Texas Instruments LaunchPad MSP-EXP430FR5994 User manual

EVM User's Guide: MSP-EXP430FR5994
MSP430FR5994 LaunchPad™ Development Kit
(MSP ‑ EXP430FR5994)
ABSTRACT
The MSP-EXP430FR5994 LaunchPad™ development kit is an easy-to-use evaluation module (EVM) for the
MSP430FR5994 microcontroller (MCU). It contains everything needed to start developing on the ultra-low-power
MSP430FRx FRAM microcontroller platform, including onboard debug probe for programming, debugging, and
energy measurements. Figure 1-1 shows the development kit.
Figure 1-1. MSP-EXP430FR5994 LaunchPad Development Kit
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Table of Contents
1 Getting Started........................................................................................................................................................................4
1.1 Introduction........................................................................................................................................................................ 4
1.2 Key Features......................................................................................................................................................................4
1.3 What's Included..................................................................................................................................................................4
1.4 First Steps: Out-of-Box Experience....................................................................................................................................4
1.5 Next Steps: Looking Into the Provided Code..................................................................................................................... 5
2 Hardware................................................................................................................................................................................. 6
2.1 Block Diagram....................................................................................................................................................................6
2.2 Hardware Features............................................................................................................................................................ 7
2.3 Power............................................................................................................................................................................... 12
2.4 Measure MSP430 Current Draw...................................................................................................................................... 14
2.5 Clocking........................................................................................................................................................................... 14
2.6 Using the eZ-FET Debug Probe With a Different Target..................................................................................................14
2.7 BoosterPack Plug-in Module Pinout.................................................................................................................................15
2.8 Design Files..................................................................................................................................................................... 16
2.9 Hardware Change Log..................................................................................................................................................... 16
3 Software Examples...............................................................................................................................................................16
3.1 Out-of-Box Software Example..........................................................................................................................................17
3.2 Blink LED Example.......................................................................................................................................................... 21
3.3 BOOSTXL-AUDIO Audio Record and Playback Example............................................................................................... 22
3.4 Filtering and Signal Processing With LEA Reference Design Example...........................................................................23
3.5 Emulating EEPROM Reference Design Example............................................................................................................24
4 Resources............................................................................................................................................................................. 25
4.1 Integrated Development Environments............................................................................................................................25
4.2 LaunchPad Websites....................................................................................................................................................... 29
4.3 MSPWare and TI Resource Explorer............................................................................................................................... 29
4.4 FRAM Utilities...................................................................................................................................................................30
4.5 MSP430FR5994 MCU..................................................................................................................................................... 31
4.6 Community Resources.....................................................................................................................................................31
5 FAQ.........................................................................................................................................................................................32
6 Schematics............................................................................................................................................................................33
7 Revision History................................................................................................................................................................... 40
List of Figures
Figure 1-1. MSP-EXP430FR5994 LaunchPad Development Kit.................................................................................................1
Figure 2-1. MSP-EXP430FR5994 Overview............................................................................................................................... 6
Figure 2-2. MSP-EXP430FR5994 Block Diagram....................................................................................................................... 7
Figure 2-3. MSP430FR5994 Pinout.............................................................................................................................................8
Figure 2-4. eZ-FET Debug Probe................................................................................................................................................ 9
Figure 2-5. eZ-FET Isolation Jumper Block Diagram................................................................................................................ 10
Figure 2-6. Application Backchannel UART in Device Manager................................................................................................11
Figure 2-7. MSP-EXP430FR5994 Power Block Diagram..........................................................................................................12
Figure 2-8. MSP-EXP430FR5994 Super Cap Power Block Diagram........................................................................................13
Figure 2-9. BoosterPack Plug-in Module Checker Tool............................................................................................................. 15
Figure 2-10. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout..................................................16
Figure 3-1. MSP-EXP430FR5994 Out-of-Box Demo GUI......................................................................................................... 18
Figure 3-2. Live Temperature Mode...........................................................................................................................................19
Figure 3-3. FRAM Log Mode..................................................................................................................................................... 20
Figure 3-4. Record.....................................................................................................................................................................22
Figure 3-5. Playback..................................................................................................................................................................23
Figure 3-6. Alternate Microphone Configuration........................................................................................................................24
Figure 3-7. EEPROM SPI Interface Block Diagram...................................................................................................................25
Figure 3-8. EEPROM I2C Interface Block Diagram................................................................................................................... 25
Figure 4-1. TI Resource Explorer Cloud.................................................................................................................................... 26
Figure 4-2. CCS Cloud.............................................................................................................................................................. 27
Figure 4-3. Directing the Project>Import Function to the Demo Project.................................................................................... 28
Figure 4-4. When CCS Has Found the Project..........................................................................................................................28
Figure 4-5. Using TI Resource Explorer to Browse MSP-EXP430FR5994 in MSPWare.......................................................... 30
Figure 6-1. Schematics (1 of 7)................................................................................................................................................. 33
Figure 6-2. Schematics (2 of 7)................................................................................................................................................. 34
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Figure 6-3. Schematics (3 of 7)................................................................................................................................................. 35
Figure 6-4. Schematics (4 of 7)................................................................................................................................................. 36
Figure 6-5. Schematics (5 of 7)................................................................................................................................................. 37
Figure 6-6. Schematics (6 of 7)................................................................................................................................................. 38
Figure 6-7. Schematics (7 of 7)................................................................................................................................................. 39
Trademarks
LaunchPad™, BoosterPack™, Code Composer Studio™, MSP430™, EnergyTrace++™, and EnergyTrace™, and
E2E™ are trademarks of Texas Instruments.
