Sony SDX-1100V/R User manual

SDX-1100V
SDX-1100V/R 5.25”Model
Product Specification Manual
Version 1.0
August, 2006
Copyright © 2006, Sony Corporation.
All right reserved.
NOTE:
This Product Specification Manual is applicable for AIT-5 drive.

Notice
This document contains proprietary information which is protected by copyright. All rights reserved. No part of this
document may be photocopied, reproduced or translated to another language without prior written consent of Sony.
The information contained in this document is subject to change without notice.
SONY MAKES NO WARRANTY OF ANY KIND WITH REGARD TO THIS DOCUMENT. Sony shall not be liable
for errors contained herein, or indirect, special, incidental or consequential damages in connection with the
furnishing, performance, or use of this document.
© Copyright 2006, Sony Corporation
For further information, please contact the appropriate Sony location listed below;
Sony Electronics Inc., Tape Storage Solutions (USA)
URL: http://www.storagebysony.com
Sony Australia Limited
33-39 Talavera Rd.
NORTH RYDE, NSW 2113
TEL: [phone] FAX: [phone]
e-mail: [e-mail]
Sony of Canada Ltd., AV/IT Marketing Group
Computer Peripherals Product Marketing
115 Gordon Baker Road Toronto, Ontario, M2H 3R6 Canada
TEL: [phone] or (1) 800-961-7669
FAX: [phone]
Sony New Zealand
Akoranga Business Park
NORTH SHORE, AUCKLAND
TEL: [phone] FAX: [phone]
e-mail: [e-mail]
Sony Business Europe
URL: http://www.sonyisstorage.com/
Sony Chile Ltda
Av. Kennedy 8017, Las Condes, Santiago, Chile
TEL: [phone] FAX: [phone]
Electronics Devices Marketing (Singapore)
(A division company of Sony Electronics (S) Pte. Ltd.)
Enterprise Storage Solutions Dept.
2 International Business Park, #01-10 Tower One,
The Strategy, Singapore 609930
TEL: [phone] FAX: [phone]
Sony Taiwan Limited
Optical Devices Storage Dept. Data Storage Section
5F, 145 Changchun Road, Taipei 104, Taiwan
TEL: [phone] FAX: [phone]
Sony Corporation of Hong Kong Ltd.
Computer Peripheral Sales & Marketing Division
Electronic Devices Marketing Hong Kong
45/F, The Lee Gardens, 33 Hysan Avenue, Causeway Bay, Hong Kong
TEL: [phone] FAX: [phone]
Sony Korea Corporation EDMK CP Sales & Marketing Team
34F, ASEM Tower, World Trade Center, 159-1, Samsung-Dong,
Kangnam-Ku, Seoul, 135-798, Korea
TEL: [phone] FAX: [phone]
URL: http://www.sony.co.kr/cp/
Sony Corporation of Hong Kong Ltd. Beijing Rep. Office
Computer Peripheral Div.
Full Link Plaza Tower A 11/F., No.18 Chaoyangmenwai Ave., Beijing
100020 P.R.C.
TEL: [phone] FAX: [phone]
URL: http://www.sony.com.cn/ed/cp/ait/
Sony Gulf FZE Computer Display & Peripheral Div.
P.O.BOX 16871, Jebel Ali, Dubai, U.A.E.
TEL: [phone] or 8816912 FAX: [phone] or 8816259
Sony Corporation of Hong Kong Ltd.,
Electronic Devices Marketing Hong Kong
Computer Peripherals Sales & Marketing Div.
8/F, One Corporate Avenue, 222 Hu Bin Road. Luwan District,
Shanghai. P.R.C. Postcode 200021
TEL: [phone]
URL: http://www.sony.com.cn/ed/cp/ait/
Sony Marketing of Japan
Business Solution Dept. Server Solution Marketing Section
URL: http://www.sony.co.jp/STORAGE
Sony Brasil Ltda.
Rua InocŽncio Tobias, 125-BlocoA, CEP01144-000, Săo Paulo-SP-Brasil
TEL: [phone] to 6598 FAX: [phone]
URL: http://www.sonybrasil.com

