UNICORECOMM UM960 User manual

UM960 User Manual
i
Revision History
Version
Revision History
Date
R1.0
First release
Sep., 2022

ii
Legal Right Notice
This manual provides information and details on the products of Unicore Communication, Inc.
(“Unicore”) referred to herein.
All rights, title and interest to this document and the information such as data, designs, layouts
contained in this manual are fully reserved, including but not limited to the copyrights, patents,
trademarks and other proprietary rights as relevant governing laws may grant, and such rights
may evolve and be approved, registered or granted from the whole information aforesaid or any
part(s) of it or any combination of those parts.
Unicore holds the trademarks of “和芯星通”,“UNICORECOMM” and other trade name, trademark,
icon, logo, brand name and/or service mark of Unicore products or their product serial referred
to in this manual (collectively “Unicore Trademarks”).
This manual or any part of it, shall not be deemed as, either expressly, implied, by estoppel or
any other form, the granting or transferring of Unicore rights and/or interests (including but not
limited to the aforementioned trademark rights), in whole or in part.
Disclaimer
The information contained in this manual is provided “as is” and is believed to be true and
correct at the time of its publication or revision. This manual does not represent, and in any
case, shall not be construed as a commitments or warranty on the part of Unicore with respect
to the fitness for a particular purpose/use, the accuracy, reliability and correctness of the
information contained herein.
Information, such as product specifications, descriptions, features and user guide in this
manual, are subject to change by Unicore at any time without prior notice, which may not be
completely consistent with such information of the specific product you purchase.
Should you purchase our product and encounter any inconsistency, please contact us or our
local authorized distributor for the most up-to-date version of this manual along with any
addenda or corrigenda.

UM960 User Manual
iii
Foreword
This document describes the information of the hardware, package, specification and the use of
Unicore UM960 modules.
Target Readers
This document applies to technicians who possess the expertise on GNSS receivers.

I
Contents
1Introduction............................................................................................1
1.1 Key Features.....................................................................................................................2
1.2 Key Specifications ...........................................................................................................2
1.3 Interfaces .........................................................................................................................4
2Hardware................................................................................................5
2.1 Dimensions ......................................................................................................................5
2.2 Pin Definition....................................................................................................................7
2.3 Electrical Specifications..................................................................................................9
2.3.1 Absolute Maximum Ratings........................................................................................9
2.3.2 Operational Conditions..............................................................................................10
2.3.3 IO Threshold ...............................................................................................................10
2.3.4 Antenna Feature.........................................................................................................10
3Hardware Design ..................................................................................11
3.1 Antenna Feed Design ....................................................................................................11
3.2 Grounding and Heat Dissipation ..................................................................................12
3.3 Power-on and Power-off ..............................................................................................12
4Production Requirement .......................................................................13
5Packaging ............................................................................................15
5.1 Label Description...........................................................................................................15
5.2 Product Packaging ........................................................................................................15

UM960 User Manual
UC-00-M34 EN R1.0 Introduction 1
1Introduction
UM960 is a new generation of GNSS high precision positioning RTK module from
Unicore. It supports all constellations and multiple frequencies, and can simultaneously
track BDS B1I/B2I/B3I + GPS L1/L2/L5 + GLONASS L1/L2+Galileo E1/E5a/E5b + QZSS
L1/L2/L5 + SBAS. The module is mainly used in UAVs, lawn mower, handheld device,
high precision GIS, precise agriculture, and intelligent drive.
UM960 is based on NebulasⅣTM, a GNSS SoC which integrates RF-baseband and high
precision algorithm. Besides, the SoC integrates a 2 GHz dual CPU, a high speed floating
point processor and an RTK co-processor with 22 nm low power design, and it supports
1408 super channels and realizes 20 Hz RTK positioning output. All these above enable
stronger signal processing.
UM960 features a compact size of 16.0 mm × 12.2 mm. It adopts SMT pads, supports
standard pick-and-place and fully automated integration of reflow soldering.
Furthermore, UM960 supports interfaces such as UART, I2C, which meets the
customers’ needs in different applications.
Figure 1-1 UM960 Module
Reserved interface, not supported currently.