IAR Embedded Workbench® and C-SPY® are registered trademarks of IAR Systems.
All trademarks are the property of their respective owners.
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1 Getting Started
1.1 Introduction
The MSP-EXP430FR5994 LaunchPad development kit is an easy-to-use evaluation module (EVM) for the
MSP430FR5994 microcontroller (MCU). The LaunchPad development kit contains everything needed to start
developing on the ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard debug probe
for programming, debugging and energy measurements. The board features onboard buttons and LEDs for
quick integration of a simple user interface, a microSD card port to interface with microSD cards, and a super
capacitor (super cap) to enable stand-alone applications without an external power supply.
The MSP430FR5994 MCU features 256KB of embedded FRAM (Ferroelectric Random Access Memory), a
nonvolatile memory known for its ultra-low power, high endurance, and high speed write access. The device
also features 8KB of SRAM, supports CPU speeds of up to 16 MHz and has integrated peripherals for
communication, ADC, timers, AES encryption, low-energy accelerator (LEA) (a new hardware module for the
FRAM family that is designed for fast, efficient, and low-power vector math), and more—plenty to get you started
in your development.
Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide
range of available BoosterPack modules. Quickly add features like wireless connectivity, graphical displays,
environmental sensing, and much more. Design your own BoosterPack plug-in module or choose among many
already available from TI and third-party developers.
Free software development tools are also available, such as the TI Eclipse-based Code Composer Studio™
IDE (CCS) and the IAR Embedded Workbench® for MSP430™ IDE (EW430). Both of these IDEs support
EnergyTrace++™ technology for real-time power profiling and debugging when paired with the MSP430FR5994
LaunchPad kit.
1.2 Key Features
• MSP ULP FRAM technology based MSP430FR5994 16-bit MCU
• EnergyTrace++ Technology available for ultra-low-power debugging
• 40-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem
• Onboard eZ-FET debug probe
• Two buttons and two LEDs for user interaction
• Onboard microSD card
• Super capacitor (0.22 F)
Note
As of the year 2022, the microSD card slot for the MSP-EXP430FR5994 is no longer populated. The
rest of this document still has references to the microSD card slot to support boards manufactured
before 2022.
1.3 What's Included
1.3.1 Kit Contents
• MSP-EXP430FR5994 LaunchPad development kit
• Micro-USB cable
• Quick start guide
1.3.2 Software Examples
• Out-of-box software
• Blink LED
• Audio BoosterPack plug-in module record and playback
• Low-energy accelerator for signal processing
• EEPROM emulation
1.4 First Steps: Out-of-Box Experience
An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. It demonstrates some
key features from a user level.
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1.4.1 Connecting to the Computer
Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED
should illuminate. For proper operation, drivers are needed. TI recommends installing the drivers by installing an
IDE such as TI CCS or IAR EW430. Drivers are also available at ti.com/MSPdrivers.
1.4.2 Running the Out-of-Box Demo
When connected to the computer, the LaunchPad development kit powers up. Press and hold the S1 and S2
buttons simultaneously to select a new mode. See Section 3.1 for a detailed explanation of each mode.
1.4.2.1 Live Temperature Mode
This mode provides live temperature data streaming to the PC GUI. You can influence the temperature of the
device and see changes on the GUI.
