Texas Instruments SimpleLink CC3200 Wi-Fi User manual

CC3200 SimpleLink™ Wi-Fi®and Internet of
Things Solution With MCU LaunchPad™
Hardware
User's Guide
Literature Number: SWRU372C
June 2014–Revised March 2020

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Table of Contents
Contents
1 Introduction......................................................................................................................... 4
1.1 CC3200 LaunchPad Development Kit................................................................................. 4
1.2 Key Features ............................................................................................................. 4
1.3 What's Included .......................................................................................................... 5
1.4 FCC/IC Regulatory Compliance........................................................................................ 5
1.5 Trademarks ............................................................................................................... 5
2 Hardware Description........................................................................................................... 6
2.1 Block Diagram ........................................................................................................... 6
2.2 Hardware Features....................................................................................................... 7
2.3 Connecting a BoosterPack Plug-in Module........................................................................... 7
2.4 Jumpers, Switches, and LEDs ......................................................................................... 8
2.5 Power..................................................................................................................... 14
2.6 Measure CC3200 Current Draw...................................................................................... 16
2.7 RF Connections......................................................................................................... 17
2.8 Design Files ............................................................................................................. 18
3 Software Examples............................................................................................................. 19
3.1 Development Environment Requirements........................................................................... 19
4 Additional Resources.......................................................................................................... 19
4.1 LaunchPad Kit Wiki..................................................................................................... 19
4.2 Information on the CC3200............................................................................................ 19
4.3 Download a Development Environment ............................................................................. 19
4.4 The CC3200 Code Examples......................................................................................... 19
4.5 CC3200 Application Notes ............................................................................................ 19
4.6 Support Resources..................................................................................................... 20
5 Known Limitations.............................................................................................................. 20
5.1 Hardware Limitations................................................................................................... 20
Revision History.......................................................................................................................... 21

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List of Figures
List of Figures
1 CC3200 LaunchPad Development Kit Overview ........................................................................ 6
2 CC3200 Block Diagram..................................................................................................... 6
3 Pn-1 Marking on the LaunchPad Kit (White Triangle) .................................................................. 7
4 JTAG Headers ............................................................................................................... 8
5 I2C Connections.............................................................................................................. 8
6 UART Signals............................................................................................................... 10
7 SOP Jumpers............................................................................................................... 10
8 2x20 Pin Connector........................................................................................................ 14
9 Powering From USB....................................................................................................... 15
10 Battery Power............................................................................................................... 15
11 Measuring Low Power..................................................................................................... 16
12 Measuring Active Power................................................................................................... 16
13 Radiated Testing Using Chip Antenna .................................................................................. 17
14 Board Set for Conducted Testing ........................................................................................ 17
List of Tables
1 JTAG Headers ............................................................................................................... 8
2 Jumper Settings.............................................................................................................. 9
3 Default I2C Addresses....................................................................................................... 9
4 Jumper Settings.............................................................................................................. 9
5 UART Signals............................................................................................................... 10
6 SOP Lines................................................................................................................... 10
7 Miscellaneous Settings .................................................................................................... 11
8 Push Buttons................................................................................................................ 12
9 LEDs ......................................................................................................................... 13
10 Change Log................................................................................................................. 18

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CC3200 SimpleLink™ Wi-Fi®and Internet of Things Solution With MCU
LaunchPad™ Hardware
User's Guide
SWRU372C–June 2014–Revised March 2020
CC3200 SimpleLink™ Wi-Fi®and Internet of Things
Solution With MCU LaunchPad™ Hardware
1 Introduction
1.1 CC3200 LaunchPad Development Kit
The high-performance CC3200 is the industry's first single-chip microcontroller (MCU) with built-in Wi-Fi®
connectivity for the LaunchPad™ ecosystem. Created for the Internet of Things (IoT), the SimpleLink Wi-
Fi CC3200 device is a wireless MCU that integrates a high-performance Arm®Cortex®-M4 MCU allowing
customers to develop an entire application with a single IC. With on-chip Wi-Fi, internet, and robust
security protocols, no prior Wi-Fi experience is needed for faster development.
The CC3200 LaunchPad development kit is a low-cost evaluation platform for Arm Cortex-M4F-based
microcontrollers. The LaunchPad kit design highlights the CC3200 Internet-on-a-chip™ solution and Wi-Fi
capabilities. The CC3200 LaunchPad kit also features programmable user buttons, RGB LED for custom
applications, and onboard emulation for debugging. The stackable headers of the CC3200 LaunchPad XL
interface demonstrate how easy it is to expand the functionality of the LaunchPad kit when interfacing with
other peripherals on many existing BoosterPack™ plug-in modules, such as graphical displays, audio
codecs, antenna selection, environmental sensing, and more. Figure 1 shows a photo of the CC3200
LaunchPad kit.
Free software development tools are also available, including TI’s Eclipse-based Code Composer
Studio™ and IAR Embedded Workbench®. More information about the LaunchPad kit, the supported
BoosterPack modules, and the available resources can be found at TI’s LaunchPad portal. Also visit the
CC3200 Wiki page for design resources and example projects.
NOTE: The antennas used for this transmitter must be installed to provide a separation distance of
at least 20 cm from all persons and must not be co-located or operating in conjunction with
any other antenna or transmitter.
NOTE: All figures and references in this document apply to the Rev3.2. Most of the document also
applies to the Rev4.1, unless otherwise stated. For the exact list of changes made across
board revisions, refer to Section 2.8.2.
1.2 Key Features
• CC3200, SimpleLink Wi-Fi, Internet-on-a-chip solution with integrated MCU
• 40-pin LaunchPad standard that leverages the BoosterPack ecosystem
• FTDI-based JTAG emulation with serial port for flash programming
• Two buttons and three LEDs for user interaction
• Backchannel universal asynchronous receiver/transmitter (UART) through USB to PC
• On-board chip antenna with U.FL for conducted testing
• On-board accelerometer and temperature sensor for out-of-box demo
• Micro USB connector for power and debug connections

