Teledyne ULTRAFLOW 150 User manual

ULTRAFLOW 150
GAS FLOW AND TEMPERATURE MONITOR
OPERATIONS MANUAL
SERIAL NUMBER: _________________________

DOCUMENT NO.: 1900-0100-01 REV. E

JANUARY 2014
Proprietary Information. All rights reserved by Teledyne Monitor Labs. No part of this
book may be reproduced or copied in any form or by any meansgraphic, electronic, or
mechanical, including photocopying, taping, or information storage and retrieval
systemswithout written permission of the publisher.
Made in the United States of America

TABLE OF CONTENTS
PAGE
1.0 SAFETY.......................................................................................................................................1-1
1.1 Internationally Recognized Symbols Used on Teledyne Monitor Labs Equipment.....................1-1
2.0 SYSTEM OVERVIEW .................................................................................................................2-1
2.1 System Description, Standard Equipment...................................................................................2-1
2.1.1 Transducer Interface Enclosure (TIE)...........................................................................2-1
2.1.2 Purge Nozzle Assemblies.............................................................................................2-1
2.1.3 Protective Purge System...............................................................................................2-3
2.1.4 Enhanced Remote Panel..............................................................................................2-3
2.2 Specifications (Standard System)...............................................................................................2-5
3.0 OPTIONAL EQUIPMENT............................................................................................................3-1
3.1 Protective Purge Air System, (Dual)............................................................................................3-1
3.2 Local User Interface Key Pad and Display..................................................................................3-1
3.3 Dual Analog Input Board .............................................................................................................3-2
3.3.1 Barometric Pressure Sensor Assembly........................................................................3-2
3.3.2 External Temperature Measurement............................................................................3-3
3.4 Link Rod.......................................................................................................................................3-4
3.5 6PT I/O PC Board option for 150DI.............................................................................................3-5
4.0 THEORY OF OPERATION .........................................................................................................4-1
4.1 Physics of Measurement.............................................................................................................4-1
4.1.1 Time of Flight Theory....................................................................................................4-1
4.1.2 Flow Volume Measurement ..........................................................................................4-3
4.1.3 Wet Basis and Dry Basis Measurements......................................................................4-3
4.1.4 Correction to Standard Temperature and Pressure......................................................4-3
4.2 Monitor Specific Theory...............................................................................................................4-4
4.2.1 Box Car Integration.......................................................................................................4-4
4.2.2 Operational Modes of the Transducer Interface Enclosure..........................................4-4
5.0 TRANSDUCER INTERFACE ENCLOSURE (TIE)......................................................................5-1
5.1 Mechanical Description ...............................................................................................................5-1
5.2 Electrical Description...................................................................................................................5-2
5.2.1 External Interface PC Board .........................................................................................5-2
5.2.2 Power Supply Board .....................................................................................................5-2
5.2.3 Flow Mother Board........................................................................................................5-2
5.2.4 Preamp Boards.............................................................................................................5-8
5.2.5 (Optional) Dual Analog Input Board..............................................................................5-9
5.2.6 (Optional) Local User Interface Key Pad and Display Assembly..................................5-9
5.2.7 Individual Button Function (When Pressed by Themselves)......................................5-12
5.2.8 Combinations of Buttons.............................................................................................5-13
5.2.9 6PT I/O PC Board option for 150DI ............................................................................5-13
6.0 ENHANCED REMOTE PANEL W / MULTI I/O MODULE ..........................................................6-1
6.1 Overview .....................................................................................................................................6-1
6.2 Mechanical Description ...............................................................................................................6-1
6.3 Electrical Description...................................................................................................................6-2
6.3.1 Input Power Requirement .............................................................................................6-2
6.3.2 Circuit Description (Overview).......................................................................................6-2
6.4 Operational Description--Menu Structure and User Interface.....................................................6-9
6.4.1 Memory Test .................................................................................................................6-9

