TQ TQMa 4XxL Series User manual

TQMaX4XxL
Preliminary User's Manual
TQMaX4XxL UM 0002
02.12.2022

Preliminary Preliminary User's Manual l TQMaX4XxL UM 0002 l © 2022, TQ-Systems GmbH Page i
TABLE OF CONTENTS
1. ABOUT THIS MANUAL ......................................................................................................................................................................1
1.1 Copyright and license expenses...................................................................................................................................................1
1.2 Registered trademarks.....................................................................................................................................................................1
1.3 Disclaimer .............................................................................................................................................................................................1
1.4 Imprint ...................................................................................................................................................................................................1
1.5 Tips on safety.......................................................................................................................................................................................2
1.6 Symbols and typographic conventions.....................................................................................................................................2
1.7 Handling and ESD tips......................................................................................................................................................................2
1.8 Naming of signals ..............................................................................................................................................................................3
1.9 Further applicable documents / presumed knowledge......................................................................................................3
2. BRIEF DESCRIPTION...........................................................................................................................................................................4
3. ELECTRONICS.......................................................................................................................................................................................6
3.1 System overview ................................................................................................................................................................................6
3.1.1 System architecture / block diagram..........................................................................................................................................6
3.1.2 Functionality........................................................................................................................................................................................6
3.1.3 Pin multiplexing .................................................................................................................................................................................7
3.2 System components.........................................................................................................................................................................7
3.2.1 Processor derivatives........................................................................................................................................................................7
3.2.2 Booting ..................................................................................................................................................................................................9
3.2.2.1 Boot source ..........................................................................................................................................................................................9
3.2.2.2 Boot device eMMc ..........................................................................................................................................................................10
3.2.2.3 Boot device NOR-flash ..................................................................................................................................................................10
3.2.3 Memory ..............................................................................................................................................................................................11
3.2.3.1 LPDDR4 SDRAM...............................................................................................................................................................................11
3.2.3.2 eMMC ..................................................................................................................................................................................................11
3.2.3.3 NOR-Flash ..........................................................................................................................................................................................12
3.2.3.4 EEPROMs ............................................................................................................................................................................................12
3.2.4 Clock supply......................................................................................................................................................................................12
3.2.5 RTC .......................................................................................................................................................................................................13
3.2.6 Secure Element................................................................................................................................................................................14
3.2.7 Temperature sensor.......................................................................................................................................................................14
3.2.8 Interfaces............................................................................................................................................................................................14
3.2.8.1 Ethernet switch................................................................................................................................................................................14
3.2.8.2 PRU_ICSSG.........................................................................................................................................................................................14
3.2.8.3 GPIO.....................................................................................................................................................................................................15
3.2.8.4 JTAG.....................................................................................................................................................................................................15
3.2.8.5 SerDes .................................................................................................................................................................................................15
3.2.8.6 Serial interfaces................................................................................................................................................................................16
3.2.8.7 I2C..........................................................................................................................................................................................................16
3.2.8.8 UART ....................................................................................................................................................................................................17
3.2.8.9 CAN ......................................................................................................................................................................................................17
3.2.8.10 USB.......................................................................................................................................................................................................17
3.2.8.11 EXTINT#...............................................................................................................................................................................................17
3.2.9 Reset ....................................................................................................................................................................................................17
3.2.9.1 Reset Options (Input).....................................................................................................................................................................17
3.2.9.1.1 TQMaX4XxL_HARD_RST# ............................................................................................................................................................17
3.2.9.1.2 MCU_PORz ........................................................................................................................................................................................18
3.2.9.1.3 MCU_RESETz.....................................................................................................................................................................................18
3.2.9.1.4 RESET_REQz ......................................................................................................................................................................................18
3.2.9.2 Reset Status (Output) ....................................................................................................................................................................18
3.2.9.2.1 PORz_OUT .........................................................................................................................................................................................18
3.2.9.2.2 MCU_RESETSTATz...........................................................................................................................................................................18
3.2.9.2.3 RESETSTATz.......................................................................................................................................................................................18
3.2.9.2.4 TQMaX4XxL_PGOOD.....................................................................................................................................................................18
3.2.10 Watchdog ..........................................................................................................................................................................................18
3.2.11 Power supply....................................................................................................................................................................................19
3.2.11.1 Main power supply.........................................................................................................................................................................19
3.2.11.2 Overview TQMaX4XxL supply ....................................................................................................................................................19
3.2.11.3 Power sequenzing..........................................................................................................................................................................20
3.2.11.4 Power modes....................................................................................................................................................................................20
3.2.11.5 Power consumption.......................................................................................................................................................................21

