Basic manual
7 TXV 101 15
2. PACKAGING, TRANSPORTATION, STORAGE
The sub-module is packed according to internal packing instructions into a cardboard box.
This documentation is enclosed in the packaging. The external packaging is done according to
the quantity and way of transportation into a shipping container being labelled and containing all
the necessary data for transportation.
The goods is transported from the manufacture's facilities as agreed when placing an order.
Transportation of the goods by the customer must be pursued by covered transport means and
in the position as indicated on the packaging. The shipping containers must be fixed in such a
way to avoid accidental spontaneous movement and damage of the external container during
transport.
During transportation and storage, the product must be protected from direct influence of
atmospheric actions. Transportation of the product is permitted within a temperature range of
-25 °C to 70 °C, relative humidity of 10 % to 95 % (without condensation) and minimum
atmospheric pressure higher than 70 kPa.
The product must be stored only in clean spaces free from conductive dust, aggressive
gases and vapours. The optimum storage temperature is 20 °C.
3. INSTALLATION
Installation of the sub-module into the end device is always described in the manual of this
end device.
The submodule is fitted on the pins of the end device in such a way that the 14-pin female
header of the submodule is against the 14-pin positioned exactly male header and the 13-pin
female header is put on the pins of the three-row header. See Fig.3.1
Modules contain electrostatic charge sensitive elements, therefore we keep
principles for working with these circuits! You can manipulate only with
module disconnected from power supply!
If you change the sub-
module, you should check carefully the right placing of
the connector to its counterpart on the mainboard. The female connec
the sub-module is not provided with a code to avoid improper putting in to its
counterpart and in the case of improper putting and switching power sup
on, the sub-module and even mainboard can be damaged!!!
4. POWER SUPPLY
The sub-module is fed from the end device where the sub-module is put in.
5. CONNECTION
The communication interfaces of the end device where the sub-module is put in are equipped
typically with a screwless connectors. The connection of connectors is mentioned in the manual
of this device. See Fig. 5.1.