SDX-1100V series Ver.1.0 Table of Contents
Table of Contents
1. INTRODUCTION.............................................................................................1-1
1.1. About this Product Specification Manual................................................................1-1
1.2. Introducing the Sony AIT Technology.....................................................................1-1
1.3. Features of the Drive.................................................................................................1-1
1.4. Reference...................................................................................................................1-3
1.4.1. How to get ECMA-329 Standard Document ............................................................ 1-3
2. SPECIFICATIONS..........................................................................................2-1
2.1. Specifications............................................................................................................2-1
2.1.1. Dimensions.............................................................................................................. 2-1
2.1.1.1. Mounting Holes....................................................................................................... 2-2
2.1.2. Weight ..................................................................................................................... 2-4
2.1.3. Connectors .............................................................................................................. 2-4
2.1.3.1. SCSI Cables and Terminators................................................................................. 2-4
2.2. Environmental Specifications.................................................................................. 2-4
2.2.1. Temperature and Humidity Range ........................................................................... 2-4
2.2.2.Altitude..................................................................................................................... 2-5
2.2.3. Suspended Particulate............................................................................................. 2-5
2.2.4. Vibration .................................................................................................................. 2-5
2.2.5. Shock....................................................................................................................... 2-5
2.2.6.Acoustic Noise......................................................................................................... 2-5
2.2.7. EMC......................................................................................................................... 2-5
2.2.8. Orientation............................................................................................................... 2-5
2.3. Performance Specification.......................................................................................2-6
2.3.1. Data Capacity.......................................................................................................... 2-6
2.3.2. Data transfer Rate ................................................................................................... 2-7
2.3.2.1. Sustained Data Transfer Rate to and from the Tape............................................... 2-7
2.3.2.2. Burst Transfer Rate to and from the SCSI Bus ....................................................... 2-7
2.3.3. Initialize Time........................................................................................................... 2-7
2.3.4. Load Time................................................................................................................ 2-7
2.3.5. Unload Time ............................................................................................................ 2-7
2.3.6. Search Time ............................................................................................................ 2-7
2.3.7. Rewind Time............................................................................................................ 2-7
2.3.8. Long Erase Time ..................................................................................................... 2-8
2.3.9. Error Rate................................................................................................................ 2-8
2.3.10. Definition of Failure ............................................................................................... 2-8
2.3.11. Mean Time Between Failures ................................................................................ 2-8
2.3.12. Mean Time to Repair............................................................................................. 2-8
2.3.13. Component Life..................................................................................................... 2-8
2.3.14. Durability ............................................................................................................... 2-8
2.4. Safety.........................................................................................................................2-9
2.4.1. Conditions of Acceptability....................................................................................... 2-9
2.5. Installation Requirements ........................................................................................2-9
2.5.1. Power Requirements ............................................................................................... 2-9
2.6. Data Compression................................................................................................... 2-10

SDX-1100V series Ver.1.0 Table of Contents
3. INSTALLATION..............................................................................................3-1
3.1. Installation Guide......................................................................................................3-1
3.1.1. SCSI ID Number Jumper......................................................................................... 3-2
3.1.2. Termination Power Switch ....................................................................................... 3-2
3.1.3. Parity Disable Jumper.............................................................................................. 3-3
3.1.4. Data Compression ON Switch ................................................................................. 3-3
3.1.5. Power Connector..................................................................................................... 3-3
3.1.6. SCSI 68 pin Connector............................................................................................ 3-3
3.1.7.Attaching and Removing the Dust Cover................................................................. 3-6
3.1.7.1. Attaching the Dust Cover........................................................................................ 3-6
3.1.7.2. Removing the Dust Cover....................................................................................... 3-7
4. OPERATION...................................................................................................4-1
4.1. Summary of LED Indications....................................................................................4-1
4.2. Operator Action.........................................................................................................4-2
4.2.1. Powering up the Drive ............................................................................................. 4-2
4.2.2. Inserting Cassettes.................................................................................................. 4-2
4.2.3. Removing Cassettes................................................................................................ 4-2
4.2.4. Hard Reset Hole...................................................................................................... 4-2
4.2.5. Write-Protecting Cassettes...................................................................................... 4-2
4.3. Internal Function.......................................................................................................4-3
4.3.1. The Load Sequence ................................................................................................ 4-3
4.3.2. The Unload Sequence............................................................................................. 4-3
4.3.3. Power-Fail or SCSI Reset Handling......................................................................... 4-3
4.3.4. Diagnostic and Normal Status Displays................................................................... 4-4
4.3.4.1. Diagnostic Status Display....................................................................................... 4-4
4.3.4.2. Normal Status Display ............................................................................................ 4-4
4.4. Tape Alert................................................................................................................... 4-5
4.5. Tape Format............................................................................................................... 4-5
4.6. Maintenance, Troubleshooting and Service............................................................ 4-6
4.6.1. Head Cleaning......................................................................................................... 4-6
4.6.1.1. Message When Cleaning Cassette is Necessary ................................................... 4-6
4.6.1.2. The condition of Cleaning Request......................................................................... 4-6
4.6.1.3. Usage of Cleaning Cassette................................................................................... 4-6
4.6.2. Troubleshooting Guide............................................................................................. 4-6
4.6.2.1. Operational Problems............................................................................................. 4-6
4.6.2.2. Read/Write Problems.............................................................................................. 4-9
4.6.2.3. Replace Tape.......................................................................................................... 4-9
4.6.2.4. Media Warning........................................................................................................ 4-9
5. SCSI INTERFACE..........................................................................................5-1
5.1. Introduction...............................................................................................................5-1
5.2. SCSI Bus Operation..................................................................................................5-3
5.3. Message Specification..............................................................................................5-4
5.3.1. COMMAND COMPLETE (00h)................................................................................ 5-5
5.3.2. EXTENDED MESSAGE (01h) ................................................................................. 5-5
5.3.2.1. PARALLEL PROTOCOL REQUEST (04h) ............................................................. 5-5
5.3.2.2. SYNCHRONOUS DATA TRANSFER REQUEST (01h).......................................... 5-6