1.4.2.2 FRAM Data Log Mode
This mode shows the FRAM data logging capabilities of the MSP430FR5994. After starting this mode, the
LaunchPad development kit wakes up every five seconds from sleep mode (indicated by LED blink) to log both
temperature and input voltage values. After reconnecting to the GUI, these values can be uploaded and graphed
in the GUI.
1.4.2.3 SD Card Data Log Mode
This mode shows the data logging capabilities of the MSP430FR5994 while interfacing with an SD card. After
starting this mode, the LaunchPad development kit wakes up every five seconds from sleep mode (indicated by
LED blink) to log both temperature and input voltage values. After reconnecting to the GUI, these values can be
uploaded and graphed in the GUI.
1.5 Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It's time to open an integrated development
environment and start editing the code examples. See Section 4 for available IDEs and where to download them.
The quickest way to get started using the LaunchPad development kit is to use TI's Cloud Development Tools.
The cloud-based Resource Explorer provides access to all of the examples and resources in MSPWare. Code
Composer Studio Cloud is a simple cloud-based IDE that enables developing and running applications on the
LaunchPad development kit.
The out-of-box source code and more code examples are provided and available on the download page. Code is
licensed under BSD, and TI encourages reuse and modifications to fit specific needs.
Section 3 describes all functions in detail and provides a project structure to help familiarize you with the code.
With the onboard eZ-FET debug probe debugging and downloading new code is simple. A USB connection
between the EVM and a PC through the provided USB cable is all that is needed.
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2 Hardware
Figure 2-1 shows an overview of the MSP-EXP430FR5994 hardware.
Figure 2-1. MSP-EXP430FR5994 Overview
2.1 Block Diagram
Figure 2-2 shows the block diagram.
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Target device
MSP430FR5994
Crystal
32.768 kHz
Micro-B
USB
3.3-V
LDO
ESD
protection
Debug
MCU
LED
red, green
Crystal
4 MHz
UART, SBW to target
User interface
2 buttons, 2 LEDs
40-pin LaunchPad
standard headers
Power to target
Reset
button
Super capacitor
EnergyTrace
microSD Card
Figure 2-2. MSP-EXP430FR5994 Block Diagram
2.2 Hardware Features
2.2.1 MSP430FR5994 MCU
The MSP430FR5994 is the next device in TI's new ULP FRAM technology platform. FRAM is a cutting-edge
memory technology that combines the best features of flash and RAM into one nonvolatile memory. For more
information on FRAM, see www.ti.com/fram.
Device features include:
• 1.8-V to 3.6-V operation
• 16-bit RISC architecture up to 16-MHz system clock and 8-MHz FRAM access
• 256KB of FRAM and 8KB of SRAM
• 16-channel 12-bit ADC
• 16-channel analog comparator
• Six 16-bit timers with seven capture/compare registers each
• 6-channel direct memory access (DMA)
• 128-bit or 256-bit AES
• 32-bit hardware multiplier (MPY)
• 68 GPIOs
Figure 2-3 shows the pinout of the MSP430FR5994 MCU in the 80-pin PN package.
