Sony TMR-IF630R User manual

TMR-IF630R
US Model
AEP Model
UK Model
E Model
Tourist Model
SERVICE MANUAL
TRANSMITTER
SPECIFICATIONS
Headphones MDR-IF630R
Transmitter TMR-IF630R
TMR-IF630R is the component model block one in the MDR-IF630RK.
COMPONENT MODEL NAME FOR MDR-IF630RK
General
Modulation system Frequency modulation
Carrier frequency Right 2.8 MHz
Left 2.3 MHz
Transmitter
Power source DC IN 9V jack accepts power supplied from the
AC power adaptor for use on the following voltages:
Where purchased Operating voltage
U.S.A. 120 V AC, 60 Hz
U.K. 220 – 230 V AC, 50 Hz
European countries 220 – 230 V AC, 50 Hz
Japan (except for Japanese 110 V/120 V/220 V/240V AC, 50/60 Hz
domestic model)
Other countries 220 – 230 V AC, 50/60Hz or
120 V AC, 60 Hz
Audio input Phono jacks/stereo mini jack
Dimensions Approx. 130 x 135 x 150 mm
(5 1/4x 5 3/8x 6 in) (w/h/d)
Mass Approx. 200 g (7 oz)
Design and specifications are subject to change without notice.
Ver 1.0 2000.12

— 2 —
SECTION 1
GENERAL
This section is extracted
from instruction manual.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
DC IN 9V
RBAL
AUDIO IN
PHONESLINE
INPUT SOURCE
Transmitter
Left channel
(white)
Right channel
(red)
Unimatch plug
adaptor
(supplied)
CD Walkman,
MD Walkman,
WALKMAN*,
TV, VCR, etc.
to headphones
jack (stereo
mini jack)
Connecting cord
(supplied)
to AUDIO IN A jacks
to headphones
jack (stereo
phone jack)
Setting up the
transmitter
1Connect the transmitter to audio/video
equipment. Select one of the hookups
below depending on the jack type:
To connect to a headphones jack
Set the INPUT SOURCE selector to
PHONES.
ATT (attenuator) selector
If a loud sound is distorted when the transmitter
is connected to an audio output jack other than
the headphones jack, set the ATT selector on the
transmitter to -12 dB. The default setting of the
ATT selector is 0 dB.
ATT
–12dB0dB
ATT selector

—3 —
SECTION 2
DISASSEMBLY
2-1. CABINET (TOP) 2-2.TX BASE BOARD
Note : Follow the disassembly procedure in the numerical order given.
2-3. TX LED BOARD
Set Cabinet (top) TX BASE boar
d
TX LED board
Note : The equipment can be removed using the following procedure.
3 Cabinet (top
)
1 Four screws (+P 2 × 8)
2 LED board (CN1)
2 TX BASE board
1 Claw
1 Two screws (+P 2 × 6)
3 Two screws (+P 2 × 6)
4 TX LED board
2 Window, luminous
a
a

—4 —
SECTION 3
ELECTRICAL ADJUSTMENTS
Note :
1. The adjustments should be performed in the order given. (As a
general rule the transmitter section (TMR-IF630R) adjustments
should be completed before performing the headphones sec-
tion (MDR-IF630R) adjustment.)
2. The adjustments and measurements should be performed for
both L-ch and R-ch unless otherwise indicated.
3. L-ch adjustment should be completed before performing R-ch
adjustment.
4. Supply 9 V dc to the transmitter section (TMR-IF630R) and
2.4V dc to the headphones section (MDR-IF630R) as the power
voltage.
TRANSMITTER SECTION
[ OSCILLATING FREQUENCY ADJUSTMENT ]
Connection :
Adjustment Procedure :
No signal state.
1. Connect the frequency counter to TP11 (L-ch) and TP13 (R-
ch) on the TX BASE board.
2. Adjust with L51 (L-ch) and L1 (R-ch) on the TX BASE board
so that the reading on the frequency counter becomes the speci-
fied value.
Specified Value :
[ RF LEVEL ADJUSTMENT ]
Connection :
Adjustment Procedure :
No signal state.
1. Connect the RF voltmeter to TP11 (L-ch) and TP13 (R-ch) on
the TX BASE board.
2. Adjust with RV51 (L-ch) and RV1 (R-ch) on the TX BASE
boardso that the readingon the RF voltmeterbecomes the speci-
fied value.
Specified Value :
TX BASE board
TP11(L-ch)
TP13(R-ch)
RF voltmete
r
+
–
TP15 (GND)
TX BASE board
TP11
i L-ch j
TP13 i R-ch j
+
–
TP15 i GND j
Frequency counte
r
L-ch
R-ch L51 L1 2.3 MHz ± 2kHz 2.8 MHz ± 2kHz
L-ch
R-ch RV51 RV1 480 mV ± 2.5 mV 480 mV ± 2.5 mV
Adjustment Location :
–TX BASE BOARD (Conductor side) –
RV51
RF level
adjustment
(L-ch)
RV1
RF level
adjustment
(R-ch)
L51
Oscillating frequency
adjustment
(L-ch)
L1
Oscillating frequency
adjustment
(R-ch)
TP13
(R-ch)
TP11 (L-ch)
TP15 (GND)