SDX-1100V series Ver.1.0 Table of Contents
5.3.2.3. WIDE DATA TRANSFER REQUEST...................................................................... 5-8
5.4. Status Specification................................................................................................5-12
6. COMMAND SPECIFICATION ........................................................................6-1
6.1. ERASE 19h................................................................................................................. 6-2
6.2. INQUIRY 12h..............................................................................................................6-3
6.3. LOAD/UNLOAD 1Bh..................................................................................................6-8
6.4. LOCATE 2Bh............................................................................................................6-10
6.5. LOG SELECT 4Ch.....................................................................................................6-11
6.6. LOG SENSE 4Dh...................................................................................................... 6-13
6.6.1. The Log Page Descriptor....................................................................................... 6-14
6.6.2. The Log Parameter Descriptor............................................................................... 6-15
6.6.3. Summary List of Supported Pages (00h)............................................................... 6-17
6.6.4. Write and Read Error Counters Pages (02h or 03h).............................................. 6-17
6.6.5. Last N Error Events List (07h) ............................................................................... 6-18
6.6.6. Tape Alert Log Page (2Eh)..................................................................................... 6-19
6.6.7. Tape Log Page (30h) (Sony Unique) ..................................................................... 6-24
6.6.8. Tape Capacity Log Page (31h) (Sony Unique)....................................................... 6-25
6.6.9. Drive Usage Log Page (33h) (Sony Unique) ......................................................... 6-26
6.6.10. Read and Write Frame Error Counter Page (34h & 35h) .................................... 6-27
6.6.11. Data Compression Transfer Log Page (39h) (Sony Unique) ............................... 6-30
6.6.12.AIT Log Page (3Ch) (Sony Unique)..................................................................... 6-31
6.6.13. MIC Fixed Length Information Page (3Dh) (Sony Unique).................................. 6-33
6.6.14. MIC Variable Length Information Page (3Eh) (Sony Unique) .............................. 6-38
6.7. MODE SELECT(6/10) 15h and 55h ......................................................................... 6-40
6.7.1. Disconnect-Reconnect Page (02h)........................................................................ 6-44
6.7.2. Control Mode Page (0Ah)...................................................................................... 6-45
6.7.3. Data Compression Control Page (0Fh).................................................................. 6-46
6.7.4. Device Configuration Page (10h)........................................................................... 6-47
6.7.5. Medium Partitions Parameter Page (11h).............................................................. 6-49
6.7.6. Informational Exceptions Control Page (1Ch)........................................................ 6-51
6.7.7.AIT Device Configuration Page (31h) .................................................................... 6-52
6.8. MODE SENSE (6/10) 1Ah and 5Ah......................................................................... 6-54
6.9. PERSISTENT RESERVE IN 5Eh.............................................................................. 6-57
6.10. PERSISTENT RESERVE OUT 5Fh .......................................................................6-60
6.11. PREVENT ALLOW MEDIUM REMOVAL 1Eh........................................................ 6-62
6.12. READ 08h .............................................................................................................. 6-63
6.13. READ ATTRIBUTE 8Ch.........................................................................................6-65
6.13.1.ATTRIBUTE VALUES service action................................................................... 6-66
6.13.2.ATTRIBUTE LIST service action ......................................................................... 6-67
6.13.3. PARTITION LIST service action.......................................................................... 6-68
6.13.4. VOLUME LIST service action.............................................................................. 6-68
6.14. READ BLOCK LIMITS 05h.................................................................................... 6-69
6.15. READ BUFFER 3Ch .............................................................................................. 6-70
6.16. READ POSITION 34h............................................................................................ 6-73
6.17. RECEIVE DIAGNOSTIC RESULTS 1Ch................................................................6-75
6.18. RELEASE (6/10) 17h and 57h............................................................................... 6-77
6.19. REPORT DENSITY SUPPORT 44h.......................................................................6-79
6.20. REPORT DEVICE IDENTIFIER A3h...................................................................... 6-82
6.21. REPORT LUNSA0h...............................................................................................6-83