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1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
DVSS3
22
DVCC2
23 24 25 26 27 28 29 30 31 32 33 34
P5.0/UCB1SIMO/UCB1SDA
35 36 37 38 39 40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61626364
DVCC1
65666768697071727374757677787980
P1.4/TB0.1/UCA0STE/A4/C4
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF-
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+
P1.2/TA1.1/TA0CLK/COUT/A2/C2
P3.0/A12/C12
P3.1/A13/C13
P3.2/A14/C14
P3.3/A15/C15
P1.3/TA1.2/UCB0STE/A3/C3
P1.5/TB0.2/UCA0CLK/A5/C5
P4.7
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6
PJ.1/TDI/TCLK/MCLK/SRSCG0/C7
PJ.2/TMS/ACLK/SROSCOFF/C8
PJ.3/TCK/SRCPUOFF/C9
P4.0/A8
P4.1/A9
P4.2/A10
P4.3/A11
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P2.6/TB0.1/UCA1RXD/UCA1SOMI
TEST/SBWTCK
RST/NMI/SBWTDIO
P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK
P2.1/TB0.0/UCA0RXD/UCA0SOMI
P2.2/TB0.2/UCB0CLK
P3.4/TB0.3/SMCLK
P3.5/TB0.4/COUT
P3.6/TB0.5
P3.7/TB0.6
P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0
P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0
P4.4/TB0.5
P4.5
P4.6
DVSS1
P2.7 P2.3/TA0.0/UCA1STE/A6/C10
AVSS3
PJ.6/HFXIN PJ.7/HFXOUT
AVSS2
PJ.4/LFXIN PJ.5/LFXOUT
AVSS1 AVCC1
P2.4/TA1.0/UCA1CLK/A7/C11
DVSS2
P5.1/UCB1SOMI/UCB1SCL
P5.2/UCB1CLK/TA4CLK
P5.3/UCB1STE
P5.4/UCA2TXD/UCA2SIMO/TB0OUTH P5.5/UCA2RXD/UCA2SOMI/ACLK
P5.6/UCA2CLK/TA4.0/SMCLK
P5.7/UCA2STE/TA4.1/MCLK
P8.0
P6.0/UCA3TXD/UCA3SIMO
P6.1/UCA3RXD/UCA3SOMI
P6.2/UCA3CLK
P6.3/UCA3STE
P8.1
DVCC3
P6.4/UCB3SIMO/UCB3SDA
P6.5/UCB3SOMI/UCB3SCL P6.6/UCB3CLK P6.7/UCB3STE
P8.2
P8.3
P7.0/UCB2SIMO/UCB2SDA
P7.2/UCB2CLK
P7.3/UCB2STE/TA4.1
P7.1/UCB2SOMI/UCB2SCL
P7.4/TA4.0/A16
P7.6/A18 P7.7/A19
P7.5/A17
Figure 2-3. MSP430FR5994 Pinout
2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace++ Technology
To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard debug
probe, which eliminates the need for expensive programmers. The MSP-EXP430FR5994 has the eZ-FET debug
probe (see Figure 2-4), which is a simple and low-cost debugger that supports all MSP430 device derivatives.
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Figure 2-4. eZ-FET Debug Probe
The MSP-EXP430FR5994 LaunchPad development kit features full EnergyTrace++ technology. The
EnergyTrace™ functionality varies across the MSP portfolio (see Table 2-1).
Table 2-1. EnergyTrace Technology
Features EnergyTrace™ Technology EnergyTrace++™ Technology
Current Monitoring ✓ ✓
CPU State ✓
Peripheral and System State ✓
Devices Supported All MSP430 MCUs FR59xx and FR69xx MCUs
Development Tool Required MSP-FET or eZ-FET MSP-FET or eZ-FET
In Figure 2-4, the dotted line through J101 divides the eZ-FET debug probe from the target area. The signals
that cross this line can be disconnected by jumpers on J101, the isolation jumper block. For more details on the
isolation jumper block, see Section 2.2.3.
The eZ-FET also provides a "backchannel" UART-over-USB connection with the host, which can be very useful
during debugging and for easy communication with a PC. For more details, see Section 2.2.4.
Details of the eZ-FET hardware can be found in the schematics in Section 6 and in the hardware design files
download page. The software and more information about the debugger can be found on the eZ-FET wiki.
2.2.3 Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 can connect or disconnect signals that cross from the eZ-FET domain
into the MSP430FR5994 target domain. This includes eZ-FET Spy-Bi-Wire signals, application UART signals,
and 3.3-V and 5-V power (see Table 2-2 and Figure 2-5).
Reasons to open these connections:
• To remove any and all influence from the eZ-FET debug probe for high accuracy target power measurements
• To control 3-V and 5-V power flow between the eZ-FET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART communication
• To expose the programming and UART interface of the eZ-FET so that it can be used for devices other than
the onboard MCU.
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Table 2-2. Isolation Block Connections
Jumper Description
GND Ground
5V 5-V VBUS from USB
3V3 3.3-V rail, derived from VBUS in the eZ-FET domain
RXD << Backchannel UART: The target MSP430FR5994 receives data through this signal. The arrows indicate the direction of
the signal.
TXD >> Backchannel UART: The target MSP430FR5994 sends data through this signal. The arrows indicate the direction of the
signal.
SBW RST Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as the RST signal (active low).
SBW TST Spy-Bi-Wire debug: SBWTCK clock signal. This pin also functions as the TST signal.
eZ-FET Debug
Probe
Isolation
Jumper Block
Spy-Bi-Wire (SBW) Emulation
Application UART
3.3-V Power
5-V Power
Target MSP430 MCU
eZ-FETMSP430 Target
USB Connector
in out
LDO
BoosterPack Header
BoosterPack Header
USB
EnergyTrace
Figure 2-5. eZ-FET Isolation Jumper Block Diagram
2.2.4 Application (or Backchannel) UART
The backchannel UART allows communication with the USB host that is not part of the target application's
main functionality. This is very useful during development, and also provides a communication channel to the
PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the PC that
communicate with the LaunchPad development kit.