TABLE OF CONTENTS
(Continued) PAGE
6.4.2 Main Display Screen...................................................................................................6-10
6.4.3 Main Menu Screen......................................................................................................6-11
6.4.4 Service Data Menu......................................................................................................6-12
6.4.5 Status Code Help........................................................................................................6-12
6.4.6 Output Cal Tests.........................................................................................................6-13
6.4.7 Output Module Configuration Menu............................................................................6-16
6.4.8 Display Properties Menu.............................................................................................6-18
6.4.9 Software Versions.......................................................................................................6-19
6.4.10 System Properties Menu...........................................................................................6-19
6.4.11 View Trending Data...................................................................................................6-22
6.4.12 View Numerical Data.................................................................................................6-23
6.4.13 View Status History...................................................................................................6-23
6.4.14 View Alarms History..................................................................................................6-23
6.5 Multi I/O Software......................................................................................................................6-24
6.5.1 Analog Outputs ...........................................................................................................6-24
6.5.2 Digital Inputs ...............................................................................................................6-24
6.5.3 Digital Outputs.............................................................................................................6-25
7.0 INSTALLATION...........................................................................................................................7-1
7.1 Pre-Installation Planning and Preparation...................................................................................7-1
7.2 Site Selection...............................................................................................................................7-1
7.2.1 Representative Sampling Location...............................................................................7-2
7.2.2 Access to Sampling Location........................................................................................7-2
7.2.3 Environmental Conditions at the Sampling Location....................................................7-2
7.3 Equipment Mounting Considerations ..........................................................................................7-2
7.3.1 Flange and Mounting Tube Installation.........................................................................7-2
7.3.2 Purge System, Reference PURGE ASS’Y MTG., PLUMBING & CLEARANCE
REQUIREMENTS Drawing ......................................................................................7-3
7.3.3 Purge Nozzle and Mounting Flange Assembly, Reference PURGE NOZZLE AND
MTG. PLATE INSTALLATION-150 Drawing............................................................7-4
7.3.4 Transducer Interface Enclosure Assembly, Reference XDUCER INTERFACE
ENCLOSURE INSTALLATION Drawing..................................................................7-5
7.3.5 Junction Box, Reference JUNCTION BOX MTG. METHODS AND
CLEARANCES Drawing...........................................................................................7-5
7.3.6 Enhanced Remote Panel Assembly, Reference ENHANCED REMOTE PANEL
ASSEMBLY Drawing................................................................................................7-5
8.0 SYSTEM CALIBRATION AND ADJUSTMENT...........................................................................8-1
8.1 Transducer Interface Enclosure Calibration................................................................................8-1
8.1.1 Transducer Interface Enclosure Program Variables.....................................................8-1
8.2 Transducer Interface Enclosure Electronics Adjustment ............................................................8-8
8.2.1 Flow Mother Board........................................................................................................8-8
8.2.2 Preamp Board Adjustment............................................................................................8-8
8.3 Remote Panel Calibration............................................................................................................8-8
8.3.1 Remote Program Variables...........................................................................................8-8
8.3.2 Enhanced Remote Panel Analog Adjustments.............................................................8-8
9.0 MAINTENANCE ..........................................................................................................................9-1
9.1 Maintenance Schedule................................................................................................................9-1
9.1.1 After Initial Installation.....................................................................................................9-1
9.1.2 Normal Maintenance.......................................................................................................9-1