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1.3 What's Included
1.3.1 Kit Contents
• CC3200 LaunchPad development kit
• Micro USB cable
• Quick start guide
1.4 FCC/IC Regulatory Compliance
The CC3200 SimpleLink Wi-Fi and IoT solution with MCU LaunchPad kit hardware is FCC Part 15 and IC
ICES-003 Class A compliant.
1.5 Trademarks
LaunchPad, Internet-on-a-chip, BoosterPack, Code Composer Studio, E2E are trademarks of Texas
Instruments.
Arm, Cortex are registered trademarks of Arm Limited.
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.

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2 Hardware Description
Figure 1. CC3200 LaunchPad Development Kit Overview
2.1 Block Diagram
Figure 2. CC3200 Block Diagram

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2.2 Hardware Features
• CC3200, SimpleLink Wi-Fi, Internet-on-a-chip solution with integrated MCU
• 40-pin LaunchPad standard that leverages the BoosterPack ecosystem
• FTDI-based JTAG emulation with serial port for flash programming
• Supports both 4-wire JTAG and 2-wire SWD
• Two buttons and three LEDs for user interaction
• Virtual COM port UART through USB on PC
• On-board chip antenna with U.FL for conducted testing
• On-board accelerometer and temperature sensor for out-of-box demo, with option to isolate them from
the inter-integrated circuit (I2C) bus
• Micro USB connector for power and debug connections
• Headers for current measurement and external JTAG connection
• Bus-powered device with no external power required for Wi-Fi
• Long-range transmission with highly optimized antenna (200 m typical in open air with a 6-dBi antenna
AP)
• Can be powered externally, with 2xAA or 2xAAA alkaline batteries working down to 2.3 V typical
2.3 Connecting a BoosterPack Plug-in Module
A compatible BoosterPack module can be stacked on top of the LaunchPad kit using the 2x20 pin
connectors. Note that the connectors do not have a key to prevent the misalignment of the pins or reverse
connection. Ensure that VCC and 5V pins are aligned with the BoosterPack module header pins. On the
CC3200 LaunchPad kit, a small white triangle symbol is provided near Pin-1 (see Figure 3) to orient all
BoosterPack modules. This same marking, provided on compatible BoosterPack modules, must be
aligned before powering up the boards.
Figure 3. Pn-1 Marking on the LaunchPad Kit (White Triangle)

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2.4 Jumpers, Switches, and LEDs
2.4.1 JTAG Headers
The headers are provided on the board to isolate the CC3200 device from the mounted FTDI JTAG
emulator. These jumpers are shorted by default when the board is shipped from TI. To connect an
external emulator, remove these jumpers and place the external emulator on the pins closer to the
CC3200 device. When a battery is used, disconnect all the JTAG headers to prevent any reverse leakage
current.
Figure 4. JTAG Headers
(1) For the SWD mode, only TCK and TMS must be shorted to the CC3200.
Table 1. JTAG Headers
Reference Usage Comments
J8 (TCK) (1) JTAG Short: Routes the on-board emulator to the CC3200
J9 (TMS) (1)
J10 (TDI) Open: Isolate the on-board emulator from the CC3200.
J11(TDO)
2.4.2 I2C Connections
The board features an accelerometer and a temperature sensor for the out-of-box demo. These are
connected to the I2C bus and can be isolated using the jumpers provided. By removing J2 and J3, the
accelerometer and the temperature sensors are isolated from the I2C bus. This also removes any pullup
resistor from the I2C bus.
Figure 5. I2C Connections