Figure 2-5 shows the pathway of the backchannel UART. The backchannel UART is the UART on eUSCI_A0.
This UART channel is separate from the UART on the 40-pin BoosterPack plug-in module connector
(eUSCI_A3).
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On the host side, a virtual COM port for the application backchannel UART is generated when the LaunchPad
development kit enumerates on the host. You can use any PC application that interfaces with COM ports,
including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the target
application. You need to identify the COM port for the backchannel. On Windows PCs, Device Manager can
assist (see Figure 2-6).
Figure 2-6. Application Backchannel UART in Device Manager
The backchannel UART is the MSP Application UART1 (COM13) port. In this case, Figure 2-6 shows COM13,
but this port can vary from one host PC to the next. Identify the correct COM port and configure it in the host
application according to its documentation. Then open the port and begin communication to it from the host.
On the target MSP430FR5994 side, the backchannel is connected to the eUSCI_A0 module. The eZ-FET has a
configurable baud rate; therefore, it is important that the PC application configures the baud rate to be the same
as what is configured on the eUSCI_A0.
2.2.5 Special Features
2.2.5.1 microSD Card
The MSP430FR5994 LaunchPad development kit features an onboard microSD card. With an SD card, there is
another method of cheap data logging available for users. The Out-Of-Box experience comes with an SD Card
Library that helps users interface the MSP430FR5994 with the SD card. The library lets users store data in files
with a name of their choice, so that the data can be used later in conjunction with a PC.
The slot can detect if a card is present. If a card is inserted while the MSP430FR5994 is on, an interrupt for the
MCU is generated. Table 2-3 lists the SD Card Detect pin and the rest of the pin assignments that are used to
communicate with the SD card.
Table 2-3. microSD Card to MCU Connections
microSD Card Function MSP430FR5994 Pin
SD Card Detect P7.2
SD SPI MOSI P1.6
SD SPI MISO P1.7
SD SPI CS P4.0
SD SPI CLK P2.2
R7 on the MSP430FR5994 LaunchPad development kit is not populated on the board to ensure accurate LPM
current measurements. Use the internal MSP pullup resistor in software, or populate R7.
R5 is also not populated. In the SD Card library, the SPI CS line is driven high or low. Often why a pullup
resistor like R5 is included is for during system startup. Before the MSP430FR5994 fully starts and outputs a
high signal on the CS line, it is possible that CS may be floating, and the SD card may interpret other floating SPI
lines as communication. It is a good practice to populate this resistor in an application where the exact startup
conditions are not controlled. For the LaunchPad development kit, this resistor is removed for precise current
measurements when all GPIO are set low.
2.2.5.2 220-mF Super Capacitor
A 220-mF (0.22-F) capacitor is mounted onboard and allows powering the system without any external power.
The super cap can be used in the following ways: charging, using (direct connection to 3V3 rail), and
disconnected. For more details on these use modes and how to use them, see Section 2.3.
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2.3 Power
The board is designed to accommodate various powering methods, including through the onboard eZ-FET and
external or BoosterPack plug-in module power (see Figure 2-7).
Figure 2-7. MSP-EXP430FR5994 Power Block Diagram
2.3.1 eZ-FET USB Power
The most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-V power
from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the target side of the
LaunchPad development kit. Power from the eZ-FET is controlled by jumper J101. For 3.3 V, make sure that a
jumper is connected across the J101 3V3 terminal.
2.3.2 BoosterPack Plug-in Module and External Power Supply
Header J6 on the board supplies external power directly. Comply with the device voltage operation specifications
when supplying external power. The MSP430FR5994 has an operating range of 1.8 V to 3.6 V. More information
can be found in the MSP430FR5994 data sheet.
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Figure 2-8. MSP-EXP430FR5994 Super Cap Power Block Diagram
2.3.3 Super Cap (C1)
A 220-mF (0.22-F) super cap is mounted onboard and allows powering the system without any external power.
This demonstrates the ultra-low power of the MSP430FR5994 target MCU. See how long you can run your
application on the super cap alone!
