Woodward MicroNet TMR User manual

Product Manual 26167V1
(Revision J, 5/2014)
Original Instructions
MicroNet TMR®
Digital Control
This manual replaces manual 85584
for the MicroNet TMR.
Manual 26167 consists of 2 volumes (26167V1 & 26167V2).
Installation and Operation Manual

General
Precautions
Read this entire manual and all other publications pertaining to the work to be
performed before installing, operating, or servicing this equipment.
Practice all plant and safety instructions and precautions.
Failure to follow instructions can cause personal injury and/or property damage.
Revisions
This publication may have been revised or updated since this copy was produced.
To verify that you have the latest revision, check manual 26311 , Revision Status &
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The latest version of most publications is available on the publications page. If
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Proper Use
Any unauthorized modifications to or use of this equipment outside its specified
mechanical, electrical, or other operating limits may cause personal injury and/or
property damage, including damage to the equipment. Any such unauthorized
modifications: (i) constitute "misuse" and/or "negligence" within the meaning of
the product warranty thereby excluding warranty coverage for any resulting
damage, and (ii) invalidate product certifications or listings.
Translated
Publications
If the cover of this publication states "Translation of the Original Instructions"
please note:
The original source of this publication may have been updated since this
translation was made. Be sure to check manual 26311 , Revision Status &
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this translation is up to date. Out-of-date translations are marked with . Always
compare with the original for technical specifications and for proper and safe
installation and operation procedures.
Revisions—Changes in this publication since the last revision are indicated by a black line
alongside the text.
Woodward reserves the right to update any portion of this publication at any time. Information provided by Woodward is
believed to be correct and reliable. However, no responsibility is assumed by Woodward unless otherwise expressly
undertaken. Manual 26167V1
Copyright © Woodward 2004–2014
All Rights Reserved

Manual 26167V1 MicroNet TMR
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Contents
IOLOCK. When a CPU or I/O module fails, watchdog logic drives it into an
IOLOCK condition where all output circuits and signals are driven to a known
de-energized state as described below. The System MUST be designed such that
IOLOCK and power OFF states will result in a SAFE condition of the controlled
device.
CPU and I/O module failures will drive the module into an IOLOCK state.
CPU failure will assert an IOLOCK signal to all modules and expansion
racks to drive them into an IOLOCK state.
Discrete outputs / relay drivers will be non-active and de-energized.
Analog and actuator outputs will be non-active and de-energized with zero
voltage or zero current.
The IOLOCK state is asserted under various conditions including:
CPU and I/O module watchdog failures
PowerUp and PowerDown conditions
System reset and hardware/software initialization
Entering configuration mode
NOTE: Additional watchdog details and any exceptions to these failure states
are specified in the related CPU or I/O module section of the manual.
This manual is divided into two volumes:
Volume 1 contains Chapters 1–8 (manual 26167V1).
Volume 2 contains Chapters 9–16 and the appendixes (manual 26167V2).
WARNINGS AND NOTICES........................................................................... IX
ELECTROSTATIC DISCHARGE AWARENESS ..................................................X
REGULATORY COMPLIANCE ....................................................................... XI
CHAPTER 1. GENERAL INFORMATION...........................................................1
1.1—Introduction ....................................................................................................1
1.2—Specifications and Compatibility ....................................................................2
CHAPTER 2. MICRONET TMR SYSTEMS.......................................................3
2.1—MicroNet TMR................................................................................................3
2.2—MicroNet TMR Operation.............................................................................14
2.3—Module Replacement...................................................................................15
2.4—Latent Fault Detection..................................................................................16
CHAPTER 3. CHASSIS CONFIGURATIONS....................................................18
3.1—TMR Main Chassis.......................................................................................18
3.2—Expansion MicroNet Plus 8-Slot I/O ............................................................21
3.3—Expansion MicroNet Plus 14-Slot I/O ..........................................................25
3.4—Expansion MicroNet Simplex 6-Slot I/O.......................................................29
3.5—Expansion MicroNet Simplex 12-Slot I/O.....................................................32
CHAPTER 4. POWER SUPPLIES..................................................................36
4.1—TMR Main Power Supplies ..........................................................................36
4.2—TMR Main Power Supply Specifications......................................................39
4.3—TMR Main Power Supply Installation...........................................................40
4.4—TMR Kernel PS Module ...............................................................................42

