TQ TQMa6ULxL User manual

MBa6ULxL
User's Manual
MBa6ULxL UM 0102
10.01.2022

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page i
TABLE OF CONTENTS
1. ABOUT THIS MANUAL................................................................................................................................................................................1
1.1 Copyright and license expenses.............................................................................................................................................................1
1.2 Registered trademarks...............................................................................................................................................................................1
1.3 Disclaimer......................................................................................................................................................................................................1
1.4 Imprint............................................................................................................................................................................................................1
1.5 Tips on safety................................................................................................................................................................................................2
1.6 Symbols and typographic conventions ...............................................................................................................................................2
1.7 Handling and ESD tips...............................................................................................................................................................................2
1.8 Naming of signals........................................................................................................................................................................................3
1.9 Further applicable documents / presumed knowledge .................................................................................................................3
2. BRIEF DESCRIPTION ....................................................................................................................................................................................3
2.1 System architecture and functionality..................................................................................................................................................4
2.1.1 MBa6ULxL block diagram.........................................................................................................................................................................4
2.1.2 Functionality.................................................................................................................................................................................................4
3. ELECTRONICS................................................................................................................................................................................................5
3.1 MBa6ULxL functional groups ..................................................................................................................................................................5
3.1.1 TQMa6ULxL...................................................................................................................................................................................................5
3.1.2 Boot-Mode configuration.........................................................................................................................................................................6
3.1.3 I2C address mapping ..................................................................................................................................................................................8
3.1.4 Port replicator PCA9554BS signals.........................................................................................................................................................9
3.1.5 Temperature sensor / SPD EEPROM ......................................................................................................................................................9
3.1.6 RTC supply.....................................................................................................................................................................................................9
3.1.7 Reset and Power....................................................................................................................................................................................... 10
3.1.8 Status LED................................................................................................................................................................................................... 10
3.2 Communication interfaces.................................................................................................................................................................... 11
3.2.1 USB 2.0 Hi-Speed Host............................................................................................................................................................................ 11
3.2.2 USB 2.0 Hi-Speed OTG ............................................................................................................................................................................ 12
3.2.3 Ethernet....................................................................................................................................................................................................... 13
3.2.4 CAN............................................................................................................................................................................................................... 14
3.2.5 Display interface....................................................................................................................................................................................... 14
3.2.6 Touch controller ....................................................................................................................................................................................... 15
3.2.7 Backlight control ...................................................................................................................................................................................... 15
3.2.8 Micro SD card connector........................................................................................................................................................................ 16
3.2.9 Mini PCIe and SIM card socket ............................................................................................................................................................. 17
3.2.10 SIM card socket......................................................................................................................................................................................... 19
3.2.11 20-pin headers .......................................................................................................................................................................................... 20
3.3 Diagnostic- and user interfaces ........................................................................................................................................................... 21
3.3.1 Power-On and Reset-button................................................................................................................................................................. 21
3.3.2 CAN termination....................................................................................................................................................................................... 21
3.3.3 Debug interfaces RS-232 / USB ............................................................................................................................................................ 21
3.4 Power supply............................................................................................................................................................................................. 22
3.4.1 Protective circuitry................................................................................................................................................................................... 22
3.4.2 Power consumption................................................................................................................................................................................ 23
3.4.3 Power supply connector........................................................................................................................................................................ 23
4. SOFTWARE.................................................................................................................................................................................................. 24
5. MECHANICS................................................................................................................................................................................................ 25
5.1 Dimensions ................................................................................................................................................................................................ 25
5.2 Thermal management............................................................................................................................................................................ 25
5.3 Assembly..................................................................................................................................................................................................... 26
6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 27
6.1 EMC............................................................................................................................................................................................................... 27
6.2 ESD................................................................................................................................................................................................................ 27
6.3 Operational safety and personal security......................................................................................................................................... 27
7. CLIMATIC AND OPERATIONAL CONDITIONS................................................................................................................................... 27
7.1 Protection against external effects..................................................................................................................................................... 27
7.2 Reliability and service life....................................................................................................................................................................... 27
8. ENVIRONMENT PROTECTION................................................................................................................................................................ 28
8.1 RoHS ............................................................................................................................................................................................................. 28
8.2 WEEE®.......................................................................................................................................................................................................... 28
8.3 REACH®........................................................................................................................................................................................................ 28
8.4 EuP ................................................................................................................................................................................................................ 28