SDX-1100V series Ver.1.0 Table of Contents
6.22. REQUEST SENSE 03h..........................................................................................6-84
6.23. RESERVE (6/10) 16h and 56h............................................................................... 6-93
6.24. REWIND 01h.......................................................................................................... 6-95
6.25. SEND DIAGNOSTIC 1Dh....................................................................................... 6-96
6.26. SET DEVICE IDENTIFIER A4h..............................................................................6-98
6.27. SPACE 11h.............................................................................................................6-99
6.27.1. CHECK CONDITION......................................................................................... 6-101
6.28. TEST UNIT READY 00h....................................................................................... 6-102
6.29. WRITE 0Ah .......................................................................................................... 6-103
6.30. WRITE ATTRIBUTE 8Dh...................................................................................... 6-104
6.31. WRITE BUFFER 3Bh........................................................................................... 6-106
6.32. WRITE FILEMARKS 10h..................................................................................... 6-108
7. DRIVE DIAGNOSTICS...................................................................................7-1
7.1. Overview.................................................................................................................... 7-1
7.2. Diagnostic Test.......................................................................................................... 7-1
7.2.1. Power-on Self Test................................................................................................... 7-1
7.2.2. SEND DIAGNOSTIC command - Self Test.............................................................. 7-2
7.2.3. SEND DIAGNOSTIC command - Individual Test..................................................... 7-2
7.2.4. Diagnostic Test Number Summary .......................................................................... 7-3
7.2.5. RECEIVE DIAGNOSTIC RESULT command .......................................................... 7-4
8. APPENDIX A: ASC & ASCQ ALPHABETIC ORDER....................................8-1
9.APPENDIX B: ASC &ASCQ NUMERIC ORDER..........................................9-1
10.APPENDIX C:ASC & ASCQ FORAIT (SONY UNIQUE)..........................10-1
11. APPENDIX D: SCSI COMMANDS (OP CODE ORDER)...........................11-1
12. APPENDIX E: MEDIUM AUXILIARY MEMORYATTRIBUTE ...................12-1
12.1. INTRODUCTION.................................................................................................... 12-1
12.2. OVERVIEW.............................................................................................................12-1
12.3. MEDIUM AUXILIALY MEMORY ATTRIBUTE TYPES AND STATES ....................12-1
12.4. MEDIUM AUXILIARY MEMORYATTRIBUTE DATA.............................................12-2
12.4.1.Attribute Format................................................................................................... 12-2
12.4.2.Attribute Identifier Values..................................................................................... 12-3
12.4.3. Standard Device Type Attributes ......................................................................... 12-3
12.4.4. Standard Medium Type Attributes ....................................................................... 12-9
12.4.5. Standard Host Type Attributes........................................................................... 12-10
13.APPENDIX F:AIT BASED WORM SYSTEM.............................................13-1
13.1. Important Notice................................................................................................... 13-1
13.2. Write-Protected (WP) Bitin Mode Sense Data.................................................... 13-1
13.3. How to detect a WORM cartridge. ....................................................................... 13-1
13.4. How to initialize a WORM cartridge.....................................................................13-1
13.5. How to handle the WORM cartridge in the drive................................................13-2

SDX-1100V series Ver.1.0 Table of Contents
14.APPENDIX G: CD-ROM DEVICE EMULATION FOR DISASTER
RECOVERY......................................................................................................14-1
14.1. Overview................................................................................................................ 14-1
14.2. Creating Disaster Recovery Tape........................................................................ 14-1
14.3. Configuring The Drive For Disaster Recovery Operation..................................14-1
14.4. Exiting DR Mode................................................................................................... 14-1
14.5. Supported CD-ROM DR Command Set............................................................... 14-1
14.5.1. Inquiry (12h)........................................................................................................ 14-1
14.5.2. Read 10 (28h) ..................................................................................................... 14-1
14.5.3. Read Capacity (0x25).......................................................................................... 14-1
14.5.4. Read TOC (0x43)................................................................................................ 14-2
14.5.5. Mode Sense/Select Page Code 0x3C................................................................. 14-2
14.6. Reset Handling...................................................................................................... 14-2

