Texas Instruments Hercules TMS570LS31x User manual

TMS570LS31x Hercules Development Kit (HDK)
User's Guide
Literature Number: SPNU509C
September 2011–Revised November 2018

2SPNU509C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Contents
Contents
Preface ........................................................................................................................................ 4
1 Introduction......................................................................................................................... 5
1.1 Scope of Document ......................................................................................................... 5
1.2 TMS570LS31 HERCULES Development Kit (HDK) Features......................................................... 5
1.3 HDK Board Block Diagram ................................................................................................. 6
1.4 TMS570LS31 HDK Contents .............................................................................................. 6
1.5 HDK Specifications .......................................................................................................... 7
1.6 Basic Operation.............................................................................................................. 7
1.7 Memory Map ................................................................................................................. 7
1.8 Power Supply................................................................................................................. 8
2 Physical Description............................................................................................................. 9
2.1 Board Layout ................................................................................................................. 9
2.2 Connectors.................................................................................................................. 10
2.2.1 20-Pin ARM JTAG Header....................................................................................... 11
2.2.2 Ethernet Interface ................................................................................................. 11
2.2.3 CAN Interface...................................................................................................... 11
2.2.4 J19, MIPI ETM Connector........................................................................................ 12
2.2.5 J7, XDS100V2 USB JTAG Interface............................................................................ 13
2.2.6 P1, +5 V to +12 V Input .......................................................................................... 14
2.2.7 SCI Interface....................................................................................................... 14
2.2.8 Daughter Card Interface.......................................................................................... 14
2.3 LEDs ......................................................................................................................... 17
2.4 S2 DIP Switch .............................................................................................................. 18
2.5 Jumpers ..................................................................................................................... 19
2.6 S4, Power On Reset Switch .............................................................................................. 19
2.7 S3, System Reset Switch ................................................................................................. 19
A Operation Notices............................................................................................................... 20
A.1 Operation Notices .......................................................................................................... 20
Revision History.......................................................................................................................... 21

www.ti.com
3
SPNU509C–September 2011–Revised November 2018
Submit Documentation Feedback Copyright © 2011–2018, Texas Instruments Incorporated
List of Figures
List of Figures
1-1. TMS570LS31 HDK Board Block Diagram................................................................................ 6
2-1. TMS570LS31 HDK Board, Interfaces Top Side ......................................................................... 9
2-2. Connectors on TMS570LS31 HDK ...................................................................................... 10
2-3. CAN Bus Termination...................................................................................................... 12
2-4. J2, J3 CAN Bus Interface (Screw Terminal)............................................................................ 12
2-5. J19, 60 Pin MIPI ETM Header............................................................................................ 12
2-6. +12 V Input Jack ........................................................................................................... 14
2-7. J9, J10, and J11 on HDK ................................................................................................. 15
2-8. DIP Switch Settings........................................................................................................ 18
List of Tables
1-1. TMS570LS31 Memory Map ................................................................................................ 7
1-2. Power Test Points ........................................................................................................... 8
2-1. Connectors on HDK Board................................................................................................ 10
2-2. 20-Pin ARM JTAG Header................................................................................................ 11
2-3. J1, Ethernet Interface...................................................................................................... 11
2-4. J19, MIPI Connector Signal Mapping.................................................................................... 13
2-5. J7, XDS100V2 USB JTAG Interface..................................................................................... 13
2-6. Expansion Connector P1 (J9, Left, BottomView) ...................................................................... 15
2-7. Expansion Connector P2 (J10, Right, BottomView)................................................................... 16
2-8. Expansion Connector P3 (J11, Bottom One, TopView)............................................................... 17
2-9. Demo LEDs ................................................................................................................. 18
2-10. Other LEDs as Indicator................................................................................................... 18
2-11. S2 DIP Switch Functions.................................................................................................. 19
2-12. Jumpers ..................................................................................................................... 19

4SPNU509C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Read This First
(1) Hercules, Code Composer Studio are trademarks of Texas Instruments.
(2) ARM is a registered trademark of ARM Limited.
(3) All other trademarks are the property of their respective owners.
(1)(2)(3) Preface
SPNU509C–September 2011–Revised November 2018
Read This First
About This Manual
This document describes the board level operations of the TMS570LS31 Hercules™ Development Kit
(HDK). The HDK is based on the Texas Instruments TMS570LS3137 Microcontroller. The TMS570LS31
HDK is a table top card that allows engineers and software developers to evaluate certain characteristics
of the TMS570LS3137 microcontroller to determine if the microcontroller meets the designer’s application
requirements as well as begin early application development. Evaluators can create software to execute
on board or expand the system in a variety of ways.
Notational Conventions
This document uses the following conventions.
The TMS570LS31 HDK will sometimes be referred to as the HDK.
Program listings, program examples, and interactive displays are shown in a special italic typeface. Here
is a sample program listing:
• equations
• !rd = !strobe&rw
Information About Cautions
This book may contain cautions.
This is an example of a caution statement.
A caution statement describes a situation that could potentially damage your software, or hardware, or
other equipment. The information in a caution is provided for your protection. Please read each caution
carefully.
Related Documentation From Texas Instruments
Information regarding this device can be found at the following Texas Instruments website:
http://www.ti.com/tms570

