ADLINK Technology SMARC LEC-MTK-I1200 User manual

COM-HPC-sIDH User’s Guide PICMG COM-HPC R1.1
Page 1 Copyright © 2023 ADLINK Technology, Inc.
LEC-MTK-I1200
Revision:
Date:
Rev. 0.1
2023-06-01
Part Number: 50M-72516-1000
User’s Guide

LEC-MTK-i1200 User’s Guide SGET SMARC Rev 2.1
Page 2 copyright © 2023 ADLINK Technology Inc.
Revision History
Revision
Description
Date
Author
0.1
Preliminary release
2023-06-01
CC

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Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK
assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product
descriptions at any time, without notice.
Environmental Responsibility
ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product
disposal and/or recovery programs prescribed by their nation or company.
California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3-
dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known to
the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC,
and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more information go to
www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.
Copyright © 2023 ADLINK Technology Incorporated
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

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Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment before
handling/operating the equipment.
Read these safety instructions carefully.
•Keep this manual for future reference.
•Read the specifications section of this manual for detailed information on the operating environment of this equipment.
•Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
•To avoid electrical shock and/or damage to equipment:
•Keep equipment away from water or liquid sources;
•Keep equipment away from high heat or high humidity;
•Keep equipment properly ventilated (do not block or cover ventilation openings);
•Make sure to use recommended voltage and power source settings;
•Always install and operate equipment near an easily accessible electrical socket outlet;
•Secure the power cord (do not place any object on/over the power cord);
•Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
•If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.
Conventions
The following conventions may be used throughout this manual, denoting special levels of information
Note: This information adds clarity or specifics to text and illustrations.
Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.
Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

LEC-MTK-i1200 User’s Guide SGET SMARC Rev 2.1
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Getting Service
Ask an Expert: https://www.adlinktech.com/en/Askanexpert
ADLINK Technology, Inc.
No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan
Tel: [phone]
Fax: [phone]
Email: [e-mail]
Ampro ADLINK Technology, Inc.
6450 Via Del Oro, San Jose, CA 95119-1208, USA
Tel: [phone]
Toll Free: [phone] (USA only)
Fax: [phone]
Email: [e-mail]
ADLINK Technology (China) Co., Ltd.
300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China
Tel: [phone]
Fax: [phone]
Email: [e-mail]
ADLINK Technology GmbH
Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany
Tel: [phone]
Fax: [phone]
Email: [e-mail]
Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.

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Table of Contents
Revision History ................................................................................................................................................................................................................................................................................................................ 2
Preface .................................................................................................................................................................................................................................................................................................................................. 3
1. Introduction ................................................................................................................................................................................................................................................................................................................... 9
1.1 LEC-MTK-i1200.................................................................................................................................................................................................................................................................................................... 9
1.2 The SMARC Form Factor.................................................................................................................................................................................................................................................................................. 9
2. Specifications.............................................................................................................................................................................................................................................................................................................10
2.1 Core System........................................................................................................................................................................................................................................................................................................10
2.2 Video......................................................................................................................................................................................................................................................................................................................11
2.3 Camera..................................................................................................................................................................................................................................................................................................................12
2.4 Audio .....................................................................................................................................................................................................................................................................................................................12
2.5 Dual Ethernet......................................................................................................................................................................................................................................................................................................13
2.6 Wi-Fi / Bluetooth ..............................................................................................................................................................................................................................................................................................13
2.7 Extension Buses.................................................................................................................................................................................................................................................................................................13
2.8 System Storage..................................................................................................................................................................................................................................................................................................14
2.9 Debug Header DB30 .......................................................................................................................................................................................................................................................................................15
2.10 Fan Control .......................................................................................................................................................................................................................................................................................................15
2.11 Power ..................................................................................................................................................................................................................................................................................................................15
2.12 Mechanical and Environmental ................................................................................................................................................................................................................................................................16
3. Block Diagram...........................................................................................................................................................................................................................................................................................................17
4. Pinout and Signal Descriptions ..........................................................................................................................................................................................................................................................................18

