TDK relyon plasma piezo brush PZ3-i User manual

BA-PZ3_i_ML / F0354901
EN Operating instructions for piezobrush® PZ3-i integration unit 3
DE Betriebsanleitung piezobrush® PZ3-i Integrationseinheit 36
www.relyon-plasma.com
All rights reserved

Operating instructions for:
piezobrush® PZ3-i integration unit
BA-PZ3_i_ML / F0354901

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Thank you for purchasing a relyon plasma GmbH branded product. To get the best from your device,
please read these instructions carefully.
Important!
Read these instructions carefully before assembling, installing and starting up the
device!
Always follow the safety instructions! Failure to follow the safety instructions may result in
accidents, serious injury and serious damage to the device.
Train your staff! The operator/user is responsible for ensuring that personnel have fully understood
the operation of the device and the safety requirements.
© Copyright relyon plasma GmbH 2022.
All rights reserved.
Text, images and graphics as well as their layout are protected by copyright and other protective laws.
Unauthorised copying and distribution of this document and the utilisation and communication of its contents
are strictly prohibited unless expressly authorised. Offenders will be held liable for the payment of damages.
All rights reserved in the event of the grant of a patent, utility model or design.
Translation of the original
operating instructions

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1Safety.........................................................................................................................................6
1.1 Residual risks....................................................................................................................................6
1.2 Information and obligations for the operator.....................................................................................8
1.3 Impermissible operating conditions...................................................................................................8
1.4 Emissions..........................................................................................................................................8
2Description of the device .........................................................................................................9
2.1 Intended use .....................................................................................................................................9
2.2 Scope of delivery...............................................................................................................................9
2.3 Description of the device.................................................................................................................10
2.4 Assignment of connecting lines ......................................................................................................12
3Technical data.........................................................................................................................13
4Transport/Storage...................................................................................................................13
5Installation...............................................................................................................................14
5.1 Unpacking .......................................................................................................................................14
5.2 Installation requirements.................................................................................................................14
5.3 Positioning of the components........................................................................................................15
5.4 Installation of the components ........................................................................................................16
5.5 Connecting up the gas supply.........................................................................................................18
5.6 Connecting up a device with digital I/O communication .................................................................18
5.7 Setting the module carrier...............................................................................................................19
5.8 Installation of several devices.........................................................................................................21
6Special note on the operation of the plasma process..........................................................22
6.1 General description.........................................................................................................................22
6.2 Carrying out surface treatment .......................................................................................................23
6.3 Measures to take after the surface treatment .................................................................................23
7Operation.................................................................................................................................24
7.1 LED display on the driver housing ..................................................................................................24
7.2 Switching signals.............................................................................................................................24
7.3 Error acknowledgement..................................................................................................................25
7.4 Installing / removing the exchange module.....................................................................................25
7.5 Commissioning of a device with digital I/O communication............................................................27
7.6 Changeover in error mode..............................................................................................................28
7.7 Working with the ‘Standard’ exchange module...............................................................................29
7.8 Working with the ‘Nearfield’ exchange module ...............................................................................29
7.9 Working with different exchange modules ......................................................................................29
8Taking out of service..............................................................................................................30
9Maintenance............................................................................................................................30
9.1 Cleaning..........................................................................................................................................30
9.2 Replacing an exchange module......................................................................................................30
10 Troubleshooting .....................................................................................................................31
11 Environment............................................................................................................................32
11.1 Disposal ..........................................................................................................................................32
12 Conformity/Standards ............................................................................................................32
12.1 CE ...................................................................................................................................................32
12.2 FCC.................................................................................................................................................32
12.3 Product standards...........................................................................................................................33
13 Spare parts..............................................................................................................................33
14 Optional accessories..............................................................................................................33

