Texas Instruments LP-MSPM0L1306 User manual

User’s Guide
MSPM0L1306 LaunchPad Development Kit
(LP ‑ MSPM0L1306)
ABSTRACT
The MSPM0L1306 LaunchPad™ Development Kit is an easy-to-use evaluation module for the MSPM0L1306
microcontroller (MCU). The kit contains everything needed to start developing on the MSPM0L1xx
microcontroller platform, including onboard debug probe for programming, debugging, and energy
measurements. The board also features onboard buttons and LEDs for quick integration of a simple user
interface, an onboard thermistor, light sensor, and RGB LED.
The following figure shows the LP-MSPM0L1306 LaunchPad development kit.
LP-MSPM0L1306 LaunchPad Development Kit
Table of Contents
1 Getting Started........................................................................................................................................................................3
1.1 Introduction........................................................................................................................................................................ 3
1.2 Key Features......................................................................................................................................................................3
1.3 What's Included..................................................................................................................................................................3
1.4 First Step Out-of-Box Experience...................................................................................................................................... 3
1.5 Next Steps: Looking Into the Provided Code..................................................................................................................... 4
2 Hardware................................................................................................................................................................................. 4
2.1 Jumper Map....................................................................................................................................................................... 6
2.2 Block Diagram....................................................................................................................................................................7
2.3 Hardware Features............................................................................................................................................................ 7
2.4 Power............................................................................................................................................................................... 12
2.5 External Power Supply and BoosterPack Plug-in Module............................................................................................... 12
2.6 Measure Current Draw of the MSPM0 MCU....................................................................................................................12
2.7 Clocking........................................................................................................................................................................... 13
2.8 BoosterPack Plug-in Module Pinout.................................................................................................................................13
2.9 Design Files..................................................................................................................................................................... 13
3 Software Examples...............................................................................................................................................................13
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4 Resources............................................................................................................................................................................. 13
4.1 Integrated Development Environments............................................................................................................................13
4.2 MSPM0 SDK and TI Resource Explorer.......................................................................................................................... 14
4.3 MSPM0L1306 MCU......................................................................................................................................................... 14
4.4 Community Resources.....................................................................................................................................................15
5 Schematics............................................................................................................................................................................16
6 Revision History................................................................................................................................................................... 22
Trademarks
LaunchPad™, BoosterPack™, Code Composer Studio™, EnergyTrace™, and TI E2E™ are trademarks of Texas
Instruments.
Embedded Workbench™ is a trademark of IAR Systems.
Arm®, Cortex®, Keil®, and µVision® are registered trademarks of Arm Limited.
All trademarks are the property of their respective owners.
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1 Getting Started
1.1 Introduction
The MSPM0L1306 is an Arm® 32-bit Cortex®-M0+ CPU with frequency up to 32 MHz. The device features
64KB of embedded flash memory combined with 4KB of on-chip RAM. The integrated high-performance analog
peripherals like 12-bit 1-Msps SAR ADC, zero-drift and zero-crossover chopper op-amps (OPA), and a general-
purpose amplifier (GPAMP) help users design their system.
Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range
of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical
displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or choose
among many already available from TI and third-party developers.
Free software development tools are also available such as TI's Code Composer Studio™ IDE, IAR Embedded
Workbench™ IDE, and Keil® µVision® IDE. Code Composer Studio IDE supports EnergyTrace™ technology
when paired with the MSPM0L1306 LaunchPad development kit. More information about the LaunchPad
development kit, the supported BoosterPack plug-in modules, and the available resources can be found at the TI
LaunchPad™ development kit portal. To get started quickly and find available resources in the MSPM0 software
development kit (SDK), visit the TI Cloud Developer Zone. MSPM0 MCUs are also supported by extensive
online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.