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2.4.2.1 Jumper Settings
Table 2. Jumper Settings
Reference Usage Comments
J2 I2C SDA Short: Connect the CC3200 I2C bus to the on-board sensors with pullup
Open: Isolate the sensors from the CC3200
J3 I2C SCL Short: Connect the CC3200 I2C bus to the on-board sensors with pullup
Open: Isolate the sensors from the CC320
J4 INT Short: Connect the accelerometer interrupt to the CC3200 on GPIO13
2.4.2.2 Default I2C Address
(1) U6 is DNP on newer CC3200-LAUNCHXL builds.
Table 3. Default I2C Addresses
Sensor Type Ref Part Number Slave Address
Temp sensor U6(1) TMP008 0x41
Accelerometer U10 BMA222 0x18
2.4.3 Power Connections
The board can be powered by using the on-board micro USB connector. An on-board LDO provides 3.3 V
for the CC3200 and the rest of the board to operate. This supply can be isolated from the LDO using the
jumpers on the board.
Table 4. Jumper Settings
Reference Usage Comments
J12 Current
measurement Measures the current flowing into the CC3200 device.
J13 Board power Short: Supply the board power from the on-board LDO.
Open: Supply the board power from the J20 (battery connector)
J19 5-V power 5-V output from the USB VBUS (has a diode drop of up to 0.4 V)
J20 3.3-V power input Can be used to power the board from an external 2xAA battery pack. It has in-built reverse
voltage protection to prevent the battery from being plugged in the reverse manner.

UART for Flashing Mode UART for BoosterPack
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2.4.4 UART Signals
The board supports a USB-based virtual COM port, which is used on the FTDI device FT2232D. There
are two ports on the FT2232: the first port is dedicated for the emulation (JTAG/SWD) and the second port
is used for the virtual COM port. The UART can also be routed to the 20-pin connector and the selection
is performed using jumpers on the board.
Figure 6. UART Signals
Table 5. UART Signals
Reference Usage Comments
J6, J7 UART for flash
programming Short 1-2: Route the signals to the 20-pin connector. Short 2-3: Route the signals to the FTDI for flash programming.
2.4.5 Sense on Power
The CC3200 can be set to operate in three different modes based on the state of the sense-on-power
(SOP) lines. These are pins 21, 34, and 35 on the CC3200 device. The state of the device is described in
Table 6.
Table 6. SOP Lines
Usage Comments
SOP[2:0] 100 = Flash programming 000 = Functional mode + 4-Wire JTAG
001 = Functional mode + 2-Wire JTAG
SOP[2:0] corresponds to J15, J16, and J17 in the LaunchPad kit schematic design.
Figure 7. SOP Jumpers

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2.4.6 Other Miscellaneous
Table 7. Miscellaneous Settings
Reference Usage Comments
J4 Accelerometer
interrupt Short = Route the accelerometer sensor interrupt to the GPIO_13 Open = Isolates the interrupt to the GPIO_13
J5 Debug header To observe the network processor (NWP), MAC logs.
J14 SOP2 isolation Isolate SOP2 (GPIO_25) from the 20-pin connector

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2.4.7 Push Buttons and LEDs
Table 8. Push Buttons
Reference Usage Comments
SW1 RESET This is used to RESET the CC3200 device. This signal is also output on
the 20-pin connector to RESET any external BoosterPack module which
may be stacked.
SW2 GPIO_22 When pushed, the GPIO_22 is pulled to VCC.
SW3 GPIO_13 When pushed, the GPIO_13 is pulled to VCC.

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(1) GPIO_10 and GPIO_11 are also used as I2C. Thus, when the pullups are enabled, the LEDs glow.
Table 9. LEDs
Refere
nce Colo4 Usage Comments
D1 Yellow nRESET This LED indicates the state of nRESET pin. If this LED is glowing,
the device is functional.
D2 Green Debug This LED glows whenever debugging is enabled over the JTAG.
D4 RED Power Indicates when the 3.3-V power is supplied to the board.
D5 GREEN GPIO_11 (1) Glows when the GPIO is logic-1
D6 YELLOW GPIO_10 (1) Glows when the GPIO is logic-1
D7 RED GPIO_09 Glows when the GPIO is logic-1