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page ii
8.5 Packaging ................................................................................................................................................................................................... 28
8.6 Batteries ...................................................................................................................................................................................................... 28
8.6.1 General notes ............................................................................................................................................................................................ 28
8.6.2 Lithium batteries ...................................................................................................................................................................................... 28
8.7 Other entries.............................................................................................................................................................................................. 28
9. APPENDIX ................................................................................................................................................................................................... 29
9.1 Acronyms and definitions...................................................................................................................................................................... 29
9.2 References.................................................................................................................................................................................................. 31

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page iii
TABLE DIRECTORY
Table 1: Terms and Conventions ............................................................................................................................................................................2
Table 2: Overview interfaces....................................................................................................................................................................................4
Table 3: Boot-Mode configuration.........................................................................................................................................................................7
Table 4: Boot-Mode configuration DIP switches – S13, S16...........................................................................................................................7
Table 5: I2C4 address assignment..........................................................................................................................................................................8
Table 6: Port replicator PCA9554BS signals.........................................................................................................................................................9
Table 7: RTC supply, components..........................................................................................................................................................................9
Table 8: TQMa6ULxL Reset and power-on signals ......................................................................................................................................... 10
Table 9: Pinout USB Host 1 & 2, stacked USB Type-A – X12......................................................................................................................... 11
Table 10: Pinout USB Host 3, Mini PCIe 1 – X25................................................................................................................................................. 11
Table 11: Pinout USB Host 4, Mini PCIe 2 – X24................................................................................................................................................. 11
Table 12: Characteristics USB .................................................................................................................................................................................. 11
Table 13: Pinout USB-Host OTG – X15.................................................................................................................................................................. 12
Table 14: Characteristics USB 2.0 Hi-Speed OTG............................................................................................................................................... 12
Table 15: Pinout Ethernet 1 – X14, left ................................................................................................................................................................. 13
Table 16: Pinout Ethernet 2 – X14, right .............................................................................................................................................................. 13
Table 17: Pinout CAN1, CAN2 – X1, X2................................................................................................................................................................. 14
Table 18: Pinout LCD interface, X19...................................................................................................................................................................... 15
Table 19: Pinout Micro SD card socket – X13 ..................................................................................................................................................... 16
Table 20: Current load Mini PCIe............................................................................................................................................................................ 17
Table 21: Pinout Mini PCIe – X24, X25; SIM card socket – X12...................................................................................................................... 18
Table 22: Pinout SIM card socket – X12 ............................................................................................................................................................... 19
Table 23: Pinout header 1 – X22............................................................................................................................................................................. 20
Table 24: Pinout header 2 – X23............................................................................................................................................................................. 20
Table 25: Pinout debug USB – X10 ........................................................................................................................................................................ 21
Table 26: Debug interface selection – S16-1 ...................................................................................................................................................... 21
Table 27: Pinout X21 .................................................................................................................................................................................................. 22
Table 28: Software interfaces.................................................................................................................................................................................. 24
Table 29: Labels on MBa6ULxL ............................................................................................................................................................................... 26
Table 30: Climatic and operational conditions MBa6ULxL, extended temperature range.................................................................. 27
Table 31: Acronyms.................................................................................................................................................................................................... 29
Table 32: Further applicable documents............................................................................................................................................................. 31