1.2 Key Features
• Onboard XDS110 debug probe with external programming option
• EnergyTrace technology available for ultra-low-power debugging
• 2 buttons, 1 LED and 1 RGB LED for user interaction
• Thermistor circuit
• Light sensor circuit
• RC filter for ADC input (unpopulated by default)
• Supports BSL invoke with GPIO and XDS110
• Backchannel UART through USB to PC
1.3 What's Included
1.3.1 Kit Contents
1. MSPM0L1306 LaunchPad Development Kit
2. 1 Micro USB cable
3. 1 Quick Start Guide
1.3.2 Software Examples
•Out-of-Box Software Example
•Sysconfig Compatibility
•SDK Examples
1.4 First Step Out-of-Box Experience
An easy way to get started with the EVM is by using its preprogrammed out-of-box code. This code
demonstrates some key features of the EVM and is meant to be used with the LP-MSPM0L1306 out-of-box
demo GUI.
1.4.1 Connecting to the Computer
Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED
illuminates. For proper operation, drivers are needed. TI recommends that you get the drivers by installing an
IDE such as the TI Code Composer Studio IDE or IAR Embedded Workbench IDE.
1.4.2 Running the Out-of-Box Experience
Access the GUI Composer powered GUI for the Out-of-Box Experience (OoBE) through the TI Cloud Gallery.
Alternatively, the GUI is provided with the MSPM0 SDK as well for offline operation. Figure X below shows the
welcome screen for the GUI. The GUI runs through three main examples:
• Blink LED – Change rate of LED blink
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• Light Sensor – Read light sensor and plot results, while also modulate RGB brightness
• Thermistor – Read thermistor voltage and plot converted temperature over time. RGB LED changes colors to
signify differences of temperature measured.
Figure 1-1. LP-MSPM0L1306 OoBE GUI
1.5 Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It’s time to open an integrated development
environment and start editing the code examples. See Section 4 for available IDEs and where to download them.
Code examples are provided in the MSPM0 SDK. Code is licensed under BSD, and TI encourages reuse
and modifications to fit specific needs. See MSPM0 SDK User Guide for more details about code examples
available.
The quickest way to get started using the LaunchPad development kit is to use TI’s cloud development tools.
The cloud-based Resource Explorer provides access to all of the examples and resources in MSPM0 SDK .
Code Composer Studio Cloud is a simple Cloud-based IDE that enables developing and running applications
on the LaunchPad development kit. SysConfig for MSPM0 is another graphical tool that can be utilized to easily
and quickly setup your MSPM0L1306 device, pins, and peripherals to fit your development needs. SysConfig is
strongly encouraged to be used when starting any new project.
With the XDS110 debug probe, debugging and downloading new code is simple. A connection between the EVM
and a PC through the provided USB cable is all that is needed.
2 Hardware
Figure 2-1 shows an overview of the LP-MSPM01306 hardware.
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UART to BP/XDS
selection
XDS110 onboard debug probe
Enables debugging and
programming as well as
communication to the PC.
The XDS110 can also provide
power to the target MCU.
EnergyTrace Technology
Real-time power consumption
readings and state updates from
the MCU viewable through the
EnergyTrace GUI
Reset
MSPM0L1306
reset
USB
To PC
Button/Switch
S1
Button/Switch
S2
40-pin BoosterPack plug-in
module connector (J1-J4)
Button/Switch
S1
Light Sensor
Thermistor
Jumper Isolation Block
J101
-Power
- GND, 5V, and 3V3
-Back-channel UART to the PC
- RXD, TXD
-SWD
- SWDIO, SWCLK
-BSL
MSPM0L1306
RGB LED
LED
Alternate PA11 Selection
Pullup voltage selection
Figure 2-1. LP-MSPM0L1306 Overview
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2.1 Jumper Map
Table 2-1. LaunchPad Kit Jumpers Shunt Installation
Jumper Description Default setting Connected Pin or
Signal
Low Power
Measurement
Recommendation
J101 XDS110-ET isolation block Installed
GND, 5V, 3V3, RXD,
TXD, NRST, SWDIO,
SWCLK, BSL
OFF to disconnect from
XDS-110 circuitry
J102 XDS110-ET Program Out NA GND, 3V3, SWDIO,
SWCLK, NRST No external connection
J103 XDS110-ET Program In NA GND, 3V3, SWDIO,
SWCLK No external connection.