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3.3 TQMaX4XxL interface....................................................................................................................................................................21
3.3.1 Pin assignment ................................................................................................................................................................................21
3.3.2 Pinout TQMaX4XxL ........................................................................................................................................................................22
4. SOFTWARE.........................................................................................................................................................................................28
5. MECHANICS.......................................................................................................................................................................................28
5.1 TQMaX4XxL dimensions and footprint...................................................................................................................................28
5.2 TQMaX4XxL component placement........................................................................................................................................30
5.3 Protection against external effects...........................................................................................................................................30
5.4 Thermal management ..................................................................................................................................................................30
5.5 Structural requirements ...............................................................................................................................................................31
6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS .............................................................................................32
6.1 EMC ......................................................................................................................................................................................................32
6.2 ESD .......................................................................................................................................................................................................32
6.3 Operational safety and personal security ..............................................................................................................................32
6.4 Climatic and operational conditions .......................................................................................................................................32
6.5 Reliability and service life.............................................................................................................................................................32
6.6 Environment protection...............................................................................................................................................................33
6.6.1 RoHS ....................................................................................................................................................................................................33
6.6.2 WEEE®..................................................................................................................................................................................................33
6.7 REACH®...............................................................................................................................................................................................33
6.8 EuP........................................................................................................................................................................................................33
6.9 Battery.................................................................................................................................................................................................33
6.10 Packaging ..........................................................................................................................................................................................33
6.11 Other entries.....................................................................................................................................................................................33
7. APPENDIX ..........................................................................................................................................................................................34
7.1 Acronyms and definitions............................................................................................................................................................34
7.2 References .........................................................................................................................................................................................36

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TABLE DIRECTORY
Table 1: Terms and Conventions...................................................................................................................................................................2
Table 2: AM64x derivatives (Source: Texas Instruments)....................................................................................................................7
Table 3: AM243x derivatives (Source: Texas Instruments)...................................................................................................................8
Table 4: Selecting the General Boot Configuration................................................................................................................................9
Table 5: Boot device selection eMMC ......................................................................................................................................................10
Table 6: Selection of the boot device NOR flash ..................................................................................................................................10
Table 7: eMMC Flash modes........................................................................................................................................................................11
Table 8: NOR-Flash modes ...........................................................................................................................................................................12
Table 9: JTAG signals ......................................................................................................................................................................................15
Table 10: I2C address assignment on the module.................................................................................................................................16
Table 11: Supply voltages ...............................................................................................................................................................................19
Table 12: Current consumption TQMaX4XxL ..........................................................................................................................................21
Table 13: Pinout TQMaX4XxL, top view through TQMaX4XxL......................................................................................................22
Table 14: TQMaX4XxL pad description ......................................................................................................................................................23
Table 15: Labels on TQMaX4XxL...................................................................................................................................................................30
Table 16: Climate and operational conditions industrial temperature range .............................................................................32
Table 17: Acronyms...........................................................................................................................................................................................34
Table 18: Further applicable documents...................................................................................................................................................36