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page iv
FIGURE DIRECTORY
Figure 1: Block diagram MBa6ULxL.........................................................................................................................................................................4
Figure 2: Block diagram TQMa6ULxL......................................................................................................................................................................5
Figure 3: Block diagram Boot Mode ........................................................................................................................................................................6
Figure 4: Position of Boot-Mode configuration DIP switches – S13, S16.....................................................................................................7
Figure 5: Block diagram I2C busses ..........................................................................................................................................................................8
Figure 6: Reset and Power button – S1, S2......................................................................................................................................................... 10
Figure 7: Block diagram USB Host interfaces..................................................................................................................................................... 11
Figure 8: Block diagram USB 2.0 Hi-Speed OTG................................................................................................................................................ 12
Figure 9: Block diagram Ethernet 100 BASE-T................................................................................................................................................... 13
Figure 10: Block diagram CAN.................................................................................................................................................................................. 14
Figure 11: Block diagram display interface, X19 ................................................................................................................................................. 14
Figure 12: Block diagram Micro SD card socket – X13 ...................................................................................................................................... 16
Figure 13: Block diagram Mini PCIe ........................................................................................................................................................................ 17
Figure 14: Block diagram of Starterkit headers – X22, X23.............................................................................................................................. 20
Figure 15: Block diagram debug interfaces RS-232 / USB................................................................................................................................ 21
Figure 16: Block diagram power supply................................................................................................................................................................ 22
Figure 17: Block diagram input protection........................................................................................................................................................... 22
Figure 18: MBa6ULxL dimensions ........................................................................................................................................................................... 25
Figure 19: MBa6ULxL, component placement top ............................................................................................................................................ 26
Figure 20: MBa6ULxL, component placement bot ............................................................................................................................................ 26
REVISION HISTORY
Rev. Date Name Pos. Modification
0100 06.06.2018 Petz Initial release
0101 26.10.2018 Petz Table 28
9
“Package temperature” replaced with “Case temperature”
Chapter reworked
0102 10.01.2022 Petz
Kreuzer
All
Figure 10, Figure 19, Figure 20
Table 28
Chapter 3.4
Table 27
Non-functional changes, formatting, structure
Link to Yocto documentation added, links updated
“PCIe” corrected to “Mini PCIe”
Updated
Added
Power connector corrected to X21
X21 pin assignment added

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 1
1.
ABOUT THIS MANUAL
1.1
Copyright and license expenses
Copyright protected © 2022 by TQ-Systems GmbH.
This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,
machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to copyrights of the respective manufacturers.
The licence conditions of the respective manufacturer are to be adhered to.
Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared
separately.
1.2
Registered trademarks
TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original
or license-free graphics and texts.
All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified
otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present
registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third
party.
1.3
Disclaimer
TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good
quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems
GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this
User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional
or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without
special notification.
Important Notice:
Before using the Starterkit MBa6ULxL or parts of the schematics of the MBa6ULxL, you must evaluate it and determine if it is
suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no
other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except
where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage
arising from the usage of the Starterkit MBa6ULxL or schematics used, regardless of the legal theory asserted.
1.4
Imprint
TQ-Systems GmbH
Gut Delling, Mühlstraße 2
D-82229 Seefeld
Tel: [phone]
Fax: [phone]
E-Mail: Info@TQ-Group
Web: TQ-Group

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 2
1.5
Tips on safety
Improper or incorrect handling of the MBa6ULxL can substantially reduce its life span.
1.6
Symbols and typographic conventions
Table 1: Terms and Conventions
Symbol Meaning
This symbol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.
A human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and also cause
damage / destruction of the component.
This symbol indicates a possible source of danger. Acting against the procedure described can lead to
possible damage to your health and / or cause damage / destruction of the material used.
This symbol represents important details or aspects for working with the MBa6ULxL.
Command
A font with fixed-width is used to denote commands, file names, or menu items.
1.7
Handling and ESD tips
General handling of the MBa6ULxL:
The MBa6ULxL may only be used and serviced by certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is: do not touch the MBa6ULxL during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring beforehand
that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the MBa6ULxL and be dangerous
to your health.
Improper handling of your MBa6ULxL would render the guarantee invalid.
Proper ESD handling:
The electronic components of the MBa6ULxL are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate the MBa6ULxL
in an ESD-safe environment. Especially when you switch modules on, change jumper settings, or
connect other devices.