J1 Thermistor signal selection 1) short to (2) PA15 (ADC0_9) OFF to disconnect from
thermistor circuit
J2 Red LED D2 Installed PA0 OFF to disconnect pin
from LED
J3 RGB LED D1 – Green Channel Installed PA13 (TIMG0_C1) OFF to disconnect pin
from RGB LED
J4 Light Sensor Installed PA25 (OPA0_IN+) OFF to disconnect from
photodiode circuit
J5 Light Sensor Installed PA24 (OPA0_IN-) OFF to disconnect from
photodiode circuit
J6 Light Sensor Installed PA22 (OPA0_OUT) OFF to disconnect from
photodiode circuit
J7 External 3.3V NA 3V3, GND No connect to external
circuits
J8 External 5V NA 5V, GND No connect to external
circuits
J9 Open-drain IO PA0 voltage pull up selection (2) open NA
OFF if pin initialized as
output low or input with
pullup/pulldown
J10 Open-drain IO PA1 voltage pull up selection (2) open NA
OFF if pin initialized as
output low or input with
pullup/pulldown
J11 Button S1 connection Installed PA18
OFF to avoid current
from external pulldown
depending on pin
configuration
J12 RGB LED D1 – Red Channel Installed PA26 (TIMG1_C0) OFF to disconnect pin
from RGB LED
J13 RGB LED D1 – Blue Channel Installed PA27 (TIMG1_C1) OFF to disconnect pin
from RGB LED
J14 Alternate PA11 BoosterPack Connection (1) short to (2) PA11 – SW1 Don't care if not used in
BoosterPack connector
J15 Thermistor Power Installed 3V3 OFF to remove power
to thermistor circuitry
J16 UART Path Selection – BP – UART TX- XDS (1) short to (2) PA8 – XDS OFF to disconnect pin
J17 UART Path Selection – BP – UART RX- XDS (1) short to (2) PA9 – XDS OFF to disconnect pin
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2.2 Block Diagram
LED
Red,Green
Debug
MCU
Reset
Button
Micro-B
USB
ESD
Protection
Target device
MSPM0L1306
40-Pin
LaunchPad
Standard
headers
Light sensor
Power, UART, SWD to
Target
Energy
Trace
Technology
Thermistor RGB LED
User Interface:
Buttons and Red
LED
External
Debug,
Out
External
Debug, In
Figure 2-2. Block Diagram
2.3 Hardware Features
2.3.1 MSPM0L1306 MCU
The MSPM0L1306 device provides up to 64KB embedded flash program memory with up to 4KB SRAM.
They incorporate a high speed on-chip oscillator with an accuracy of ±1%, eliminating the need for an
external crystal. Additional features include a 3-channel DMA, 16 and 32-bit CRC accelerator, and a variety
of high-performance analog peripherals such as one 12-bit 1MSPS ADC with configurable internal voltage
reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover op-amps with
programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These devices also
offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer,
and a variety of communication peripherals including two UARTs, one SPI, and two I2C. These communication
peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus. Device
feature include:
• 1.62 V to 3.6 V operation
• Arm 32-bit Cortex-M0+, up to 32 MHz
• 64KB of flash and 4KB SRAM
• 12-bit 1-Msps ADC
• Two zero-drift, zero-crossover chopper op-amps
• Four 16-bit general purpose timers
• Internal 4- to 32-MHz oscillator with ±1% accuracy (SYSOSC)
• 28 GPIOs
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VQFN32
Thermal pad
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25
PA20 / SWCLK / A6
PA19 / SWDIO
PA18 / A7
PA17
PA16 / A8
PA15 / A9
PA14
PA13
PA0
PA1
NRST
VDD
VSS
PA2 / ROSC
PA3
PA4
PA5 PA6 PA7 PA8 PA9
PA10 PA11 PA12
VCORE PA27 / A0 PA26 / A1 PA25 / A2 PA24 / A3 PA23 / VREF+ PA22 / A4 PA21 / A5 / VREF-
Figure 2-3. 32-Pin RHB (VQFN) (Top View)
2.3.2 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
To keep development easy and cost effective, the TI LaunchPad development kits integrate an onboard debug
probe, which eliminates the need for expensive programmers. The MSPM0L1306 has the XDS110 debug probe
(see Figure 2-4), which is a simple and low-cost debugger that supports all MSPM0 device derivatives.