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1 Safety
The device was designed in accordance with the relevant international standards.
However, as with any technical product, hazards may arise if the system is not used
properly or is used for purposes other than its intended use.
In addition to the safety instructions in this document, you must also comply with general
safety standards.
Caution –Danger!
When working with the device, please note and observe the safety instructions and
requirements in these operating instructions because non-compliance may result in
serious or fatal injury.
1.1 Residual risks
This device has been manufactured in accordance with the current state of the art.
However, it is impossible to eliminate residual risks.
Always adhere to the following safety instructions:
Caution –Electrical voltage!
This device is in protection class III.
- Arrange to have the electrical wiring installed by a qualified person.
- Only use PELV power supply units or connect the device to a PELV circuit.
- Arrange for a qualified person to check for compliance with the requirements for
basic protection and fault protection defined in DIN VDE 0100-410.
Hazard from electrical voltage. If there is any visible damage to the wiring:
- do not start up the device;
- replace the damaged parts or have them repaired by a qualified person.
Hazard from sparks on the piezo element and on the substrate to be treated:
- do not reach into the plasma discharge area;
- electrically conductive substrates must be earthed or protected against contact;
- do not use combustible gases as process gases. This device is only approved for
operation with compressed air or nitrogen.
- flammable or thermally sensitive materials could catch fire or get damaged. Where
necessary, check the compatibility of plasma treatment in advance. All work on
combustible substrates must be supervised.
Tripping hazard!
Lay all connecting lines and gas lines in appropriate
cable ducts. Lay cables such that they do not present a tripping hazard.
Tripping hazard!
Lay all connecting lines and gas lines in appropriate
cable ducts. Lay cables such that they do not present a tripping hazard.

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Attention –Emissions!
Dangerous amounts of the reaction gas ozone (O3) and nitrogen oxides may be
produced during device operation.
- Ozone concentrations of more than 0.2 mg/m³ can occur.
- Note that compliance with national health and safety measures is mandatory when
operating the device.
- Only use the device in conjunction with a suitable extraction system.
- Do not let the device run without supervision.
- Never point the device at people while it is operating.
- To exclude any possibility of dangerous amounts of ozone and nitrogen oxides being
produced in the event of a failure of the extraction system, we recommend monitoring
the extraction power in the process and only releasing the plasma generation while
the extraction system is active.
- Due to the corrosive effect of ozone, we recommend positioning a suitable
extraction unit as close as possible to the nozzle outlet to prevent corrosion or
damage to other devices or surfaces through contact with ozone.
Caution –Hot surface!
The exchange modules can become hot due to operation. Do not touch them until they
have cooled down, and ensure when working with exchange modules that they do not
damage surfaces that are not sufficiently heat-resistant.
Depending on the process parameters, the plasma process may heat up the workpiece
being treated. If necessary, allow the workpiece to cool down before handling it.
Attention –Damage to device!
The plasma generator may be damaged if it is operated without gas flow. This would
interrupt the supply of cooling medium required in operation.
- Monitor the gas flow and deactivate the device immediately if the gas flow is too
low or is interrupted.
Never touch the piezo element on the front side of the device with sharp-edged objects.
This component may be damaged by improper handling.
Protect the plasma generator from falls or other hard impacts which may damage the
electronics or the piezo element.
Caution! Device for use in an industrial environment
Conducted as well as radiated interference can cause problems to occur with this device,
potentially impairing its electromagnetic compatibility in other environments.

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1.2 Information and obligations for the operator
•The system may emit interference.
- The device has been tested in accordance with EMC legislation.
- The operator must verify and assure electromagnetic compatibility with other
electrical and electronic equipment in the immediate vicinity of the system.
•Ensure that:
- operating personnel have read and understood these operating instructions.
- anyone working near the device is made aware of the dangers and is provided with
the necessary protective equipment.
- repairs are only carried out by qualified persons.
•In particular, make operating personnel aware of the safety instructions in this
document.
•Always keep the device in fully functional condition.
•Any modifications made to the device will invalidate the operating licence and the
warranty. Exception: if such modifications are expressly authorised by the
manufacturer.
1.3 Impermissible operating conditions
The device must not be operated under the following conditions:
•in explosive (Ex) zones;
•in areas with a severe build-up of dust;
•where there is excessive ambient humidity (see chapter 3);
•when installed at altitudes of more than 6,000 feet (2,000 m) above sea level;
•where there are strong vibrations;
•outdoors.
1.4 Emissions
The plasma generator produces the following emissions:
•Ozone (O3)
•Oxides of nitrogen (NOx)
Process medium
Gas flow
Emission/Production
speed
Air (compressed air)
10 l/min
Ozone < 0.1 g/h
Air (compressed air)
10 l/min
NO2< 5 mg/h
Air (compressed air)
10 l/min
N2O < 1 mg/h
Note!
As a precautionary measure, we recommend using an extraction system with a flow
volume of approx. 10 times the total amount of gas flow through the device (or devices) in
the immediate vicinity of the plasma outlet.
To prevent any dangerous amounts of ozone and nitrogen oxides from being produced if
the extraction system malfunctions, we recommend monitoring the extraction power in the
process and only releasing the plasma generation while the extraction system is active.