SDX-1100V series Ver.1.0 Table of Contents
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1.Introduction
SONY AIT-5 drive SDX-1100V series Ver.1.0 1-1
1. Introduction
1.1. About this Product Specification Manual
This Product Specification Manual is applicable for AIT-5 drive.
This manual provides information about the Sony SDX-1100V series Advanced Intelligent Tape Drives which is
necessary to integrate the drives into OEM products. This manual describes the specifications, SCSI Interface,
diagnostics, operation and installation of the Sony AIT-5 Tape Drives.
The Sony SDX-1100V drive uses data compression to achieve high capacity and high transfer rates. Actual
capacity and transfer rate depends on the source file type. The capacity ratings listed in the next subsection are
based on a 246 meter tape AIT-5 cassette. The Sony SDX-1100V drive is a high capacity data storage device
using Advanced intelligent tape (AIT) technology. The Sony SDX-1100V drive achieves high data integrity through
read-after-write, an additional level of Error Correction Code, and other features.
The Sony SDX-1100V drives provide MIC technology that automatically enhance reliability and performance. The
Sony SDX-1100V drives provide read and write capability for MIC user data area.
1.2. Introducing the Sony AIT Technology
While magnetic storage technologies continue to push the envelope of recording density and provide higher
capacities and transfer rates every 18 to 24 months, improvements in time to access this data have become very
limited. Since 1990, tape recording densities have increased up to ten fold, while the time to access this data
has increased less than two fold, creating a large mismatch between the amount of stored data and the ability to
access it.
This large “gap” between data access latency and area density has created a dilemma in application development
and limited the potential to implement truly cost-effective tertiary storage solutions. Many applications
compensated for this deficiency by incorporating multiple redundant tape drives, at higher cost, to achieve an
acceptable level of service for their users. Sony’s new Advanced Intelligent Tape design has recognized this need
and provided an innovative approach to solving the data latency problem while increasing capacity and data
transfer rates.
Traditional, older tape technologies relied mostly on conventional mechanical means, such as faster search
speeds or an on-tape index to improve access to stored data. While improvements in electronics and magnetics
have been the main enablers of increased capacity and transfer rates, rarely have these same technologies been
employed to significantly improve access to data.
Sony’s Advanced Intelligent Tape (AIT) architecture has deviated from conventional designs and employed
electronic enhancements to significantly improve access to stored data, using a captive, non-volatile memory
chip contained within the magnetic data cartridge. Known as Memory-In-Cassette, or MIC, this memory chip
provides a direct and immediate connection to the tape drive’s on-board processors to enable quick media
load, fast access to user files and provide a wealth of data about the history and current state of the data
cartridge.
1.3. Features of the Drive
Major features of the Sony SDX-1100V include:
• Capacity
100 Gbyte typical when using 230 meter tape AIT-3 cassette (SDX3-100C)
260 Gbyte with 2.6:1 Data Compression
150 Gbyte typical when using 246 meter tape AIT-3Ex cassette (SDX3X-150C)
390 Gbyte with 2.6:1 Data Compression
200 Gbyte typical when using 246 meter tape AIT-4 cassette (SDX4-200C)
520 Gbyte with 2.6:1 Data Compression
400 Gbyte typical when using 246 meter tape AIT-5 cassette (SDX5-400C)

1.Introduction
1-2 SONY AIT-5 drive SDX-1100V series Ver. 1.0
1040 Gbyte with 2.6:1 Data Compression
• Sustained transfer rate
16 Mbyte/sec when using AIT-3 cassette
18 Mbyte/sec when using AIT-3Ex cassette
24 Mbyte/sec when using AIT-4 cassette and AIT-5 cassette
• Supported Format
AIT-3 (Read/Write)
AIT-3Ex (Read/Write)
AIT-4 (Read/Write)
AIT-5 (Read/Write)
• Not compatible with the DDS and EXABYTE format tapes
• Burst transfer rate
12 Mbyte/sec Asynchronous
160 Mbyte/sec Synchronous
• Large 96 MB Buffer Memory
• 3.5” Standard Height, 5.25” Half Height
• Embedded SCSI interface (Ultra 160 LVD, Single-ended or Low Voltage differential)
• Supports Variable or Fixed record length
• Supports SCSI Disconnection/Arbitration
• Read After Write (RAW) On and Off capability
• Read Retry On and Off capability
• Frame rewrite function –AIT-3
• Fragment rewrite function – AIT-3Ex, AIT-4 and AIT-5
• Three levels of Error Correction Code (ECC) – AIT-3
• Two levels of Error Correction Code (ECC) – AIT-3Ex, AIT-4 and AIT-5
• High Speed search
• Random read, Append write
• MIC Support (Automatic reliability and performance enhancement.)
• MIC Support (Read and write capability for MIC user data area.)
• Remote-MIC Support
• Tape Alert

1.Introduction
SONY AIT-5 drive SDX-1100V series Ver.1.0 1-3
1.4. Reference
Please refer to the following documents for additional information:
•SCSI-2 1ANSI X3.131.-1996 Small Computer Systems Interface-2 (SCSI-2).
• SCSI Parallel Interface-2 (SPI-2) ANSI X3T10-1142D rev 20b.
ANSI X3T9.2/86-109 (Revision 10H, or above), available through ANSI.
• SCSI Parallel Interface-3 (SPI-3) ANSI INCITS 336-2000
• SCSI Architecture Model-2 (SAM-2) ANSI INCITS 366-2003
• ALDC - Adaptive Lossless Data Compression (ALDC) Algorithm;
ECMA-222, available through 2ECMA.
•
1.4.1. How to get ECMA-329 Standard Document
You can get the ECMA-329 Standard Document file from the following URL.
http://www.ecma-international.org/publications/standards/standard.html
1ANSI (American National Standard for Industry)
2ECMA (European Computer Manufacturers Association)