TMR-IF630R
4-1. BLOCK DIAGRAM
— 5 — — 6 —
SECTION 4
DIAGRAMS
L
J3
J1
SW1
R
A
AUDIO
IN
B
LINE
INPUT
SOURSE
SW2
J4
+9V
9
3
13
7
1
5
IC1
ALC AMP.
VCC
IN2
IN1
Q30
OUT2 2
7
IC601
COMPRESSOR
OSCILLATOR/
MODULATOR
D51,Q51
INPUT
L-CH
L51
2.3MHz
OSC COIL
L52
C60-C62
OUT
86
VCC
OUT1
-
+
VREF
G.CELL
LPF
Q52
RV51
RF LEVEL
BUFFER
(CHG)
Q54
LED DRIVE
Q53
+9V
LED DRIVE
2
7
IC602
COMPRESSOR
OSCILLATOR/
MODULATOR
D1,Q1
INPUT
R-CH
L1
2.8MHz
OSC COIL
L2
C10-C12
+5V
+5V
OUT
10
9
IC603
TIMER
VDD
8TIMER OUT TIMER OUT
86
VCC
-
+
VREF
G.CELL
LPF
Q2
RV1
RF LEVEL
BUFFER
Q4
LED DRIVE
Q3
LED DRIVE
D30
(IR LED)
D33
D34
D37
D38
PHONES
0dB
ATT
DC IN 9V
-12dB
LEFT
RIGHT
RIPPLE
FILTER
Q605
PULSE
GEN
Q604
CHG LED
DRIVE
IC2
D601
Q601
+5V REG.
IC3,Q32
AUDIO
INPUT DET
IC604(2/2)
IC604(1/2)
CHARGE2
BATTERY
SENSE
Q33-Q35
AUTO ON/OFF
Q603
CHARGE OUT
Q606,Q607
RF POWER OFF
Q602
CHARGE1
16
Signal path.
: RF
: ANALOG
TO
MDR-IF630R
(BATTERY CHARGER)

TMR-IF630R
4-2. SCHEMATIC DIAGRAM –MAIN SECTION– •See page 11 for IC Block Diagrams.
—7 — — 8 —
Note on Schematic Diagram:
•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or
less are not indicated except for electrolytics and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise specified.
•A: B+ Line.
•Power voltage is dc 9 V and fed with regulated dc power supply
from battery terminal.
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
•Signal path.
F : ANALOG
J :RF

TMR-IF630R
4-3. PRINTED WIRING BOARD –MAIN SECTION–
—9 — — 10 —
Note on Printed Wiring Board:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•b: Pattern from the side which enables seeing.
15
1-679-555-11
(11)
11
(11)
1-679-554-
(CHG)
(IR LED)
INPUT SOURCE
AUDIO IN
LINE
PHONES
ATT
(TP13)
(TP15)
(TP11)
0dB
–12dB
B
RJ1 L
A
J3
16
DC IN 9V
J4
TO
MDR-IF630R
(BATTERY CHARGER)
(TO LEFT)
TO
MDR-IF630R
(BATTERY CHARGER)
(TO RIGHT)
12
A
B
C
D
E
F
G
H
I
J
3456789101112131415
IC 604
IC 603
IC 3
IC 2
IC 601 IC 602
IC 1
Ref. No. Location
D1 D-11
D51 C-4
D601 E-2
D605 I-4
IC1 G-9
IC2 H-6
IC3 G-6
IC601 D-7
IC602 D-9
IC603 G-5
IC604 G-4
Q1 C-11
Q2 A-9
Q3 B-5
Q4 B-9
Q30 H-7
Q32 F-6
Q33 D-5
Q34 D-6
Q35 D-4
Q51 C-3
Q52 B-5
Q53 B-6
Q54 B-8
Q601 D-3
Q602 F-5
Q603 H-5
Q604 G-4
Q605 F-4
Q606 D-6
Q607 E-5
•Semiconductor
Location