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FIGURE DIRECTORY
Figure 1: Block diagram AM6442....................................................................................................................................................................4
Figure 2: Block diagram AM243x....................................................................................................................................................................5
Figure 3: Block diagram TQMaX4XxL............................................................................................................................................................6
Figure 4: Block diagram Boot-Strapping......................................................................................................................................................9
Figure 5: Block diagram DDR3L SDRAM connection............................................................................................................................11
Figure 6: Block diagram eMMC flash interface .......................................................................................................................................11
Figure 7: Block diagram NOR-Flash.............................................................................................................................................................12
Figure 8: Block diagram clock supply.........................................................................................................................................................12
Figure 9:Block diagram RTC..........................................................................................................................................................................13
Figure 10: Block diagram SEC..........................................................................................................................................................................14
Figure 11: Block diagram JTAG .......................................................................................................................................................................15
Figure 12: Block diagram SerDes....................................................................................................................................................................16
Figure 13: Block diagram I2C bus on the TQMaX4XxL ...........................................................................................................................16
Figure 14: Block diagram Reset.......................................................................................................................................................................17
Figure 15: Block diagram power supply......................................................................................................................................................19
Figure 16: Recommended power up sequence .......................................................................................................................................20
Figure 17: TQMaX4XxL dimensions (1) ........................................................................................................................................................28
Figure 18: TQMaX4XxL dimensions (2) ........................................................................................................................................................28
Figure 19: TQMaX4XxL side view...................................................................................................................................................................29
Figure 20: Recommended PCB land pattern for TQMaX4XxL, top view through TQMaX4XxL...........................................29
Figure 21: TQMaX4XxL component placement top ...............................................................................................................................30
Figure 22: TQMaX4XxL component placement bottom .......................................................................................................................30
REVISION HISTORY
Rev. Date Name Pos. Modification
0001 14.03.2022 M. Kreuzer All Initial release
0002 02.12.2022 M.Kreuzer
2.
6.5
Table 5
Table 6
Table 12
5.1
New hardware rev. 020x
New MTBF values
Table updated
Table updated
Table updated
Mass added

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1. ABOUT THIS MANUAL
1.1 Copyright and license expenses
Copyright protected © 2022 by TQ-Systems GmbH.
This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in
electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective
manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared
separately.
1.2 Registered trademarks
TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original
or license-free graphics and texts.
All brand names and trademarks mentioned in this Preliminary User's Manual, including those protected by a third party, unless
specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the
present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a
third party.
1.3 Disclaimer
TQ-Systems GmbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or
of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-
Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information
given in this Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there
is no proven intentional or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it
without special notification.
Important Notice:
Before using the Starterkit MBaX4XxL or parts of the schematics of the MBaX4XxL, you must evaluate it and determine if it is
suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no
other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except
where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage
arising from the usage of the Starterkit MBaX4XxL or schematics used, regardless of the legal theory asserted.
1.4 Imprint
TQ-Systems GmbH
Gut Delling, Mühlstraße 2
D-82229 Seefeld
Tel: [phone]
Fax: [phone]
E-Mail: Info@TQ-Group
Web: TQ-Group

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1.5 Tips on safety
Improper or incorrect handling of the product can substantially reduce its life span.
1.6 Symbols and typographic conventions
Table 1: Terms and Conventions
Symbol Meaning
This symbol represents the handling of electrostatic-sensitive devices and / or components. These
components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.
A human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and also cause
damage / destruction of the component.
This symbol indicates a possible source of danger. Acting against the procedure described can lead to
possible damage to your health and / or cause damage / destruction of the material used.
This symbol represents important details or aspects for working with TQ-products.
Command
A font with fixed-width is used to denote commands, file names, or menu items.
1.7 Handling and ESD tips
General handling of your TQ-products
The TQ-product may only be used and serviced by certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is: do not touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring beforehand
that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the TQMaX4XxL and be dangerous
to your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you power up the TQMaX4XxL or the Starterkit,
change jumper settings, or connect other devices.

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1.8 Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.
The identification of the individual functions follows the above conventions.
Example: WE2# / OE#
1.9 Further applicable documents / presumed knowledge
•Specifications and manuals of the modules used:
These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).
•Specifications of the components used:
The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.
They contain, if applicable, additional information that must be taken note of for safe and reliable operation.
These documents are stored at TQ-Systems GmbH.
•Chip errata:
It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.
The manufacturer’s advice should be followed.
•Software behaviour:
No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
•General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required to fully comprehend the following contents:
•MBaX4XxL circuit diagram
•MBaX4XxL User's Manual
•Sitara™ AM6442 / AM2434 Data Sheet
•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation
•PTXdist documentation: www.ptxdist.de
•TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:tqmax4xxl