TABLE OF CONTENTS
(Continued) PAGE
9.2 Troubleshooting Guide................................................................................................................9-2
APPENDIX A Site Specification Data Sheets
APPENDIX B Maintenance Check Sheets
APPENDIX C Spare Parts
1900-0090-01Ultraflow 150 Spare Parts Location Drawing
APPENDIX D Drawings
Drawing No. Sheet Rev Description
1900-0001-01 1 of 2 D Ultraflow 150 Flange Installation (English)
1900-0001-02 2 of 2 D Ultraflow 150 Flange Installation (Metric)
1900-0002-01 1 of 5 H Ultraflow 150 System Installation, Dual Blowers
1900-0002-02 2 of 5 H Ultraflow 150 System Installation, Single Blower
1900-0002-03 3 of 5 H Ultraflow 150 System Installation, Small Stacks
1900-0002-04 4 of 5 H Ultraflow 150 System Installation, X-Pattern
1900-0004 1 of 12 F Ultraflow 150 50Khz Wiring Diagram (115/230 VAC)
1900-0004 2 of 12 F Ultraflow 150DI 50Khz Direct Interface Wiring Diagram
(115/230 VAC)
1900-0004 3 of 12 F Ultraflow 150 X-Pattern 50Khz Wiring Diagram
(115/230 VAC)
1900-0004 4 of 12 F Ultraflow 150 X-Pattern Wiring Diagram (115/230 VAC)
1900-0004 5 of 12 F Ultraflow 150DI X-Pattern Direct Interface Wiring
Diagram (115/230 VAC)
1900-0004 6 of 12 F Ultraflow 150 Long Range (14/20Khz) Wiring Diagram
(115/230 VAC)
1900-0004 7 of 12 F Ultraflow 150DI Long Range (14/20Khz)
Direct Interface Wiring Diagram (115/230 VAC)
1900-0004 8 of 12 F Ultraflow 150 Long Range (20/14Khz) X-Pattern Wiring
Diagram (115/230 VAC)
1900-0004 9 of 12 F Ultraflow 150 Long Range (20/14Khz) X-Pattern Wiring
Diagram (115/230 VAC)
1900-0004 10 of 12 F Ultraflow 150DI Long Range (14/20Khz) X-Pattern Direct
Interface Wiring Diagram (115/230 VAC)
1900-0004 11 of 12 F Ultraflow 150 50Khz Std. Wiring Diagram (No J-Boxes) –
115/230V
1900-0004 12 of 12 F Ultraflow 150DI 50Khz Direct Interface Wiring Diagram
(No J-Boxes) – 115/230V
1900-0006-01 1 of 1 B Ultraflow 150 Flange Installation X-Pattern
1901-0008-01 1 of 5 B Purge Nozzle and Mtg. Plate Installation-150,
Standard Range, 50Khz
1901-0008-02 2 of 5 B Purge Nozzle and Mtg. Plate Installation-150, Long
Range LR003, 20Khz
1901-0008-04 4 of 5 B Purge Nozzle and Mtg. Plate Installation-150,
Extended Long Range LR006, 14Khz

TABLE OF CONTENTS
(Continued)
Drawing No. Sheet Rev Description
1901-0008-05 5 of 5 B Purge Nozzle and Mtg. Plate Installation-150,
Extended Long Range LR007, 14Khz w/Horn
1903-0000 3 of 4 M Transducer Interface Enclosure Std. Wiring Diagram
1903-0000 4 of 4 M Transducer Interface Enclosure Direct Interface Wiring
Diagram
1903-0010-01 1 of 1 B Transducer Interface Enclosure Installation
1903-0011-02 2 of 2 C Transducer Interface Enclosure Internal Layout
1004-0008-01 1 of 2 J Purge System Assy, Dual 42CFM Blowers
1904-0000-01 1 of 2 A Purge System Assy, Single 110CFM Blower
1904-0000-02 2 of 2 A Purge System Assy, Single 42CFM Blower
1906-0010-01 1 of 2 A Junction Box Mtg. Methods and Clearances, 20/14Khz
1906-0010-02 2 of 2 A Junction Box Mtg. Methods and Clearances, 50Khz
1803-2003-02 2 of 2 H Enhanced Remote Panel Customer Drawing
1903-0012-02 2 of 2 B UF150 Subpanel Assy, Upgrade Installation
1900-0005 1 of 4 C Upgrade Ultraflow 100 to 150 50Khz Wiring, W/New TIE
Subpanel in Existing Stack Elect. Box
1900-0005 2 of 4 C Upgrade Ultraflow 100 to 150 20/14Khz Wiring, w/New
TIE Subpanel and Buffer Boards in Existing J-Boxes
APPENDIX E Enhanced Serial Port Communication Protocol