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 3
1.8
Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.
The identification of the individual functions follows the above conventions.
Example: WE2# / OE#
1.9
Further applicable documents / presumed knowledge
•
Specifications and manual of the modules used:
These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).
•
Specifications of the components used:
The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of.
They contain, if applicable, additional information that must be taken note of for safe and reliable operation.
These documents are stored at TQ-Systems GmbH.
•
Chip errata:
It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of.
The manufacturer’s advice should be followed.
•
Software behaviour:
No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
•
General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required to fully comprehend the following contents:
•MBa6ULxL circuit diagram
•TQMa6ULxL User's Manual
•IMX6ULRM Reference Manual
•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation
•PTXdist documentation: www.ptxdist.de
•Yocto documentation: www.yoctoproject.org/docs/
•TQ-Support Wiki: Support-Wiki TQMa6ULx
2.
BRIEF DESCRIPTION
This User's Manual describes the hardware of the MBa6ULxL, revision 02xx. The MBa6ULxL is designed as a carrier board for the
LGA version of the TQMa6ULxL. The figures in this User's Manual also refer to the TQMa6ULxL.
In addition the standard interfaces routed to the user’s connectors, more interfaces like CAN, UART, RS-232, GPIO, I2C and SPI
interfaces are routed to headers on the MBa6ULxL. The characteristics of the i.MX6ULx can be evaluated, and therefore the
software development can start immediately.
Currently the MBa6ULxL supports TQMa6ULxL modules with NXP i.MX6UL CPU derivatives MCIMX6G2CVM05AA,
MCIMX6G3CVM05AA and MCIMX6Y2CVM05AB.

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 4
2.1
System architecture and functionality
2.1.1 MBa6ULxL block diagram
CAN
Transceiver
RS-232
Transceiver
CAN
Transceiver
RS-232
Transceiver
10/100 MBit
Ethernet PHY
10/100 MBit
Ethernet PHY
USB HOST 2
(Type-A)
TQMa6ULxL
USB OTG
(Micro USB)
Ethernet 2
(RJ45)
Ethernet 1
(RJ45)
SD card
socket
Mini PCIe 2
20-pin 2.54 mm header
Power-IN
(DC socket)
CSI
I²C
SPI
GPIO
USB 2-0
Hub
USB HOST 1
(Type-A)
CAN 1
(Pin header)
40-pin.
FFC connector
Touch
Controller
CAN 2
(Pin header)
Reset/Power-On
buttons
Boot Mode
(DIP switch)
120 Ω CAN
termination
(DIP switch)
Internal
Supply
USB-OTG 2
RMII 1
RMII 2
CAN1
CAN2
LICELL
USB-OTG 1
I2C4
LCD
Power supply
3.3 V / 5 V
USB Host 4
USB HOST 3
(internal)
Galvanically
isolated
20-pin 2.54 mm header
SDHC
Battery
(CR2032)
Mini PCIe 1 SIM card
socket
USB Host 3
Protective
Ciruitry
MBa6ULxL
USB
Transceiver
USB Debug
(Micro USB)
Analog
Switch
UART3
UART1
RS-232.1 RS-232.2
UART1 FTDI
Figure 1: Block diagram MBa6ULxL
2.1.2 Functionality
Core of the MBa6ULxL is the TQMa6ULxL, which is based on an NXP i.MX6ULx CPU. In addition to the standard communication
interfaces like USB, Ethernet, RS-232, etc. other signals and interfaces are routed to two 20-pin 2.54 mm headers.
The MBa6ULxL provides the following interfaces and functions:
Table 2: Overview interfaces
Connector Interface Type of connector Remark
X1, X2 CAN 2.0B Phoenix contact, MC1.5/3-G-3.5 CAN transceiver, galvanically separated
X10 USB / RS-232 Single USB receptacle Micro-AB RS-232 debug interface (via FTDI as USB)
X12 SIM card SIM card socket –
X13 SD card Micro SD card connector –
X14 Ethernet RJ45 receptacle 10/100BASE-T, double RJ45 with integrated magnetics
X15 USB-OTG Single USB receptacle Micro-AB USB OTG
X16 USB Host Stacked USB receptacle Type-A USB Host 1 / 2
X19 Graphics 40-pin FFC, 0.5 mm Meets EDT platform concept, for displays with PCT or RT
X21 Power Phoenix contact, MC1,5/2-G-3,5 Power supply 6.5 V to 30 V
X22
GPIOs
20-pin header, 2.54 mm pitch
I2C4, SPI2, RS-232.1, RS-232.2, PWM, Ext-Wakeup, 2 x ADC, 3.3 V, 5.0 V
X23 GPIOs 20-pin header, 2.54 mm pitch GPIOS, I2C2, UART6, 3.3 V, 5.0 V
X24 Mini PCIe Mini PCIe connector LoRa (assembly option)
X25
Mini PCIe
Mini PCIe connector
Mini PCIe (only USB), with SIM card socket (assembly option)
G2 Battery SMTU2032 Battery / GoldCap for RTC