5
SPNU509C–September 2011–Revised November 2018
Submit Documentation Feedback Copyright © 2011–2018, Texas Instruments Incorporated
Introduction
Chapter 1
SPNU509C–September 2011–Revised November 2018
Introduction
This development kit provides a product-ready hardware and software platform for evaluating the
functionality of the Texas Instruments TMS570LS31 microcontroller family. Schematics, list of materials,
and PCB layout are available to ease hardware development and reduce time to market.
1.1 Scope of Document
This user's guide lists the contents of the development kit, points out the features of the major
components, and provides the instructions necessary to verify your development kit is in working order.
Any additional usage instructions or details fall outside the scope of this document. Additional resources
will be listed at the end of this user's guide.
1.2 TMS570LS31 HERCULES Development Kit (HDK) Features
The HDK comes with a full complement of on board devices that suit a wide variety of application
environments. Key features include:
• A Hercules TMS570LS3137 337-pin BGA microcontroller
• Integrated USB JTAG Emulator (XDS100v2)
• External JTAG Headers (ARM®20 pin and TI Compact 20-pin CTI)
• 10/100 Mbps Ethernet interface
• Two CAN transceivers (SN65HVDA541Q1) and screw terminal blocks
• One ambient light sensor
• One ambient temperature sensor
• Microcontroller’s serial communication interface (SCI) universal asynchronous receiver/transmitter
(UART) accessible through a USB virtual COM port
• One 8MB SDRAM
• Eight user programmable white LEDs around the MCU silicon
• One user programmable pushbutton
• Three expansion connectors for hardware prototyping
• Reset pushbuttons (nPORRST and nRST)
• One SD card slot (SPI mode)
• Embedded trace macrocell (ETM) debug interface via MIPI connector
• Configurable pin mux options
• 5 V and 3.3 V analog-to-digital converter (ADC) option jumper
• Current measurement capability for 3.3 V IO, 1.2 V core, 1.2 V core, 1.2 V PLL, 3.3 V or 5 V ADC, and
3.3 V VCCP
• Accepts an external power supply between +5V and +12V

SDRAM
CAN1
ETM
SPI/ADC
JTAG
POR
RST
PWR
USB
EMU
EXP Conn1
SPI2
SD
Slot
XDS100V2
CPLD
FTDI
2332
Ext JTAG
EMIF/
ETM/
SPI2
ENET
RJ45
ENET
PHY
MII/
RMII
CAN
PHY
EXP Conn2
EXP Conn3
Pinmux
DIP
PIN MUX
TMS570LS3137
180 MHz
PIN MUX
CAN/
FRAY/LIN/
GIO/HET
Light
Sensor
Temp
Sensor
CAN2
CAN
PHY
GIO
Button
3.3V/5V A/D 3.3V I/O
1.2V Core
HDK Board Block Diagram www.ti.com
6SPNU509C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Introduction
1.3 HDK Board Block Diagram
Figure 1-1 illustrates the HDK block diagram.
Figure 1-1. TMS570LS31 HDK Board Block Diagram
1.4 TMS570LS31 HDK Contents
The kit contains everything needed to develop and run applications for TMS570LS3137 microcontrollers
including:
• Board:
– TMS570LS31 Card
• Cables and Accessories
– Type A to mini B USB cable for using on board XDS100V2 JTAG emulator
– Ethernet cable
– Flashlight for light sensor demo
• CCS DVD Containing:
– Texas Instruments’ Code Composer Studio™ Integrated Development Environments (IDE)
• Hercules DVD Containing:
– Hercules Safety Demos
– Hardware Abstraction Layer Code Generator (HALCoGen)
– Training Videos
– Device Documentation
Not included:
• 12-V power supply
Below are two options that electrically and mechanically will work with the HDK:

