
After rack mounting, check that the temperature inside the rack is within the range of 5 dC through 35 dC.

1-4 PMW-EX30
1-4. External Connectors
1-4-1. Signal Inputs and Outputs
HD/SD SDI OUTPUT: BNC Type
SDI output signal
HD SDI INPUT: BNC Type
SDI input signal
VIDEO OUTPUT COMPOSITE: BNC Type
Composite videooutput signal
PHONES: Stereo mini jack
_20.5 dBu (Reference level 16 Zloaded)
Sound monitor, monaural/Stereo Selectable
AUDIO INPUT CH-1, CH-2: RCA-PIN (Female)
(0 dBu = 0.775 V rms)
No. Signal I/O Specifications
1 LINE (X) I High impedance, Unbalanced,
_10 dBu/_2 dBu/+4 dBu, selectable
2 LINE (G) _GND
AUDIO OUTPUT CH-1/3, CH-2/4: RCA-PIN (Female)
(0 dBu = 0.775 V rms)
No. Signal I/O Specifications
1 LINE (X) O Unbalanced, _10 dBu
2 LINE (G) _GND
VIDEO OUTPUT S_VIDEO: Mini DIN 4-pin (Female)
No. Signal I/O Specifications
1 A GND _GND
2 A GND _GND
3 Y O COMPONENT (Y)
4 C O COMPONENT (C)
VIDEO OUTPUT COMPONENT Y, Pb/B_Y, Pr/R_Y:
BNC x3
No. Signal I/O Specifications
1 Y O COMPONENT (Y)
2 Y_GND _Y GND
1 PB O COMPONENT (Pb)
2 PB_GND _PB GND
1 PR O COMPONENT (Pr)
2 PR_GND _PR GND
12
_EXT VIEW _
12
34
_EXT VIEW _
121212
_EXT VIEW _
12
_EXT VIEW _

1-5
PMW-EX30
HDV/DV: i.LINK connector (IEEE1394, S400) (6P)
No. Signal I/O Specifications
1 VP I BUS POWER
2 VG _GND
3 NTPB I/O STROBE B (_)
4 TPB I/O STROBE B (+)
5 NTPA I/O DATA A (_)
6 TPA I/O DATA A (+)
: USB mini B connector (5P)
No. Signal I/O Specifications
1 VCC _USB Vcc
2 D _I/O USB_
3 D +I/O USB+
4 ID _NC
5 GND _Ground
1-5. Board Location
AVP-11 board
KY-633 board
IF-1072 board EC-64 boards
DPR-297 board
CP-400 board
HP-143 board
2 4 6
1 3 5
_EXT VIEW _
15
_EXT VIEW _
 DC IN: 2P (DC JACK TYPE 4)
GNDEXT DC
_EXT VIEW _

1-6 PMW-EX30
1-6. Function of Switches on Boards
AVP-11 board
Ref. No. (address) Description Factory setting
S1 (A-4) Factory use OFF
S2001 (B-1) RESET _
S2001
S1
AVP-11 board (A side)

1-7
PMW-EX30
1-7. Circuit Description
1. Video signal system
DPR-297 board
The digital video (Y/C) signal output from the Copro Sub IC (IC900) on the AVP-11 board enters the
baseband processing IC (IC100).
The baseband processing IC (IC100) performs the overall baseband processing of video and audio signals
with a single chip IC containing the various scaler functions (supporting the multiple format outputs),
various OSD functions, PLL function (54 MHz →74 MHz) and CPU.
The baseband processing IC (IC100) provides the following outputs:
.HD/SD-SDI (digital): To AVP-11 board
.HDMI (digital): To AVP-11 board
.HD/SD Component (analog): To AVP-11 and CP-400 boards
.Composite (analog): To AVP-11 and CP-400 boards
.S-Video (analog): To AVP-11 and CP-400 boards
.LCD signal (digital): To LCD module
The input/output signals of the baseband processing IC (IC100) are the following signals:
.MPEG encoder/decoder I/F signal (digital): To IC401
.Audio I/F signal (digital): To IC800 on the AVP-11 board
Peripheral circuits of the baseband processing IC (IC100) are the master clock 54 MHz VCXO (X100)
control circuit (IC102 to IC106 and IC108) and the Mobile DDR SDRAM memory (IC300, IC301).
Peripheral circuits of the built-in CPU are FLASH ROM (IC202) and SDRAM (IC205).
The baseband processing IC (IC100) is controlled by the system controller (IC1600) on the AVP-11 board.
The LCD driver IC, the EVF driver IC, SDI Copro, the audio system and the power save control of the
output systems are controlled by the built-in CPU inside IC100.
2. Media recording and playback
DPR-297 board
Output from the baseband processing IC (IC100) is input into the MPEG encoder/decoder (IC401).
The MPEG encoder/decoder (IC401) is the single-chip MPEG Codec IC that encodes and decodes both
the high-quality HD video signal and audio signal in real-time. It has various interfaces with signals such
as MPEG video, video input/output, MPEG audio, audio input/output, bit stream input/output, and inter-
face with the host.
IC401 output is then input into LSI (IC400) for AVIT signal processing.
LSI (IC400) for AVIT signal processing contains the built-in CPU and has interfaces for 2 GBit DDR2
SDRAM memory (IC500, IC501), PCI bus, PCI-Express bus, I/O for IC401, and serial communication
with system controller (IC1600) on the AVP-11 board.
IC400 is also connected to the NOR-type Flash ROM (IC601) to read the CPU program in the IC400
during initial startup.
LSI (IC400) for AVIT signal processing is controlled by the system controller (IC1600) on the AVP-11
board, in the same way as other main devices, and provides the following types of functions: video/audio
stream control, access to the SxS memory card, mass storage operations when connected to USB and
HDV device controls when connected to i.LINK.