2.3.3.1 Charging the Super Cap
The super cap can be charged when the EVM is plugged into the PC or when the board is externally powered.
During charging, set J8 to the Charge setting, which adds a current limiting resistor for charging.
To charge the super cap, power must be coming from the eZ-FET debug probe, external power through J5, or a
BoosterPack plug-in module powering through J1. Allow two to three minutes for the super cap to charge (time
may vary depending on initial charge of the super cap and the power source) to full VCC.
2.3.3.2 Using the Super Cap
After charging of the super cap, move the J8 jumper to the Use setting and unplug power. This connects the
super cap to the 3V3 rail without the charging resistor. Now, the LaunchPad development kit is being powered
completely by the C1 super capacitor.
For the lowest-power operation, make sure to disconnect the J101 jumpers and remove the microSD card if it is
not in use. Removing J101 jumpers prevents the super cap from powering the eZ-FET circuitry and consuming
additional power. The microSD card has approximately 100 µA of current draw just being plugged into the
system, even when not in use. Taking these steps allows your application to be powered longer from only the
super cap.
2.3.3.3 Disabling the Super Cap
The super cap can be completely decoupled from the board by removing the J8 jumper. Hang this jumper off
only one pin to prevent losing the jumper.
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2.4 Measure MSP430 Current Draw
To measure the current draw of the MSP430FR5994 using a multimeter, use the 3V3 jumper on the J101 jumper
isolation block. The current measured includes the target device and any current drawn through the BoosterPack
plug-in module headers.
To measure ultra-low power, follow these steps:
1. Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper.
2. Consider the effect that the backchannel UART and any circuitry attached to the MSP430FR5994 may have
on current draw. Consider disconnecting these at the isolation jumper block, or at least consider their current
sinking and sourcing capability in the final measurement.
3. Make sure there are no floating inputs or outputs (I/Os) on the MSP430FR5994. These cause unnecessary
extra current draw. Every I/O should either be driven out or, if it is an input, should be pulled or driven to a
high or low level.
4. Begin target execution.
5. Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a stable
measurement. It is easier to measure quiescent states.
Alternatively, EnergyTrace++ technology can be used to measure the same current, and see energy profiles
through integrated GUI in CCS and IAR. EnergyTrace allows you to compare various current profiles and better
optimize the energy performance.
2.5 Clocking
The MSP-EXP430FR5994 provides external clocks in addition to the internal clocks in the device.
• Q1: 32-kHz Epson crystal (FC-135R)
• Q2: DNP high-frequency crystal footprint
The 32-kHz crystal allows for lower LPM3 sleep currents than do the other low-frequency clock sources.
Therefore, the presence of the crystal allows the full range of low-power modes to be used.
The high-frequency crystal is not populated by default, but the footprint for a crystal is provided. Populate a
high-frequency crystal for applications that need more precise high-frequency clock sources than the internal
DCO.
The internal clocks in the device default to the following configuration:
• MCLK: DCO 1 MHz
• SMCLK: DCO 1 MHz
• ACLK: REFO 32.768 kHz
For more information about configuring internal clocks and using the external oscillators, see the
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide.
2.6 Using the eZ-FET Debug Probe With a Different Target
The eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 derivative devices,
not just the onboard MSP430FR5994 target device.
To do this, disconnect every jumper in the isolation jumper block. This is necessary, because the debug probe
cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.
Next, make sure the target board has proper connections for SBW. To be compatible with SBW, the capacitor
on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430 JTAG interface
circuitry is the MSP430 Hardware Tools User's Guide.
Finally, wire together these signals from the debug probe side of the isolation jumper block to the target
hardware:
• 5 V (if 5 V is needed)
• 3.3 V
• GND
• SBWTDIO
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• SBWTCK
• TXD (if the UART backchannel is to be used)
• RXD (if the UART backchannel is to be used)
This wiring can be done either with jumper wires or by designing the board with a connector that plugs into the
isolation jumper block.
2.7 BoosterPack Plug-in Module Pinout
This LaunchPad development kit complies with the 40-pin LaunchPad development kit pinout standard. This
standard was created to aid compatibility between LaunchPad development kits and BoosterPack plug-in
modules across the TI ecosystem.
The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPad development kit like
the MSP-EXP430FR4133. This allows some subset of functionality of 40-pin BoosterPack plug-in modules to be
used with 20-pin LaunchPad development kits.