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2. BRIEF DESCRIPTION
The TQMaX4XxL is a universal TQ-LGA mini module based on the TI Sitara family AM64x and AM243x processors with ARM
Cortex A53, Cortex R5 and Cortex M4 cores.
This Preliminary User's Manual describes the hardware of the TQMaX4XxL Rev.020x and refers to some software settings.
It does not replace the AM6442 / AM2434 Reference Manual (3).
Figure 1: Block diagram AM6442
(Source: Texas Instruments)

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Figure 2: Block diagram AM243x
(Source: Texas Instruments)
All useful AM64x / AM243x signals are routed to the TQMaX4XxL pads. There are no restrictions for customers using the
TQMaX4XxL with respect to an integrated customised design.
Please take note of that not all interfaces can be used simultaneously.

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3. ELECTRONICS
The information provided in this User's Manual is only valid in connection with the tailored boot loader,
which is preinstalled on the TQMaX4XxL, and the BSP provided by TQ-Systems GmbH, see also section 4.
3.1 System overview
3.1.1 System architecture / block diagram
Figure 3: Block diagram TQMaX4XxL
3.1.2 Functionality
The following key functions are implemented on the TQMaX4XxL:
•AM64x, AM243x CPU
•16-bit LPDDR4 memory
•1x eMMC NAND-Flash 5.1
•1x QSPI-NOR-Flash (optional)
•Clock supply
•EEPROM (optional)
•Real-Time-Clock (optional)
•Secure Element Chip (optional)
•Temperature sensor + EEPROM
•Supervisor
•Power Supply

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3.1.3 Pin multiplexing
The pin multiplexing of the AM64x / AM243x permits to use many pins for different interfaces.
The information provided in this User's Manual is based on the BSP provided by TQ-Systems GmbH.
Attention: Destruction or malfunction
Many AM64x, AM243x pins can be configured as different function.
Please take note of the information in the AM64x / AM243x data sheets (1) (2) concerning the
configuration of these pins before integration / start-up of your carrier board / Starterkit.
Please also take note of the latest AM64x, AM243x errata (4).
3.2 System components
3.2.1 Processor derivatives
Depending on the TQMaX4XxL version, one of the following AM64x/AM243x derivatives is assembled:
•AM6442 / AM6441 / AM6422 / AM6421 / AM6412 / AM6411
•AM2434 / AM2432 / AM2431
Table 2: AM64x derivatives (Source: Texas Instruments)

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Table 3: AM243x derivatives (Source: Texas Instruments)

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Attention: Malfunction
Please take note of the latest AM64x/AM243x errata (4).
3.2.2 Booting
3.2.2.1 Boot source
The boot source is selected via the boot strapping pins of the AM64x / AM243x. The signals are directly routed to the LGA balls
and will be available again as GPIO after reading the boot configuration.
After the release of MCU_PORz the boot configuration is read in at the BOOTMODE[15:0] pins. Independent of the boot device,
the ROM bootloader is executed first, which assists in reading and executing the application code. The data can be read and
loaded either directly from the memory device or by a peripheral.
The following figure shows the implementation of boot strapping on the module:
Figure 4: Block diagram Boot-Strapping
According to the Reference Manual (3) the general boot configuration at the TQMaX4XxL can be set as follows:
Table 4: Selecting the General Boot Configuration
Boot configuration pin
Setting
TQMaX4XxL
BOOTMODE[15:14]
Reserved, fixed to 0
00
BOOTMODE[13:10]
Select the backup boot mode, if primary boot device failed
Don't care
BOOTMODE[9:3]
See following chapters for boot devices
-
BOOTMODE[2:0]
Ref Clock Select:
000 = 19.2 MHz
001 = 20 MHz
010 = 24 MHz
011 = 25 MHz
100 = 26 MHz
101 = 27 MHz
110 = Reserved
111 = Reserved
011
Attention: Malfunction
All BOOTMODE[15:00] signals must have either a pullup (to V_1V8) or pulldown (to Ground). Undefined
levels can lead to a malfunction during booting.