Figure 2-4. LP-MSPM0L1306 Debugger
The XDS110-ET provides a "backchannel" UART-over-USB connection with the host, which can be very useful
during debugging and for easy communication with a PC. More details can be found in Section 2.3.4.
The XDS110-ET also includes EnergyTrace Technology that allows a user to quickly estimate the power
consumption of their application. Accurate EnergyTrace measurements can only be taken if the XDS110-ET
is the sole provider of power to the target device. Measurements include all power drawn from the portion of the
board below the isolation block. See Section 2.6 for more information around current measurements.
2.3.3 Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the
XDS110-ET domain into the MSPM0L1306 target domain. This includes XDS110-ET SWD signals, application
UART signals, and 3.3-V and 5-V power.
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LDO
MSPM0L1306
Target MCU
BoosterPack Header BoosterPack Header
USB
IN OUT
USB Connector
XDS110-ETMSPM0L1306 Target
XDS110-ET
Debug Probe
MCU
XDS110
Debug Out
External
Debug In
SWD + BSL
Application UART
UART0
3.3-V
Power
5-V Power
J101
Isolation
EnergyTrace
Figure 2-5. Debug Probe Connection
Table 2-2. Isolation Block Jumpers
Jumper Description
GND Ground
5V 5-V VBUS from USB
3V3 3.3-V rail, derived from VBUS in the XDS110-ET domain
RXD<< Backchannel UART: The target MSPM0L1306 receives data through this signal. The arrows indicate the direction of the
signal.
TXD>> Backchannel UART: The target MSPM0L1306 sends data through this signal. The arrows indicate the direction of the
signal.
NRST RST signal
SWDIO Serial wire debug: SWDIO data signal.
SWCLK Serial wire debug: SWDCLK clock signal
BSL Bootstrap Loader signal
Reasons to open these connections:
• To remove any and all influence from the XDS110-ET debug probe for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the XDS110-ET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART communication
• To expose the programming and UART interface of the XDS110-ET so that it can be used for devices other
than the onboard MCU.
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2.3.4 Application (or "Backchannel") UART
The backchannel UART allows communication with the USB host that is not part of the target application’s
main functionality. This is very useful during development, and also provides a communication channel to the
PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the PC that
communicate with the LaunchPad development kit.
Figure 2-6 shows the pathway of the backchannel UART. The backchannel UART is connected to UART0 (PA8,
PA9) deepening on the jumper settings on headers J16 and J17.
On the host side, a virtual COM port for the application backchannel UART is generated when the LaunchPad
development kit enumerates on the host. You can use any PC application that interfaces with COM ports,
including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the target
application. You need to identify the COM port for the backchannel. On Windows PCs, Device Manager can
assist.
Figure 2-6. Application Backchannel UART in Device Manager
The backchannel UART is the "XDS110 Class Application/User UART" port. In this case, Figure 2-6 shows
COM14, but this port can vary from one host PC to the next. After you identify the correct COM port, configure it
in your host application according to its documentation. You can then open the port and begin communication to
it from the host.
On the target MSPM0L1306 side, the backchannel is connected to the UART0 module. The XDS110-ET has a
configurable baud rate; therefore, it is important that the PC application configures the baud rate to be the same
as what is configured on the UART0.
2.3.5 Using an External Debug Probe Instead of the Onboard XDS110-ET
Many users have a specific external debug probe that they prefer to use, and may wish to bypass the XDS110-
ET debug probe to program the MSPM0 target MCU. This is enabled by jumpers on isolation block J101, and
the connector J103. Using an external debug probe is simple, and full JTAG access is provided through J103.