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4.5—TMR Kernel PS Module Specifications........................................................43
4.6—TMR Kernel PS Installation..........................................................................44
4.7—TMR System Power-up................................................................................45
4.8—TMR Power Supply Troubleshooting ...........................................................45
4.9—MicroNet Plus 8/14 Chassis Power Supplies...............................................47
4.10—MicroNet Simplex 6/12 Chassis Power Supplies.......................................53
4.11—MicroNet Simplex Power Supply Specifications ........................................55
4.12—MicroNet Simplex Power Supply Installation .............................................56
4.13—MicroNet Simplex Power Supply Troubleshooting ....................................58
CHAPTER 5. CPUS....................................................................................60
5.1—TMR5200 CPU Module................................................................................60
5.2—CPU_040 Module.........................................................................................67
CHAPTER 6. COMMUNICATION....................................................................77
6.1—Remote RTN Module ...................................................................................77
6.2—Main Transceiver (XCVR) Module ...............................................................85
6.3—Remote Transceiver (XCVR) Module ..........................................................87
6.4—Transceiver Accessories..............................................................................90
6.5—Ethernet Module...........................................................................................92
6.6—SIO Module ..................................................................................................96
CHAPTER 7. DISCRETE I/O MODULES.......................................................101
7.1—Introduction ................................................................................................101
7.2—MicroNet TMR Discrete I/O Smart-Plus Module ........................................102
7.3—24/12 TMR Discrete I/O Module ................................................................114
7.4—MicroNet Discrete I/O Smart-Plus Module (HDDIO)..................................128
7.5—48/24 Discrete Combo Module ..................................................................138
7.6—48 Channel Discrete Input Module ............................................................148
7.7—32 Channel Discrete Output Module..........................................................152
7.8—64 Channel Discrete Output Module..........................................................157
CHAPTER 8. ANALOG I/O MODULES.........................................................161
8.1—Introduction ................................................................................................161
8.2—Combination I/O Modules ..........................................................................161
8.3—TMR 24/8 Analog Module ..........................................................................161
8.4—TMR Analog Combo Module......................................................................169
8.5—TMR Analog Combo Module – 3 MPU, 1 Prox ..........................................185
8.6—24/8 Analog Module ...................................................................................202
8.7—Dataforth 24/8 Analog Module ...................................................................210
8.8—Analog Combo Module ..............................................................................221
8.9—34 Ch High Density Versatile Input Module (HDVIM)................................234
8.10—Current Input Modules .............................................................................243
8.11—8 Ch Current Input (4–20 mA) Module.....................................................243
8.12—Non-Standard 8 Ch Current Input (4–20 mA) Module .............................249
8.13—Voltage Input Modules .............................................................................254
8.14—8 Channel Voltage Input (0–10 Vdc) Module...........................................254
8.15—Current Output Modules...........................................................................259
8.16—8 Ch Current Output (4–20 mA) Module..................................................260
8.17—8 Ch Current Output (0–1 mA) Module....................................................265
8.18—Voltage Output Modules ..........................................................................266
8.19—8 Ch Voltage Output (0–5 Vdc ) Module..................................................267
8.20—8 Ch Voltage Output (0–10 Vdc) Module.................................................272
8.21—Thermocouple Input Modules ..................................................................273
8.22—8 Ch TC (Fail Low) Module ......................................................................274

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8.23—8 Ch TC (Fail High) Module .....................................................................280
8.24—RTD Input Modules..................................................................................281
8.25—8 Ch RTD Input (10 ohm) ........................................................................282
8.26—8 Ch RTD Input (100 ohm) ......................................................................287
8.27—8 Ch RTD Input (200 ohm) ......................................................................289
8.28—8 Ch RTD Input (500 ohm) ......................................................................290
8.29—4 Ch MPU/Proximity Module....................................................................292
REVISION HISTORY..................................................................................299
Illustrations and Tables
Figure 1-1—MicroNet TMR System (Single Rack) ................................................2
Figure 1-2— Expansion Chassis Options ..............................................................2
Figure 2-1—Double Exchange and Vote Structure................................................5
Figure 2-2—Fault Tolerant Analog Input ................................................................7
Figure 2-3—Fault Tolerant Discrete Input ..............................................................7
Figure 2-4—Fault Tolerant Analog Output .............................................................9
Figure 2-5—Fault Tolerant Single Coil Actuator Output.......................................10
Figure 2-6—Fault Tolerant Dual Coil Actuator Output .........................................11
Figure 2-7—Fault Tolerant Discrete Output .........................................................12
Figure 2-8—Input Flow .........................................................................................13
Figure 2-9—Output Flow ......................................................................................13
Figure 2-10—Redundant Sensors........................................................................13
Figure 2-11—Redundant Inputs ...........................................................................14
Figure 2-12—TCHAS_STAT Block ......................................................................16
Figure 2-13—SYS_INFO Block............................................................................17
Figure 3-1—MicroNet TMR Main Chassis............................................................18
Figure 3-2—Outline Drawing of MicroNet TMR Main Chassis.............................19
Figure 3-3—Mounting Template of MicroNet TMR Main Chassis........................20
Figure 3-4—MicroNet Plus 8-Slot I/O Chassis .....................................................21
Figure 3-5—MicroNet Plus 8-Slot Chassis...........................................................22
Figure 3-6—Outline Drawing of MicroNet Plus 8-Slot Chassis ............................24
Figure 3-7—Mounting Template of MicroNet Plus 8-Slot I/O Chassis.................24
Figure 3-8—MicroNet Plus 14-Slot I/O Chassis ...................................................25
Figure 3-9—MicroNet Plus 14-Slot Chassis.........................................................26
Figure 3-10—Outline Drawing of MicroNet Plus Chassis ....................................28
Figure 3-11—Mounting Template of MicroNet Plus 14-Slot I/O Chassis.............29
Figure 3-12—Simplex MicroNet Six Slot I/O ........................................................30
Figure 3-13—Outline Drawing of MicroNet Six Slot I/O .......................................31
Figure 3-14—Mounting Template of MicroNet 6 Slot I/O Chassis .......................32
Figure 3-15—Simplex MicroNet 12 Slot I/O .........................................................33
Figure 3-16—Outline Drawing of MicroNet 12 Slot I/O ........................................34
Figure 3-17—Mounting Template of MicroNet 12 Slot I/O Chassis .....................35
Figure 4-1—TMR Power Supply Diagram............................................................36
Figure 4-2—TMR Main Chassis PS Ribbon Cable Connections .........................37
Figure 4-3—TMR PS Chassis PS Ribbon Cable (5416-977) Connections .........37
Figure 4-4—Chassis to Chassis Power Cable (5417-293) ..................................38
Figure 4-5—TMR Power Supply Modules (24 Vdc/120 Vac/dc)..........................39
Figure 4-6—TMR Main Power Supply..................................................................40
Figure 4-7—Kernel Power Supply Module ...........................................................43
Figure 4-8—MicroNet Kernel Power Supplies......................................................44