ULTRAFLOW 150 GAS FLOW AND TEMPERATURE MONITOR
1.0 SAFETY
1.1 INTERNATIONALLY RECOGNIZED SYMBOLS USED ON
TELEDYNE MONITOR LABS EQUIPMENT
This equipment is intended only for the purposes specified in this manual.
Safety protections inherent in this equipment may be impaired if the
Ultraflow 150 is used in a manner different than specified herein.
The following are internationally recognized symbols used on the
Ultraflow 150 along with specific cautions applicable to the equipment.
Label Standard Number:
ISO 3864 B.3.1
Generic meaning:
CAUTION: RISK OF DANGER. CONSULT MANUFACTURER’S
DOCUMENTATION.
Cautions Invoked By This Label for the Ultraflow 150:
1. The Transducer Interface Enclosure (TIE) and Enhanced Remote
Panel (ERP) power supplies are fused on both grounded (neutral)
and ungrounded (high line) mains supply conductors.
2. The Transducer Interface Enclosure (TIE) and Junction Box Covers
are to be opened only by trained service personnel.
3. This equipment must be installed by a qualified electrician as per
applicable local electrical codes.
4. The Protective Purge System blowers (both Single and Dual) are
permanently connected devices whose overcurrent protection and
supply disconnection must be provided externally and installed by a
qualified electrician in accordance with applicable local electrical
codes. Consult the Ultraflow 150 Wiring Diagrams in Appendix D of
this manual for further guidance of appropriate overcurrent and
supply disconnection requirements.
5. The Transducer Interface Enclosure, Junction Boxes and Protective
Purge System enclosure protection ratings apply only if "liquid tight"
conduit and fittings (such as Appleton Electric type ST, STB or STN
or equivalents) are installed by qualified electricians as per the fitting
manufacturer's documentation.
Label Standard Number:
ISO 3864 B.3.6
Meaning:
CAUTION: RISK OF ELECTRIC SHOCK.
Hazardous AC supply inside. Remove power before servicing.
1-1

SECTION 1.0, SAFETY
Label Standard Number:
ISO 3864, DIN 4844-2 D-W026
Meaning:
CAUTION: HOT SURFACE. DO NOT TOUCH.
This caution refers only to the single blower style of Protective Purge
System.
1-2

ULTRAFLOW 150 GAS FLOW AND TEMPERATURE MONITOR
2.0 SYSTEM OVERVIEW
This manual describes the installation, operation, calibration and routine
maintenance of the Teledyne Monitor Labs Ultraflow 150 Ultrasonic
Stack Flow Measurement System.
2.1 SYSTEM DESCRIPTION, STANDARD EQUIPMENT
The Ultraflow 150 system consists of the following standard equipment.
Transducer Interface Enclosure (TIE)
Purge Nozzle Assemblies
Protective Purge Air System (Single)
Enhanced Remote Panel (ERP)
(Not supplied with a 560DI, see section 3.5)
As shown on the Ultraflow 150 Installation Drawings, the first three above
are located on the stack. The Enhanced Remote Panel Assembly is
typically located in the plant Control Room or CEMS Shelter.
2.1.1 Transducer Interface Enclosure (TIE)
The Transducer Interface Enclosure Assembly contains sophisticated
sampling electronics that control the transmit and receive signals from the
transducers and calculates the flow velocity, flow volume and
temperature. It also provides power for the purge fail sensors. These
measurement data are transmitted to the Enhanced Remote Panel via a
commercial network communication protocol.
Each TIE is capable of controlling and performing analysis of up to two
pairs of Purge Nozzle Assemblies.
2.1.2 Purge Nozzle Assemblies
There are two Purge Nozzle Assemblies located on opposite sides of the
stack or duct. Each houses an ultrasonic transducer and is designed to
conduct the protective purge air around the transducer to prevent
contamination from the effluent gas stream. The Purge Nozzles are
constructed using Teflon, stainless steel, and other corrosion resistant
materials to provide a long service life. The actual transducer element is
housed in the Transducer Housing Subassembly and is located near the
end of the Purge Nozzle Nosepiece.
2-1