1-8 PMW-EX30
Explanation of peripheral devices
<SxS memory card slot>
Two memory card slot boards (EC-64) are connected to the dual channel PCI-Express signals coming
from IC400 through a 0.5 mm pitch, 30-pin fine coaxial cables connected to CN800 and CN801.
Furthermore, dual channel USB host signals output from USB host controller (IC802) are connect to the
EC-64 boards through fine coaxial cables just as with the PCI-Express signals.
IC802 is controlled by PCI bus from IC400.
<USB device controller>
USB device signal output from USB device controller (IC602) is connected to USB Mini-B connector
(CN600).
IC602 is controlled by the dedicated bus from IC400.
If there is no USB connection, the power supply for IC602 drops off.
<i.Link controller >
The i.Link signal output from the i.Link controller (IC700) is connected to the 6-pin i.Link connector
(CN700).
IC700 is controlled by the PCI bus from IC400.
3. Audio system
This overview explains the audio system according to the audio block diagram shown in Fig. 1.
CP-400 board
This board is a connector board on which RCA-pin (2-pin) connector for external LINE input and the
[_10 dBu/_2 dBu/+4 dBu] input selection switch for two channels are mounted on this connector board.
AVP-11 board (Audio block)
This board controls the analog audio input signal processing, as well as serial signal.
.This audio input signal is received by the input amplifier (IC1024, IC1025) that performs amplification
of 0/+12 dB and switching (Q1006 to Q1009) in accordance with the level that is set by INPUT TRIM.
After that, the audio signal is connected to the SEL/AMP (1, 2).
.SEL/AMP (1, 2) is a signal selector and buffer amplifier.
.Serial control
The I2C control signal from Display Block (T-one) is converted into GPI, and performs the switching
between MONITOR [CH1/CH2] / [CH1+CH2] / [CH1] / [CH2] for CH1 and CH2 respectively.
The I2C control from Display Block (T-one) selects either IC1160 or IC1161 for the target with I2C
MPX and sets the register of IC1160 or IC1161.

1-9
PMW-EX30
This board is comprised of two pieces of the Audio Codec IC and the GLUE.
.Audio Codec (IC1160, IC1161)
The analog audio signal is connected to IC1160 and IC1161 that are the Audio Codec (PGA, ADC, DSP,
Digital IF, headphones amplifier are built on one chip and the parameters are set with I2C).
The Input TRIM (PGA) functions in the [MANUAL] mode, and fixed GAIN functions in the [PRESET]
mode to control the audio signal level. The analog signal after level adjustment is converted to the
digital signal with the ADC.
After the digital signal receives the audio level control processing from the DSP, the digital signal is
output for audio recording.
Playback output (including EE) is the digital signal that is connected to Audio Codec where it is con-
verted to the analog signal with DAC and output to the CP-400 board.
Furthermore, the audio signal that is processed for audio monitoring in Audio Codec is connected to the
headphones amplifier through the monitor level control from the AUX input of IC1160.
.GLUE (IC800)
After the digital signal output signal from the Audio Codec is amplified by +12 dB, it is supplied to the
Display Block (T-one). GLUE (IC800) also receives the playback output signal from the Display Block.
The playback system selects CH1/CH2 or CH3/CH4, connects EE, and connects TEST TONE from the
Display Block depending on the data.
Furthermore, GLUE divides the clock signal that is supplied from the Display Block to Audio Codec.
.Analog output from DAC re-enters into the AUX input of Audio Codec after passing through the moni-
tor selector/mixer (IC1019 to IC1021), and becomes the monitor signal.
CP-400 board (Audio block)
Analog output from Audio Codec on the AVP-11 board is buffered by IC101 and is output to the RCA-pin
connector after passing through the audio MUTE control. The audio output from the AVP-11 board is con-
nected to PCA-pin connector.
HP-143 board (Audio block)
The headphones output signal is connected to the headphones jack.
The headphones output is muted by the MUTE (Q1160, Q1161) on the AVP-11 board.
Switch/volume control/menu panel (Audio controller block)
Operation panel functions relating to audio signal are built into the following blocks.
KY-633 board (Audio block)
Each CH1 and CH2 are connected to PIO of CPU (IC400), and the volume control [AUDIO LEVEL] is
connected to ADC of CPU (IC400).
The switch [MONITOR (AUDIO) +/_] that is common to CH1 and CH2 is connected to PIO of CPU
(IC300).
MENU processing
(1) Audio Input
.CH1, CH2 [REC Level]: Preset 0 dB/Manual +12 dB to _%
.[1 kHz Tone]: ON/OFF
(2) Audio Output
.[MONITOR CH]: [CH1/CH2] / [CH1+CH2] / [CH1] / [CH2] selection
.Output CH: [CH1/CH2] / [CH3/CH4] selection