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Illustrations and Tables
Figure 4-9—Power Supply Module.......................................................................48
Figure 4-10—Power Supply Modules...................................................................54
Figure 4-11—MicroNet Simplex Power Supply ....................................................56
Figure 5-1—TMR5200 CPU Module ....................................................................60
Figure 5-2—CPU Module Block Diagram.............................................................61
Figure 5-3—CPU Communications Port (DB9F)..................................................65
Figure 5-4—CPU Service Port (mini-DIN6F)........................................................66
Figure 5-5—040 CPU Module ..............................................................................67
Figure 5-6—CPU Module .....................................................................................68
Figure 5-7—CPU Module Block Diagram.............................................................69
Figure 5-8—68040 CPU Communications Port ...................................................70
Figure 6-1—Remote RTN Module........................................................................77
Figure 6-2—Remote RTN Module Block Diagram ...............................................78
Figure 6-3—MicroNet TMR5200 System (copper, 3-rack)...................................79
Figure 6-4—MicroNet TMR5200 System (fiber, 2 locations) ...............................80
Figure 6-5—RTN Service Port (mini-DIN6F)........................................................84
Figure 6-6—Main XCVR Module Block Diagram .................................................85
Figure 6-7—Main XCVR Module ..........................................................................86
Figure 6-8—Remote XCVR Module Block Diagram.............................................87
Figure 6-9—Remote XCVR Module Jumpers ......................................................88
Figure 6-10—Remote XCVR Module ...................................................................89
Figure 6-11—T-Module (I/O XCVR-Module) ........................................................90
Figure 6-12—Cables ............................................................................................90
Figure 6-13—Expansion I/O Chassis ...................................................................91
Figure 6-14—Termination.....................................................................................92
Figure 6-15—Ethernet Module .............................................................................93
Figure 6-16—SIO Module.....................................................................................96
Figure 6-17—SIO Module Block Diagram ............................................................97
Figure 6-18—RS-422 Terminator Locations ........................................................98
Figure 6-19—RS-485 Terminator Locations ........................................................98
Figure 6-20—Termination and Cable Connection Examples...............................99
Figure 6-21—Preferred Multipoint Wiring Using Shielded Twisted-Pair Cable with
a Separate Signal Ground Wire.....................................................100
Figure 6-22—Alternate Multipoint Wiring Using Shielded Twisted-Pair Cable
without a Separate Signal Ground Wire ........................................100
Figure 7-1—DI/DO Field Wire Shielding Example .............................................101
Figure 7-2—MicroNet TMR Discrete I/O Smart-Plus Module ............................102
Figure 7-3—MicroNet TMR Discrete I/O Smart-Plus Module Block Diagram....103
Figure 7-4—Example TMR System Configuration .............................................104
Figure 7-5—Wiring Diagram for a FT Relay/Discrete Input Module...................105
Figure 7-6—Optional Internal 24 Vdc Contact Wetting Configuration................106
Figure 7-7—TMR Discrete Output......................................................................107
Figure 7-8—Latent Fault Detection Verification Graph–18-32 Vdc Circuitry .....109
Figure 7-9—Jumper and Relay Location Diagram .............................................110
Figure 7-10—FT Relay/Discrete Input Module Labels .......................................110
Figure 7-11—Example Relay Output Wiring Diagram........................................111
Figure 7-12—24/12 TMR Discrete I/O Module...................................................114
Figure 7-13—24/12 TMR Discrete I/O Module Block Diagram ..........................115
Figure 7-14—Example TMR System Configuration ...........................................116
Figure 7-15—Wiring Diagram for a FT Relay/Discrete Input Module.................117
Figure 7-16—Optional Internal 24 Vdc Contact Wetting Configuration..............118
Figure 7-17—Optional External 24/125 Vdc Contact Wetting Configuration .....119
Figure 7-18—TMR Discrete Output....................................................................120
Figure 7-19—Latent Fault Detection Verification Graph–18-32 Vdc Circuitry ...122
Figure 7-20—Latent Fault Detection Verification Graph–18-132 Vac Circuitry .122

