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Contents
1INTRODUCTION ....................................... 1
1.1 OVERVIEW.........................................................................................................................1
1.2 KEY FEATURES..................................................................................................................2
1.3 INTERFACE........................................................................................................................3
2PRODUCT INSTALLATION .............................. 4
2.1 INSTALLATION PREPARATION............................................................................................4
2.2 HARDWARE INSTALLATION................................................................................................5
3TECHNICAL SPECIFICATIONS ........................... 6
3.1 ELECTRICAL SPECIFICATIONS............................................................................................6
3.2 OPERATION CONDITION.....................................................................................................6
3.3 DIMENSIONS .....................................................................................................................6
3.4 PIN DEFINITION (TOP VIEW)..............................................................................................7
4HARDWARE DESIGN ................................... 8
4.1 DESIGN IN CONSIDERATIONS .............................................................................................8
4.2 AVOID POWER CONNECTION............................................................................................10
4.3 ANTENNA........................................................................................................................10
4.4 SERIAL PORT ..................................................................................................................11
5DISASSEMBLY ....................................... 12
6PACKAGE ........................................... 12
6.1 PRODUCT LABEL DESCRIPTION........................................................................................12
6.2 PACKAGE DESCRIPTION ..................................................................................................12
7CLEAN .............................................. 14
8REFLOW SOLDERING.................................. 14