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4.1 Pin Summary.......................................................................................................................................................................................................................................................................................................18
4.2 Signal Terminology Descriptions................................................................................................................................................................................................................................................................22
4.3 Signal Description by Function ...................................................................................................................................................................................................................................................................23
4.4 Secondary Display Interface.........................................................................................................................................................................................................................................................................27
4.5 SMARC Pin-to-controller Mapping ...........................................................................................................................................................................................................................................................45
5. Software Support.....................................................................................................................................................................................................................................................................................................56
5.1 Yocto......................................................................................................................................................................................................................................................................................................................56
5.2 Android.................................................................................................................................................................................................................................................................................................................56
5.3 AI .............................................................................................................................................................................................................................................................................................................................56
6. Mechanical..................................................................................................................................................................................................................................................................................................................57
7. Thermal Solutions....................................................................................................................................................................................................................................................................................................58
7.1 Heatspreader: HTS ...........................................................................................................................................................................................................................................................................................58
7.2 Heatsink: THS .....................................................................................................................................................................................................................................................................................................59

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List of Figures
Figure 1 – Module function diagram......................................................................................................................................................................................................................................................................17
Figure 2 – Module top/botom side pin numbering .........................................................................................................................................................................................................................................18
Figure 3 – Module Dimensions.................................................................................................................................................................................................................................................................................57
Figure 4 – Heatspreader HTS.....................................................................................................................................................................................................................................................................................58
Figure 5 – Heatsink THS...............................................................................................................................................................................................................................................................................................59

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1. Introduction
1.1 LEC-MTK-i1200
ADLINK LEC-MTK-i1200 is aSMARC module based onMediaTek Genio 1200 (4xArm Cortex-A78 + 4x Cortex-A55) processor with up to 5 TOPS AI
Processor Unit (APU). The module incorporates a spate of IoTtechnologies, such as on-device artificial intelligence (AI) capabilities and up to 3 camera
support while delivering a low power envelope, making itthe ideal solution for robotic and drone applications across various sectors, including
consumer, enterprise, defense, industrial, logistics, and more.
1.2 The SMARC Form Factor
The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor Computer on Module definition targeting applications that require low
power and high performance at low costs.Typically under 6W, the modules often utilize ARM and other alternative low-power option CPUs, and are
used in many familiar handheld devices, such as tablet computers and smart phones.
Two module sizes are defined in SMARC: 82 mm x 50 mm and 82 mm x 80 mm.
The module PCBs have 314 edge fingers that mate with a low-profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes
identified as a 321 pin connector, with 7 pins used by the key).
SMARC modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot
flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the module. Modules are used
with application-specific carrier boards that implement other features such as audio codecs, touch controllers, wireless devices, etc.
The modular approach allows scalability, faster time to market and upgradability while still maintaining low costs, low power, and small physical size.
SMARC module and carrier specifications are available online at: https://www.sget.org/standards/smarc.html
Note: This module is compliant with the new 2.1.1 pinout.

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2. Specifications
2.1 Core System
SoC
MediaTek Genio i1200 8-core CPU:
•4x Arm Cortex-A78 (64KB L1 per core) + 4x Cortex-A55 (32KB L1 per core)
AI Accelerator
Top performance:
•Fix8 1966 GMACs, Fix16 983 GMACs, FP16 983 GMACs
•Supports Android NN asymmetric quantized data format
•Supports compressed weight to reduce DRAM BW
Memory
LPDDR4X SDRAM @2133MHz supporting up to 16GB system memory down
L2 Cache
System L2 cache (ECC), 256KB/core for Cortex-A78, 128KB per core for Cotex-A55
L3 Cache
Shared 2MB L3 cache
Security
Arm TrustZone security, TPM 2.0 (optional)

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2.2 Video
2.2.1 GPU / VPU
GPU Core
MALI G57 MC5 supporting 4K60
VPU Core
4x video data processing pipe (SVPP), 2x hard warping engine
Each video data processing pipe supports:
-HDR decode/encode/transcode, HDR10, DHR10+, HLG.
-Auto local contrast enhancement
-Image resizer, scaling ratio range 1/128 to 64
-Image sharpening
-Preference color tuning
Graphics
•3D graphic accelerator capable of processing 17600M pixel/sec @880MHz
•OpenGL ES 3.2/2.0/1.1
•Vulkan 1.1/1.0
•OpenCL 2.2

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2.2.2 Display Interfaces
MIPI DSI
2x MIPI DSI 4 lane, compliant with MIPI-DSI standard v1.2, max. resolution 4K p60
eDP
1x 4lane eDP port
HDMI
HDMI 2.0b , Supports a maximum display resolution of 4K p60
DP
Displayport 1.4, 4K p60
2.3 Camera
Supports CSI0 2-lane and CSI1 4-lane MIPI CSI2 camera input over MXM connector.
CSI2 on module feature connector (4 lanes)
2.4 Audio
Supports on-carrier I2S codec