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Figure 7-21—Latent Fault Detection Verification Graph–100–150 Vdc
Circuitry..........................................................................................123
Figure 7-22—Jumper and Relay Location Diagram...........................................124
Figure 7-23—FT Relay/Discrete Input Module Labels .......................................124
Figure 7-24—Example Relay Output Wiring Diagram .......................................125
Figure 7-25—Discrete Combo Module (HDDIO)................................................128
Figure 7-26—Configuration 1, One 48/24 Discrete FTM with Relay Module(s).130
Figure 7-27—Discrete Input Interface Wiring to a 24 Vdc 48/24 Discrete FTM.130
Figure 7-28—Relay Output Interface Wiring to a 16Ch Relay Module ..............132
Figure 7-29—Relay Output Interface Wiring to a 32Ch Relay Module ..............132
Figure 7-30—Configuration 2, Two 24/12 Discrete FTMs..................................133
Figure 7-31—Discrete Input Interface Wiring to a 24/12 Discrete FTM .............134
Figure 7-32—Relay Output Interface Wiring to a 24/12 Discrete FTM ..............135
Figure 7-33—MicroNet Discrete I/O Smart-Plus Module Block Diagram...........136
Figure 7-34—Discrete Combo Module...............................................................138
Figure 7-35—Configuration 1, One 48/24 Discrete FTM with Relay Module(s).140
Figure 7-36—Discrete Input Interface Wiring to a 24 Vdc 48/24 Discrete FTM.141
Figure 7-37—Discrete Input Interface Wiring to a 125 Vdc 48/24 Discrete
FTM................................................................................................141
Figure 7-38—Relay Output Interface Wiring to a 16 Ch Relay Module .............142
Figure 7-39—Relay Output Interface Wiring to a 32 Ch Relay Module .............143
Figure 7-40—Configuration 2, Two 24/12 Discrete FTMs..................................143
Figure 7-41—Discrete Input Interface Wiring to a 24/12 Discrete FTM .............144
Figure 7-42—Relay Output Interface Wiring to a 24/12 Discrete FTM ..............145
Figure 7-43—48/24 Discrete Combo Module Block Diagram ............................146
Figure 7-44—Discrete Input Module ..................................................................148
Figure 7-45—48 Ch DI Module with two FTMs ..................................................149
Figure 7-46—Discrete Input Interface Wiring with Internal Power Source to a 24
Vdc Discrete Input/Output FTM .....................................................150
Figure 7-47—Discrete Input Interface Wiring with External Power Source to a
Discrete Input (with LEDs) FTM ....................................................150
Figure 7-48—Discrete Input Module Block Diagram..........................................151
Figure 7-49—Discrete Output Module................................................................153
Figure 7-50—32 Ch DO Module with Relay Modules ........................................154
Figure 7-51—Relay Output Interface Wiring to a 16 Ch Relay Module .............154
Figure 7-52—Relay Output Interface Wiring to a 32 Ch Relay Module .............155
Figure 7-53—Discrete Output Module (32 Channel) Block Diagram .................156
Figure 7-54—Discrete Output Module................................................................157
Figure 7-55—64 Ch DO Module with Relay Modules ........................................159
Figure 7-56—Relay Output Interface Wiring to a 16 Ch Relay Module .............159
Figure 7-57—Relay Output Interface Wiring to a 32 Ch Relay Module .............160
Figure 8-1—24/8 Analog Module .......................................................................162
Figure 8-2—Example TMR System Configuration .............................................163
Figure 8-3—Analog Input Wiring for a 24/8 Analog FTM ...................................164
Figure 8-4—Analog Output Wiring for a 24/8 Analog FTM ................................165
Figure 8-5—Analog Combo Module...................................................................169
Figure 8-6—Example Fault Tolerant System Configuration...............................171
Figure 8-7—MPU/Proximity Interface Wiring to the TMR Analog Combo FTM .173
Figure 8-8—Current Input Wiring for an Analog Combo Module FTM...............174
Figure 8-9—Voltage Input Wiring for an Analog Combo Module FTM
(Simplex)........................................................................................175
Figure 8-10—Analog Output and Actuator Wiring for an Analog Combo FTM..177
Figure 8-11—TMR MPU and Analog I/O Module FTM Fuse Locations.............185
Figure 8-12—MPU and Analog I/O Module FTM Fuse Locations......................185
Figure 8-13—Analog Combo Module.................................................................186