1. Remove jumpers on the JTAG signals on the J101 isolation block, including NRST, SWDIO and SWCLK.
2. Plug any Arm debug probe into J103
3. J103 follows the Arm Cortex Debug Connector standard outlined in Cortex-M Debug Connectors.
4. Plug USB power into the LaunchPad development kit, or power it externally.
5. Ensure that the jumpers across 3V3 and GND are connected if using USB power.
6. External debug probes do not provide power, the VCC pin is a power sense pin.
7. For more details on powering the LaunchPad development kit, see Section 2.4.
2.3.6 Using the XDS110-ET Debug Probe With a Different Target
The XDS110-ET debug probe on the LaunchPad development kit can interface to most Arm Cortex-M devices,
not just the onboard target MSPM0L1306 device. This functionality is enabled by the J102 10-pin Cortex-M
JTAG connector and a 10-pin cable. Header J102 follows the Cortex-M Arm standard, however, pin 1 is not
a voltage sense pin. The XDS110-ET outputs only 3.3-V JTAG signals. If another voltage level is needed, the
user must provide level shifters to translate the JTAG signal voltages. Additionally, 3.3 V of output power can be
sourced from the XDS110-ET when jumper J102 is connected. This allows the XDS110-ET to power the external
target at 3.3 V through pin 1. EnergyTrace technology is not supported on this interface.
1. Remove jumpers on the JTAG signals on the J101 isolation block, including RST, TMS, TCK, TDO, and TDI.
2. Plug the 10-pin cable into J102, and connect to an external target. a. J102 follows the Arm Cortex Debug
Connector standard outlined in Cortex-M Debug Connectors.
3. Plug USB power into the LaunchPad development kit, or power it externally. JTAG levels are 3.3 V ONLY.
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2.3.7 Special Features
2.3.7.1 Thermistor
The LaunchPad kit includes a 10k linear thermistor (PTC) – TMP6131. User can find the circuit in Figure
2-7. The PTC is in a low-side configuration with a 10-kΩ 10-ppm pullup resistor. Default position of jumper
in header indicated (1-2 position) connects this circuit directly to the ADC. In this mode, the output voltage is
approximately 1.6 V at room temperature. See Section 3 for code examples. See Table 2-1 for device-specific
module connections.
The jumper can also be set to the 2-3 position to allow an OPA connection to the thermistor. The OPA output
can be connected internally, using software, to the negative OPA terminal. This allows the OPA to be used as a
buffer for the thermistor with an internal connection to an ADC channel for sampling. If an external connection or
additional biasing or filtering is wanted, then the passives identified in Figure 2-7 need to be populated.
Note
The capacitor and resistor network associated with OPA is not populated by default. This allows the
user to populate with their own passive values to fit their application needs.
Note
When using OPA and its passive network, be sure to check for conflicts with other pins on the
LaunchPad EVM as pins are multiplexed with several functions.
Figure 2-7. Thermistor Circuit
2.3.7.2 Light Sensor
A light sensor circuit is provided on the EVM by using the photodiode in configuration shown in Figure 2-8. The
jumper connections between this circuit and the MSPM0 are populated by default so the photodiode is in circuit.
The jumpers can be removed to place the photodiode out of circuit so the MSPM0 connections can be used for
other evaluation purposes.
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Figure 2-8. Light Sensor Circuit
This circuit is intended to be used with the internal OPA of the MSPM0 in an transimpedance configuration
to drive the circuit. The OPA output is internally set to an ADC channel for sampling. See Table 2-1 for
device-specific module connections and Section 3 for example code.
2.4 Power
The board accommodates various powering methods, including through the onboard XDS110-ET as well as
external or BoosterPack plug-in module power.
2.4.1 XDS110-ET USB Power
The most common power-supply scenario is from USB through the XDS110-ET debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for XDS110-ET operation and 3.3 V to the target
side of the LaunchPad development kit. Power from the XDS110-ET is controlled by jumper J101. For 3.3 V,
make sure that a jumper is connected across the J101 3V3 terminal.