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3.2.2.2 Boot device eMMc
Table 5: Boot device selection eMMC
Boot configuration pin
Setting
TQMaX4XxL
BOOTMODE[9]
Port: MMCSD Port 0 (8 bit width)
This bit must be set to 0
BOOTMODE[8]
Reserved
BOOTMODE[7]
0 = Filesystem Mode
1 = Raw Mode
BOOTMODE[6:3]
Primary Boot Mode:
0000 = Reserved
0001 = OSPI
0010 = QSPI
0011 = SPI
0100 = Ethernet RGMII
0101 = Ethernet RMII
0110 = I2C
0111 = UART
1000 = MMCSD boot
1001 = eMMC
1010 = USB
1011 = GPMC NAND
1100 = GPMC NOR
1101 = PCIe
1110 = xSPI
1111 = No-boot/Dev boot
1000
3.2.2.3 Boot device NOR-flash
Table 6: Selection of the boot device NOR flash
Boot configuration pin
Setting
TQMaX4XxL
BOOTMODE9
Reserved, fixed to 0
Don't Care
BOOTMODE8
Clock Source:
0 = Iclock source external
1 = Iclock source internal (pad loopback)
1
BOOTMODE7
Chip-Select:
0 = Boot-Flash is on CS0
1 = Boot-Flash is on CS1
0
BOOTMODE[6:3]
Primary Boot Mode:
0000 = Reserved
0001 = OSPI
0010 = QSPI
0011 = SPI
0100 = Ethernet RGMII
0101 = Ethernet RMII
0110 = I2C
0111 = UART
1000 = MMCSD card
1001 = eMMC
1010 = USB
1011 = GPMC NAND
1100 = GPMC NOR
1101 = PCIe
1110 = xSPI
1111 = No-boot/Dev boot
0011
Further boot configurations can be found in the Reference Manual (3).

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Note: Update
When designing a mainboard, it is recommended to plan a redundant update concept for software
updates in the field. Furthermore, it is recommended to switch the conversion of the boot strap pins to
high impedance after reading in.
3.2.3 Memory
3.2.3.1 LPDDR4 SDRAM
The TQMaX4XxL has an LPDDR4 memory with the use of in-line ECC:
•16-bit bus width with optional ECC (8-bit data + 8-bit ECC)
•Up to 1600 Mbps = 800 MHz
•1 GByte / 2 GByte
Figure 5: Block diagram DDR3L SDRAM connection
3.2.3.2 eMMC
An eMMC is available to the TQMaX4XxL as non-volatile data memory for programs and data (e.g. boot loader, operating
system). The used MMC0 signals are not available to the Pinout.
•MMC0 Interface is connected to the eMMC Flash
•RESETSTATz is used to reset the eMMC
•8 / 16 / 32 / 64 GByte
Figure 6: Block diagram eMMC flash interface
The TQMaX4XxL supports the following transmission modes:
Table 7: eMMC Flash modes
Mode
1-bit
4-bit
8-bit
Note
Default Speed
TBD
TBD
TBD
High Speed
TBD
TBD
TBD
Boot process
HS200
TBD
TBD
TBD
U-boot
HS400
TBD
TBD
TBD
Linux

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3.2.3.3 NOR-Flash
A NOR-Flash on the TQMaX4XxL is available as further non-volatile memory. The used OSPI0 signals are not available to the
pinout.
•OSPI0 Interface is connected to the NOR Flash
•RESETSTATz is used to reset the NOR Flash
•512 / 1024 / 2048 Mbit
Figure 7: Block diagram NOR-Flash
The NOR-Flash variants Quad SPI Flash and Octal SPI Flash are usable. The TQMaX4XxL supports the following transmission
modes:
Table 8: NOR-Flash modes
Mode
Read
Write
Note
Extended SPI (SDR)
TBD
TBD
3.2.3.4 EEPROMs
I2C EEPROMs are provided on the TQMaX4XxL for non-volatile storage. A distinction is made here between:
•Customer data, freely accessible
•TQ manufacturing data ( Serial Number, MAC, ...)
All I²C slave address and bus structure are summarized in chapter 3.2.8.7.
3.2.4 Clock supply
The clock supply of the TQMaX4XxL is represented as follows:
Figure 8: Block diagram clock supply
To get the module executable only with a 5V supply, MCU_OSC0_XO / XI was implemented as clock on the module. The
remaining clock inputs can either be derived from the system clock or fed externally via the LGA balls, as an example the
following clocks can be fed externally:
•SERDES0 Reference Clock