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2.5 Dual Ethernet
Primary LAN
10/100/1000 Ethernet controller over RGMII with PHY
Supports 10/100/1000-Mbps data transfer rates, both full-duplex and half-duplex
Secondary LAN
10/100/1000 Ethernet controller over USB 3.0
Supports 10/100/1000-Mbps data transfer rates, both full-duplex and half-duplex
2.6 Wi-Fi / Bluetooth
M.2 1216 industry standard footprint with support for PCIe solder down modules
2.7 Extension Buses
PCIe
1x PCI Express Gen3 x1/x, 1x PCI Express Gen2 x1
USB
2x USB 3.0/2.0, 2x USB 2.0 coming from USB hub, 2 x USB 2.0 coming from SoC
UART
4x UART interfaces SER0,1,2,3 (SER2 derives from USB2UART)

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CAN bus
1x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps (over SPI optional)
SPI
2x SPI
I2S
1x I2S
I2C
4x I2C
Software programmable clock frequency:
-Standard mode: 100 kbit/s
-Fast mode: 400 kbit/s
GPIO
14 x GPIO with interrupt, one GPIO with PWM
2.8 System Storage
SDIO
1x SDIO (4-bit) compatible with SD3.0, MMC version 4.51 to edge connector
UFS Storage
Up to 256GB UFS

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2.9 Debug Header DB30
Multipurpose Connector: ADLINK standard 30-pin FPC with following pins
-Boot Select strap pins
-Serial port
2.10 Fan Control
Passive cooling, no fan control pins
2.11 Power
5.0V +/- 5%

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2.12 Mechanical and Environmental
Operating Temperature
Standard: 0 to 60°C commercial grade BOM (memory, eMMC, USB hub, SoC)
Rugged: -40 to 85°C industrial grade BOM (memory, eMMC, USB hub, SoC, TBD)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
EMI
EN55022 Class B inside an enclosure
Shock and Vibration
MIL-STD-202F, Method 213B, Table 213-I, Condition A.
MIL-STD-202F, Method 214A, Table 214-I, Condition D.
MTBF
300,000 hrs (at 40°C), 100,000 hrs (at 85°C),

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3. Block Diagram
LPDDR4
x16
LPDDR4
x16
LPDDR4
x16
BMC
LITE
4K HDMI / 4K DP
LVDS / DSI / eDP
USB 0,1
USB 2,3
LAN
LAN0
PCIe A,B
14x GPIO
CAN
SPI
SDIO
SER 0,1,2,3
I2S
4x I2C
Power
Management
CSI_0/1
MediaTek MT8395
4x Arm Cortex-A78 +
4x Arm Cortex-A55
USB 2.0 HO ST
USB 3.0 HO ST
HDMI / DP
eDP / DSI
GPIO
I2C
2L PC Ie Gen3
RGMII_0
LPDDR4
x16
NX P P TN 34 60
TPM 2.0
BT / Wi-Fi
SPI
PHY
PHY
HUB
SDIO
UART
CSI_2
UFS
64/128/256 GB
US B P1
PCIe x1
SPI
SPI2CAN
I2S
CSI
DSI option
SX1509
APU system
(APU + VPU)
A78
A78 A78
A78
A55
A55 A55
A55
Figure 1 – Module function diagram

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4. Pinout and Signal Descriptions
4.1 Pin Summary
The below table is a comprehensible list of all signal pins on the MXM 3 connector in the standard specification SMARC 2.1.
Signals not supported on LEC-MTK-i1200 are strikethrough STRIKETHROUGH
Top Side
P1 P74 P75
Key
P156
Bottom Side
S156 S76 S75
Key
S1
Figure 2 – Module top/botom side pin numbering