While most BoosterPack plug-in modules are compliant with the standard, some are not. The MSP-
EXP430FR5994 LaunchPad development kit is compatible with all 40-pin BoosterPack plug-in module that
comply with the standard. If the reseller or owner of the BoosterPack plug-in module does not explicitly
indicate compatibility with the MSP-EXP430FR5994 LaunchPad development kit, compare the schematic of
the candidate BoosterPack plug-in module with the LaunchPad development kit to ensure compatibility. Keep in
mind that sometimes conflicts can be resolved by changing the MSP430FR5994 MCU pin function configuration
in software.
To check the compatibility of your desired BoosterPack plug-in module for your design, with a LaunchPad
development kit of your choice, you can use the BoosterPack Checker tool (see Figure 2-9). This allows you to
select any LaunchPad development kit we offer and determine its compatibility with any number of BoosterPack
plug-in module that we offer. You can also add your own BoosterPack plug-in module to check its compatibility
as you prototype that next design.
Figure 2-9. BoosterPack Plug-in Module Checker Tool
Figure 2-10 shows the 40-pin pinout of the MSP430FR5994 LaunchPad development kit.
Software configuration of the pin functions plays a role in compatibility. The LaunchPad development kit side of
the dashed line shows only the applicable function for conforming to the standard. However, each pin has other
functionality that can be configured by the software. See the MSP430FR5994 data sheet for more details on
individual pin functions.
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Figure 2-10. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout
2.8 Design Files
2.8.1 Hardware
See Section 6 for schematics. All design files including schematics, layout, bill of materials (BOM), Gerber files,
and documentation are available on the MSP-EXP430FR5994 Design File Download Page.
2.8.2 Software
All design files including TI-TXT object-code firmware images, software example projects, and documentation
are available on the MSP-EXP430FR5994 Design File Download Page.
2.9 Hardware Change Log
Table 2-4 lists the change history for all released hardware revisions.
Table 2-4. Hardware Change Log
PCB Revision Description
Rev 1.1 Initial Release
3 Software Examples
Software examples are included with the MSP430FR5994 LaunchPad development kit (see Table 3-1), and
can be found in the MSP430FR5994 LaunchPad development kit Download Page and are also available in
MSP430Ware for MSP Microcontrollers.
Table 3-1. Software Examples
Demo Name BoosterPack Required Description More Details
OutOfBox_FR5994 None The out-of-box demo pre-programmed on the LaunchPad from
the factory. Demonstrates features of MSP430FR5994 MCU. Section 3.1
BlinkLED_FR5994 None Blinks an LED on the LaunchPad at a fixed interval. Section 3.2
BOOSTXL-AUDIO_
RecordPlayback_
MSP430FR5994
• MSP-EXP430FR5994
• BOOSTXL-AUDIO
Demonstrates how to record and playback audio from FRAM
memory using DMA. Section 3.3
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Table 3-1. Software Examples (continued)
Demo Name BoosterPack Required Description More Details
BOOSTXL-AUDIO_
LEA_MSP430FR5994
• MSP-EXP430FR5994
• BOOSTXL-AUDIO
• 430BOOST-SHARP96
or BOOSTXL-
SHARP128
Demonstrates the performance of the MSP low-energy
accelerator (LEA) by performing FFT and FIR. Section 3.4
EEPROM Emulation
reference design • MSP-EXP430FR5994 Emulates EEPROM using FRAM technology on MSP supporting both I2C and SPI Section 3.5
To use any of the software examples with the LaunchPad kit, you must have an integrated development
environment (IDE) that supports the MSP430FR5994 MCU. Table 3-2 lists the minimum requirements for IDEs.
Table 3-2. IDE Minimum Requirements for MSP-EXP430FR5994
Code Composer Studio™ IDE IAR Embedded Workbench® IDE
Code Composer Studio IDE v6.1.3 or later IAR Embedded Workbench for MSP430 v6.40.2 or later
For more details on how to get started quickly, and where to download the latest Code Composer Studio and
IAR Embedded Workbench IDEs, see Section 4.
3.1 Out-of-Box Software Example
This section describes the functionality and structure of the out-of-box software that is preloaded on the EVM.