2 Introduction UC-00-M34 EN R1.0
1.1 Key Features
High precision, compact size and low power consumption
Based on the new generation GNSS SoC -NebulasIVTM, with RF-baseband and high
precision algorithm integrated
16.0 mm × 12.2 mm × 2.6 mm, surface-mount device
Supports all-constellation multi-frequency on-chip RTK positioning solution
Supports BDS B1I/B2I/B3I + GPS L1/L2/L5 + GLONASS L1/L2 + Galileo E1/E5b/E5a
+ QZSS L1/L2/L5 + SBAS
All constellations and multiple frequencies RTK engine, and advanced RTK
processing technology
Independent track of each frequency, and 60 dB narrowband anti-jamming
Advanced function of jamming detection
1.2 Key Specifications
Table 1-1 Technical Specifications
Basic Information
Channels
1408 channels, based on NebulasIVTM
Constellations
GPS/BDS/GLONASS/Galileo/QZSS
Frequency
GPS: L1C/A, L2P(W), L2C, L5
BDS: B1I, B2I, B3I
GLONASS: L1C/A, L2C/A
Galileo: E1, E5b, E5a
QZSS: L1, L2, L5
Power
Voltage
+3.0 V~ +3.6 V DC
Power Consumption
440 mW(Typical)
Performance
Positioning Accuracy
Single Point
Positioning (RMS)
Horizontal: 1.5 m
Vertical: 2.5 m
DGPS (RMS)
Horizontal: 0.4 m
Vertical: 0.8 m
RTK (RMS)
Horizontal: 0.8 cm + 1 ppm
Vertical: 1.5 cm + 1 ppm

UM960 User Manual
UC-00-M34 EN R1.0 Introduction 3
Observation Accuracy(RMS)
BDS
GPS
GLONASS
Galileo
B1I/ L1C/A /G1/E1 Pseudorange
10 cm
10 cm
10 cm
10 cm
B1I/ L1C/A /G1/E1 Carrier Phase
1 mm
1 mm
1 mm
1 mm
B2I/L2P/G2/E5b Pseudorange
10 cm
10 cm
10 cm
10 cm
B2I/L2P/G2/E5b Carrier Phase
1 mm
1 mm
1 mm
1 mm
B3I/L5/E5a Pseudorange
10 cm
10 cm
10 cm
10 cm
B3I/L5/E5a Carrier Phase
1 mm
1 mm
1 mm
1 mm
Time Accuracy (RMS)
20 ns
Velocity Accuracy (RMS)
0.03 m/s
Time to First Fix (TTFF)
Cold Start < 30 s
Initialization Time
< 5 s (Typical)
Initialization Reliability
> 99.9%
Data Update Rate
20 Hz Positioning
Differential Data
RTCM 2.3, RTCM3.x, CMR
Data Format
NMEA-0183; Unicore
Physical Specifications
Package
24 pin LGA
Dimensions
16.0 mm × 12.2 mm × 2.6 mm
Environmental Specifications
Operating Temperature
-40 °C~ +85 °C
Storage Temperature
-55 °C~ +95 °C
Humidity
95% No condensation
Vibration
GJB150.16A-2009; MIL-STD-810F
Shock
GJB150.18A-2009; MIL-STD-810F
Functional Ports
UART x 3
I2Cx 1
Reserved interface, not supported currently.

4 Introduction UC-00-M34 EN R1.0
1.3 Interfaces
UM960
SAW
Filter
TCXO
RESET_N
EVENT
PPS
I2C
UART1/2/3
LNA
ANT1_IN
RTC
Nebulas IV
CLOCK
RTK_STAT/LAN_EN
GNSS
RF
GNSS
BB
Interface
PMU
Figure 1-2 UM960 Block Diagram
RF Part
The receiver gets filtered and enhanced GNSS signal from the antenna via a coaxial
cable. The RF part converts the RF input signals into the IF signal, and converts IF
analog signal into digital signals required for NebulasIV chip.
NebulasIV SoC
NebulasIV is UNICORECOMM’s new generation high precision GNSS SoC with 22 nm low
power design, supporting all constellations, multiple frequencies and 1408 super
channels. It integrates a 2 GHz dual CPU, a high speed floating point processor and an
RTK co-processor, which can fulfill the high precision baseband processing and RTK
positioning independently.
1PPS
UM960 outputs 1 PPS with adjustable pulse width and polarity.
Event
UM960 provides 1 Event Mark Input with adjustable frequency and polarity.
Reset (RESET_N)
Active LOW, and the active time should be no less than 5 ms.