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P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P1
SMB_ALERT_1V8#
S1
CSI1_TX+ / I2C_CAM1_CK
P2
GND
S2
CSI1_TX- / I2C_CAM1_DAT
P3
CSI1_CK+
S3
GND
P4
CSI1_CK-
S4
RSVD
P5
GBE1_SDP
S5
CSI0_TX- / I2C_CAM0_CK
P6
GBE0_SDP
S6
CAM_MCK
P7
CSI1_RX0+
S7
CSI0_TX+ / I2C_CAM0_DAT
P8
CSI1_RX0-
S8
CSI0_CK+
P9
GND
S9
CSI0_CK-
P10
CSI1_RX1+
S10
GND
P11
CSI1_RX1-
S11
CSI0_RX0+
P12
GND
S12
CSI0_RX0-
P13
CSI1_RX2+
S13
GND
P14
CSI1_RX2-
S14
CSI0_RX1+
P15
GND
S15
CSI0_RX1-
P16
CSI1_RX3+
S16
GND
P17
CSI1_RX3-
S17
GBE1_MDI0+
P18
GND
S18
GBE1_MDI0-
P19
GBE0_MDI3-
S19
GBE1_LINK100#
P20
GBE0_MDI3+
S20
GBE1_MDI1+
P21
GBE0_LINK100#
S21
GBE1_MDI1-
P22
GBE0_LINK1000#
S22
GBE1_LINK1000#
P23
GBE0_MDI2-
S23
GBE1_MDI2+
P24
GBE0_MDI2+
S24
GBE1_MDI2-
P25
GBE0_LINK_ACT#
S25
GND
P26
GBE0_MDI1-
S26
GBE1_MDI3+
P27
GBE0_MDI1+
S27
GBE1_MDI3-
P28
GBE0_CTREF
S28
GBE1_CTREF
P29
GBE0_MDI0-
S29
PCIE_D_TX+ /
P30
GBE0_MDI0+
S30
PCIE_D_TX- / SERDES_1_TX-
P31
SPI0_CS1#
S31
GBE1_LINK_ACT#
P32
GND
S32
PCIE_D_RX+ /
P33
SDIO_WP
S33
PCIE_D_RX- /
P34
SDIO_CMD
S34
GND
P35
SDIO_CD#
S35
USB4+
P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P36
SDIO_CK
S36
USB4-
P37
SDIO_PWR_EN
S37
USB3_VBUS_DET
P38
GND
S38
AUDIO_MCK
P39
SDIO_D0
S39
I2S0_LRCK
P40
SDIO_D1
S40
I2S0_SDOUT
P41
SDIO_D2
S41
I2S0_SDIN
P42
SDIO_D3
S42
I2S0_CK
P43
SPI0_CS0#
S43
ESPI_ALERT0#
P44
SPI0_CK
S44
ESPI_ALERT1#
P45
SPI0_DIN
S45
MDIO_CLK
P46
SPI0_DO
S46
MDIO_DAT
P47
GND
S47
GND
P48
SATA_TX+
S48
I2C_GP_CK
P49
SATA_TX-
S49
I2C_GP_DAT
P50
GND
S50
HDA_SYNC / I2S2_LRCK
P51
SATA_RX+
S51
HDA_SDO / I2S2_SDOUT
P52
SATA_RX-
S52
HDA_SDI / I2S2_SDIN
P53
GND
S53
HDA_CK / I2S2_CK
P54
ESPI_CS0# / SPI1_CS0#
S54
SATA_ACT#
P55
ESPI_CS1# / SPI1_CS1#
S55
USB5_EN_OC#
P56
ESPI_CK / SPI1_CK
S56
ESPI_IO_2
P57
ESPI_IO_1 / SPI1_DIN
S57
ESPI_IO_3
P58
ESPI_IO_0 / SPI1_DO
S58
ESPI_RESET#
P59
GND
S59
USB5+
P60
USB0+
S60
USB5-
P61
USB0-
S61
GND
P62
USB0_EN_OC#
S62
USB3_SSTX+
P63
USB0_VBUS_DET
S63
USB3_SSTX-
P64
USB0_OTG_ID
S64
GND
P65
USB1+
S65
USB3_SSRX+
P66
USB1-
S66
USB3_SSRX-
P67
USB1_EN_OC#
S67
GND
P68
GND
S68
USB3+
P69
USB2+
S69
USB3-
P70
USB2-
S70
GND