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Illustrations and Tables
Figure 8-14—Example Fault Tolerant System Configuration.............................188
Figure 8-15—MPU Interface Wiring to the TMR Analog Combo FTM (Speed 1, 2,
& 3) ................................................................................................190
Figure 8-16—Proximity Interface Wiring to the TMR Analog Combo FTM (Speed
4)....................................................................................................190
Figure 8-17—Current Input Wiring for an Analog Combo Module FTM.............191
Figure 8-18—Voltage Input Wiring for an Analog Combo Module FTM
(Simplex)........................................................................................192
Figure 8-19—Analog Output and Actuator Wiring for an Analog Combo FTM ..194
Figure 8-20—TMR MPU and Analog I/O Module FTM Fuse Locations.............202
Figure 8-21—Simplex MPU and Analog I/O Module FTM Fuse Locations........202
Figure 8-22—24/8 Analog Module......................................................................203
Figure 8-23—Simplex System Configuration Example ......................................205
Figure 8-24—Analog Input Wiring for a 24/8 Analog FTM .................................206
Figure 8-25—Analog Output Wiring for a 24/8 Analog FTM ..............................207
Figure 8-26—Dataforth 24/8 Analog Module......................................................210
Figure 8-27—Simplex Dataforth Configuration Example ...................................212
Figure 8-28—Thermocouple Wiring to Simplex Dataforth FTM .........................213
Figure 8-29—RTD Wiring to Simplex Dataforth FTM.........................................214
Figure 8-30—Loop powered 4–20 mA Signal Wiring to Simplex Dataforth
FTM................................................................................................214
Figure 8-31—Self-powered 4–20 mA Signal Wiring to Simplex Dataforth FTM 215
Figure 8-32—0–5 Vdc Signal Wiring to Simplex Dataforth FTM........................215
Figure 8-33—Analog Output Signal Wiring to Simplex Dataforth FTM..............216
Figure 8-34—Dataforth Plug-in Modules............................................................216
Figure 8-35—Analog Combo Module.................................................................221
Figure 8-36—Simplex System Configuration Example ......................................224
Figure 8-37—MPU/Proximity Interface Wiring to the Analog Combo FTM........225
Figure 8-38—Current Input Wiring for an Analog Combo Module FTM.............227
Figure 8-39—Voltage Input Wiring for an Analog Combo Module FTM.............228
Figure 8-40—Analog Output and Actuator Wiring for an Analog Combo FTM ..230
Figure 8-41—34 Channel HDVIM Module..........................................................235
Figure 8-42—Simplex System Configuration Example ......................................238
Figure 8-43—Wiring Diagram for 34 Ch HDVIM FTM........................................239
Figure 8-44—Analog Input Interface Wiring to the 34 Ch HDVIM Module for
Thermocouple Inputs .....................................................................241
Figure 8-45—Analog Input Interface Wiring to the 34 Ch HDVIM Module for 4–20
mA Inputs.......................................................................................241
Figure 8-46—4–20 mA Input Interface Wiring to the 34 Ch HDVIM Module for
4–20 mA on 4/20 mA/RTD Inputs..................................................241
Figure 8-47—RTD Input Interface Wiring to the 34 Ch HDVIM Module for RTDs
on 4–20 mA/RTD Inputs ................................................................241
Figure 8-48—8 Channel Current Input (4–20 mA) Module ................................244
Figure 8-49—8 Ch Current Input (4–20 mA) Module Configuration...................245
Figure 8-50—Analog Input Wiring for an 8 Ch Current Input (0–25 mA)
Module ...........................................................................................246
Figure 8-51—8 Ch Current Input (0–25 mA) Module Block Diagram.................247
Figure 8-52—Non-standard 8 Channel Current Input (4–20 mA) Module .........249
Figure 8-53—Non-Standard 8 Channel Current Input (4–20 mA) Module
Configuration .................................................................................250
Figure 8-54—Analog Input Wiring for a Non-Standard 8 Ch Current Input (0–25
mA) Module....................................................................................252
Figure 8-55—8 Channel Voltage Input (0–10 Vdc) Module ...............................255
Figure 8-56—8 Ch Voltage Input (0–10 Vdc) Module Configuration..................256

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Figure 8-57—Voltage Input Wiring for an 8 Channel Voltage Input (0–10 Vdc)
Module ...........................................................................................257
Figure 8-58—8 Ch Voltage Input (0–10 Vdc) Module Block Diagram ...............258
Figure 8-59—8 Channel Current Output (4–20 mA) Module .............................260
Figure 8-60—8 Ch Current Output (4–20 mA) Module Configuration................261
Figure 8-61—Analog Output Wiring for an 8 Channel Current Output (4–20 mA)
Module ...........................................................................................263
Figure 8-62—Current Output ( 4–20 mA) Module Block Diagram .....................264
Figure 8-63—8 Channel Current Output (0–1 mA) Module ...............................265
Figure 8-64—8 Channel Voltage Output (0–5 Vdc) Module ..............................267
Figure 8-65—8 Ch Voltage Output (0–5 Vdc) Module Configuration.................268
Figure 8-66—Analog Output Wiring for an 8 Channel Voltage Output (0–5 Vdc)
Module ...........................................................................................270
Figure 8-67—8 Ch Voltage Output (0–5 Vdc) Module Block Diagram...............271
Figure 8-68—8 Channel Voltage Output (0–10 Vdc) Module ............................272
Figure 8-69—8 Channel TC (Fail Low) Module .................................................274
Figure 8-70—8 Ch TC (Fail Low) Module Configuration....................................276
Figure 8-71—8 Ch TC Input (Fail Low) Module Field Wiring .............................277
Figure 8-72—Thermocouple Input Block Diagram.............................................278
Figure 8-73—8 Channel TC (Fail High) Module.................................................280
Figure 8-74—8 Channel RTD Input Module (10 ohm) .......................................282
Figure 8-75—8 Ch RTD Module Configuration ..................................................283
Figure 8-76—8 Ch RTD Input Module Field Wiring ...........................................285
Figure 8-77—RTD Input Block Diagram.............................................................286
Figure 8-78—8 Channel RTD Input Module (100 ohm) .....................................288
Figure 8-79—8 Channel RTD Input Module (200 ohm) .....................................289
Figure 8-80—8 Channel RTD Input Module (500 ohm) .....................................291
Figure 8-81—4 Channel MPU/Proximity Module ...............................................293
Figure 8-82—4 Ch MPU/Proximity Module ........................................................294
Figure 8-83—MPU and Proximity Probe Interface Wiring..................................296
Figure 8-84—Digital Speed Sensor Module Block Diagram ..............................297
Table 2-1—AI Redundancy Manager Truth Table .................................................7
Table 4-1—MicroNet TMR Power Supply Requirements.....................................42
Table 4-2—Kernel Power Supply Troubleshooting ..............................................47
Table 4-3—MicroNet Plus Power Supply Requirements .....................................51
Table 4-4—MicroNet Simplex Power Supply Requirements................................57
Table 5-1—Off-line Tests .....................................................................................71
Table 5-2—Flash Codes.......................................................................................72
Table 5-3—On-Line Tests ....................................................................................72
Table 5-4—Test Failure Messages ......................................................................73
Table 5-5—Operation Errors ................................................................................73
Table 5-6—Numbered System Errors ..................................................................74
Table 5-7—System Alarms...................................................................................75
Table 5-8—System Alarms...................................................................................76
Table 5-9—Numbered System Alarms.................................................................76
Table 6-1—Remote XCVR Module Jumpers (JPR1–4) .......................................88
Table 7-1—LED Indications of Failure ...............................................................112
Table 7-2—LED Indications of Failure ...............................................................126
Table 7-3—Discrete Outputs/Relay Module Configuration ................................131
Table 7-4—LED Indications of Failure ...............................................................136
Table 7-5—Discrete Outputs/Relay Module Configuration ................................142
Table 7-6—LED Indications of Failure ...............................................................146