3.1.1 Source File Structure
The project is organized in multiple files. This organization makes it easier to navigate and to reuse parts of it for
other projects. Table 3-3 describes each file in the project
Table 3-3. Source File and Folders
Name Description
main.c The out-of-box demo main function, initializations, shared ISRs, and more
LiveTempMode.c Contains functions for the live temperature streaming mode
FRAMLogMode.c Contains functions for the FRAM data logging mode
SDCardLogMode.c Contains function for the SD card data logging mode
Library: Driverlib Device driver library
Library: FatFs Generic FAT file system module for small embedded systems (FatFs)
HAL/HAL_SDCard.c Hardware abstraction layer for board/device to SD card connection
Library: SDCardLib Wrapper library to provide higher-level SD card APIs
3.1.2 Out-of-Box Demo GUI
The out-of-box demo GUI (see Figure 3-1) is required to control the out-of-box application running on the
MSP-EXP430FR5994 LaunchPad development kit. The GUI can be found in the latest MSPWare installation or
in MSP-EXP430FR5994_Software_Examples.zip, available on the MSP-EXP430FR5994 Design File Download
Page.
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Figure 3-1. MSP-EXP430FR5994 Out-of-Box Demo GUI
Establish connection to the LaunchPad development kit by first clicking the Connect button, followed by selecting
the correct Serial COM Port (MSP Application UART1) and clicking the Open button. On Windows, open Device
Manager → Ports (COM & LPT) to verify the corresponding COM port of the backchannel UART.
After connection has been established, the GUI pings the LaunchPad development kit every few seconds to
make sure that it is still present and to keep the serial port open. If no response is received from the LaunchPad
development kit, the GUI automatically closes the serial port connection.
3.1.3 Power Up and Idle
When the LaunchPad development kit powers up after being connected to a computer, the red and green LEDs
toggle several times to indicate that the out-of-box demo is running. The MSP430FR5994 then enters low-power
mode 3 to wait for UART commands from the PC GUI.
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3.1.4 Live Temperature Mode
To enter the live temperature mode, click the Start button below Live Temp Mode in the GUI Application Controls
panel (see Figure 3-2).
Figure 3-2. Live Temperature Mode
The MSP430FR5994 first sends two ADC calibration constants for the temperature sensor to the PC GUI. It then
sets up its 12-bit ADC for sampling and converting the signals from its internal temperature sensor. A hardware
timer is also configured to trigger the ADC conversion every 0.125 seconds before the device enters low-power
mode 3 to conserve power. As soon as the ADC sample and conversion is complete, the raw ADC data is sent
the through the UART backchannel to the PC GUI.
As the raw ADC data is received by the PC GUI, Celsius and Fahrenheit units are calculated first. The PC GUI
keeps a buffer of the most recent 100 temperature measurements, which are graphed against the current time of
the PC on the Incoming Data panel.
A red horizontal line is drawn across the data plot to indicate the moving average of the incoming data.
To exit this mode, click the Stop button under Live Temp Mode. You must exit this mode before starting the other
modes.
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3.1.5 FRAM Log Mode
To enter the FRAM Log Mode, click the Start button under FRAM Log Mode in the GUI Application Controls
panel. The PC GUI also sends its current timestamp over UART to be stored in the LaunchPad development kit.
This timestamp is later used to extrapolate the X-axis time values when the FRAM logged data are transferred to
the GUI (see Figure 3-3).
Figure 3-3. FRAM Log Mode
When the MSP430FR5994 receives the UART command from the GUI, it starts the entry sequence by initializing
the Real-Time Clock to trigger an interrupt every 5 seconds. The red LED blinks three times to indicate
successful entry into FRAM Log Mode.
The MSP430FR5994 wakes up every 5 seconds from low-power mode 3 to perform data logging before going
back to low-power mode 3. The GUI automatically disconnects from the LaunchPad development kit after
entering FRAM Log Mode. Each time the device wakes up, the green LED lights up to indicate a data point is
stored. Two 10000 long FRAM array buffers are allocated to store the raw ADC output data.
Because the device can be powered solely with the onboard Super Cap, the 12-bit ADC is set up to sample and
convert the signals from its internal temperature sensor and battery monitor (super cap voltage).
The board allows powering the application with the USB cable or the onboard super cap. See Section 2.3.3 for
more detail on the super cap. To switch to the super cap:
1. While board is powered through USB, configure the jumper to Charge on J8. Wait 2 to 3 minutes.
2. Start FRAM Logging.
3. Switch the jumper on J8 to Use.
4. Disconnect the SBWTDIO and 3v3 jumpers on J101 (to prevent back powering the eZ-FET).
5. Disconnect the USB.
Note
Remove the SD card from the holder to reduce power consumption and extend application run time
when using the super cap.
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