ADLINK Technology SMARC LEC-MTK-I1200 User manual

COM-HPC-sIDH User’s Guide PICMG COM-HPC R1.1
Page 1 Copyright © 2023 ADLINK Technology, Inc.
LEC-MTK-I1200
Revision:
Date:
Rev. 0.1
2023-06-01
Part Number: 50M-72516-1000
User’s Guide

LEC-MTK-i1200 User’s Guide SGET SMARC Rev 2.1
Page 2 copyright © 2023 ADLINK Technology Inc.
Revision History
Revision
Description
Date
Author
0.1
Preliminary release
2023-06-01
CC

LEC-MTK-i1200 User’s Guide SGET SMARC Rev 2.1
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Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK
assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product
descriptions at any time, without notice.
Environmental Responsibility
ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product
disposal and/or recovery programs prescribed by their nation or company.
California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3-
dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known to
the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC,
and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more information go to
www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.
Copyright © 2023 ADLINK Technology Incorporated
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

LEC-MTK-i1200 User’s Guide SGET SMARC Rev 2.1
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Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment before
handling/operating the equipment.
Read these safety instructions carefully.
•Keep this manual for future reference.
•Read the specifications section of this manual for detailed information on the operating environment of this equipment.
•Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
•To avoid electrical shock and/or damage to equipment:
•Keep equipment away from water or liquid sources;
•Keep equipment away from high heat or high humidity;
•Keep equipment properly ventilated (do not block or cover ventilation openings);
•Make sure to use recommended voltage and power source settings;
•Always install and operate equipment near an easily accessible electrical socket outlet;
•Secure the power cord (do not place any object on/over the power cord);
•Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
•If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.
Conventions
The following conventions may be used throughout this manual, denoting special levels of information
Note: This information adds clarity or specifics to text and illustrations.
Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.
Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

LEC-MTK-i1200 User’s Guide SGET SMARC Rev 2.1
Page 5 copyright © 2023 ADLINK Technology Inc.
Getting Service
Ask an Expert: https://www.adlinktech.com/en/Askanexpert
ADLINK Technology, Inc.
No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan
Tel: [phone]
Fax: [phone]
Email: [e-mail]
Ampro ADLINK Technology, Inc.
6450 Via Del Oro, San Jose, CA 95119-1208, USA
Tel: [phone]
Toll Free: [phone] (USA only)
Fax: [phone]
Email: [e-mail]
ADLINK Technology (China) Co., Ltd.
300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China
Tel: [phone]
Fax: [phone]
Email: [e-mail]
ADLINK Technology GmbH
Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany
Tel: [phone]
Fax: [phone]
Email: [e-mail]
Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.

LEC-MTK-i1200 User’s Guide SGET SMARC Rev 2.1
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Table of Contents
Revision History ................................................................................................................................................................................................................................................................................................................ 2
Preface .................................................................................................................................................................................................................................................................................................................................. 3
1. Introduction ................................................................................................................................................................................................................................................................................................................... 9
1.1 LEC-MTK-i1200.................................................................................................................................................................................................................................................................................................... 9
1.2 The SMARC Form Factor.................................................................................................................................................................................................................................................................................. 9
2. Specifications.............................................................................................................................................................................................................................................................................................................10
2.1 Core System........................................................................................................................................................................................................................................................................................................10
2.2 Video......................................................................................................................................................................................................................................................................................................................11
2.3 Camera..................................................................................................................................................................................................................................................................................................................12
2.4 Audio .....................................................................................................................................................................................................................................................................................................................12
2.5 Dual Ethernet......................................................................................................................................................................................................................................................................................................13
2.6 Wi-Fi / Bluetooth ..............................................................................................................................................................................................................................................................................................13
2.7 Extension Buses.................................................................................................................................................................................................................................................................................................13
2.8 System Storage..................................................................................................................................................................................................................................................................................................14
2.9 Debug Header DB30 .......................................................................................................................................................................................................................................................................................15
2.10 Fan Control .......................................................................................................................................................................................................................................................................................................15
2.11 Power ..................................................................................................................................................................................................................................................................................................................15
2.12 Mechanical and Environmental ................................................................................................................................................................................................................................................................16
3. Block Diagram...........................................................................................................................................................................................................................................................................................................17
4. Pinout and Signal Descriptions ..........................................................................................................................................................................................................................................................................18