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2 Description of the device
2.1 Intended use
The device is an integration unit for generation of what is known as a ‘cold’ discharge,
hereafter referred to as ‘plasma’. It is intended to be mounted in stationary devices or in
positioning units and is used for pre-treating various material surfaces prior to process
steps such as adhering or printing. The cleaning effect of the plasma can also be utilised.
Only use the device for the intended purposes. Failure to do so may restrict product
liability.
2.2 Scope of delivery
piezobrush®PZ3-i integration unit (1000 7000 00)
The scope of delivery includes the following components:
•Plasma generator/integration unit
(consisting of a driver unit and a module carrier)
•Connecting line between driver unit and module carrier (length 0.3 m)
•Assembly screws (2 units M3x30; 1 unit M3x6)
•Operating instructions
Not included:
•Power unit / voltage supply
•DC connecting lines and communication
•Exchange module

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2.3 Description of the device
The individual parts of the device are shown and named in the diagram below. These terms
are used at corresponding points in the operating instructions
No.
Component description
1
Module ‘Standard’ (shown here installed in the device; not included)
2
Piezo element (firmly installed in the exchange module)
3
Integration unit (module carrier)
4
Integration unit (driver unit)
5
Locking ring
6
CONFIG cover
7
‘Digital I/O’ interface
8
‘Module out’ interface
9
‘DC in’ interface
10
‘Module in’ interface
11
‘Gas in’ interface
12
LED status display (3 LED: Plasma / Warning / Error)
13
Adjustment screw for module carrier
14
Locating pins for module carrier
15
Functional earth connection (M3)
1
2
3
4
7
10
11
8
9
12
13
6
5
14
15

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No.
Component description
16
Module connecting line (8-pin, length 0.3 m)
17
DC connecting line (3-pin, not included)
18
Communication connecting line (6-pin, not included)
19
Gas hose, external diameter of 4 mm (not included)
Caution!
The piezo element is an oscillating component that vibrates mechanically at high
frequency. Due to its design, this component cannot be attached rigidly. Therefore the
module may be located off-centre within defined limits in these exchange modules. This is
not a fault or a quality defect.
Under some circumstances, this vibration can cause audible frequencies. This is also
normal and is not a fault or a quality defect.
19
17
16
18

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2.4 Assignment of connecting lines
The DC connecting line must be assigned as follows:
#
Colour
Signal
1
brown
24V DC
3
blue
GND
4
black
Not assigned
The communication connecting line must be assigned as follows:
#
Colou
r
Signal
1
brown
Plasma on (input 0 to 10 V analogue,
up to 24 V voltage-proof)
2
white
Plasma OK (output 0 V / 24 V at max.
20 mA)
3
blue
Error (output 0 V / 24 V at max. 20 mA)
4
black
Not assigned
5
grey
GND
6
pink
Not assigned
Specification for connecting lines:
DC connecting
line
Communication
connecting line
Standard
M8 plug connector IEC 61076-2-104
Number of poles
3
6
Head shape
Socket/female
Plug/male
DC reference voltage [V]
60
30
Reference current [A]
4
1.5
Coding
A /Standard
A/ Standard
Cable cross-section
3x 0.25 mm²
6x 0.14 mm²
Maximum length
30 m
30 m
Caution –Electrical voltage!
The wires may only be connected to the power supply unit or control system
by authorised electrically skilled persons!
If there is any visible damage to the wiring:
- do not start up the device;
- arrange to have the damaged parts repaired by a qualified person or
replace them.

