Themis RES-32XR3/FIO User manual

User Manual
User Manual
RES-32XR3/FIO
RES-32XR3/FIO
Installation
Manual
Installation
Manual
3RU 19” Rack-Mount Rugged Enterprise Server
with X8DAH+-F Motherboard Configuration
/ Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
Front I/O Chassis
Front I/O Chassis

Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-32XR3/FIO - Front I/O
RES-32XR3/FIO - Front I/O
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-32XR3/FIO - Front I/O
RES-32XR3/FIO - Front I/O
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-32XR3/FIO - Front I/O
RES-32XR3/FIO - Front I/O
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-32XR3/FIO - Front I/O
RES-32XR3/FIO - Front I/O
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-32XR3/FIO - Front I/O
RES-32XR3/FIO - Front I/O
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-32XR3/FIO - Front I/O
RES-32XR3/FIO - Front I/O
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-32XR3/FIO - Front I/O
RES-32XR3/FIO - Front I/O
Two Quad-Core 5500 or Quad/Six-Core 5600 Xeon CPUs
RES-32XR3/FIO - Front I/O
RES-32XR3/FIO - Front I/O

Themis Computer—Rest of World
5 Rue Irene Joliot-Curie
38320 Eybens, France
Phone [phone]
Fax [phone]
Themis Computer—Americas and Pacific Rim
47200 Bayside Parkway
Fremont, CA 94538
Phone [phone]
Fax [phone]
World Wide Web http://www.themis.com
RES-32XR3/FIOInstallation
Manual*
Version 1.0—July2010
* SuperMicro Motherboard X8DAH+-F

Copyright © 2010 Themis Computer, Inc.
ALL RIGHTS RESERVED. No part of this publication may be reproduced in any form, by
photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without
the prior written permission of Themis Computer.
The information in this publication has been carefully checked and is believed to be accurate. However,
Themis Computer assumes no responsibility for inaccuracies. Themis Computer retains the right to
make changes to this publication at any time without prior notice. Themis Computer does not assume
any liability arising from the application or use of this publication or the product(s) described herein.
RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government
is subject to the restrictions set forth in DFARS 252.227-7013 (c)(1)(ii) and FAR 52.227-19.
TRADEMARKS and SERVICEMARKS
Themis®is a registered trademark of Themis Computer, Inc.
Intel® is a registered trademark of Intel Corporation.
Xeon™is a trademark of Intel Corporation.
Red Hat®is a registered trademark of Red Hat, Inc.
Linux®is a registered trademark of Linus Torvalds.
All other trademarks, servicemarks, or registered trademarks used in this publication are the property of
their respective owners.
CE Marking
This product complies with the European EMC Directive (2004/108/EC) and the European Low Voltage
Safety Directive (2006/95/EC)/.
Safety Precautions
Instructions regarding safety precautions during installation, operation, or maintenance of the equipment
are given in the section entitled “Safety Instructions” on page iv.
WARNINGS and CAUTIONS
The definitions of WARNINGS and CAUTIONS as used in this document are given in the Preface in
the section entitled “Notes, Cautions, Warnings, and Sidebars”.
RES-32XR3/FIO Installation Manual, Version 1.0
July 2010
Part Number: 117611-024
Themis Customer Support
North America, South America, and Pacific Rim
Telephone: [phone]
Fax: [phone]
E-mail: [e-mail]
Web Site: http://www.themis.com