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 5
3.
ELECTRONICS
3.1
MBa6ULxL functional groups
3.1.1 TQMa6ULxL
Figure 2: Block diagram TQMa6ULxL
The TQMa6ULxL with the i.MX6ULx CPU is the central system component. It provides DDR3L SDRAM, eMMC, NOR flash and
EEPROM memory. All voltages required by the TQMa6ULxL are derived from the supply voltage. More information is to be taken
from the accompanying User’s Manual of the TQMa6ULxL (7).
The boot behaviour of the TQMa6ULxL can be customised. The required Boot-Mode configuration can be set with DIP switches
on the MBa6ULxL, see chapter 3.1.2.

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 6
3.1.2 Boot-Mode configuration
The TQMa6ULxL can boot from different media:
•eMMC (on TQMa6ULxL)
•QSPI NOR flash
•SD card
The settings of DIP switches S13 and S16 determine, which device is selected to boot from.
TQMa6ULxL
8 ×3-state
buffer
8-fold
DIP switch
Resistor
network
2-fold
DIP switch
8 × 3-state
buffer
8 × 3-state
buffer
8 × BOOT CFG
GPIO
8 × BOOT CFG
8 ×BOOT CFG
2 × BOOT MODE
Figure 3: Block diagram Boot Mode
Attention: Flickering display
During the boot process, the LCD_DATA signals are not separated from the display.
It may therefore be necessary to deactivate the display at system start-up.
This can be implemented by appropriate software adaptation via the Data Enable Input.

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3.1.2 Boot-Mode configuration (continued)
The following tables describe the DIP switch settings for each boot source.
Further settings such as transfer modes and CPU clock are to be taken from the TQMa6ULxL User's Manual (7).
Table 3: Boot-Mode configuration
Boot-Mode S13-2, BOOT_MODE1 S13-1, BOOT_MODE0
Boot from eFuses OFF OFF
Serial Downloader OFF ON
Internal Boot ON OFF
Reserved ON ON
Table 4: Boot-Mode configuration DIP switches – S13, S16
DIP switch eMMC SD card QSPI NOR Serial-Downloader
S13 1 OFF OFF OFF ON
2 ON ON ON OFF
S16
1 X X X X
2 ON OFF X X
3 OFF ON X X
4 ON OFF X X
5 ON ON OFF X
6 ON OFF OFF X
7 OFF OFF ON X
8 OFF ON OFF X
S13 S16
Figure 4: Position of Boot-Mode configuration DIP switches – S13, S16

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3.1.3 I2C address mapping
A port replicator and the I2C touch screen controller can be addressed via I2C4 on the MBa6ULxL.
Table 5 shows the addresses used on the TQMa6ULxL and the MBa6ULxL. The I2C4 bus is also routed to header X22.
The following table shows the address assignment of TQMa6ULxL and MBa6ULxL.
TQMa6ULxL
Header 1 (X22)
PF3000
SCL
SDA
SE97BTP
SCL
SDA
24LC64T
SCL
SDA
DS1339U PCA9554
SCL
SDA
SCL
SDA
I2C4_SCL
I2C4_SDA
I2C2_SCL
I2C2_SDA
3.3 V MBa6ULxL
U11
T11
U8
U7
2.2 kΩ 2.2 kΩ
Header 2 (X23)
Mini PCIe 2 (X24)
Mini PCIe 1 (X25)
18 Bit TFT (X19)
STMPE
811Q
SCL
SDA
Figure 5: Block diagram I2C busses
Table 5: I2C4 address assignment
Component Ref ID 7-bit address Location
Port replicator (PCA9554BS) D20
0x22 / 010 0010b
MBa6ULxL
I2C Touch Screen Controller (STMPE811Q) D9
0x41 / 100 0001b
PMIC (PF3000/3001) –
0x08 / 000 1000b
TQMa6ULxL
Temperature sensor (SE97BTP) –
0x1A / 001 1010b
EEPROM (SE97BTP) Protected Mode (PWP) –
0x32 / 011 0010b
EEPROM (24LC64T-I_MC) –
0x50 / 101 0000b
EEPROM (SE97BTP) Normal Mode (RWP) –
0x52 / 101 0010b
RTC (DS1339U-33) –
0x68 / 110 1000b