1-10 PMW-EX30
MIX
AMP
MUTE
LINE 2
RCA-PIN
LINE 1
RCA-PIN
MUTE
HP Out
(PHONE
MINI)
MUTE
MUTE AMP
Out1
(Line Out1)
Out2
(Line Out2) AMP
AMP
AMP
AMP
MONITOR LEVEL
SEL/
AMP1
GPIO
LINE -2
D/A
SEL/
AMP2
SEL/
MIX1
SEL/
MIX2
MONI1-1,2-1,
MONI2-2,2-1,
BEEP,
MUTE
PWR or
DET MUTE
AMP
AMP
(GAIN SEL CH1)
Linked/
Separated
LINE 3/4
Digital Audio
OUT 1
CLOCK DIV
(1fs,64fs,256fs)
Digital Audio
IN 1 or 3
GAIN MAKE
OUT 2
Digital Audio
IN 2 or 4
CLOCK DIV
(1fs,64fs,256fs)
MONI CH2-2
MONI CH2-2 BEEP
AUX IN (L)
AUX IN (R)
Display
Block
(T-one)
IC1160(2/2)
I2C to
GPIO
Display
Block(T-on)
I2C
I2C
I2C
INT/EXT1,INT/EXT2
MIC/LINE/+48V-1,
MIC/LINE/+48V-2,
COPY1to2, LINK2to1, LINK1to2
A/D
D/A
I2S
AUDIO IF
I2S
AUDIO IF
FIL AGC LVL
A/D FIL AGC LVL
PGA
GAIN
PGA
GAIN
PGA
GAIN
PGA
GAIN
EXT 1
INT/EXT 2
CH1 CH1/CH2 Linked/
Separated
IC1025
IC024
Q1009,
Q1008
(GAIN SEL CH2)
Q1006,
Q1007
IC1014, IC1018
IC1016,
IC1017
IC1013,
IC1015
MONI CH-1
MONI CH2-1
CLOCK DIV
(1fs,64fs,256fs)
DP_O_CAM_
AU_DT12O
CPLD_O_
AU_DT12
CPLD_O_
AU_DT34
O_AU_
DT12
O_AU_
DT34
DP_I_AU_
DT12
DP_I_AU_
DT34
AU_DT12_FOR_AEE
AU_DT34_FOR_AEE
(DP_O_CAM
_AU_DT34O)
DP_I_CAM_A
U_DT34O
DP_I_CAM_A
U_DT12O
Q1160
Q1161 IC1020,
IC1019 (1/2)
IC1021,
IC1019 (2/2)
Q1161
CN1
Q1000-Q1005
Q1160
IC1163
IC1009-IC1012
IC1022-IC1026 I2C MPX
(DEVICE CONTROL)
AVP-11
CP-400
HP-143
DPR-297
DPR-297
IC1160(1/2)
IC1161
IC800
GLUE
IC102
DC-COPRO
IC900
COPRO
SUB Recording
signal
TO
DPR-297
FROM
DPR-297
Playback
signal
LINE -1
Fig.1 Audio block diagram