1.Introduction
1-4 SONY AIT-5 drive SDX-1100V series Ver. 1.0
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2.Specification
SONY AIT-5 drive SDX-1100V series Ver.1.0 2-1
2. Specifications
Physical, environmental and performance specifications for the SDX-1100V and SDX-1100V/R.
2.1. Specifications
2.1.1. Dimensions
The SDX-1100V
Height 41.2 mm (1.62 in) ± 0.5 mm (0.02 in)
Width 101.6 mm (4.00 in) ± 0.5 mm (0.02 in)
Depth 155.0 mm (6.10 in) ± 0.5 mm (0.02 in)
The SDX-1100V/R
Height 41.2 mm (1.62 in) ± 0.5 mm (0.02 in)
Width 146.0 mm (5.75 in) ± 0.5 mm (0.02 in)
Depth 155.0 mm (6.10 in) ± 0.5 mm (0.02 in)
Note: The above dimensions do not include the front panel thickness, eject button and SCSI connector.
Height 41.2 0.5mm
[1.62" 0.02"]
Width 101.6 0.5mm
[4.00" 0.02"]
Depth 155.0 0.5mm
[6.10" 0.02"]
7.6
0.5mm
[0.30" 0.02"]
+
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7.4 0.6mm
[0.29" 0.02"]
+
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Figure 2-1: Dimensions (SDX-1100V)

2.Specification
2-2 SONY AIT-5 drive SDX-1100V series Ver. 1.0
2.1.1.1. Mounting Holes
Figure 2-2a gives details of the mounting holes for the Sony SDX-1100V and figure 2-2b for the Sony
SDX-1100V/R.
155.0 0.5mm [6.10" 0.02"]
90.0 0.3mm [3.54" 0.01"]
60.0 0.3mm
[2.36" 0.01"]
70.0 0.3mm [2.76" 0.01"]
31.0 0.3mm
[1.22" 0.01"]
21.0 0.3mm
[0.83" 0.01"]
41.2 0.5mm [1.62" 0.02"]
4.8 0.5mm [0.19" 0.02"]
6-M3 (depth 2.5mm [0.10"] max.)
6-M3 (depth 2.5mm [0.10"] max.)
42.0 0.3mm
[1.65" 0.01"]
94.0 0.5mm [3.70" 0.02"]
101.6 0.5mm [4.00" 0.02"]
+
_+
_
+
_+
_
+
_+
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+
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+
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+
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+
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+
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+
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+
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+
_
+
_
+
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+
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+
_
+
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+
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+
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_
7.4 0.6mm
[0.29" 0.02"]
+
_
+
_
9.8 0.6mm [0.39" 0.02"]
+
_
+
_
Figure 2-2a: SDX-1100V Mounting Holes

2.Specification
SONY AIT-5 drive SDX-1100V series Ver.1.0 2-3
79.2 0.3mm [3.12" 0.01"]
79.2 0.3mm [3.12" 0.01"]
47.5 0.3mm
[1.87" 0.01"]
79.2 0.3mm [3.12" 0.01"]
47.5 0.3mm
[1.87" 0.01"]
94.0 0.5mm [3.70" 0.02"]
21.8 0.5mm [0.86" 0.02"]
41.2 0.5mm [1.62" 0.02"]
9.9 0.5mm [0.39" 0.02"]
139.6 0.5mm [5.50" 0.02"] 146.0 0.5mm [5.75" 0.02"] 149.0 0.5mm [5.87" 0.02"]
155.0 0.5mm [6.10" 0.02"]
70.0 0.3mm [2.76" 0.01"]
31.0 0.3mm
[1.22" 0.01"] 42.0 0.3mm [1.65" 0.01"]
4-M3
6-M3
+
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8.4 0.5mm
[0.33" 0.02"]
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7.6 0.5mm
[0.30" 0.02"]
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Figure 2-2b: SDX-1100V/R Mounting Holes