2.5 External Power Supply and BoosterPack Plug-in Module
Header J7 is present on the board to supply external power directly. It is important to comply with the device
voltage operation specifications when supplying external power. The MSPM0L1306 has an operating range of
1.62 V to 3.6 V. More information can be found in the MSPM0L1306 data sheet.
2.6 Measure Current Draw of the MSPM0 MCU
To measure the current draw of the MSPM0L1306 MCU using a multimeter, use the 3V3 jumper on the J101
jumper isolation block. The current measured includes the target device, launchpad circuits, and any current
drawn through the BoosterPack plug-in module headers.
To measure ultra-low power, follow these steps:
1. Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper.
2. Consider the effect that the backchannel UART and any circuitry attached to the MSPM0L1306 may have on
the current draw. Consider disconnecting these at the isolation jumper block, or at least considertheir current
sinking and sourcing capability in the final measurement.
3. Make sure there are no floating inputs/outputs (I/Os) on the MSPM0L1306. This causes unnecessary extra
current draw. Every I/O should either be driven out or, if it is an input, should be pulled or driven to a high or
low level
4. Begin target execution.
5. For the most accurate current measurements, place the device in “Free Run” mode and disconnect
programming signals between the MSPM0L1306 and the debug portion of the board (header J101).
6. Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
7. stable measurement. It is easier to measure quiescent states.
8. Note that the thermistor circuitry on revision E1 of this board cannot be completely unpowered, and will
provide additional current to your measurements unless the thermistor is unpopulated.
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EnergyTrace technology can also be used to compare various current profiles and better optimize your energy
performance!
2.7 Clocking
The internal SYSOSC is 32 MHz as default at the accuracy of 2.5%. To achieve higher accuracy, a 0.1%
100-kΩ resistor is connected to the ROSC pin, PA2. If higher accuracy is not needed, then resistor R6 can be
depopulated, and pin PA2 used for its other functions. The MCLK is sourced by 32-MHz SYSOSC at default.
CPUCLK is sourced directly from MCLK in RUN mode and disabled in other modes. The low-power clock
(ULPCLK) can be sourced by MCLK and active in RUN and SLEEP mode by configuration. For more clock
tree details see Section 2.3 Clock Module (CKM) of the MSPM0 L-Series 32-MHz Microcontrollers Technical
Reference Manual.
2.8 BoosterPack Plug-in Module Pinout
The LaunchPad development kit adheres to the 40-pin LaunchPad development kit pinout standard, where
pins are available. A standard was created to aid compatibility between LaunchPad development kits and
BoosterPack plug-in modules across the TI ecosystem.
While most BoosterPack plug-in modules are compliant with the standard, some are not. The MSPM0L1306
LaunchPad development kit is not compatible with all 40-pin BoosterPack plug-in modules due to the fact
that the MSPM0L1306 device does not have enough pins to fill the standard. If the reseller or owner of
the BoosterPack plug-in module does not explicitly indicate compatibility with the MSPM0L1306 LaunchPad
development kit, compare the schematic of the candidate BoosterPack plug-in module with the LaunchPad
development kit to ensure compatibility. Keep in mind that sometimes conflicts can be resolved by changing the
MSPM0L1306 device pin function configuration in software.
LP-MSPM0L1306
1
3
4
5
7
8
9
10
20
19
18
17
16
15
14
13
12
11
3V3
PA25
PA24
ADC0.
2
UART TXD
SPI_CLK
I2C_SCL
I2C_SDA
GND
NRST
21
22
23
24
25
26
27
28
29
30
40
39
38
37
36
35
34
33
32
31
5V
GND
2
6
UART_RX PA9
PA8
PA21
ADC0.