SECTION 2.0, SYSTEM OVERVIEW
The stack geometry, wall thickness, and mounting details determine the
length of the Purge Nozzle Assemblies.
Mounting of the assembly is accomplished using four 1/2-13 threaded rods
and nuts to hold the flange seal and squeeze ring in place. A quick
disconnect latching mechanism secures the assembly to the threaded rods.
Electrical connections include those from the Transducer Housing
Subassembly BNC connector and from the purge sensor switch. Both the
transducer coax cable and the purge air sensor cable are housed in a single
length of 3/4" flexible conduit connected from the rear of the Purge
Nozzle Assembly to the junction box.
2.1.2.1 Transducer Assemblies
The wide variety of user stack geometry, effluent composition and effluent
temperatures require that several different types of ultrasonic transducers
be employed to meet individual user requirements. Decisions on which
transducer type is appropriate for your particular application are made by
the Teledyne Monitor Labs factory based on information supplied by the
user prior to factory configuration and checkout. Documentation of the
transducer type for your particular monitor is included as part of Appendix
A of this manual.
2.1.2.1.1 Electrostatic Transducer
The Electrostatic Transducer is used in the majority of all Ultraflow 150
applications. It is typically employed in instrument pathlengths less than
26 feet (8 meters). Its electrostatic characteristics maximize sampling
accuracy at short to moderate pathlengths and in low to moderate acoustic
attenuation conditions.
Consult the Site Specification Data sheet of Appendix A for information on
the transducer type of your individual monitor.
2.1.2.1.2 Long Range Transducer (LR003)
The LR003 Transducer is employed where the instrument pathlengths are
about 30 to 50 feet (9-15 meters). Additional sample medium
characteristics may present acoustic attenuation conditions that reduce the
ultrasonic signal strength of the Standard Transducer below acceptable
levels. This may require the use of the LR003 at some pathlengths less
than 30 feet (9 meters). Long Range Transducers are capable of higher
drive (transmit) energies and have horn designs unique to their operating
frequencies.
Consult the Site Specification Data sheet of Appendix A for information on
the transducer type of your individual monitor.
2-2

ULTRAFLOW 150 GAS FLOW AND TEMPERATURE MONITOR
2.1.2.1.3 Extended Long Range Transducers (LR004 through LR007)
As pathlength, temperature, velocities and medium molecular weight
increase, the acoustic attenuation increases vigorously. As these factors
combine to challenge the signal strength of the Long Range Transducer
LR003, the Extended Long Range Transducers are used to obtain
satisfactory operation in these conditions. This family of transducers
(LR004 through LR007) uses a common transducer element design with
various purging and horn designs. These designs ensure accurate
measurement signals throughout the operating range of the most
challenging acoustic effluent conditions.
Consult the Site Specification Data sheet of Appendix A for information on
the transducer type of your individual monitor.
2.1.3 Protective Purge System
The Standard Purge System for Electrostatic Transducers consists of a
single blower that has a dual outlet and flow restriction device to provide
clean, proportioned purge air to each of the two Purge Nozzle Assemblies.
This configuration can be employed where the effluent pressures are
negative to modestly positive. Use of the single Protective Purge Air may
not be recommended in cases of high positive stack pressures. Long range
uses a dual blower system.
The Purge System provides filtered air to keep the effluent from
contacting the transducers. The air is injected into the stack through the
nozzles of these assemblies by actually having air blow around and in
front of the transducers. Each assembly has a purge air sensor switch that
remains activated as long as the purge air is flowing. If purge air is lost to
either transducer an indication is provided at the Enhanced Remote Panel.
2.1.4 Enhanced Remote Panel
2.1.4.1 Enhanced Remote Display
The Enhanced Remote Display is built with a modular design. It is 19”
rack mountable. The software is menu driven and uses a commercial
network communications platform. It
uses a membrane switch keypad, a 4 ½”
Liquid Crystal Display (LCD) with
graphics capability and a key lockout for
critical functions.
2.1.4.2 Multi I/O Board
The Multi I/O Board is installed in the Enhanced Remote Panel chassis
and has eight relay outputs, eight digital inputs, and four individually
2-3

SECTION 2.0, SYSTEM OVERVIEW
isolated analog outputs. The connections to the user interface devices
from the Multi I/O Board are made via connectors on the back panel of the
Enhanced Remote Display Panel.
2.1.4.3 Ethernet Module
The Ethernet Module is a single printed circuit board located inside of the
ERP chassis. External connection to the Ethernet Module is made via a
standard RJ45 connector socket in the rear panel of the ERP. The module
will provide web browser-based remote access, configuration and control
of the Ultraflow 150. At the same time the Ethernet Module can provide
HTML web pages for user interface and fast Modbus TCP access to
instrument data and parameters.
The details of this powerful ERP feature are described in its own
instruction manual which is provided with the instrument. The customer
supplied network cable may be installed into the socket marked “Ethernet”
at the right hand side of the ERP rear panel.
This option can be supplied in a standalone version for users who
purchased the 560DI.
2-4