CC3200
P1 P3
Ref Signal
Dev
Pin#
Dev
Pin# Signal
13.3V 5V
2ADC_CH1 58 GND
3UART0_RX 4 57 ADC_CH0
4UART0_TX 3 60 ADC_CH3
5GPIO 61 58* ADC_CH1
6ADC_CH2 59 59* ADC_CH2
7SPI_CLK 5 63 AUD_SYNC
8GPIO 62 53 AUD_CLK
9I2C_SCL 1 64 AUD_DOUT
10 I2C_SDA 2 50 AUD_DIN
P4 P2
Signal
Dev
Pin#
Dev
Pin# Signal Ref
PWM 2* GND 1
PWM 1* 18 GPIO 2
PWM 17* 8 SPI_CS 3
PWM 64* 45 GPIO 4
CCAP/GPIO 21* RESET_OUT 5
CCAP/GPIO 18* 7 SPI_DOUT 6
GPIO 62* 6 SPI_DIN 7
GPIO 60* 21 GPIO 8
GPIO 16 55 GPIO 9
GPIO 17 15 GPIO 10
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2.4.8 2x20 Pin Connector Assignment
The signal assignment on the 2x20 pin connector is shown in Figure 8. The P1-Pn naming convention is
used for 2x20 pin connectors only.
Figure 8. 2x20 Pin Connector
The signal mappings are as indicated in Figure 8. All the signals are referred to by the pin number in the
SDK; Figure 8 shows the default mappings. Some of the pins are repeated across the connector. For
instance, pin 62 is available on P1 and P4, but only P1 is connected by default. The signal on P4 is
marked with a *(star) to signify that it is not connected by default. It can be routed to the pin by using a 0-
Ωresistor in the path. For the exact resistor placement, see the schematics and placement diagram.
2.5 Power
The LaunchPad kit is designed to be powered by the USB connection or by external 2xAA or 2xAAA
batteries.

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2.5.1 USB Power
The LaunchPad kit is designed to work from the USB-provided power supply. The LaunchPad kit
enumerates as a bus-powered device on the computer. When the board is powered from the USB
connector, the jumpers must be placed on the following headers, as shown in Figure 9.
J12 (shorted)
J13 (shorted)
Figure 9. Powering From USB
2.5.2 Battery Power (2 × 1.5 V)
The LaunchPad kit can also be powered from an external battery pack by feeding the voltage on the J20
header. This input features reverse voltage protection to ensure that the board is not damaged due to an
accidental reverse voltage. The following care should be taken while using the board with a battery.
1. Remove the USB cable.
2. Plug-in the battery pack on J20 with correct polarity (see Figure 10).
Figure 10. Battery Power
2.5.3 BoosterPack Module Power Supply
The CC3200 LaunchPad kit can be powered by a stacked booster-pack, which can provide a 3.3-V power
on P1.1. During this mode, remove the J13 so that the on-board LDO is not overloaded.

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2.6 Measure CC3200 Current Draw
To measure the current draw of the CC3200, use the 3V3 jumper on the jumper isolation block (J12). The
current measured in this mode includes only the CC3200 current and no external blocks. However, if a
GPIO of the CC3200 is driving a high current load like LED, then that is also included in this
measurement.
2.6.1 Measuring Low Power (<1 mA)
Follow these steps to measure ultra-low power:
Figure 11. Measuring Low Power
1. Remove the 3V3 jumper (J12); attach an ammeter across this jumper.
2. The CC3200 should not drive any high-current loads directly, such as an LED, as this can draw a large
current.
3. Begin target execution and set the device to low-power modes (LPDS or hibernate).
4. Measure the current. If the current levels are fluctuating, it may be difficult to get a stable
measurement. It is easier to measure quiescent states.
2.6.2 Measuring Active Power
Figure 12. Measuring Active Power
1. Remove the 3V3 jumper (J12).
2. Solder a 0.1-Ωresistor on the board at R62. Or, attach a jumper wire between J12 so that it can be
used with a current probe.
3. Measure the voltage across the R62 using an oscilloscope with a differential probe. (For the current
probe, coil the wire around the sensor multiple times for good sensitivity).
4. An ammeter can also be used for this measurement, but the results may be erroneous due to the
switching nature of the current.