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RES-32XR3/FIO Installation Manual
VersionRevisionHistory
Version 1.0..............................................................................................July 2010

iv Themis Computer
RES-32XR3/FIO Installation Manual
Safety Instructions
To maximize user safety and ensure correct device operation, all instructions con-
tained in this section should be read carefully.
• The device must be used in accordance with the instructions for use.
• Electrical installations in the room must correspond to the requirements of
respective regulations.
• Take care that there are no cables, particularly mains cables, in areas where
persons can trip over them.
• Do not use a mains connection in sockets shared by a number of other power
consumers. Do not use an extension cable.
• Only use the mains cable supplied.
• The unit is completely disconnected from the power source only when the
power cord is disconnected from the power source. Therefore the power cord
and its connectors must always remain easily accessible.
• Do not set up the device in the proximity of heat sources or in a damp location.
Make sure the device has adequate ventilation.
• All connection cables must be screwed or locked to the chassis housing.
• The device is designed to be used in horizontal position only.
• The device is no longer safe to operate when
— the device has visible damage or
— the device no longer functions.
• In these cases, the device must be shut down and secured against unintentional
operation.
• Repairs may only be carried out by a person authorized by Themis Computer.
• The device may only be opened for the installation and removal of extension
(PCI) cards, memory modules, storage drives, fan housings, power supplies,
Caution: It is important that the user observe all warnings and instructions
that are on the device and contained in this manual.

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RES-32XR3/FIO Installation Manual
and the lithium battery—all in accordance with the instructions given in this
manual.
• If extensions are made to the device, the legal stipulations and the device spec-
ifications must be observed.
• The device must be switched off when removing the top cover; for example,
before installing extension (PCI) cards.
Operation of Laser Source Devices
DVD/CD-ROM drives contain laser light-emitting diodes (classified in accordance
with IEC 825-1:1993: LASER CLASS 1) and, therefore, must not be opened.
If the enclosure of such a drive is opened, invisible laser radiation is emitted. Do
not allow yourself to be exposed to this radiation.
The laser system meets the code of Federal Regulations 21 CFR,1040 for the USA
and Canadian Radiation Emitting Devices Act, REDR C 1370.
Electrostatic Discharge (ESD)
A sudden discharge of electrostatic electricity can destroy static-sensitive devices
or micro-circuitry. Proper packaging and grounding techniques are necessary pre-
cautions to prevent damage. Always take the following precautions:
1. Transport boards in static-safe containers such as boxes or bags.
2. Keep electrostatic-sensitive parts in their containers until they arrive at static-
free stations.
3. Always be properly grounded when touching a sensitive board, component, or
assembly.
4. Store electrostatic-sensitive boards in protective packaging or on conductive
foam.
Grounding Methods
Guard against electrostatic damage at workstations by following these steps:
1. Cover workstations with approved anti-static material. Provide a wrist strap
connected to a work surface and properly grounded tools and equipment.

vi Themis Computer
RES-32XR3/FIO Installation Manual
2. Use anti-static mats, heel straps, or air ionizers to give added protection.
3. Handle electrostatic-sensitive components, boards, and assemblies by the case
or the PCB edge.
4. Avoid contact with pins, leads, or circuitry.
5. Turn off power and input signals before inserting and removing connectors or
test equipment.
6. Keep the work area free of non-conductive materials such as ordinary plastic as-
sembly aids and Styrofoam.
7. Use field service tools, such as cutters, screwdrivers, and vacuums that are con-
ductive.
8. Always place drives and boards PCB-assembly-side down on the foam.
Instructions for the Lithium Battery
Systems are equipped with a lithium battery installed on the motherboard. To
replace this battery, please observe the instructions that are described in this man-
ual.
Warning: There is a danger of explosion when the wrong type of battery is used
as a replacement.