ULTRAFLOW 150 GAS FLOW AND TEMPERATURE MONITOR
3.0 OPTIONAL EQUIPMENT
The components listed below are optional on the Ultraflow 150 system.
They are not included on a standard system. Please consult the Site
Specification Data sheets in the back of this manual for the details of your
particular system.
Protective Purge Air System, Dual
Local User Interface Key Pad and Display
Dual Analog Input Board
Link Rod
6PT I/O PC Board Option
3.1 PROTECTIVE PURGE AIR SYSTEM, (DUAL)
The Dual Protective Purge Air System consists of two blowers and
weather covers designed to supply purge air to each Purge Nozzle
assembly. This configuration uses separate purge blowers to provide
clean purge air to each of the two Purge Nozzle Assemblies. This option
can be employed where the effluent pressures are very positive and is used
on all standard long range installations.
Consult the Site Specification Data sheet of Appendix A for information on
the configuration of your individual monitor
3.2 LOCAL USER INTERFACE KEY PAD AND DISPLAY
The Local User Interface Key Pad and Display option provides an
operator interface capability at the Transducer Interface Enclosure (TIE)
on the stack. This is a Local User Interface that will provide the ability to
evaluate the operation and setup variables of the system from the TIE
location.
This assembly contains a 6 character, 7 segment display and a keypad. The
two leftmost characters are GREEN while the 4 remaining characters to
the right are RED. The display is organized so that the 2 GREEN
characters indicate the software bank location of data, operational
variables, markers or configuration modifiers. The 4 RED characters to
the right hold the value of the data, status or marker in that bank location.
The locations are organized into different categories or BANKs of data
and parameters. The leftmost GREEN letter character describes the
3-1

SECTION 3.0, OPTIONAL EQUIPMENT
BANK or category of display information, while the second GREEN
numeric character identifies the individual memory location within the
BANK.
Consult the Site Specification Data sheet of Appendix A for information on
the configuration of your individual monitor.
3.3 DUAL ANALOG INPUT BOARD
The Dual Analog Input Board option is required when the user wishes to
have the Ultraflow 150 take in external information on stack pressure and
temperature in order to convert the stack flow volume values to standard
conditions.
3.3.1 Barometric Pressure Sensor Assembly
A Barometric Pressure Sensor Assembly is available for the purpose of
correcting flow volume data to standard pressure. The assembly contains
an on-board absolute pressure transducer that reads the ambient pressure
outside the Transducer Interface Enclosure via a sealed vent line. This
approach is recommended only for applications in which the static gage
pressure of the process is not likely to undergo dramatic changes. For
cases where static pressure varies widely, a pressure transducer measuring
the actual process pressure will deliver maximum accuracy. See the
System Properties Menu section (Section 6.0) of this manual for external
pressure transducers.
The Barometric Pressure Sensor Assembly is inserted into a connector on
the Dual Analog Input Board, a separate option located in the Transducer
Interface Enclosure. The Dual Analog Input Board provides the required
operating power for the assembly and converts the pressure transducer
voltage to 12 bit digital data for use by the Flow Mother Board.
Consult the Enhanced Remote section (Section 6.0) of this manual for
information on calibration of the Barometric Pressure Sensor Assembly.
See Table 3-1 below for the Dual Analog Input Board jumper settings for
use of the Barometric Pressure Sensor Assembly.
3-2

