ADLINK Technology COM Express cExpress-BT2 User manual

cExpress-BT2
User’s Manual
COM Express Compact Size Type 2Module with
Intel Atom® E3800 and Celeron® Processor SoC
Manual Rev.: 1.2
Revision Date: April 7, 2020
Part Number: 50-1J052-1020

ii Preface
Preface
Copyright
Copyright © 2014-2020 ADLINK Technology, Inc. This document contains proprietary information protected by
copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other
means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation
through compliance with the European Union's Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental
protection is a top priority for ADLINK. We have enforced measures to ensure that our
products, manufacturing processes, components, and raw materials have as little impact on
the environment as possible. When products are at their end of life, our customers are
encouraged to dispose of them in accordance with the product disposal and/or recovery
programs prescribed by their nation or company.
Battery Labels (for products with battery)
廢電池請回收
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arsenic, benzene,
cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP,
styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause
cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP,
DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
Revision History
Revision
Description
Date
By
1.00 Initial release 2014-09-24 JC
1.01 Correct specifications (memory, GPIO, LAN, serial port, GPIO, eMMC, OS) 2015-09-14 JC
1.2 Update BIOS 2020-04-07 JC

cExpress-BT2
Preface iii
Table of Contents
Preface................................................................................................................................ii
List of Figures ....................................................................................................................v
List of Tables.....................................................................................................................vi
1. Introduction................................................................................................................1
2. Specifications ............................................................................................................3
2.1. Core System...............................................................................................................3
2.2. Expansion Busses......................................................................................................3
2.3. Video...........................................................................................................................4
2.4. Audio...........................................................................................................................4
2.5. LAN.............................................................................................................................4
2.6. Multi I/O and Storage..................................................................................................4
2.7. SEMA Board Controller ..............................................................................................5
2.8. Debug.........................................................................................................................5
2.9. Trusted Platform Module (TPM) .................................................................................5
2.10. Power Specifications...............................................................................................5
2.11. Operating Temperatures .........................................................................................5
2.12. Environmental .........................................................................................................6
2.13. Specification Compliance........................................................................................6
2.14. Operating Systems..................................................................................................6
2.15. Functional Diagram .................................................................................................7
2.16. Mechanical Dimensions...........................................................................................8
3. Pinouts and Signal Descriptions..............................................................................9
3.1. AB/CD Pin Definitions.................................................................................................9
3.2. Signal Description Terminology................................................................................12
3.3. AB Signal Descriptions.............................................................................................13
3.4. CD Signal Descriptions.............................................................................................23
4. Module Interfaces....................................................................................................27
4.1. Connector, Switch and LED Locations.....................................................................27
4.2. 40-pin Debug Connector...........................................................................................28
4.3. Status LEDs..............................................................................................................29
4.4. XDP Debug Header..................................................................................................30
4.5. Fan Connector..........................................................................................................31
4.6. BIOS Setup Defaults Reset Button...........................................................................32

iv Preface
5. Smart Embedded Management Agent (SEMA) .....................................................33
5.1. Board Specific SEMA Functions...............................................................................34
6. System Resources ..................................................................................................37
6.1. System Memory Map................................................................................................37
6.2. I/O Map.....................................................................................................................37
6.3. Interrupt Request (IRQ) Lines...................................................................................38
6.4. PCI Configuration Space Map..................................................................................40
6.5. PCI Interrupt Routing Map........................................................................................41
6.6. PCI Interrupt Routing Map........................................................................................41
7. BIOS Setup...............................................................................................................43
7.1. Menu Structure.........................................................................................................43
7.2. Main..........................................................................................................................44
7.3. Advanced..................................................................................................................49
7.4. Boot ..........................................................................................................................61
7.5. Security.....................................................................................................................63
7.6. Save & Exit...............................................................................................................64
8. BIOS Checkpoints, Beep Codes.............................................................................65
8.1. Status Code Ranges.................................................................................................66
8.2. Standard Status Codes.............................................................................................66
8.3. OEM-Reserved Checkpoint Ranges.........................................................................73
9. Mechanical Information...........................................................................................75
9.1. Board-to-Board Connectors......................................................................................75
9.2. Thermal Solution.......................................................................................................76
9.3. Mounting Methods....................................................................................................79
9.4. Standoff Types..........................................................................................................80
Safety Instructions...........................................................................................................81
Getting Service.................................................................................................................82