—11 — — 12 —
4-4. IC BLOCK DIAGRAMS
IC 601, IC602 TK10690M
IC 603 TB1004AF (EL)
NOTE:
• -XX, -X mean standardized parts, so they may
have some differences from the original one.
• Items marked “*” are not stocked since they
are seldom required for routine service. Some
delayshould be anticipated when orderingthese
items.
• Themechanical parts withno reference number
in the exploded views are not supplied.
• Accessories and packing materials are given in
the last of this parts list.
SECTION 5
EXPLODED VIEWS
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
1 3-222-524-01 WINDOW, LUMINOUS
* 2 1-679-555-11 TX LED BOARD
3 3-222-522-01 CABINET (TOP)
4 3-222-525-01 TERMINAL, CHARGE
* 5 A-4542-659-A TX BASE BOARD, COMPLETE
3
5
1
6
7
#1 #1
a
a
#2 #2
2
4
not
supplied
6 X-3380-047-2 CABINET ASSY, LOWER
7 4-984-729-01 FOOT, RUBBER
#1 7-685-104-19 SCREW +P 2X6 TYPE2 NON-SLIT
#2 7-685-105-19 SCREW +P 2X8 TYPE2 NON-SLIT
G SELL
VREF
RECT
6
7
8
5
3
2
1
4
NF IN
INPUT
REF CAP
GND
VCC
OUTPUT
CONT IN
RECT CAP
1
2
3
4
56
7
8
9
10 VDD
TIMER OUT1
CMP+
RESET
TIMER OUT2
OSC1
OSC2
OSC3
CMP-
GND
CK Q22
22BIT COUNTER
R
R
SQ
R
SQ
R
Q
RQ
SQ
INITIALIZE
CK
R
Q
CK
*
*

—11 — — 12 —
4-4. IC BLOCK DIAGRAMS
IC 601, IC602 TK10690M
IC 603 TB1004AF (EL)
NOTE:
• -XX, -X mean standardized parts, so they may
have some differences from the original one.
• Items marked “*” are not stocked since they
are seldom required for routine service. Some
delayshould be anticipated when orderingthese
items.
• Themechanical parts withno reference number
in the exploded views are not supplied.
• Accessories and packing materials are given in
the last of this parts list.
SECTION 5
EXPLODED VIEWS
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
1 3-222-524-01 WINDOW, LUMINOUS
* 2 1-679-555-11 TX LED BOARD
3 3-222-522-01 CABINET (TOP)
4 3-222-525-01 TERMINAL, CHARGE
* 5 A-4542-659-A TX BASE BOARD, COMPLETE
3
5
1
6
7
#1 #1
a
a
#2 #2
2
4
not
supplied
6 X-3380-047-2 CABINET ASSY, LOWER
7 4-984-729-01 FOOT, RUBBER
#1 7-685-104-19 SCREW +P 2X6 TYPE2 NON-SLIT
#2 7-685-105-19 SCREW +P 2X8 TYPE2 NON-SLIT
G SELL
VREF
RECT
6
7
8
5
3
2
1
4
NF IN
INPUT
REF CAP
GND
VCC
OUTPUT
CONT IN
RECT CAP
1
2
3
4
56
7
8
9
10 VDD
TIMER OUT1
CMP+
RESET
TIMER OUT2
OSC1
OSC2
OSC3
CMP-
GND
CK Q22
22BIT COUNTER
R
R
SQ
R
SQ
R
Q
RQ
SQ
INITIALIZE
CK
R
Q
CK
*
*