UM960 User Manual
UC-00-M34 EN R1.0 Hardware 5
2Hardware
2.1 Dimensions
Table 2-1 Dimensions
Symbol
Min.(mm)
Typ. (mm)
Max. (mm)
A
15.80
16.00
16.50
B
12.00
12.20
12.70
C
2.40
2.60
2.80
D
0.90
1.00
1.10
E
0.20
0.30
0.40
F
1.40
1.50
1.60
G
1.00
1.10
1.20
H
0.70
0.80
0.90
J
3.20
3.30
3.40
N
2.90
3.00
3.10
P
1.30
1.40
1.50
R
0.99
1.00
1.10
X
0.72
0.82
0.92
φ
0.99
1.00
1.10

6 Hardware UC-00-M34 EN R1.0
C
X
NG
D
E
φ
R
R
A
P
P
B
F
H
D
G
E
D
J
J
Figure 2-1 UM960 Mechanical Dimensions

UM960 User Manual
UC-00-M34 EN R1.0 Hardware 7
2.2 Pin Definition
Figure 2-2 UM960 Pin Definition
Table 2-2 Pin Definition
No.
Pin
I/O
Description
1
RSV
—
Reserved, must be floating; cannot connect
ground or power supply or peripheral I/O
2
RSV
—
Reserved, must be floating; cannot connect
ground or power supply or peripheral I/O
3
PPS
O
Pulse per second
4
EVENT
I
Event Mark
5
RSV
—
Built-in function; recommended to add a
through-hole testing point and a 10 kΩ pull-up
resistor; cannot connect ground or power
supply or peripheral I/O, but can be floating.
6
TXD2
O
COM 2 transmitting data
7
RXD2
I
COM 2 receiving data
8
RESET_N
I
System reset
Active Low

8 Hardware UC-00-M34 EN R1.0
No.
Pin
I/O
Description
9
VCC_RF1
O
External LNA power supply
10
GND
—
Ground
11
ANT_IN
I
GNSS antenna signal input
12
GND
—
Ground
13
GND
—
Ground
14
RTK_STAT/LAN_EN
O
RTK_STAT: High level, RTK Fix;
Low level, RTK No Fix
LAN_EN: High level, enable external LNA;
Low level, disable external LNA;
Note: The pin function is configured by protocol.
The default is RTK_STAT.
15
RXD3
I
COM 3 receiving data
16
TXD3
O
COM 3 transmitting data
17
RSV
—
Built-in function; recommended to add a
through-hole testing point and a 10 kΩ pull-up
resistor; cannot connect ground or power
supply or peripheral I/O, but can be floating.
18
SDA
I/O
I2C data
19
SCL
I/O
I2C clock
20
TXD1
O
COM 1 transmitting data
21
RXD1
I
COM 1 receiving data
22
V_BCKP
I
When the main power supply VCC is cut off,
V_BCKP supplies power to RTC and relevant
register. Level requirements: 2.0 V ~ 3.6 V, and
the working current is less than 60 μA at
25 °C. If you do not use the hot start function,
connect V_BCKP to VCC. Do NOT connect it to
ground or leave it floating.
23
VCC
I
Supply voltage
24
GND
—
Ground
1
Not recommended to take VCC_RF as ANT_BIAS to feed the antenna See section 3.1 for more details.

UM960 User Manual
UC-00-M34 EN R1.0 Hardware 9
2.3 Electrical Specifications
2.3.1 Absolute Maximum Ratings
Table 2-3 Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Unit
Power Supply (VCC)
VCC
-0.3
3.6
V
Voltage Input
Vin
-0.3
3.6
V
GNSS Antenna Signal Input
ANT_IN
-0.3
6
V
RF Input Power
Consumption of Antenna
ANT_IN input
power
+10
dBm
External LNA Power Supply
VCC_RF
-0.3
3.6
V
VCC_RF Output Current
ICC_RF
100
mA
Storage Temperature
Tstg
-55
95
°C

10 Hardware UC-00-M34 EN R1.0
2.3.2 Operational Conditions
Table 2-4 Operational Conditions
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Power Supply (VCC)
VCC
3.0
3.3
3.6
V
Maximum Ripple Voltage
Vrpp
0
50
mV
Working Current2
Iopr
133
218
mA
VCC = 3.3 V
VCC_RF Output Voltage
VCC_RF
VCC-0.1
V
VCC_RF Output Current
ICC_RF
50
mA
Operating Temperature
Topr
-40
85
°C
Power Consumption
P
440
mW
2.3.3 IO Threshold
Table 2-5 IO Threshold
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Low Level Input
Voltage
Vin_low
0
VCC × 0.2
V
High Level Input
Voltage
Vin_high
VCC × 0.7
VCC + 0.2
V
Low Level Output
Voltage
Vout_low
0
0.45
V
Iout= 4 mA
High Level Output
Voltage
Vout_high
VCC - 0.45
VCC
V
Iout =4 mA
2.3.4 Antenna Feature
Table 2-6 Antenna Feature
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Optimum Input Gain
Gant
18
30
36
dB
2
Since the product has capacitors inside, inrush current occurs during power-on. You should evaluate
in the actual environment in order to check the effect of the supply voltage drop caused by inrush
current in the system.