MicroNet TMR Manual 26167V1
viii Woodward
Illustrations and Tables
Table 8-1—LED Indications of Failure................................................................165
Table 8-2—LED Indications of Failure................................................................178
Table 8-3—LED Indications of Failure................................................................195
Table 8-4—LED Indications of Failure................................................................207
Table 8-5—Module Accuracy .............................................................................211
Table 8-6—LED Indications of Failure................................................................217
Table 8-7—LED Indications of Failure................................................................230
Table 8-8—LED Indications of Failure................................................................242
The following are trademarks of Woodward, Inc.:
GAP
LINKnet
LINKnet HT
MicroNet
MicroNet TMR
RTCnet
Woodward
The following are trademarks of their respective companies:
Dataforth (Dataforth Corporation)
DeviceNet (Open DeviceNet Vendor Association, Inc.)
Modbus (Schneider Automation Inc.)
VxWorks (Wind River Systems, Inc.)
Windows NT (Microsoft Corporation)

Manual 26167V1 MicroNet TMR
Woodward ix
Warnings and Notices
Important Definitions
This is the safety alert symbol. It is used to alert you to potential
personal injury hazards. Obey all safety messages that follow this
symbol to avoid possible injury or death.
DANGER—Indicates a hazardous situation which, if not avoided, will result
in death or serious injury.
WARNING—Indicates a hazardous situation which, if not avoided, could
result in death or serious injury.
CAUTION—Indicates a hazardous situation which, if not avoided, could
result in minor or moderate injury.
NOTICE—Indicates a hazard that could result in property damage only
(including damage to the control).
IMPORTANT—Designates an operating tip or maintenance suggestion.
Overspeed /
Overtemperature /
Overpressure
The engine, turbine, or other type of prime mover should be
equipped with an overspeed shutdown device to protect against
runaway or damage to the prime mover with possible personal injury,
loss of life, or property damage.
The overspeed shutdown device must be totally independent of the
prime mover control system. An overtemperature or overpressure
shutdown device may also be needed for safety, as appropriate.
Personal Protective
Equipment
The products described in this publication may present risks that
could lead to personal injury, loss of life, or property damage. Always
wear the appropriate personal protective equipment (PPE) for the job
at hand. Equipment that should be considered includes but is not
limited to:
Eye Protection
Hearing Protection
Hard Hat
Gloves
Safety Boots
Respirator
Always read the proper Material Safety Data Sheet (MSDS) for any
working fluid(s) and comply with recommended safety equipment.
Start-up
Be prepared to make an emergency shutdown when starting the
engine, turbine, or other type of prime mover, to protect against
runaway or overspeed with possible personal injury, loss of life, or
property damage.
Automotive
Applications
On- and off-highway Mobile Applications: Unless Woodward's control
functions as the supervisory control, customer should install a
system totally independent of the prime mover control system that
monitors for supervisory control of engine (and takes appropriate
action if supervisory control is lost) to protect against loss of engine
control with possible personal injury, loss of life, or property damage.

MicroNet TMR Manual 26167V1
x Woodward
Battery Charging
Device
To prevent damage to a control system that uses an alternator or
battery-charging device, make sure the charging device is turned off
before disconnecting the battery from the system.
Electrostatic Discharge Awareness
Electrostatic
Precautions
Electronic controls contain static-sensitive parts. Observe the
following precautions to prevent damage to these parts:
Discharge body static before handling the control (with power to
the control turned off, contact a grounded surface and maintain
contact while handling the control).
Avoid all plastic, vinyl, and Styrofoam (except antistatic versions)
around printed circuit boards.
Do not touch the components or conductors on a printed circuit
board with your hands or with conductive devices.
To prevent damage to electronic components caused by improper
handling, read and observe the precautions in Woodward manual
82715, Guide for Handling and Protection of Electronic Controls,
Printed Circuit Boards, and Modules.
Follow these precautions when working with or near the control.
1. Avoid the build-up of static electricity on your body by not wearing clothing
made of synthetic materials. Wear cotton or cotton-blend materials as much
as possible because these do not store static electric charges as much as
synthetics.
2. Do not remove the printed circuit board (PCB) from the control cabinet
unless absolutely necessary. If you must remove the PCB from the control
cabinet, follow these precautions:
Do not touch any part of the PCB except the edges.
Do not touch the electrical conductors, the connectors, or the
components with conductive devices or with your hands.
When replacing a PCB, keep the new PCB in the plastic antistatic
protective bag it comes in until you are ready to install it. Immediately
after removing the old PCB from the control cabinet, place it in the
antistatic protective bag.