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
— 13 —
SECTION 6
ELECTRICAL PARTS LIST
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts
specifiedin the diagrams or the components
used on the set.
• -XX, -X mean standardized parts, so they
may have some difference from the original
one.
• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
• CAPACITORS:
uF: µF
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
• COILS
uH: µH
• SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...
When indicating parts by reference number,
please include the board name.
*A-4542-659-A TX BASE BOARD, COMPLETE
***********************
3-222-525-01 TERMINAL, CHARGE
< CAPACITOR >
C1 1-163-109-00 CERAMIC CHIP 47PF 5% 50V
C2 1-130-491-00 MYLAR 0.047uF 5% 50V
C3 1-126-964-11 ELECT 10uF 20.00% 50V
C4 1-163-005-11 CERAMIC CHIP 470PF 10% 50V
C6 1-104-664-11 ELECT 47uF 20.00% 16V
C7 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C8 1-163-227-11 CERAMIC CHIP 10PF 0.50PF 50V
C9 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C10 1-163-107-00 CERAMIC CHIP 39PF 5% 50V
C11 1-163-227-11 CERAMIC CHIP 10PF 0.50PF 50V
C12 1-163-109-00 CERAMIC CHIP 47PF 5% 50V
C13 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C14 1-163-005-11 CERAMIC CHIP 470PF 10% 50V
C30 1-104-664-11 ELECT 47uF 20.00% 16V
C31 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C32 1-104-664-11 ELECT 47uF 20.00% 16V
C33 1-163-021-11 CERAMIC CHIP 0.01uF 10.00% 50V
C34 1-104-664-11 ELECT 47uF 20.00% 16V
C36 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C38 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C39 1-126-968-11 ELECT 100uF 20.00% 6.3V
C40 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C41 1-163-113-00 CERAMIC CHIP 68PF 5% 50V
C42 1-115-339-11 CERAMIC CHIP 0.1uF 10.00% 50V
C44 1-104-664-11 ELECT 47uF 20.00% 16V
C47 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C49 1-104-664-11 ELECT 47uF 20.00% 16V
C51 1-163-109-00 CERAMIC CHIP 47PF 5% 50V
C52 1-130-491-00 MYLAR 0.047uF 5% 50V
C53 1-126-964-11 ELECT 10uF 20.00% 50V
C54 1-163-005-11 CERAMIC CHIP 470PF 10% 50V
C56 1-104-664-11 ELECT 47uF 20.00% 16V
C57 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C58 1-163-229-11 CERAMIC CHIP 12PF 5.00% 50V
C59 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C60 1-163-109-00 CERAMIC CHIP 47PF 5% 50V
C61 1-163-229-11 CERAMIC CHIP 12PF 5.00% 50V
C62 1-163-111-00 CERAMIC CHIP 56PF 5% 50V
C63 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C64 1-163-005-11 CERAMIC CHIP 470PF 10% 50V
C80 1-104-664-11 ELECT 47uF 20.00% 16V
C81 1-104-664-11 ELECT 47uF 20.00% 16V
C84 1-104-664-11 ELECT 47uF 20.00% 16V
C86 1-104-664-11 ELECT 47uF 20.00% 16V
C601 1-126-963-11 ELECT 4.7uF 20.00% 50V
C602 1-126-964-11 ELECT 10uF 20.00% 50V
C603 1-126-964-11 ELECT 10uF 20.00% 50V
C604 1-126-963-11 ELECT 4.7uF 20.00% 50V
C605 1-126-963-11 ELECT 4.7uF 20.00% 50V
C606 1-126-964-11 ELECT 10uF 20.00% 50V
C607 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C609 1-126-963-11 ELECT 4.7uF 20.00% 50V
C611 1-126-963-11 ELECT 4.7uF 20.00% 50V
C612 1-126-964-11 ELECT 10uF 20.00% 50V
C613 1-126-964-11 ELECT 10uF 20.00% 50V
C614 1-126-963-11 ELECT 4.7uF 20.00% 50V
C615 1-126-963-11 ELECT 4.7uF 20.00% 50V
C616 1-126-964-11 ELECT 10uF 20.00% 50V
C617 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C619 1-126-963-11 ELECT 4.7uF 20.00% 50V
C621 1-163-986-00 CERAMIC CHIP 0.027uF 10.00% 25V
C622 1-164-346-11 CERAMIC CHIP 1uF 16V
C623 1-163-024-00 CERAMIC CHIP 0.018uF 10.00% 50V
C626 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C628 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C629 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C630 1-163-021-11 CERAMIC CHIP 0.01uF 10.00% 50V
< CONNECTOR >
*CN1 1-568-954-11 PIN, CONNECTOR 5P
< DIODE >
D1 8-719-939-02 DIODE SVC203CP
D51 8-719-939-02 DIODE SVC203CP
D601 8-719-069-55 DIODE UDZS-TE17-5.6B
D605 8-719-210-33 DIODE EC10DS2
< IC >
IC1 8-759-998-71 IC BA3308F-E2
IC2 8-759-537-90 IC KIA78S05P-TP
IC3 8-759-909-71 IC BA4558F-T1
IC601 8-759-384-88 IC TK10690MTL
IC602 8-759-384-88 IC TK10690MTL
IC603 8-759-678-31 IC TB1004AF(EL)
IC604 8-759-510-73 IC BA10393F-E2
TX BASE