cExpress-BT2
Preface v
List of Figures
Figure 1: cExpress-BT2 Functional Block Diagram .................................................................................7
Figure 2: cExpress-BT2 Mechanical Drawing..........................................................................................8
Figure 3: cExpress-BT2 Connector, Switch and LED Locations............................................................27
Figure 4: cExpress-BT2 and the DB40 Debug Module..........................................................................27
Figure 6: COM Express Mounting Methods...........................................................................................79
Figure 7: COM Express Standoff Types.................................................................................................80

vi Preface
List of Tables
Table 1: cExpress-BT2 AB/CD Pin Definitions.........................................................................................9
Table 2: 40-pin Debug Connector Pin Definition....................................................................................28
Table 3: cExpress-BT2 LED Descriptions..............................................................................................29
Table 4: MIPI60 Debug Header Pin Definition.......................................................................................30
Table 5: Fan Connector Pin Definition ...................................................................................................31
Table 7: SEMA Onboard Voltage Monitor..............................................................................................34
Table 8: SEMA BMC Status...................................................................................................................34
Table 9: SEMA Exception Codes...........................................................................................................35
Table 10: SEMA BMC Flags...................................................................................................................35

cExpress-BT2
Introduction 1
1. Introduction
The cExpress-BT2 is a COM Express® COM.0 R2.1 Type 2 module supporting the Intel Atom® E3800 processor
and Intel® Celeron® processor, memory controller, and graphics processor on a single-chip design. The cExpress-
BT2 is specifically designed for customers who need high-level processing and graphics performancewith low
power consumption in a long product life solution.
The cExpress-BT2 features the Intel Atom® E3800 processor and Intel® Celeron® processor supporting non-ECC
type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance.
Integrated Intel® 7th Generation HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1
support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include VGA and dual-channel 18/24-bit
LVDS. The cExpress-BT2 is specifically designed for customers with high-performance graphics processing
requirements who want to outsource the custom core logic of their systems for reduced development time.
The cExpress-BT2 has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. In addition,
an onboard eMCC memory is supported (optional, 8GB/16GB/32GB).
The cExpress-BT2 features a single onboard Gigabit Ethernet port, USB 2.0 ports, PATA and SATA 3 Gb/s ports,
and PCI 2.3. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS
backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog
timer.

2 Introduction
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cExpress-BT2
Specifications 3
2. Specifications
2.1. Core System
CPU Single, dual or quad-core Intel Atom® or Celeron® Processor
•Intel Atom® E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333)
•Intel Atom® E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333)
•Intel Atom® E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066)
•Intel Atom® E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066)
•Intel Atom® E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066)
•Intel Atom® E3805 1.33 GHz (No Graphics) 3W (2C/1066)
•Celeron® N2930 1.83/2.16 (Burst) GHz, 311/854 (Turbo) 7.5W (4C/1333)
•Celeron® J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)
Single, dual or quad Out-of-Order Execution (OOE) processor cores. Intel® VT-x, Intel®
SSE4.1 and SSE4.2, Intel® 64 architecture, IA 32-bit, PCLMULQDQ Instruction. DRNG,
Intel® Thermal Monitor (TM1 & TM2)
Notes:
Availability of features may vary between processor SKUs.
Cache •2MB L2 Cache: E3845, N2930 and J1900
•1MB L2 Cache: E3827, E3826, E3825 and E3805
•512k L2 Cache: E3815
Memory Non-ECC 1066/1333 MHz DDR3L memory up to 8GB
•Dual stacked SODIMM sockets: E3845, E3827, E3826, N2930, J1900 (lower slot must
be populated)
•Single SODIMM socket: E3825, E3815, E3805
BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
2.2. Expansion Busses
PCI Express •2 PCI Express x1 (AB): Lanes 0/1
Other •1 PCI (CD): PCI 2.3, 32-bit, 33MHz
•LPC bus, SMBus (system), I2C (user)