ULTRAFLOW 150 GAS FLOW AND TEMPERATURE MONITOR
Table 3-1
Dual Analog Input Board Jumpers for Pressure Input
DESCRIPTION
JUMPER
NUMBER
LABEL
POSITION
WIRING
Barometric Pressure Assembly
JU2
Don’t
Care
Don’t Care
None
JU3
INT
1-2
4-20mA Pressure Transmitter
JU2
CUR
1-2
J4 Terminals
1(+) and 2(-)
JU3
EXT
3-4
0-5VDC Pressure Transmitter
JU2
VOL
3-4
J4 Terminals
3(+) and 2(-)
JU3
EXT
3-4
3.3.2 External Temperature Measurement
The Ultraflow 150 can measure medium temperature in two manners:
INTERNAL MEDIUM TEMPERATURE: This measurement uses the
speed of sound data derived from the time of flights between the
upstream and downstream ultrasonic transducers. Since speed of
sound is directly proportional to the square root of absolute
temperature, a temperature measurement can be made based on this
data provided the concentrations of the major constituent gases
(usually O2, CO2, H20 and N2) are either relatively constant or
change predictably as a function of speed of sound. Examples of
applications where this is true include flow monitoring of single fuel
utility boiler stack gas emissions, cement kiln combustion emissions,
secondary combustion air and process steam boiler emissions.
EXTERNAL MEDIUM TEMPERATURE : This measurement utilizes
external, non-ultrasonic sensors to establish medium temperature.
This technique is recommended when the concentrations of the major
constituent gases (usually O2, CO2, H20 and N2) change
unpredictably or are not a function of speed of sound. In these cases,
the absolute values of the Ultraflow 150’s INTERNAL MEDIUM
TEMPERATURE will be inaccurate by magnitudes roughly
proportional to the change in molecular weight. An example of such an
application is a multi-fuel (i.e., one that can run on coal or natural gas
at base load) utility boiler.
The Dual Analog Input Board option is required to implement the
EXTERNAL MEDIUM TEMPERATURE option. The Dual Analog
Input Board is compatible with a variety of external temperature sensors:
1000 ohm 2 wire RTD’s (see the next sub-section of this manual), 4 – 20
mA and 0 to 5 Volt. Thermocouples are not supported. See the System
Properties Menu section (Section 6.0) of this manual for information on
calibration of EXTERNAL MEDIUM TEMPERATURE devices.
3-3

SECTION 3.0, OPTIONAL EQUIPMENT
3.3.2.1 Resistive Temperature Device (RTD)
An optional Resistive Temperature Device (RTD) probe is available for
use as an EXTERNAL MEDIUM TEMPERATURE sensor. The heart of
the assembly is a 1000 ohm 2 wire RTD. Consult the system wiring
diagram for connection of the RTD Assembly to the TIE.
The optional Dual Analog Input Board is required to use the RTD
assembly. See Table 3-2 for the applicable Dual Analog Input Board
jumper settings for the assembly.
Table 3-2
Dual Analog Input Board Jumpers for External Temperature
JUMPER
OPTIONS
DEFAULT
FUNCTION
JU1
RTD = 1-2
CUR = 3-4
VOL = 5-6
RTD = 1-2
Selects external input to
temperature channel between
RTD, 1-5 volts, or 4-20 mA
JU4
3-4 (1000 ohms)
3-4 (1000 ohms)
Selects the 32°F (0°C) RTD
resistor for calibration
JU7
3-4 (1000 ohms)
3-4 (1000 ohms)
Selects the 1000 ohm RTD
for operations
3.4 LINK ROD
For stacks with an annulus or thick outer walls that must be bridged by the
Ultraflow 150 Purge Nozzle Assemblies, Teledyne Monitor Labs offers
the Link Rod option whenever the Purge Nozzle Assemblies would exceed
72 inches (183 cm) in length. Beyond this length, the standard assemblies
become unwieldy and are difficult to align in the center of their ports. The
Link Rod Assemblies replace the standard Purge Nozzles. The Link Rod
Assemblies consist of a transducer housing with skids to center it in the
port, and a series of short rods that connect or disconnect as the transducer
housing is inserted or removed from the port. The Link Rod option also
reduces the amount of removal clearance required to extract the
transducers for maintenance and cleaning. This mounting option is
complete with all hardware, flanges and seals.
Consult the Site Specification Data sheet of Appendix A for information on
the configuration of your individual monitor.
3-4