2.Specification
2-4 SONY AIT-5 drive SDX-1100V series Ver. 1.0
2.1.2. Weight
SDX-1100V 0.8 kg, without a cassette and a front bezel.
SDX-1100V/R 1.1 kg, without a cassette and a front bezel.
2.1.3. Connectors
The SDX-1100V has a SCSI connector with a power connector and Jumpers at the positions shown in Figure 2-3.
All other connectors are for use by Sony’s manufacturing and service facilities only.
Figure 2-3: Connector Positions
2.1.3.1. SCSI Cables and Terminators
The Single-Ended SCSI configuration and Low-Voltage-differential SCSI configuration are supported by
SDX-1100V, and SDX-1100V/R The hardware specification of this interface can be found in Clause 3. Physical
Characteristics, of the X3T10/1142D (SCSI Parallel Interface2) standard. Only unshielded connectors are
supported. Possible cable and connector sources are listed below. This does not imply that these are the only
sources for SCSI accessories.
Note: When using high speed data transfer with the SDX-1100V it is recommended that total length of the SCSI
data cable not exceeded 1.5m for Single Ended SCSI configuration. As for Low-Voltage-differential SCSI
configuration, less than 12m is recommended.
Cable 30 AWG Ribbon
Hitachi UL 20848 (or equivalent)
Connector AMP 1-786090-7 (or equivalent)
2.2. Environmental Specifications
The specifications which apply when media is present may be different than these.
2.2.1. Temperature and Humidity Range
Temperature
Operating 5 ºC to 40 ºC (ΔT < 10 ºC/h)
Non-Operating(mech.) -40 ºC to 70 ºC (ΔT < 20 ºC/h)
Non-Operating(tape) -40 ºC to 45 ºC (ΔT < 20 ºC/h)
Humidity
Operating 20 to 80% RH, non-condensing
Maximum wet bulb temperature = 26 ºC
Non-operating (mech.) 5 to 95%RH(ΔRH<30%/h)
Maximum wet bulb temperature = 45 ºC
Non-operating (tape) 20 to 80%RH(ΔRH<30%/h)
.
Jumpers
SCSI 68 pin Connector
Power Connector

2.Specification
SONY AIT-5 drive SDX-1100V series Ver.1.0 2-5
2.2.2. Altitude
Operating 0 to 10,000 feet
2.2.3. Suspended Particulate
Operating Less than 150 microgram/m3
Based Sampling period 24 hours
2.2.4. Vibration
Operating Swept Sine 5 to 500Hz, @0.25G Peak 1 Octave/min.
3 axis, 3 directions
Non-operating Swept Sine 5 to 500Hz, @ 0.5G Peak 1 Octave/min.
3 axis, 3 directions
2.2.5. Shock
Operating No Data Loss
Half Sine
Performance
5 G Peak 3 ms
3 axes, 3 directions
*Interval 10 seconds
Non-operating No Device Damage
Half Sine
90 G Peak 3 ms
(30 G Peak 11 ms)
3 axes, 3 directions
*Interval 10 seconds
2.2.6. Acoustic Noise
The ambient noise level is no greater than 25 dB (A). The sound-meter on (A) scale is located 1m in front of the
center of the drive front panel. (A): A curve weight
Streaming Write/Read 35dB(A)
Insert/Eject 60dB(A)
2.2.7. EMC
EMI/EMS Radiated Emissions /
Conducted noise
Emissions
EN 55022 / 94 + EN 55022 A1 / 95 class B
EMS ESD
(Front Panel Only,
integrated product)
Discharge Voltage
Less than 15kV: No operation failure
Less than 20kV: No drive damage
2.2.8. Orientation
The SDX-1100V can be installed in three different mounting positions as shown in the figure below. Each position
has a maximum tolerance of ± 10 degrees.

2.Specification
2-6 SONY AIT-5 drive SDX-1100V series Ver. 1.0
10 10
10 10
10 10
10
10
Figure 2-4: Mounting Attitude and Tolerance
2.3. Performance Specification
The data capacity, data transfer rate and data reliability specifications this chapter require the media to conform to
the AIT-3, AIT-3Ex, AIT-4 and AIT-5 Media Specification and also require the drive and media to remain within their
respective operating and non-operating environmental specifications. The specifications below also assume that
the C3 ECC frame (AIT-3) or C3 ECC fragment (AIT-3Ex, AIT-4 and AIT-5) is generated on writing and used as
necessary on reading, and further assumes that read-after-write rewrites are used as necessary on writing.
2.3.1. Data Capacity
The SDX-1100V includes a data compression capability. When data compression is enabled the drive capacity can
increase from 2 times to 3 times. The efficiency of the data compression depends on the actual data that is being
compressed and cannot be predicted precisely prior to compression.
Format AIT-3 Standard Format
Native
Capacity 100.0 Gbyte typical When using 230 meter tape AIT-3 cassette (SDX3-100C)
Format AIT-3Ex Standard Format
Native
Capacity 150.0 Gbyte typical When using 246 meter tape AIT-3Ex cassette (SDX3X-150C)
Format AIT-4 Standard Format
Native
Capacity 200.0 Gbyte typical When using 246 meter tape AIT-4 cassette (SDX4-200C)
Format AIT-5 Standard Format
Native
Capacity 400.0 Gbyte typical When using 246 meter tape AIT-5 cassette (SDX5-400C)