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 9
3.1.4 Port replicator PCA9554BS signals
The port replicator PCA9554BS with I2C address 0x22 provides the following signals:
Table 6: Port replicator PCA9554BS signals
I/O port Direction Function Remark
IO0 O ENET1_RST# –
IO1 O ENET2_RST# –
IO2 O BOOT_CFG_EN# –
IO3 O PWR_EN_3V3_DISPLAY Default
I ENET1_INT# Alternative
IO4 O PWR_EN_1V5 Default
I ENET2_INT# Alternative
IO5 O LCD.PWRCTRL –
IO6 O LCD.WAKE –
IO7 O PCIE_1.DIS# Alternative: PCIE_2.DIS#
Attention: I2C4 bus
Attention when using I2C4. Since the PMIC can be addressed via I2C4,
errors on the bus can lead to instabilities of the MBa6ULxL!
3.1.5 Temperature sensor / SPD EEPROM
Since there is already a temperature sensor SE97BTP on the TQMa6ULxL, no temperature sensor is provided on the MBa6ULxL.
3.1.6 RTC supply
The TQMa6ULxL provides a discrete RTC. Another RTC is provided by the i.MX6ULx on the TQMa6ULxL.
Both RTCs are supplied via the LICELL.
A lithium battery type CR2032 with very low self-discharge is provided on the MBa6ULxL as a backup supply for both RTCs.
The increased current consumption must be considered, if the i.MX6ULx RTC is used.
This leads to a fast battery discharge. More information can be found in the User’s Manual of the TQMa6ULxL.
For the RTCs installed on the MBa6ULxL the following applies:
Table 7: RTC supply, components
Parameter Value Temperature range
Coin cell 2.1 V to 3.7 V, typical 3.0 V, 220 mAh –20 °C to +60 °C
Current consumption RTC See TQMa6ULxL User’s Manual Depends on RTC used

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 10
3.1.7 Reset and Power
The MBa6ULxL provides a power and a reset button. Signal RESET_OUT# resets all components on the MBa6ULxL.
The following table shows the signals.
Table 8: TQMa6ULxL Reset and power-on signals
Push button Signal TQMa6ULxL pad Direction Remark
S1 RESET_IN# T14 I 10 kΩ PU to 3.3 V on MBa6ULxL
S2 PMIC_PWRON U16 I 10 kΩ PU to 3.3 V on MBa6ULxL
– RESET_OUT# U15 O Resets all components on MBa6ULxL
TQMa6ULxL
Push button S1
RESET_IN#
Push button S2
PMIC_PWRON
RESET_OUT#
[System]
Figure 6: Reset and Power button – S1, S2
3.1.8 Status LED
The MBa6ULxL provides a status LED. The LED shines green during normal operation and orange during reset.

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 11
3.2
Communication interfaces
3.2.1 USB 2.0 Hi-Speed Host
The MBa6ULxL provides two USB 2.0 Host (double stack USB Type-A) and USB 2.0 Host interfaces at both Mini PCIe connectors.
TQMa6ULxL
Mini PCIe 1 (X25)
Stacked
USB Type-A
(X12)
USB 2.0 Hub
USB H3
USB H1
USB OTG2
Mini PCIe 2 (X24)
USB H4
USB H2
Bot
Top
Figure 7: Block diagram USB Host interfaces
The following tables show the pinout of the connectors used.
Table 9: Pinout USB Host 1 & 2, stacked USB Type-A – X12
Pin Pin name Signal Direction Remark
1A VBUS USB_H1_VBUS P 100 µF to DGND + EMI Filter
2A D– USB_H1_D_N I/O Common Mode Choke in series
3A D+ USB_H1_D_P I/O Common Mode Choke in series
4A DGND DGND P –
1B VBUS USB_H2_VBUS P 100 µF to DGND + EMI Filter
2B D– USB_H2_D_N I/O Common Mode Choke in series
3B D+ USB_H2_D_P I/O Common Mode Choke in series
4B DGND DGND P –
M1 – M4 DGND DGND P –
Table 10: Pinout USB Host 3, Mini PCIe 1 – X25
Pin Pin name Signal Direction Remark
36 D– USB_H3_D_N I/O Common Mode Choke in series
38 D+ USB_H3_D_P I/O Common Mode Choke in series
Table 11: Pinout USB Host 4, Mini PCIe 2 – X24
Pin Pin name Signal Direction Remark
36 D– USB_H4_D_N I/O Common Mode Choke in series
38
D+
USB_H4_D_P
I/O
Common Mode Choke in series
The USB host port of the TQMa6ULxL provides a theoretical data rate of 480 Mbit/s. The data rate is shared amongst the
connected ports. The data rates of the ports can significantly deviate depending on the hardware and software used.
Table 12: Characteristics USB
Parameter Min. Typ. Max. Unit Remark
Voltage 4.75 5 5.25 V –
Current – 500 900 mA –
Read – 15.7 – Mbyte/s USB stick at port 1: 100 Mbyte file, 10 Mbyte block size
Write – 7.4 – Mbyte/s USB stick at port 1: 100 Mbyte file, 10 Mbyte block size