ULTRAFLOW 150 GAS FLOW AND TEMPERATURE MONITOR
3.5 6PT I/O PC BOARD OPTION FOR 150DI
The Six Point I/O Board is an optional device intended to provide a low
cost Direct Interface feature to the Ultraflow 150DI where analog output
and control signals are supplied directly from the Transducer Interface
Enclosure (TIE) Assembly. The PC Board has 2 analog outputs, 2 digital
inputs and 2 relay outputs. The Local User Interface Key Pad and Display
option comes standard with the 6PT I/O option. The configuration of the
6PIO Board is software selectable using the PC to Modbus interface
software supplied with the Ultraflow 150DI. Below are the specifications.
The details on this option are described in its own instruction manual.
Six Point I/O Board Specifications
SIX POINT I/O BOARD ANALOG OUTPUTS
Number
2
Isolation Type
Optical & capacitive barriers; channel to channel, channel
to circuit common & earth
Minimum Isolation Voltage
500Vpeak*, 500VDC*
Output Type
4-20mA with live 4mA zero, OR 0-20mA w/o live zero
Maximum Load Resistance
900 ohms
Maximum Offset
±0.05% of full scale
Total Output Error
±0.30% of full scale
SIX POINT I/O BOARD DIGITAL INPUTS
Number
2
Modes
Isolated and Non-isolated
Isolated Mode Minimum Isolation
Voltage
500Vrms*
Isolated Mode Minimum Actuation
Voltage
5VDC (user supplied)
Isolated Mode Maximum Actuation
Voltage
24VDC (user supplied)
Isolated Mode Maximum Input Current
50mA @ 24VDC
Non-Isolated Mode Actuation
Condition
Dry contact closure
Non-Isolated Mode Internal
Operating Voltage
5VDC
SIX POINT I/O BOARD RELAY OUTPUTS
Number
2 SPST, N.O. (Single Pole Single Throw, Normally Open or
Normally Closed [jumper selectable])
Minimum Isolation
500Vrms
*
Maximum Contact Voltage
250VAC
Maximum Contact Current
1Amp AC, 1Amp DC
*I/O wires with respect to earth (common mode).
3-5

SECTION 4.0, Theory of operation
4.0 THEORY OF OPERATION
4.1 PHYSICS OF MEASUREMENT
4.1.1 Time of Flight Theory
The Ultraflow 150 system measures the transit times of ultrasonic tone bursts
through the gas stream to determine flow velocity, temperature, and volume.
Each effluent path monitored by the Transducer Interface Enclosure (TIE) uses
two transducers placed on opposite sides of the stack or duct (see Ultraflow 150
System Installation Drawing, Appendix D). The transducers are pointed at each
other with one transducer located diagonally upstream from the other. Each
transducer acts alternately as a transmitter or receiver with the ultrasonic waves
passing through the centroid of the stack or duct to the other transducer. This
makes the measurements a line average of the tone burst path length. When a
tone burst is sent through the gas stream from the upstream transducer to the
downstream transducer the movement of the gas stream reduces the time required
to traverse the distance. When the tone burst is traveling against the gas stream
from the downstream to the upstream transducer, the traverse time is increased.
When there is no gas flow, the time required for the ultrasonic tone bursts to
traverse the gas stream in either direction is the same. Both the upstream and
downstream transit times are measured by the Transducer Interface Enclosure to
an accuracy of 0.5 microseconds.
Figure 4-1
Transit Time Theory
Upstream
Transducer
L
θ
(Actual)
Fv
(Nominal)
Fv
Ft
Downstream
Transducer
4-1

ULTRAFLOW 150 GAS FLOW AND TEMPERATURE MONITOR
4.1.1.1 Flow Velocity Measurement
The root measurement of the Ultraflow 150 is transit time. The difference
between upstream and downstream transit times through the gas stream is directly
proportional to the velocity of the gas stream. From transit time and the following
physical equations the TIE calculates flow velocity. This velocity measurement is
inherently independent of the temperature, density, viscosity, and particulate
concentration since these terms drop out of the simplified equations.
1)
Velocity of Sound from Upstream to Downstream Transducer
2)
Velocity of Sound From Downstream to Upstream Transducer
Where:
Cs = The Speed of Sound
F ν = Flue Gas Velocity
θ = Transducer Angle to Flow
V = Velocity of Respective Tone Bursts
3) Subtract equations 1 & 2:
and solving for Fν:
4)
substituting
5)
Fνis the Line Average Velocity.
And: t = Transit times of sound between the transducers
L = Distance between the transducers
4-2