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4.1 Pin Summary.......................................................................................................................................................................................................................................................................................................18
4.2 Signal Terminology Descriptions................................................................................................................................................................................................................................................................22
4.3 Signal Description by Function ...................................................................................................................................................................................................................................................................23
4.4 Secondary Display Interface.........................................................................................................................................................................................................................................................................27
4.5 SMARC Pin-to-controller Mapping ...........................................................................................................................................................................................................................................................45
5. Software Support.....................................................................................................................................................................................................................................................................................................56
5.1 Yocto......................................................................................................................................................................................................................................................................................................................56
5.2 Android.................................................................................................................................................................................................................................................................................................................56
5.3 AI .............................................................................................................................................................................................................................................................................................................................56
6. Mechanical..................................................................................................................................................................................................................................................................................................................57
7. Thermal Solutions....................................................................................................................................................................................................................................................................................................58
7.1 Heatspreader: HTS ...........................................................................................................................................................................................................................................................................................58
7.2 Heatsink: THS .....................................................................................................................................................................................................................................................................................................59

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List of Figures
Figure 1 – Module function diagram......................................................................................................................................................................................................................................................................17
Figure 2 – Module top/botom side pin numbering .........................................................................................................................................................................................................................................18
Figure 3 – Module Dimensions.................................................................................................................................................................................................................................................................................57
Figure 4 – Heatspreader HTS.....................................................................................................................................................................................................................................................................................58
Figure 5 – Heatsink THS...............................................................................................................................................................................................................................................................................................59

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1. Introduction
1.1 LEC-MTK-i1200
ADLINK LEC-MTK-i1200 is aSMARC module based onMediaTek Genio 1200 (4xArm Cortex-A78 + 4x Cortex-A55) processor with up to 5 TOPS AI
Processor Unit (APU). The module incorporates a spate of IoTtechnologies, such as on-device artificial intelligence (AI) capabilities and up to 3 camera
support while delivering a low power envelope, making itthe ideal solution for robotic and drone applications across various sectors, including
consumer, enterprise, defense, industrial, logistics, and more.
1.2 The SMARC Form Factor
The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor Computer on Module definition targeting applications that require low
power and high performance at low costs.Typically under 6W, the modules often utilize ARM and other alternative low-power option CPUs, and are
used in many familiar handheld devices, such as tablet computers and smart phones.
Two module sizes are defined in SMARC: 82 mm x 50 mm and 82 mm x 80 mm.
The module PCBs have 314 edge fingers that mate with a low-profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes
identified as a 321 pin connector, with 7 pins used by the key).
SMARC modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot
flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the module. Modules are used
with application-specific carrier boards that implement other features such as audio codecs, touch controllers, wireless devices, etc.
The modular approach allows scalability, faster time to market and upgradability while still maintaining low costs, low power, and small physical size.
SMARC module and carrier specifications are available online at: https://www.sget.org/standards/smarc.html
Note: This module is compliant with the new 2.1.1 pinout.

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2. Specifications
2.1 Core System
SoC
MediaTek Genio i1200 8-core CPU:
•4x Arm Cortex-A78 (64KB L1 per core) + 4x Cortex-A55 (32KB L1 per core)
AI Accelerator
Top performance:
•Fix8 1966 GMACs, Fix16 983 GMACs, FP16 983 GMACs
•Supports Android NN asymmetric quantized data format
•Supports compressed weight to reduce DRAM BW
Memory
LPDDR4X SDRAM @2133MHz supporting up to 16GB system memory down
L2 Cache
System L2 cache (ECC), 256KB/core for Cortex-A78, 128KB per core for Cotex-A55
L3 Cache
Shared 2MB L3 cache
Security
Arm TrustZone security, TPM 2.0 (optional)