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3 Technical data
Electrical data
•Supply voltage
24 V DC
•Power consumption
max. 18 W
•Model
Integration unit with gas connection
•Overvoltage cat.
Category I(DIN EN 60664-1 VDE 0110-1)
Dimensions
•Weight
370 g complete device with module, without connection lines
(178 g module carrier / 202 g driver unit)
• Dimensions
40 x 150 x 72 mm (WxHxD); without connecting lines / module
•Cable length
0.3 m
Typical application parameters (example of Standard exchange module)*
Range of applications
Precision cleaning
Adhesive bonding
Compression
•Plasma temperature*
< 50 °C (at 5 mm distance)
•Distance for treatment*
2 –10 mm
•Width for treatment*
Compressed air 5 to 29 mm; nitrogen 5 to 50 mm
•Speed*
1-15 mm/s
10-150 mm/s
100-1500 mm/s
Operating conditions
•Air humidity
< 80% rel. (non-condensing)
•Temperature
10 –40 °C; 50 –104 °F
•Degree of contamination
2
Storage conditions
•Air humidity
< 80% rel. (non-condensing)
•Temperature
0 –60 °C; 32 –140 °F
Gas connection
•Gas types
- Compressed air (purified, free of oil and lubricants)
- Nitrogen (industrial gases free of particles and oil)
- Additional gas types only after approval from relyon plasma.
•Gas flow rate / gas inlet
pressure
8 to 20 l/min; max. 2 bar
•Quality
Compressed air 1.4.1 acc. to ISO 8573.1
Nitrogen 2.8 (N2) acc. to DIN EN ISO 14175:N1
•Connection
Hose outer diameter Ø 4 mm (quick coupling)
* These values are only a course guideline. Depending on treated material, process parameters,
following processes and process requirements the actual results can vary significantly from the
typical parameters in both directions (see chapter 6). Due to the low plasma temperature of
lower than 50 °C a slower treatment is not considered critically.
4 Transport/Storage
•Store the device in a dry place. This will prevent the electrical contacts from corroding.
•Protect the device from dirt and foreign objects.
•Protect the device from falls or other hard impacts.

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5 Installation
Attention –Damage to device!
To prevent damage to the device, always pay attention to the notes on operation in
chapter 7.
5.1 Unpacking
•Open the packaging carefully. Note the information about directions provided on the
packaging.
•Take the device and its small parts out of the packaging.
5.2 Installation requirements
Before installing the device, the following criteria must be met.
•The device must be fully intact.
•Before starting to use this device, leave it to acclimatise at its installation location for at
least one hour to balance out any temperature differentials caused by storage or
transport;
•Provide a power supply (SELV/PELV) that satisfies the requirements listed below.
- Output voltage: 24V +/- 5%
- Output ripple: <1%
- Power: min. 15 W / max. 18 W (on each device)
- Maximum current to each device must not exceed 750 mA. This must be assured
by an appropriate pre-fuse.
•Provide a corresponding gas supply (see Point 3). Install an upstream pressure
reducer to ensure that the device is never exposed to a pressure of more than 2 bar.
•Provide a corresponding extraction system (see Point 1.4).
•Provide the corresponding connecting lines (see Point 2.4)
•Ensure by monitoring the gas supply and the extraction power that the unit can only
initiate plasma activation if sufficient levels of gas supply and extraction power are
available.
•If installing as a permanent installation or in a building, a suitable switch or circuit
breaker that satisfies national safety requirements (in Germany: VDE 0100) must be
fitted as an upstream all-pole cut-off device that will disconnect the device from the
power supply. This cut-off device should be fitted near the device and must be easily
accessible to the user. The switch must also be labelled as the cut-off device for the
device.
•The device releases its waste heat most efficiently using a heat line at the back of the
device. To dissipate heat in the most effective way, secure the device to a material that
conducts heat well (e.g. aluminium).