Resistor mounted
towards U.FL
Murata connector
Resistor mounted
towards antenna path
Murata
Connector
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2.7 RF Connections
2.7.1 Radiated Testing (AP connection)
By default, the board ships with the RF signals routed to the on-board chip antenna. An on-board u.fl
(Murata) connector provides a means to perform the testing in the lab using a compatible cable.
Figure 13. Radiated Testing Using Chip Antenna
Figure 14. Board Set for Conducted Testing

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2.8 Design Files
2.8.1 Hardware
All design files include schematics, layout, Bill of Materials (BOM), Gerber files, and documentation, which
are made available for download from the following URL: http://www.ti.com/tool/cc3200-launchxl-rd.
2.8.2 Revision History
Table 10. Change Log
PCB Revision Description
Rev 3.0B • First baseline revision
Rev 3.1 The main changes pertain to the bill of materials (BOM) and the layout:
• Replaced the caps C23, C24 with ceramic ones to minimize leakage current
• R62 is made to DNP by default so that the jumper is used to measure the hibernate current
• Miscellaneous silk screen changes to clearly annotate components on the board.
Rev 3.2 • Layout changes for the DC-DC section to improve the mask margin
• Updated the silk screen to reflect the final markings.
Rev 4.1 • Added pullup and pulldowns for the serial flash. (Reduces hibernate current to around 17 uA)
• Moved the nRESET pull from VCC_BRD to VBAT_CC (ensures always pulled high).
• Added pullup on UART_TX going to the FTDI to prevent false start bits.
• Added pullup resistor for acccelerometer address to avoid conflict with audio booster pack
• Added 100K pullup on RESET_OUT net for any BP without RESET pulls.
• Changed R61 to 2.7K, R57-> 270 Ω(To solve false entering to bootloader mode)
• Miscellaneous silk changes
2.8.3 Software
All design files including firmware patches, software example projects, and documentation are made
available from the SimpleLink Wi-Fi Platform page.
The software development kit (SDK) for the CC3200 LaunchPad kit can be obtained from
http://www.ti.com/tool/cc3200sdk.

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3 Software Examples
3.1 Development Environment Requirements
The following software examples with the LaunchPad kit require an integrated development environment
(IDE) that supports the CC3200 device.
For more details on where to download the latest IDE, see Section 4.3.
The CC3200 programmer's guide (SWRU369) has detailed information on software environment setup,
with examples. Refer to this document for further details on the software sample examples.
3.1.1 CCS
CCS 6.0 or higher is required. When CCS has been launched, and a workspace directory chosen, use
Project →Import Existing CCS Eclipse Project. Direct it to the desired demo’s project directory containing
main.c.
3.1.2 IAR
IAR 6.70 or higher is required. To open the demo in IAR, choose File →Open →Workspace…, and direct
it to the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information
is contained within this file.
The subdirectory also has an *.ewp project file; this file can be opened into an existing workspace, using
Project →Add-Existing-Project….
4 Additional Resources
4.1 LaunchPad Kit Wiki
Most updated information is available on the CC3200 Wiki page.
4.2 Information on the CC3200
For more information on CC3200, visit the product page (http://www.ti.com/product/cc3200), which
includes the data sheet (SWAS032) and key documents such as the technical reference manual
(SWRU367) and Wiki (http://www.ti.com/simplelinkwifi-wiki). These resources contain information on
getting started, hardware details, software details including porting information, testing and certification,
support, and the CC3200 community.
4.3 Download a Development Environment
Although the files can be viewed with any text editor, more can be done with the projects if they are
opened with a development environment such as Code Composer Studio (CCS),IAR, or Energia.
CCS and IAR are each available in a full version, or a free, code-size-limited version. The full out-of-box
demo cannot be built with the free version of CCS or IAR (IAR Kickstart), due to the code-size limit. To
bypass this limitation, a code-size-limited CCS version is provided that has most functionality integrated
into a library. The code built into the library is able to be viewed by the user, but it cannot be edited. For
full functionality, download the full version of either CCS or IAR.
4.4 The CC3200 Code Examples
The user's guide for each example can be found within the Software Development Kit (SDK) or on the
SimpleLink Wiki.
4.5 CC3200 Application Notes
There are many application notes with practical design examples and topics located at the SimpleLink(TM)
Wi-Fi(R) Wiki page and the main landing page.

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4.6 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help —
straight from the experts. Search existing answers or ask your own question to get the quick design help
you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications
and do not necessarily reflect TI's views; see TI's Terms of Use.
5 Known Limitations
5.1 Hardware Limitations
5.1.1 Floating IO (All Revisions)
All GPIO outputs from the CC3200 device float while the device enters hibernate state. This can cause
glitches on the lines if they are not pulled externally.
5.1.2 Board Modification for LPDS Mode
There must be a 100K pulldown resistor on pin19 (JTAG_TCK) for the device to reliably enter LPDS
mode. This is not present on the boards.
5.1.3 Floating S-Flash Lines (Rev 3.2 and Earlier)
The SPI lines routed from the CC3200 to the on-board serial flash are not pulled up or down using
resistors on the board. When the device enters hibernate state, these pins can be floating, and high
currents can be drawn by the serial flash.