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Themis Computer
Table of Contents
Table of Contents
.Preface............................................................................................................................ xix
1. Overview and Specifications ........................................................................................ 1-1
1.1 Overview ................................................................................................................ 1-1
1.2 System LEDs and I/O Connectors ......................................................................... 1-5
1.3 Chipset Overview ................................................................................................ 1-10
1.3.1 Features of the 5500/5600 Processor and the 5520 Chipset .................... 1-10
1.4 Special Features ................................................................................................... 1-11
1.4.1 Recovery from AC Power Loss ............................................................... 1-11
1.5 PC Health Monitoring .......................................................................................... 1-11
1.5.1 Fan Status Monitor with Firmware Control ............................................. 1-11
1.5.2 Environmental Temperature Control ....................................................... 1-11
1.5.3 CPU Fan Auto-Off in Sleep Mode .......................................................... 1-12
1.5.4 System Resource Alert ............................................................................. 1-12
1.6 ACPI Features ...................................................................................................... 1-12
1.6.1 Slow Blinking LED for Suspend-State Indicator .................................... 1-13
1.6.2 Main Switch Override Mechanism .......................................................... 1-13
1.7 Power Supply ....................................................................................................... 1-13
1.8 Super I/O .............................................................................................................. 1-14
1.9 Overview of the Winbond WPCM450 Controller ............................................... 1-14
1.10 Specifications ....................................................................................................... 1-15
1.10.1 General ..................................................................................................... 1-15
1.10.2 Electrical .................................................................................................. 1-16
1.10.2.1 System Power ........................................................................... 1-16
1.10.2.2 Output Voltage .......................................................................... 1-17
1.10.3 Environmental .......................................................................................... 1-17
1.10.3.1 Shock ........................................................................................ 1-17
1.10.3.2 Electrostatic Discharge ............................................................. 1-17
1.11 Packaging and Shipping ....................................................................................... 1-18
1.11.1 Accessory Kit ........................................................................................... 1-18
1.11.2 Rack-Mount Slides (Optional) ................................................................. 1-19
2. Installation and Operation ........................................................................................... 2-1

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RES-32XR3/FIO Installation Manual
2.1 Installation Procedures ........................................................................................... 2-1
2.1.1 Remove Protective Top Cover ................................................................... 2-1
2.1.2 Memory Modules ....................................................................................... 2-3
2.1.2.1 Installation .................................................................................. 2-4
2.1.3 PCI Cards ................................................................................................... 2-7
2.1.3.1 Installing Cards ........................................................................... 2-7
2.1.4 Lithium Battery .......................................................................................... 2-8
2.1.4.1 Removing the Lithium Battery ................................................... 2-8
2.1.4.2 Installing a Lithium Battery ........................................................ 2-9
2.1.5 SATA Storage Drive .................................................................................. 2-9
2.1.5.1 Storage Drive Removal ............................................................... 2-9
2.1.5.2 Storage Drive Installation .........................................................2-10
2.1.6 Removable 120-mm Fan .......................................................................... 2-11
2.1.6.1 Removing and Installing a 120-mm Fan ................................... 2-11
2.1.7 Power Supply ........................................................................................... 2-12
2.1.7.1 Removing a Power Supply ....................................................... 2-12
2.1.7.2 Installing a Power Supply ......................................................... 2-13
2.2 Rack Mounts ........................................................................................................ 2-14
2.2.1 Mounting Brackets ................................................................................... 2-14
2.2.2 Rack-Mount Slides (Optional) ................................................................. 2-15
2.3 Operation ............................................................................................................. 2-15
2.3.1 Plugging in the AC Power Cords ............................................................. 2-15
2.3.2 Getting Started ......................................................................................... 2-16
2.3.2.1 Configuration ............................................................................ 2-16
2.3.2.2 Turning The System On ............................................................ 2-16
2.3.2.3 Linux Installation ...................................................................... 2-16
2.3.3 Turning the System Off ........................................................................... 2-17
3. BIOS Setup Utility ........................................................................................................ 3-1
3.1 Introduction ............................................................................................................ 3-1
3.1.1 Starting BIOS Setup Utility ....................................................................... 3-1
3.1.2 How To Change the Configuration Data ................................................... 3-2
3.1.3 Starting the Setup Utility ........................................................................... 3-2
3.2 Main Setup ............................................................................................................. 3-3
3.2.1 System Time/System Date ......................................................................... 3-3
3.2.2 Supermicro X8DAH .................................................................................. 3-4
3.2.3 Processor .................................................................................................... 3-4