Manual 26167V1 MicroNet TMR
Woodward xi
Regulatory Compliance
European Compliance for CE Marking:
These listings are limited only to those units bearing the CE Marking.
EMC Directive: Declared to 2004/108/EC COUNCIL DIRECTIVE of 15
Dec 2004 on the approximation of the laws of the
Member States relating to electromagnetic compatibility
and all applicable amendments.
Conditions for Use:
This equipment is intended to be installed in a metal cabinet or enclosure. In
TMR systems with 3 expansion racks (a 4-rack system), the installation must use
an EMC enclosure to meet RF emission requirements. An EMC enclosure may
be used any time to improve performance, however it is only required when more
than one TMR chassis and two expansion racks are used.
Low Voltage Declared to 2006/95/EC COUNCIL DIRECTIVE of 12
Directive: December 2006 on the harmonization of the laws of the
Member States relating to electrical equipment designed
for use within certain voltage limits.
Other International Compliance:
GOST R: Certified for use in ordinary locations within the Russian
Federation per GOST R certificate РОСС
US.МЛ03.В01257.
USE IN THE RUSSIAN FEDERATION—This equipment is considered
indicator equipment and is not to be used as metrology equipment.
All measurements need to be verified using calibrated equipment.
North American Compliance:
These listings are limited only to those units bearing the CSA identification.
CSA: CSA Listed for Class I, Division 2, Groups A, B, C, & D,
T3A at +55 °C surrounding air temperature or non-
hazardous locations only for use in Canada and the
United States.
5441-694 DIO FTM Relay Driver rated for temperatures
up to +75˚C
CSA Certificate of Compliance 2314167
Conditions for Safe Use:
This equipment may be suitable for use in Class I, Division 2, Groups A, B, C,
and D or non-hazardous locations only.
The 16-Channel Relay Interface Modules are suitable for ordinary or
non-hazardous locations only.
This equipment is suitable for use in European Zone 2, Group IIC environments
when installed in an IP54 minimum rated enclosure per self-declaration to
EN60079-15.
Wiring must be in accordance with North American Class I, Division 2, or
European Zone 2, Category 3 wiring methods as applicable, and in accordance
with the authority having jurisdiction.

MicroNet TMR Manual 26167V1
xii Woodward
A fixed wiring installation is required.
The power supply mains should be properly fused according to the National
Electrical Code. The recommended fuse is a European Type T fuse.
Ground leakage current exceeds 3.5 mA.
Grounding is required by the input PE terminal.
A switch or circuit breaker shall be included in the building installation that is in
close proximity to the equipment and within easy reach of the operator and that is
clearly marked as the disconnecting device for the equipment. The switch or
circuit breaker shall not interrupt the protective earth conductor.
An emergency switch shall be included in the building installation that is in close
proximity to the equipment and within easy reach of the operator and that is
clearly marked as the emergency disconnecting device for the equipment.
Field wiring must be suitable for at least 80 °C for operating ambient
temperatures expected to exceed 55 °C.
For ATEX compliance, this equipment must be installed in an area providing
adequate protection against the entry of dust or water. A minimum ingress
protection rating of IP54 is required for the enclosure per EN60529. The interior
of the enclosure shall not be accessible in normal operation without the use of a
tool and must meet the construction requirements of IEC 60079-0.
For ATEX compliance, this equipment must be protected externally against
transient disturbances. Provisions shall be made to prevent the power input from
being exceeded by transient disturbances of more than 40% of the rated voltage.
Personnel must discharge their electrostatic build up to the cabinet ground point
or use an ESD strap prior to touching the MicroNet or modules if the
engine/turbine is operational.
CPU modules contain internal energy limited circuits. These circuits have no
external connections and are not affected by module loading.
CPU modules contain single cell primary batteries. These batteries are not to be
charged and are not customer replaceable.
For environmental specifications, please refer to the appropriate appendix in
Volume 2 of this manual.

Manual 26167V1 MicroNet TMR
Woodward xiii
EXPLOSION HAZARD—Do not connect or disconnect while circuit is
live unless area is known to be non-hazardous.
Substitution of components may impair suitability for Class I,
Division 2 applications.
Do not remove or install power supply while circuit is live unless
area is known to be non-hazardous.
Do not remove or install modules while circuit is energized unless
area is known to be non-hazardous.
RISQUE D’EXPLOSION—Ne pas raccorder ni débrancher
tant que l’installation est sous tension, sauf en cas
l’ambiance est décidément non dangereuse.
La substitution de composants peut rendre ce matériel
inacceptable pour les emplacements de Classe I,
applications Division 2.
Ne pas enlever ni installer l’alimentation électrique pendant
que le circuit est sous tension avant de s’assurer que la
zone est non dangereuse.
Ne pas enlever ni installer les cartes pendant que le circuit
est sous tension sans s’assurer que la zone non
dangereuse.