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P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P71
USB2_EN_OC#
S71
USB2_SSTX+
P72
RSVD
S72
USB2_SSTX-
P73
RSVD
S73
GND
P74
USB3_EN_OC#
S74
USB2_SSRX+
S75
USB2_SSRX-
Key
Key
P75
PCIE_A_RST#
P76
USB4_EN_OC#
S76
PCIE_B_RST#
P77
PCIE_B_CKREQ#
S77
PCIE_C_RST#
P78
PCIE_A_CKREQ#
S78
PCIE_C_RX+ /
P79
GND
S79
PCIE_C_RX- / SERDES_2_RX-
P80
PCIE_C_REFCK+
S80
GND
P81
PCIE_C_REFCK-
S81
PCIE_C_TX+ /
P82
GND
S82
PCIE_C_TX- / SERDES_2_TX-
P83
PCIE_A_REFCK+
S83
GND
P84
PCIE_A_REFCK-
S84
PCIE_B_REFCK+
P85
GND
S85
PCIE_B_REFCK-
P86
PCIE_A_RX+
S86
GND
P87
PCIE_A_RX-
S87
PCIE_B_RX+
P88
GND
S88
PCIE_B_RX-
P89
PCIE_A_TX+
S89
GND
P90
PCIE_A_TX-
S90
PCIE_B_TX+
P91
GND
S91
PCIE_B_TX-
P92
HDMI_D2+ / DP1_LANE0+
S92
GND
P93
HDMI_D2- / DP1_LANE0-
S93
DP0_LANE0+
P94
GND
S94
DP0_LANE0-
P95
HDMI_D1+ / DP1_LANE1+
S95
DP0_AUX_SEL
P96
HDMI_D1- / DP1_LANE1-
S96
DP0_LANE1+
P97
GND
S97
DP0_LANE1-
P98
HDMI_D0+ / DP1_LANE2+
S98
DP0_HPD
P99
HDMI_D0- / DP1_LANE2-
S99
DP0_LANE2+
P100
GND
S100
DP0_LANE2-
P101
HDMI_CK+ / DP1_LANE3+
S101
GND
P102
HDMI_CK- / DP1_LANE3-
S102
DP0_LANE3+
P-Pin
Primary (Top) Side
S-Pin
Secondary (Bottom) Side
P103
GND
S103
DP0_LANE3-
P104
HDMI_HPD / DP1_HPD
S104
USB3_OTG_ID
P105
HDMI_CTRL_CK / DP1_AUX+
S105
DP0_AUX+
P106
HDMI_CTRL_DAT / DP1_AUX-
S106
DP0_AUX-
P107
DP1_AUX_SEL
S107
LCD1_BKLT_EN
P108
GPIO0 / CAM0_PWR#
S108
LVDS1_CK+ / DSI1_CLK+
P109
GPIO1 / CAM1_PWR#
S109
LVDS1_CK- / DSI1_CLK-
P110
GPIO2 / CAM0_RST#
S110
GND
P111
GPIO3 / CAM1_RST#
S111
LVDS1_0+ / eDP1_TX0+ /
P112
GPIO4 / HDA_RST#
S112
LVDS1_0- / eDP1_TX0- /
P113
GPIO5 / PWM_OUT
S113
eDP1_HPD / DSI1_TE
P114
GPIO6 / TACHIN
S114
LVDS1_1+ / eDP1_TX1+ /
P115
GPIO7
S115
LVDS1_1- / eDP1_TX1- /
P116
GPIO8
S116
LCD1_VDD_EN
P117
GPIO9
S117
LVDS1_2+ / eDP1_TX2+ /
P118
GPIO10
S118
LVDS1_2- / eDP1_TX2- /
P119
GPIO11
S119
GND
P120
GND
S120
LVDS1_3+ / eDP1_TX3+ /
P121
I2C_PM_CK
S121
LVDS1_3- / eDP1_TX3- /
P122
I2C_PM_DAT
S122
LCD1_BKLT_PWM
P123
BOOT_SEL0#
S123
GPIO13
P124
BOOT_SEL1#
S124
GND
P125
BOOT_SEL2#
S125
LVDS0_0+ / eDP0_TX0+ /
P126
RESET_OUT#
S126
LVDS0_0- / eDP0_TX0- /
P127
RESET_IN#
S127
LCD0_BKLT_EN
P128
POWER_BTN#
S128
LVDS0_1+ / eDP0_TX1+ /
P129
SER0_TX
S129
LVDS0_1- / eDP0_TX1- /
P130
SER0_RX
S130
GND
P131
SER0_RTS#
S131
LVDS0_2+/eDP0_TX2+/
P132
SER0_CTS#
S132
LVDS0_2- / eDP0_TX2- /
P133
GND
S133
LCD0_VDD_EN
P134
SER1_TX
S134
LVDS0_CK+/eDP0_AUX/
P135
SER1_RX
S135
LVDS0_CK-/eDP0_AUX-/
P136
SER2_TX
S136
GND
P137
SER2_RX
S137
LVDS0_3+ / eDP0_TX3+ /