www.ti.com HDK Specifications
7
SPNU509C–September 2011–Revised November 2018
Submit Documentation Feedback Copyright © 2011–2018, Texas Instruments Incorporated
Introduction
•QAWA-24-12-US01
– 12-V output, 2-A max output current
– Positive center
– Barrel plug (2.1-mm x 5.5-mm)
– Output Protection: Short Circuit, Overvoltage, Overcurrent
– Safety approvals: CB, CE, UL, FCC, PSE, LPS, BSMI, RCM, and CCC
•SMI24-12-V-P5
– 12-V output, 2-A max output current
– Positive center
– Barrel plug (2.1-mm x 5.5-mm)
– Output Protection: Short Circuit, Overvoltage, Overcurrent
– Safety approvals: UL/cUL, CCC, RCM, and PSE
1.5 HDK Specifications
• Board supply voltage: 5 V–12 V Vdc
• Board supply current: 130 mA typ (fully active, CPU at 180 MHz)
• Dimensions: 4.90” x 4.30” x 0.85” (LxWxH)
1.6 Basic Operation
The HDK is designed to work with TI’s Code Composer Studio and other third party ARM IDEs. The IDE
communicates with the board through the embedded emulator or an external JTAG emulator. To start,
follow the instructions in the Quick Start Guide to install Hercules-specific software. This process will install
all of the necessary development tools, documentation and drivers.
1.7 Memory Map
The TMS570LS31 family of MCUs have a large byte addressable address space. Table 1-1 shows the
address space of a TMS570LS3137 microcontroller on the left with specific details of how each region is
used by the HDK on the right. By default, the internal memory sits at the beginning of the address space.
The SDRAM is mapped into CS0 space on the EMIF. CS[4:2] are used for synchronous memory for
example SRAM, NOR Flash, NAND Flash, and so forth.
To use EMIF, the MPU has to be enabled, and the CS regions have to be configured as “device mode” or
“strongly ordered mode” through MPU.
Table 1-1. TMS570LS31 Memory Map
Start Address End Address HDK
0x0000 0000 0x002F FFFF Flash
0x0800 0000 0x0803 FFFF RAM
0x0840 0000 0x0843 FFFF RAM-ECC
0x6000 0000 0x63FF FFFF CS2 Async RAM
0x6400 0000 0x67FF FFFF CS3 Async RAM
0x6800 0000 0x7BFF FFFF CS4 Async RAM
0x8000 0000 0x87FF FFFF CS0 Sync SDRAM

Power Supply www.ti.com
8SPNU509C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Introduction
1.8 Power Supply
The HDK board operates from a single +12 V external power supply connected to the main power input
(P1), a 2.5 mm, barrel-type plug. Internally, the +12 V input is converted into +1.2 V, +3.3 V and +5.0 V
using Texas Instruments swift voltage regulators and PTH power module. The +1.2 V supply is used for
the MCU core while the +3.3 V supply is used for the MCU's I/O buffers and other module on the board.
The +5.0 V supply is used for ADC power (second option) and USB VBUS.
There are multiple power test points on the HDK board. The three main test point pairs provide a
convenient mechanism to check the HDK’s current for each supply. Table 1-2 shows the voltages for each
test point and what the supply is used for.
Table 1-2. Power Test Points
Test Point Pair Voltage Voltage Use
TP14 and TP15 1.2 V MCU core
TP16 and TP17 3.3 V MCU IO and logic
TP18 and TP19 1.2 V MCU PLL
TP20 and TP21 3.3 V MCU Flash pump
TP22 and TP23 3.3 V or 5.0 V
(J8 to enable 5 V) MCU MibADC, and ADREFHI

Hercules
TMS570LS
3137
9
SPNU509C–September 2011–Revised November 2018
Submit Documentation Feedback Copyright © 2011–2018, Texas Instruments Incorporated
Physical Description
Chapter 2
SPNU509C–September 2011–Revised November 2018
Physical Description
This section describes the physical layout of the TMS570LS31 HDK board and its interfaces.
2.1 Board Layout
The TMS570LS31 HDK board is a 4.9 x 4.3 inch (125 x 109 mm) eight layer printed circuit board that is
powered by an external +5 V to approximately +12 V only power supply. Figure 2-1 shows the layout of
the TMS570LS31 HDK board.
Figure 2-1. TMS570LS31 HDK Board, Interfaces Top Side

J1
J2 J3
J4
J6
J7
J15
J12
J19
J10
J11
J9
P1
Hercules
TMS570LS
3137
Connectors www.ti.com
10 SPNU509C–September 2011–Revised November 2018
Submit Documentation Feedback
Copyright © 2011–2018, Texas Instruments Incorporated
Physical Description
2.2 Connectors
The HDK board has 13 interfaces to various peripherals. These interfaces are described in the following
sections.
Figure 2-2. Connectors on TMS570LS31 HDK
Table 2-1. Connectors on HDK Board
Connector Size Function
J1 RJ45 Ethernet
J2 3 terminal, 2.54mm DCAN1
J3 3 terminal, 2.54mm DCAN2
J4 10x2, 2.54mm ARM 20pin JTAG header
J6 19x2, mictor RTP
J7 4pin, Mini-B USB XDS100V2 USB
J9 33x2, 2mm Exp P1, SPI1, SPI5, ADC
J10 33x2, 2mm EXP P2, SPI2, EMIF, ECLK
J11 40x2, 2mm EXP P3, SPI3, GIO, NHET, DCAN, LIN
J12 19x2, mictor DMM
J15 SD card
J19 30x2, MIPI ETM MIPI Header
P1 2.5mm +12 V In