ADLINK Technology COM Express cExpress-BT2 User manual

cExpress-BT2
User’s Manual
COM Express Compact Size Type 2Module with
Intel Atom® E3800 and Celeron® Processor SoC
Manual Rev.: 1.2
Revision Date: April 7, 2020
Part Number: 50-1J052-1020

ii Preface
Preface
Copyright
Copyright © 2014-2020 ADLINK Technology, Inc. This document contains proprietary information protected by
copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other
means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation
through compliance with the European Union's Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental
protection is a top priority for ADLINK. We have enforced measures to ensure that our
products, manufacturing processes, components, and raw materials have as little impact on
the environment as possible. When products are at their end of life, our customers are
encouraged to dispose of them in accordance with the product disposal and/or recovery
programs prescribed by their nation or company.
Battery Labels (for products with battery)
廢電池請回收
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arsenic, benzene,
cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP,
styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause
cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP,
DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
Revision History
Revision
Description
Date
By
1.00 Initial release 2014-09-24 JC
1.01 Correct specifications (memory, GPIO, LAN, serial port, GPIO, eMMC, OS) 2015-09-14 JC
1.2 Update BIOS 2020-04-07 JC

cExpress-BT2
Preface iii
Table of Contents
Preface................................................................................................................................ii
List of Figures ....................................................................................................................v
List of Tables.....................................................................................................................vi
1. Introduction................................................................................................................1
2. Specifications ............................................................................................................3
2.1. Core System...............................................................................................................3
2.2. Expansion Busses......................................................................................................3
2.3. Video...........................................................................................................................4
2.4. Audio...........................................................................................................................4
2.5. LAN.............................................................................................................................4
2.6. Multi I/O and Storage..................................................................................................4
2.7. SEMA Board Controller ..............................................................................................5
2.8. Debug.........................................................................................................................5
2.9. Trusted Platform Module (TPM) .................................................................................5
2.10. Power Specifications...............................................................................................5
2.11. Operating Temperatures .........................................................................................5
2.12. Environmental .........................................................................................................6
2.13. Specification Compliance........................................................................................6
2.14. Operating Systems..................................................................................................6
2.15. Functional Diagram .................................................................................................7
2.16. Mechanical Dimensions...........................................................................................8
3. Pinouts and Signal Descriptions..............................................................................9
3.1. AB/CD Pin Definitions.................................................................................................9
3.2. Signal Description Terminology................................................................................12
3.3. AB Signal Descriptions.............................................................................................13
3.4. CD Signal Descriptions.............................................................................................23
4. Module Interfaces....................................................................................................27
4.1. Connector, Switch and LED Locations.....................................................................27
4.2. 40-pin Debug Connector...........................................................................................28
4.3. Status LEDs..............................................................................................................29
4.4. XDP Debug Header..................................................................................................30
4.5. Fan Connector..........................................................................................................31
4.6. BIOS Setup Defaults Reset Button...........................................................................32

iv Preface
5. Smart Embedded Management Agent (SEMA) .....................................................33
5.1. Board Specific SEMA Functions...............................................................................34
6. System Resources ..................................................................................................37
6.1. System Memory Map................................................................................................37
6.2. I/O Map.....................................................................................................................37
6.3. Interrupt Request (IRQ) Lines...................................................................................38
6.4. PCI Configuration Space Map..................................................................................40
6.5. PCI Interrupt Routing Map........................................................................................41
6.6. PCI Interrupt Routing Map........................................................................................41
7. BIOS Setup...............................................................................................................43
7.1. Menu Structure.........................................................................................................43
7.2. Main..........................................................................................................................44
7.3. Advanced..................................................................................................................49
7.4. Boot ..........................................................................................................................61
7.5. Security.....................................................................................................................63
7.6. Save & Exit...............................................................................................................64
8. BIOS Checkpoints, Beep Codes.............................................................................65
8.1. Status Code Ranges.................................................................................................66
8.2. Standard Status Codes.............................................................................................66
8.3. OEM-Reserved Checkpoint Ranges.........................................................................73
9. Mechanical Information...........................................................................................75
9.1. Board-to-Board Connectors......................................................................................75
9.2. Thermal Solution.......................................................................................................76
9.3. Mounting Methods....................................................................................................79
9.4. Standoff Types..........................................................................................................80
Safety Instructions...........................................................................................................81
Getting Service.................................................................................................................82

cExpress-BT2
Preface v
List of Figures
Figure 1: cExpress-BT2 Functional Block Diagram .................................................................................7
Figure 2: cExpress-BT2 Mechanical Drawing..........................................................................................8
Figure 3: cExpress-BT2 Connector, Switch and LED Locations............................................................27
Figure 4: cExpress-BT2 and the DB40 Debug Module..........................................................................27
Figure 6: COM Express Mounting Methods...........................................................................................79
Figure 7: COM Express Standoff Types.................................................................................................80