5
PA6
PA1
PA0
PA15
ADC0.9
PA16
ADC0.8/OPA1_OUT
PA17
OPA1_IN0-
PA18
ADC0_7/
OPA1_IN0+ NA*
NA*
PA27
PA7 SPI_CS
PA5 SPI_PICO
PA4 SPI_POCI
PA20
PA23
PA12
PA13
PA26
PA10
PA11+
NA*
NA*
NA*
NA*
*These pins are not connected to the LaunchPad kit connector by default.
PA22
NA*
PA3
PA11+
NA*
PA19
PWM
PWM
PWM
PWM
PWM
PWM
Timer Capture
Timer
Capture
+ Connection to LaunchPad kit connector is determined by header J14
SPI_CS
SPI_CS
Figure 2-9. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout
2.9 Design Files
Schematics can be found in Section 5. All design files including schematics, layout, bill of materials (BOM),
Gerber files, and documentation are available on the LP-MSPM0L1306 Design File download page.
3 Software Examples
See the MSPM0 SDK documentation for more details about available software.
4 Resources
4.1 Integrated Development Environments
Although the source files can be viewed with any text editor, more can be done with the projects if they’re
opened with a development environment like Code Composer Studio IDE (CCS), IAR Embedded Workbench
IDE, or KIEL IDE.
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4.1.1 TI Cloud Development Tools
TI’s Cloud-based software development tools provide instant access to MSPM0 SDK content and a web-based
IDE.
4.1.2 TI Resource Explorer Cloud
TI Resource Explorer Cloud provides a web interface for browsing examples, libraries, and documentation
found in MSPM0SDK without having to download files to your local drive. Visit TI Resource Explorer Cloud at
dev.ti.com.
4.1.3 Code Composer Studio Cloud
Code Composer Studio Cloud (CCS Cloud) is a web-based IDE that enables you to quickly create, edit, build,
and debug applications for your LaunchPad development kit. No need to download and install large software
packages, simply connect your LaunchPad development kit and begin. You can choose to select from a large
variety of examples in MSPM0SDK software or develop your own application. CCS Cloud supports debug
features such as execution control, breakpoints, and viewing variables.
For more information, see the full comparison between CCS Cloud and CCS Desktop.
Visit Code Composer Studio Cloud at dev.ti.com
4.1.4 Code Composer Studio IDE
Code Composer Studio Desktop is a professional integrated development environment that supports the TI
Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to
develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project
build environment, debugger, profiler, and many other features.
Learn more about CCS and download it at http://www.ti.com/tool/ccstudio. Access the MSPM0 SDK and
MSPM0L1306 code examples by using TI Resource Explorer within CCS.
4.2 MSPM0 SDK and TI Resource Explorer
TI Resource Explorer is a tool integrated into CCS that allows you to browse through available design resources.
TI Resource Explorer will help you quickly find what you need inside packages. TI Resource Explorer is well
organized to find everything that you need quickly, and you can import software projects into your workspace in
one click!
TI Resource Explorer Cloud is one of the TI Cloud Development tools, and is tightly integrated with CCS Cloud
to deliver the best cloud based IDE experience.
4.3 MSPM0L1306 MCU
4.3.1 Device Documentation
At some point, you will want more information about the MSPM0L1306 device. For every MSP device, the
documentation is organized as shown in Table 4-1.
Table 4-1. Device Documentation
Document For MSPM0L1306 Description
Device family
TRM
MSPM0 L-Series 32-MHz Microcontrollers Technical
Reference Manual
Architectural information about the device, including all
modules and peripherals such as clocks, timers, ADC, and
so on
Device-specific
data sheet
MSPM0L134x, MSPM0L130x Mixed-Signal
Microcontrollers
MSPM0L110x Mixed-Signal Microcontrollers
Device-specific information and all parametric information
for this device
4.3.2 MSPM0L1306 Code Examples
MSPM0_SDK has a set of simple C examples that demonstrate how to use the entire set of peripherals on the
MSPM0L1306 MCU. Every MSP derivative has a set of these code examples. When starting a new project or
adding a new peripheral, these examples serve as a great starting point.
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4.4 Community Resources
4.4.1 TI E2E Forums
Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the community!
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