2.Specification
SONY AIT-5 drive SDX-1100V series Ver.1.0 2-7
2.3.2. Data transfer Rate
2.3.2.1. Sustained Data Transfer Rate to and from the Tape
The sustained transfer rate to and from the tape is 24Mbyte per second with AIT-4 and AIT-5 cassette, 18Mbyte
per second with AIT-3Ex cassette, 16Mbyte per second with AIT-3 cassette. For this sustained rate to be achieved,
the drive must be streaming.
2.3.2.2. Burst Transfer Rate to and from the SCSI Bus
The SDX-1100V will transmit and receive data bursts to and from the SCSI bus at a maximum burst rate of
12Mbyte per second, using Ultra 160 asynchronous transfers and maximum of 160Mbyte per second, using
Ultra160 synchronous transfers.
2.3.3. Initialize Time
Initialize Time means the period from the time the drive is powered on to the time when the drive is ready and
waiting for a SCSI command such as INQUIRY or TEST UNIT READY. Initialize Time is less than 7 seconds.
The drive will respond with BUSY status until the completion of the Initialize Time. The Initialize Time does not
include the time necessary for drive diagnostics to complete and the drive to become ready for tape insertion.
2.3.4. Load Time
Load Time means the period from the time when the operator inserts a cassette into the drive to the time
when the drive is ready. The data in the below table represents the average time for SDX-1100V. The time it
may take for retrying is not reflected here.
SDX3-100C (230 m) SDX3X-150C (246 m)
SDX4-200C (246 m) SDX5-400C (246 m)
Load Time 40 sec 14 sec 14 sec 14 sec
2.3.5. Unload Time
Unload Time means the period from the beginning of the unload sequence caused by Unload Command or Eject
button to the time when a cassette is ejected from the slot. Unload Time does not include Rewind time. The data in
the below table represents the average time for SDX-1100V. The time it may take for retrying is not reflected here.
SDX3-100C (230 m) SDX3X-150C (246 m)
SDX4-200C (246 m)
SDX5-400C (246 m)
Unload Time 24 sec 24 sec 24 sec 24 sec
2.3.6. Search Time
Search Time means the period for the drive to find the position that is required by a command. This time also
depends on the tape length and the position of the head along the tape. The data in the below table represents the
average time for SDX-1100V. The time it may take for retrying is not reflected here.
SDX3-100C (230 m) SDX3X-150C (246 m)
SDX4-200C (246 m)
SDX5-400C (246 m)
Search Time 130 sec 130 sec 130 sec 130 sec
2.3.7. Rewind Time
Rewind Time means the period from the beginning to the end of rewinding sequence. This value depends on the
tape length and the position of the head along the tape. The data in the below table represents the average
time for SDX-1100V. The time it may take for retrying is not reflected here.
SDX3-100C (230 m) SDX3X-150C (246 m)
SDX4-200C (246 m)
SDX5-400C (246 m)
Rewind Time 105 sec 115 sec 115 sec 115 sec

2.Specification
2-8 SONY AIT-5 drive SDX-1100V series Ver. 1.0
2.3.8. Long Erase Time
Long Erase Time means the period from the beginning of the Erase (long) sequence caused by Erase Command
at BOT. The data in the below table represents the average time for SDX-1100V. The time it may take for retrying
is not reflected here.
SDX3-100C (230 m) SDX3X-150C (246 m)
SDX4-200C (246 m)
SDX5-400C (246 m)
Long Erase Time 2 hrs 2.5 hrs 2.5 hrs 5 hrs
2.3.9. Error Rate
The un-correctable bit error rate is expected to be less than 1 in 10 to the 17th.
2.3.10. Definition of Failure
A failure is defined as any permanent manufacture of the drive that prevents the user from retrieving data from
tape. This includes failure to power up, failure to unload or eject a cassette, or failure to write and read data to and
from the tape, providing that both the drive and tape are being used within specification.
Faults are not considered failures when they are related to operator error mishandling and abuse, system-related
faults (cabling problems unsupported systems, operating software and so on) no trouble found, and transportation
damage.
2.3.11. Mean Time Between Failures
The Mean Time Between Failures (MTBF) for the SDX-1100V is 400,000 power-on hours, assuming a duty cycle
of 100%, where:
DutyCycle =Tape
M
otion Time
PowerOn Time ×100
2.3.12. Mean Time to Repair
The Mean Time To Repair (MTTR) of the SDX-1100V is 30 minutes. Since at the field level the entire drive is
considered a Field Replaceable Unit (FRU) the time to replace the drive with a new one is less that 30 minutes.
2.3.13. Component Life
The specified life of the SDX-1100V is 5 years average.
2.3.14. Durability
The durability of the components in the SDX-1100V will exceed the number of operations listed on the following
table:
Start/Stop 400,000 times
Reposition 3,000,000 times
Thread/Unthread 100,000 times
Load/Eject 100,000 times