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•External System Clock Inputs
Further information can be obtained from the associated data sheets (1) (2).
3.2.5 RTC
An optional RTC can be equipped on the TQMaX4XxL. The connection is realized as follows:
•The RTC can be supplied from the base board via V_RTC_IN. V_RTC_IN = 2.0 V to 5.5V
•RTC_INT# and RTC_CLKOUT is accessible at the LGA pads.
•RTC_CLKOUT is only activated as soon as the TQMaX4XxL is supplied with V_5V_IN.
•I2C is connected via I2C0 (I²C addresses are described in chapter 3.2.8.7)
Figure 9: Block diagram RTC
Note: Equipping the base board
The RTC is supplied internally by a LDO (1.8V) via V_RTC_IN. This allows the user an easy use of Gold-
Caps or Coin cells on the main board.

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3.2.6 Secure Element
A Secure Element Chip can optionally be fitted on the TQMaX4XxL. The connection can be seen in the following figure:
Figure 10: Block diagram SEC
The SE050C2HQ1/Z01 from NXP is used as the secure element. All I²C addresses are described in chapter 3.2.8.7.
3.2.7 Temperature sensor
A temperature sensor is placed on the TQMaX4XxL to monitor the module temperature.
The over temperature output (TEMP_ALERT) of the sensor is available at the LGA balls as an open drain output.
The I²C addresses are described in chapter 3.2.8.7.
3.2.8 Interfaces
In general, except for the memory connection, all IO pins of the CPU are provided at the LGA pads.
For further information about the interfaces and the pin multiplexing refer to the CPU Reference Manual (3).
3.2.8.1 Ethernet switch
The AM64x / AM243x provides an integrated Ethernet switch (CPSW3G) supporting:
•Up to 2 Ethernet ports
oRMII (10/100)
oRGMII (10/100/1000)
•IEEE 1588 (2008 Annex D, Annex E, Annex F) with 802.1AS PTP
•Clause 45 MDIO PHY management
•Energy efficient Ethernet (802.3az)
CPSW3G MDIO0, CPSW3G RMII1, CPSW3G RMII2, and CPSW3G RGMII1 have one or more signals which can be multiplexed to
more than one pin. Timing requirements and switching characteristics are only valid for specific pin combinations known as
IOSETs. Valid pin combinations or IOSETs for these interfaces are shown in the AM64x / AM243x data sheets (1) (2).
3.2.8.2 PRU_ICSSG
The Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG) of the AM64x / AM243x
provides flexible industrial communications capability including full protocol stacks for EtherCAT slave, PROFINET device,
EtherNet/IP adapter, and IO-Link Master. The PRU-ICSSG further provides capability for gigabit and TSN based protocols. In

Preliminary Preliminary User's Manual l TQMaX4XxL UM 0002 l © 2022, TQ-Systems GmbH Page 15
addition, the PRU-ICSSG also enables additional interfaces in the SoC including sigma delta decimation filters and absolute
encoder interfaces.
The signals of the PRUs are available as multiplexing options at the pads of the TQMaX4XxL. The IO logic of the interface is 1.8 V.
3.2.8.3 GPIO
Besides their interface function, most AM64x / AM243x pins can also be used as GPIOs. Details are to be taken from the AM64x /
AM243x Data Sheet (1) (2).
3.2.8.4 JTAG
The CPU has a JTAG interface that is directly accessible at the LGA pads. The following default configuration is provided on the
TQMaX4XxL:
Figure 11: Block diagram JTAG
The following table shows the signals used by the JTAG interface.
Table 9: JTAG signals
Signal / Multiplexing I/O Power domain Note
TCK
I
VDDSHV_MCU (1,8 V) 4.7 kΩ Pull-up on module
TDI
I
TDO
O
TMS
I
4.7 kΩ Pull-up on module
TRST#
I
4.7 kΩ Pull-up on module
EMU[1:0]
IO
Optional signals, not required for JTAG
3.2.8.5 SerDes
The CPU has a SerDes lane, which can be used either as PCIe or USB3.0. The signals are directly accessible at the LGA pads.
For more information please refer to the Reference Manual (3).