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 12
3.2.2 USB 2.0 Hi-Speed OTG
Both USB-OTG interfaces of the TQMa6ULxL are provided on the MBa6ULxL.
USB-OTG1 is provided at a 5-pin Micro-AB receptacle. USB-OTG2 is connected to the USB hub controller, see 3.2.1.
Both OTG interfaces operate in host mode only.
An OTG or device function is not implemented in software except for the serial downloader.
TQMa6ULxL
USB
Micro AB
(X15)
Power switch
CMC
USB OTG 1
USB OTG 2
PWR
USB HUB
Figure 8: Block diagram USB 2.0 Hi-Speed OTG
The following table shows the pinout of the connector used.
Table 13: Pinout USB-Host OTG – X15
Pin Pin name Signal Direction Remark
1 VBUS USB_OTG2_VBUS P 100 µF to DGND; EMI filter, Imax = 100 mA
2 D– USB_OTG2_D_N I/O Common mode choke in series
3 D+ USB_OTG2_D_P I/O Common mode choke in series
4 ID USB_OTG2.ID I –
5 DGND DGND P –
M1 – M6 DGND DGND P –
The interface can serve as Client or Host. To use this feature, appropriate software support is necessary, however.
The OTG ports of the TQMa6ULxL provide a theoretical data rate of 480 Mbit/s. The data rate can significantly deviate depending
on the hardware and software used.
Table 14: Characteristics USB 2.0 Hi-Speed OTG
Parameter Min. Typ. Max. Unit Remark
Voltage 4.75 5 5.25 V –
Current – 500 900 mA –
Read – 20.4 – Mbyte/s USB 2.0 stick: 100 Mbyte file, 10 Mbyte block size
Write – 8.0 – Mbyte/s USB 2.0 stick: 100 Mbyte file, 10 Mbyte block size

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 13
3.2.3 Ethernet
Both i.MX6ULx MACs are provided on the MBa6ULxL via two SMSC PHYs LAN8720Ai. The PHYs are connected via RMII.
The implementation is shown in the following block diagram.
TQMa6ULxL LAN8720Ai
RMII2
Double
RJ45
(X14)
ENET2.INT#
ENET2.RST#
LAN8720Ai
RMII1
ENET1.INT#
ENET1.RST#
Right
Left
Figure 9: Block diagram Ethernet 100 BASE-T
Both RJ45 jacks contain integrated magnetics and two status LEDs.
The following tables show the pinout of the RJ45 receptacles.
Table 15: Pinout Ethernet 1 – X14, left
Pin Pin name Signal Direction
1 TX+ ETH1_MDI_TX_P I/O
2 TX– ETH1_MDI_TX_N I/O
3 RX+ ETH1_MDI_RX_P I/O
4 – NC –
5 – NC –
6 RX– ETH1_MDI_RX_N I/O
7 – NC –
8 – NC –
Table 16: Pinout Ethernet 2 – X14, right
Pin Pin name Signal Direction
1 TX+ ETH2_MDI_TX_P I/O
2 TX– ETH2_MDI_TX_N I/O
3 RX+ ETH2_MDI_RX_P I/O
4 – NC –
5 – NC –
6 RX– ETH2_MDI_RX_N I/O
7 – NC –
8 – NC –
The possible data throughput is influenced by the system load and the software platform used.