vi Preface
List of Tables
Table 1: cExpress-BT2 AB/CD Pin Definitions.........................................................................................9
Table 2: 40-pin Debug Connector Pin Definition....................................................................................28
Table 3: cExpress-BT2 LED Descriptions..............................................................................................29
Table 4: MIPI60 Debug Header Pin Definition.......................................................................................30
Table 5: Fan Connector Pin Definition ...................................................................................................31
Table 7: SEMA Onboard Voltage Monitor..............................................................................................34
Table 8: SEMA BMC Status...................................................................................................................34
Table 9: SEMA Exception Codes...........................................................................................................35
Table 10: SEMA BMC Flags...................................................................................................................35

cExpress-BT2
Introduction 1
1. Introduction
The cExpress-BT2 is a COM Express® COM.0 R2.1 Type 2 module supporting the Intel Atom® E3800 processor
and Intel® Celeron® processor, memory controller, and graphics processor on a single-chip design. The cExpress-
BT2 is specifically designed for customers who need high-level processing and graphics performancewith low
power consumption in a long product life solution.
The cExpress-BT2 features the Intel Atom® E3800 processor and Intel® Celeron® processor supporting non-ECC
type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance.
Integrated Intel® 7th Generation HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1
support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include VGA and dual-channel 18/24-bit
LVDS. The cExpress-BT2 is specifically designed for customers with high-performance graphics processing
requirements who want to outsource the custom core logic of their systems for reduced development time.
The cExpress-BT2 has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. In addition,
an onboard eMCC memory is supported (optional, 8GB/16GB/32GB).
The cExpress-BT2 features a single onboard Gigabit Ethernet port, USB 2.0 ports, PATA and SATA 3 Gb/s ports,
and PCI 2.3. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS
backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog
timer.

2 Introduction
This page intentionally left blank.

cExpress-BT2
Specifications 3
2. Specifications
2.1. Core System
CPU Single, dual or quad-core Intel Atom® or Celeron® Processor
•Intel Atom® E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333)
•Intel Atom® E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333)
•Intel Atom® E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066)
•Intel Atom® E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066)
•Intel Atom® E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066)
•Intel Atom® E3805 1.33 GHz (No Graphics) 3W (2C/1066)
•Celeron® N2930 1.83/2.16 (Burst) GHz, 311/854 (Turbo) 7.5W (4C/1333)
•Celeron® J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)
Single, dual or quad Out-of-Order Execution (OOE) processor cores. Intel® VT-x, Intel®
SSE4.1 and SSE4.2, Intel® 64 architecture, IA 32-bit, PCLMULQDQ Instruction. DRNG,
Intel® Thermal Monitor (TM1 & TM2)
Notes:
Availability of features may vary between processor SKUs.
Cache •2MB L2 Cache: E3845, N2930 and J1900
•1MB L2 Cache: E3827, E3826, E3825 and E3805
•512k L2 Cache: E3815
Memory Non-ECC 1066/1333 MHz DDR3L memory up to 8GB
•Dual stacked SODIMM sockets: E3845, E3827, E3826, N2930, J1900 (lower slot must
be populated)
•Single SODIMM socket: E3825, E3815, E3805
BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
2.2. Expansion Busses
PCI Express •2 PCI Express x1 (AB): Lanes 0/1
Other •1 PCI (CD): PCI 2.3, 32-bit, 33MHz
•LPC bus, SMBus (system), I2C (user)

4 Specifications
2.3. Video
Integrated on Processor 7th generation graphics Intel core architecture with four execution units supporting two
independent displays
GPU Feature Support •3D graphics hardware acceleration
•Support for DirectX 11, OpenCL 1.1, OpenGL ES Halti/2.0/1.1, OpenGL 3.2
•Video decode hardware acceleration including support for H.264, MPEG2, MVC, VC-1,
WMV9 and VP8 formats
•Video encode hardware acceleration including support for H.264, MPEG2 and MVC
formats
•Playback of Blu-ray disc 3D content using HDMI (1.4a spec compliant with 3D)
Note: Availability of features may vary between operating systems.
Display Types •Dual channel 18/24-bit LVDS through eDP-to-LVDS bridge (use DDI0 signal of SoC)
•
VGA
supporting resolutions of up to 2560x1600x24bpp @60Hz
2.4. Audio
Integrated Intel® HD Audio integrated on SoC
Codec Located on carrier Express-BASE2 (ALC886 standard support)
2.5. LAN
MAC/PHY Intel® Ethernet Controller I210
Interface 10/100/1000 Mbit/s connection
2.6. Multi I/O and Storage
USB 7x USB 1.1/2.0 (USB 0/1/2/3/4/5/6, ports 3~6 from USB hub)
SATA 1x SATA 3Gb/s (SATA0)
Build option two SATA 3GB/s (SATA0, SATA1) when PATA bridge is not used (lose PATA
function)
PATA 1x PATA port (through SATA to PATA bridge)
GPIO 4 GPO and 4 GPI
eMMC Soldered on module bootable eMMC flash storage 8GB or 16GB or 32GB (optional,
support dependent on OS)