1-11
PMW-EX30
4. System control
AVP-11 board
The 32-bit RISC CPU (ARM) with ARM core is built-in as the system controller (IC1600).
It has the peripheral interface functions of SDRAM, USB, SCI, and I2C. It operates on a 27 MHz clock
(X1200). FLASH ROM (IC1202), SDRAM (IC1203), and EEPROM (IC1313) are mounted as the periph-
eral ICs.
It performs the system control through serial communication with IC100 of the video signal system, and
IC400 of the media recording/playback system on the DPR-297 board.
Main functions of the system controller and peripherals
(1) Reading operation switch information
Reading the switch information and the LED control are performed by I2C bus communication with each
sub-microprocessor.
.Front switch: IC200, IC300, IC400 on the KY-633 board
.Power supply switch: IC2002
(2) Watch IC (RTC) control
The watch IC (IC102) is built onto the KY-633 board.
The watch IC (IC102) is backed up by a lithium coin battery, and the current time is read or set via
IC1600 on the AVP-11 board.
(3) Infrared remote control demodulation
The KY-633 board has an IC (IC101) for infrared remote control signal demodulation, and it receives the
command codes via IC300 on the KY-633 board.
(4) Power supply voltage detection
The power supply voltage at the DC IN connector is measured by the A/D port on IC2002 on the AVP-11
board, and it is posted to the system controller as the input voltage value.
(5) Power system control
IC2002 on the AVP-11 board checks that the power switch on the unit is turned ON, and turns on the
system controller of IC1600. After that, it controls the power for each circuit block according to the
system controller.
The system controller controls the respective power supply systems in the AVP-11 and DPR-297 boards
according to the operation mode of the device, via the POWER SUPPLY MICON (IC2002).
By turning off the power systems to unnecessary circuits blocks, power can be saved.
5. SDI system
SDI block (Input)
AVP-11 board
An SDI signal is input through cable EQ (IC453) from CN401 to DC_Copro (IC102).
In the DC_Copro (IC102), the input signal is decoded from a serial signal and separated to a parallel video
signal, embedded audio signal, and time code. After this, the resultant signal is video-filtered, audio-
deemphasized, and audio level-controlled in the Copro SUB (IC900) and input to IC100 on the DPR-297
board.

1-12 PMW-EX30
SDI block (Output)
AVP-11 board
The DC Copro (IC102) receives the parallel video signal from IC100 on the DPR-297 board and per-
formes signal-parallel conversion, and outputs the SDI signal.
Output SDI signals are supplied to CN401 through the cable driver (IC451).
The PLL circuit is used to reduce jitter of the HD-SDI clock signal.
The DC_Copro (IC102) is controlled by IC100 on the DPR-297 board through 4-line serial communica-
tion.
The FPGA program is stored in the IC901 ROM, and SPI can be used to overwrite the data from IC1600.
HDMI block (Output)
AVP-11 board
The parallel video signal and serial audio signal output from DC_Copro (IC102) are output from an
HDMI connector (CN404) through an HDMI transmitter (IC452).
DVCAM OUT block (Output)
AVP-11 board
The parallel video output signal that was down-converted using IC100 on the DPR-297 board is filtered
from 4:2:0 to 4:1:1 (4:1:0) in GLUE (IC800). After that, the signal is converted into a 4-bit signal and
sent to IC400 on the DPR-297 board. In IC400, the resultant signal is encoded to a DVCAM signal and
output from the i.LINK connector (CN700) on the DPR-297 board.
6. Power supply system
AVP-11 board
This board is comprised of the power supply circuit and the POWER SUPPLY MICON (IC2002).
However, part of the low-voltage power supply is mounted on the DPR-297 board.
(1) Input power supply (UNREG) system operations
When the UNREG power is input, the EVER power state is established.
In this state, the ON/OFF state of the Power switch can be recognized.
If the POWER SUPPLY MICON (IC2002) recognizes that Power switch is ON, the power is turned on
for the system control system and the POWER SUPPLY MICON controls the power supply for each
block according to the system controller (IC1600).
The normal value for the input power supply (UNREG) is in the range of about +10.5 V to +18 V.
.Input overvoltage protection
If the voltage is too high in the UNREG power supply, the overvoltage protection circuit starts operat-
ing around the set value of +17.9 V, and the unit shuts down. When the input power supply voltage to
this circuit becomes less than +17.9 V, the power supply immediately switches on with automatic
recovery.
.Input low-voltage protection
If the voltage is too low in the UNREG power supply, the low-voltage protection circuit starts operating
around the set value of +10.5 V according to the control by the POWER SUPPLY MICON (IC2002),
and the unit shuts down. When the input power supply voltage becomes higher than +10.5 V, the power
supply immediately switches on with automatic recovery according to the control by the POWER
SUPPLY MICON.