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 14
3.2.4 CAN
The MBa6ULxL provides two CAN interfaces. CAN1 is routed to X1, CAN2 is optionally available at X2.
Both interfaces are galvanically separated. The CAN interfaces are not separated galvanically among themselves.
The CAN signals can be terminated with 120 Ω using DIP switches S15 and S14.
Figure 10: Block diagram CAN
Table 17: Pinout CAN1, CAN2 – X1, X2
Connector Pin Pin name Signal Direction Termination Remark
X1
1 CAN_H CAN2_P I/O S15-2
Assembled2 CAN_L CAN2_N I/O S15-1
3 DGND DGND_CAN P –
X2
1 CAN_H CAN1_P I/O S14-2
Assembly option2 CAN_L CAN1_N I/O S14-1
3 DGND DGND_CAN P –
3.2.5 Display interface
The i.MX6ULx provides an Enhanced LCD interface (eLCDIF), which is routed to X19 on the MBa6ULxL. The eLCDIF consists of
24 data and 5 control signals and supports different video formats like RGB, VSYNC, ITU-R BT.656, or 4:2:2 YCbCr.
The following block diagram shows the display interface:
TQMa6ULxL
40-pin FFC
connector
(X19)
Touch
controller
LCD
I2C4
3-state
buffer
Touch
BOOT_CFG
Figure 11: Block diagram display interface, X19

User's Manual l MBa6ULxL UM 0102 l © 2022, TQ-Systems GmbH Page 15
3.1.2 Boot-Mode configuration (continued)
The following table shows the pinout of connector X19.
Table 18: Pinout LCD interface, X19
Pin Signal TQMa6ULxL LCD channel RGB Remark
1
TOUCH_X–
–
–
–
2
TOUCH_Y–
–
–
Optional I2C4 SDA
3
TOUCH_X+
–
–
–
4
TOUCH_Y+
–
–
Optional I2C4 CLK
5
LED_CTRL
–
–
–
6
TOUCH_INT#
–
–
–
7
VCC3V3
–
–
Backlight VCC
8
VCC3V3
–
–
Backlight VCC
9
GND
–
–
–
10
GND
–
–
–
11
VCC3V3
–
–
Digital VDD
12
LCD_PWR_CTRL
–
–
3.3 V
13
LCD_ENABLE
U2
–
3.3 V
14
LCD_VSYNC
U4
–
3.3 V
15
LCD_HSYNC
U3
–
3.3 V
16
LCD_WAKE
–
–
3.3 V
17
LCD_CLK
T1
–
3.3 V
18
GND
–
–
–
19
LCD_DATA18
K3
R2 (LSB)
–
20
LCD_DATA19
K4
R3
–
21
LCD_DATA20
J1
R4
–
22
LCD_DATA21
J2
R5
–
23
LCD_DATA22
J3
R6
–
24
LCD_DATA23
J4
R7 (MSB)
–
25
GND
–
–
–
26
LCD_DATA10
M1
G2 (LSB)
–
27
LCD_DATA11
M3
G3
–
28
LCD_DATA12
M4
G4
–
29
LCD_DATA13
L1
G5
–
30
LCD_DATA14
L2
G6
–
31
LCD_DATA15
L3
G7 (MSB)
–
32
GND
–
–
–
33
LCD_DATA2
R3
B2 (LSB)
–
34
LCD_DATA3
P1
B3
–
35
LCD_DATA4
P3
B4
–
36
LCD_DATA5
P4
B5
–
37
LCD_DATA6
N1
B6
–
38
LCD_DATA7
N2
B7 (MSB)
–
39
LCD_RESET#
T4
–
3.3 V
40
LCD.RESET#
–
–
Not connected, optional
FFC connector type Hirose FH12A-40S-0.5SH (55) is assembled on the MBa6ULxL.
3.2.6 Touch controller
The i.MX6ULx Touch Screen Controller (TSC) signals are used for USB OTG. Therefore a separate TSC STMPE811 is assembled on
the MBa6ULxL. The STMPE811 is connected to I2C4 using address 0x41.
3.2.7 Backlight control
Attention, TBD: The display brightness can be controlled at pin X19-5 with PWM signal PWM4 (TQMa6ULxL, pad H15).