MicroNet TMR Manual 26167V1
xiv Woodward

Manual 26167V1 MicroNet TMR
Woodward 1
Chapter 1.
General Information
1.1—Introduction
The MicroNet control is a 32-bit microprocessor-based digital controller that is
programmable for many types of applications in the control of:
Gas Turbines
Steam Turbines
Hydro Turbines
Diesel Engines
Gas Engines
The MicroNet platform provides a flexible system to control any prime mover and
its associated processes such as high speed control functions, system
sequencing, auxiliary system control, surge control, monitoring and alarming, and
station control. The MicroNet platform is available in simplex, redundant, and
triple modular redundant (TMR) configurations. This manual covers only TMR
based control configurations. Please refer to MicroNet Plus manual 26166 for
simplex and redundant based control configurations using the MicroNet Plus
CPU. Please refer to manual 26336 for information on VxWorks Operating
System tools used with the TMR5200 CPU module.
The MicroNet Operating System, together with Woodward’s GAP Graphical
Application Program, produces a powerful control environment. Woodward’s
unique rate group structure ensures that control functions will execute
deterministically at rate groups defined by the application engineer. Critical
control loops can be processed within 5 milliseconds. Less critical code is
typically assigned to slower rate groups. The rate group structure prevents the
possibility of changing system dynamics by adding additional code. Control is
always deterministic and predictable.
Synchronized inputs and outputs (I/O) are available for key control signals while
distributed I/O can be used for other less critical parameters.
The MicroNet platform provides several types of communications to program and
service the control as well as to interface with other systems (Plant DCS, HMI,
etc.). Woodward’s GAP and Ladder Logic programming tools are used to
generate Application code. A service interface allows the user to view and tune
system variables. Several tools are available to provide this interface (see
Engineering and Service Access). Communication protocols such as TCP/IP,
OPC, Modbus, and other current designs are included so that the user can
correctly interface the control to existing or new plant level systems.
The MicroNet TMR platform is expandable into multiple chassis as required by
the system size and will support any mix of I/O, including networked and
distributed I/O. The MicroNet TMR main control chassis is only available in one
size with 18 VME slots. All slots are dedicated to the control section. The power
supply for the MicroNet TMR main control chassis is a separate chassis which
connects to either the lower right or left of the MicroNet TMR main control
chassis. The power supply chassis contains redundant power supplies.

MicroNet TMR Manual 26167V1
2 Woodward
The MicroNet TMR control may be expanded to a multi-chassis system using the
Plus8 or Plus14 chassis options. For field upgrades, the expansion racks may
also be the older Simplex6 or Simplex12 chassis. Each expansion chassis has
dedicated power supply, control, and I/O sections located in a single chassis.
The expansion power supply architecture supports simplex or redundant power
supplies.
Figure 1-1—MicroNet TMR System (Single Rack)
MicroNet Plus
8 I/O Slot Chassis
MicroNet Plus
14 I/O Slot Chassis
MicroNet Simplex
6 I/O Slot Chassis
MicroNet Simplex
12 I/O Slot Chassis
Figure 1-2— Expansion Chassis Options
1.2—Specifications and Compatibility
For environmental specifications and MicroNet compatibility information, please
refer to the appropriate appendix in Volume 2 of this manual.

Manual 26167V1 MicroNet TMR
Woodward 3
Chapter 2.
MicroNet TMR Systems
2.1—MicroNet TMR
The TMR Main chassis provides slots for kernel power supplies, CPU’s, and twelve
I/O Modules. This is the basis of the TMR systems whether using the TMR5200
processor or the TMR040 processor. NOTE: Kernel PS modules must be matched
to the type of CPU being used. The system may be expanded to 3 I/O chassis
using RTN networks with the TMR5200 processors. With the RTN each CPU has
access to the I/O so I/O in the expansion chassis is considered Shared I/O.
With the TMR040 processors, Transceiver modules and copper or fiber cables are
used to connect to multiple chassis to accommodate additional system I/O
requirements. In this case, I/O is dedicated to a specific CPU.
2.1.1—MicroNet TMR Main Chassis
In the MicroNet TMR Main Chassis, whether the TMR040 or TMR5200 CPUs are
used, the I/O modules are associated with a particular Kernel. If that Kernel fails,
the associated I/O modules are failed.
MicroNet TMR
MicroNet TMR Chassis
3 Kernel Power Supplies
3 TMR CPU Modules
4 I/O modules slots per Kernel
Expandable to a 4-rack system.
2.1.2—MicroNet TMR Power Supply Chassis
The MicroNet TMR Power Supply Chassis, contains two redundant TMR power
supply modules. Power supply modules come in low voltage DC, AC/DC, and
high voltage AC/DC versions. Each module supplies power to the Kernel PS
Modules.
MicroNet TMR Power Supply Chassis
1 or 2 TMR Power Supply Chassis can be configured.
(2) Redundant PS Modules per Chassis
PS Modules are load sharing
3 Module versions available
Low voltage DC
120 Vac / Vdc
220 Vac/Vdc

MicroNet TMR Manual 26167V1
4 Woodward
2.1.3 MicroNet TMR5200 Expansion Chassis
With the TMR5200 systems, connection to up to 3 Expansion chassis is
accomplished through Real Time Networks (RTNs) associated with each Kernel.
There are 3 RTN networks. The TMR5200 system supports the MicroNet Plus 8
or 14 chassis and MicroNet Simplex 6 or 12 chassis. The MicroNet Plus 8 or 14
chassis can have either 1 or 2 RTN modules. The MicroNet 6 or 12 chassis only
have 1 RTN module. The I/O in the Expansion Chassis is not associated with a
specific Kernel and is considered “shared” I/O. The failure of any Kernel does not
affect the ability for the other CPUs to access the I/O.
2.1.4—MicroNet TMR040 Expansion Chassis
With the TMR040 systems, each Kernel can be connected to up to 15 Expansion
I/O Chassis via Transceiver (XCVR) modules. The TMR040 system supports the
MicroNet 6 or 12 chassis. Refer to Chapters 6-2 through 6-4 for detailed
information on the use of XCVR modules. Each expansion chassis is associated
with a particular Kernel. If that Kernel fails, the associated I/O modules local and
expansion are failed.