UM960 User Manual
UC-00-M34 EN R1.0 Hardware Design 11
3Hardware Design
3.1 Antenna Feed Design
UM960 just supports feeding the antennal from the outside of the module rather than
the inside. It is recommended to use devices with high power and that can withstand
high voltage. Gas discharge tube, varistor, TVS tube and other high-power protective
devices may also be used in the power supply circuit to further protect the module from
lighting strike and surge.
UM960
ANT_IN
ANT
VCC_RF
GND
C2
ANT_BIAS
L1
C1D1 D2
Figure 3-1 UM960 External Antenna Feed Reference Circuit
Remarks:
L1: feed inductor, 68nH RF inductor in 0603 package is recommended;
C1: decoupling capacitor, it is recommended to connect two capacitors of
100nF/100pF in parallel;
C2: DC blocking capacitor, recommended 100pF capacitor;
Not recommended to take VCC_RF as ANT_BIAS to feed the antenna (VCC_RF is not
optimized for the anti-lighting strike and anti-surge due to the compact size of the
module)
D1: ESD diode, choose the ESD protection device that supports high frequency
signals (above 2000 MHz)
D2: TVS diode, choose the TVS diode with appropriate clamping specification
according to the requirement of feed voltage and antenna voltage

12 Hardware Design UC-00-M34 EN R1.0
3.2 Grounding and Heat Dissipation
Figure 3-2 Grounding and Heat Dissipation Pad
The 55 pads in the rectangle in Figure 3-2 are for grounding and heat dissipation.
In the PCB design, they must connect to a large sized ground to strengthen the heat
dissipation.
3.3 Power-on and Power-off
VCC
The VCC initial level when power-on is less than 0.4 V and it has good
monotonicity. The voltages of undershoot and ringing are within 5% VCC.
VCC power-on waveform: The time interval from 10% rising to 90% must be within
100 μs to 1 ms.
Power-on time interval: The time interval between the VCC < 0.4 V (after power-off)
to the next power-on must be larger than 500 ms.
V_BCKP
The V_BCKP initial level when power-on is less than 0.4 V and it has good
monotonicity. The voltages of undershoot and ringing are within 5% V_BCKP.
V_BCKP power-on waveform: The time interval from 10% rising to 90% must be
within 100 μs to 1 ms.
Power-on time interval: The time interval between the V_BCKP < 0.4 V (after power-
off) to the next power-on must be larger than 500 ms.
Grounding and heat
dissipation pad

UM960 User Manual
UC-00-M34 EN R1.0 Production Requirement 13
4Production Requirement
Recommended soldering temperature curve is as follows:
°C
250
217
200
150
100
50
0
Rising CoolingReflux
Peak 245 °C
40 to 60s
60 to120s
Preheating
Max. 4°C/s
Max. 3°C/s
Time (s)
Figure 4-1 Soldering Temperature (Lead-free)
Temperature Rising Stage
Rising slope: Max. 3 °C/s
Rising temperature range: 50 °C to 150 °C
Preheating Stage
Preheating time: 60 s to 120 s
Preheating temperature range: 150 °Cto 180 °C
Reflux Stage
Over melting temperature (217 °C) time: 40 s to 60 s
Peak temperature for soldering: no higher than 245 °C
Cooling Stage
Cooling slope: Max. 4 °C/s

14 Production Requirement UC-00-M34 EN R1.0
In order to prevent falling off during soldering of the module, do not solder it on
the back of the board during design, that is, better not go through soldering
cycle twice.
The setting of soldering temperature depends on many factors of the factory,
such as board type, solder paste type, solder paste thickness, etc. Please also
refer to the relevant IPC standards and indicators of solder paste.
Since the lead soldering temperature is relatively low, if using this method,
please give priority to other components on the board.
The opening of the stencil needs to meet your design requirement and comply
to the examine standards. The thickness of the stencil is recommended to be
0.15 mm.

UM960 User Manual
UC-00-M34 EN R1.0 Packaging 15
5Packaging
5.1 Label Description
Figure 5-1 Label Description
5.2 Product Packaging
The UM960 module uses carrier tape and reel (suitable for mainstream surface mount
devices), packaged in vacuum-sealed aluminum foil antistatic bags, with a desiccant
inside to prevent moisture. When using reflow soldering process to solder modules,
please strictly comply with IPC standard to conduct humidity control. As packaging
materials such as the carrier tape can only withstand the temperature of 55 °C, modules
shall be removed from the package during baking.
Figure 5-2 UM960 Package
Product Model
Part Number
Serial Number
Product QR Code
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