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5.3 Positioning of the components
Pay attention to the following points when positioning the device:
•The spacing between piezo elements must be at least 40 mm from centre to centre.
This minimum spacing is established automatically by the housing width of 40 mm.
However, in the event of a different configuration, ensure that the module outlets in this
case maintain spacing of at least 40 mm.
In case of an positioning with the plasma outlets facing eacht other, the minimum
distances can differ for the different module types. Please contact us in this case.
•In the area of the exchange module that protrudes from the front of the module carrier,
no electrically conductive objects or other piezo elements must be positioned closer than
40 mm.
•If possible, you should position an extraction unit close to the plasma discharge point.
Note that ozone is a corrosive gas and that the gas flow being extracted can corrode
painted surfaces. With reference to the extraction volume, also pay attention to Point 1.4.
•Heat is dissipated from the device passively through its metal housing. At higher than
usual ambient temperatures, special care must be taken to ensure that the device is
attached to a support with good thermal conductivity (e.g. made of aluminium).
•Route the cables with strain relief, avoid laying them over sharp edges, ensure they do
not pose a trip hazard and that movement is kept to a minimum.
•Either position the device so that the exchange module can be pulled out of the module
carrier during maintenance or, alternatively, in such a way that the module carrier can be
removed as described in 7.4.
•To mount the device, use three threaded holes M4 (min. 4 mm thread depth) as shown
in the drawing below.

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5.4 Installation of the components
5.4.1 Installation when positioning the module carrier directly on the driver housing
Secure the driver housing to your locating surface with the mounting screws provided
(waf 2.5).

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Turn the locking ring on the module carrier anti-clockwise into its ‘open’ position (red).
Install the desired exchange module in the module carrier. For this, grip the front area
from outside, as shown in this illustration, without touching the piezo element. With the
adhesive label facing upwards, it is easy to slide the exchange module into the module
carrier. Ensure that the exchange module is installed as deeply as shown in this
illustration. Turn the locking ring on the module carrier clockwise into its ‘closed’ position
(green).
Grip the module carrier as shown and place it on the driver housing by sliding it onto the
two locating pins from the front and then pressing it firmly home against the driver
housing.
5.4.2 Installation with separate positioning of driver housing and module carrier
Secure the driver housing as described in 5.4.1.
Remove both locating pins from the front of the driver housing (waf 2.5 Allen key).
In accordance with the bore pattern, prepare a locating bore to accommodate the
module.
Screw both locating pins into the locating bores.
Install the module in the module carrier as described in 5.4.1.
Set the module carrier on the locating pins and press this firmly home.
Please note that EMC compatibility levels were only measured on 0.3 m lengths of cable
between module carrier and driver housing. Lengths beyond this can cause deviations
from these measurement results depending on the routing in installation and, in case of

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doubt, would have to be measured by the company operating the system in the given
integration situation.
For both mounting variants, the two grub screws on the underside of the module carrier
retaining ring can be tightened to deactivate the tool-free removability of the module
carrier. This is recommended if, due to the installation situation, access to the exchange
module is also possible without removing the module carrier without any problems.
5.5 Connecting up the gas supply
Connect up an appropriate gas hose with an external diameter of Ø 4 mm.
Press this into the push-in fitting deep enough to secure it firmly. Check that the hose is
fitted tightly before applying pressure to it.
5.6 Connecting up a device with digital I/O communication
Connect up the line connecting module and driver housing. Then hand-tighten all cap
nuts.
Connect the communication connecting line to the driver housing.
Connect the DC connecting line to the driver housing.
Connect equipotential bonding to the earth potential.

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5.7 Setting the module carrier
•Height adjustment
The height of the module carrier can be adjusted using the adjustment screw.
Loosen it then slide the module carrier to the desired height. Tighten the screw back
down in this position. Please note that the different types of exchange module protrude
from the module carrier to different extents. This figure illustrates the standard module.
-

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•Adjusting the angle
On the vertical axis, the module carrier can be turned relative to the driver housing.
For design-related reasons, the piezo element does not have a rotationally symmetrical
cross-section. The discharge shape creates the optimum angles for the most
homogeneous activation results possible.
Depending on the direction of movement of the substrate to be treated relative to the unit,
the angle of attack can be optimised if high homogeneity is required.
To do this, unfasten the adjusting screw until the screw head can be moved across the
recesses in the cutaway.
The pre-packaged angles are -76 °, -45°, -14 °, 0°, +14 °, +45° and +76°.
For optimised homogeneity at maximum treatment width choose an angle of 45°.
For optimised homogeneity at maximum treatment intensity choose an angle of 14° / 76°
(depending on direction of movement).
•Fitting the seal label
To prevent accidental adjustment of these settings, the adjusting screw can be masked
using the enclosed seal label. The interface to the module carrier during a module
change can be done without tools and without changes to the positioning of the module
carrier.