4 Specifications
2.3. Video
Integrated on Processor 7th generation graphics Intel core architecture with four execution units supporting two
independent displays
GPU Feature Support •3D graphics hardware acceleration
•Support for DirectX 11, OpenCL 1.1, OpenGL ES Halti/2.0/1.1, OpenGL 3.2
•Video decode hardware acceleration including support for H.264, MPEG2, MVC, VC-1,
WMV9 and VP8 formats
•Video encode hardware acceleration including support for H.264, MPEG2 and MVC
formats
•Playback of Blu-ray disc 3D content using HDMI (1.4a spec compliant with 3D)
Note: Availability of features may vary between operating systems.
Display Types •Dual channel 18/24-bit LVDS through eDP-to-LVDS bridge (use DDI0 signal of SoC)
•
VGA
supporting resolutions of up to 2560x1600x24bpp @60Hz
2.4. Audio
Integrated Intel® HD Audio integrated on SoC
Codec Located on carrier Express-BASE2 (ALC886 standard support)
2.5. LAN
MAC/PHY Intel® Ethernet Controller I210
Interface 10/100/1000 Mbit/s connection
2.6. Multi I/O and Storage
USB 7x USB 1.1/2.0 (USB 0/1/2/3/4/5/6, ports 3~6 from USB hub)
SATA 1x SATA 3Gb/s (SATA0)
Build option two SATA 3GB/s (SATA0, SATA1) when PATA bridge is not used (lose PATA
function)
PATA 1x PATA port (through SATA to PATA bridge)
GPIO 4 GPO and 4 GPI
eMMC Soldered on module bootable eMMC flash storage 8GB or 16GB or 32GB (optional,
support dependent on OS)

cExpress-BT2
Specifications 5
2.7. SEMA Board Controller
Type:ADLINK Smart Embedded Management Agent (SEMA)
Functions:
•Voltage/Current monitoring
•Power sequence debug support
•AT/ATX mode control
•Logistics and forensic information
•Flat panel control
•General purpose I2C
•Failsafe BIOS (dual BIOS by build option)
•Watchdog timer and fan control
2.8. Debug
40-pin flat cable connector to be used with DB-40 debug module
Supports: BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
MIPI60 60-pin header for debug of SoC (build option)
2.9. Trusted Platform Module (TPM)
Chipset: AT97SC3204 (build option)
Type:TPM 1.2
2.10. Power Specifications
Power Modes
AT and ATX mode (AT mode startup controlled by SEMA Board Controller)
Standard Voltage Input
ATX: 12V ±5% / 5Vsb ±5%, or AT: 12V ±5%
Wide Voltage Input
ATX: 5-20 V / 5Vsb ±5% , or AT: 5-20 V
Power Management
ACPI 4.0 compliant, Smart Battery support
Power States Supports C1-C6, S0, S3, S4, S5, S5 ECO mode (Wake-on-USB S3/S4, WoL S3/S4/S5)
ECO Mode Supports deep S5 (S5 ECO mode) for 5Vsb power saving
Please contact your ADLINK representative for the document “COM Express Module Power Consumption”.
2.11. Operating Temperatures
Standard Operating
Temperature 0°C to +60°C (Wide Voltage Input)
Storage: -20°C to +70°C
Extreme Rugged Operating
Temperature (optional)* -40°C to +85°C (Standard Voltage Input only, build option supported by Atom™ SKUs
only)
Storage: -40°C to +85°C
*Intel Atom® E3800 Series processors only

6 Specifications
2.12. Environmental
Humidity Operating: 5-90% RH, non-condensing
Storage: 5-95% RH (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I,
Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
2.13. Specification Compliance
PICMG COM.0: Rev. 2.1 Type 2, Compact size 95 x 95 mm
2.14. Operating Systems
Standard Support •Windows 7/8 32/64-bit
• Linux 32/64-bit
Extended Support (BSP) •WES7/8
•WEC7 32-bit
•Linux 32/64-bit
•VxWorks

cExpress-BT2
Specifications 7
2.15. Functional Diagram
GbE
i210
AB
LVDS
eDP to LVDS
Realtek Intel Atom®
E3845
E3827
E3826
E3825
E3815
Intel® Celeron®
N2930
J1900
(formerly “Baytrail” )
CD
SODIMM
1~4 GB DDR3L
non ECC
Analog VGA
HD Audio
1x SATA 3Gb/s
(port 0)
XDP
2 PCIe x1 Gen2
(port 0, 1)
PCIe x1 Gen2
(port 3)
UART0, UART1
eMMC
8/16/32GB
LM73
TPM
Atmel
AT97SC3204
GPIO
PCA9535
SEMA
BMC
SMBus
4x GP0
GP I
2
C
SPI 0
BIOS
LPC bus
SPI
4x GPI
SPI 1
BIOS
DDC I
2
C
SPI
SPI_CS#
SODIMM
1~4 GB DDR3L
non ECC
SATA to
PATA
1x SATA 3Gb/s
(port 1)
PCIe to
PCI
PCIe x 1
(port 2)
DDI0
eDP 2 lanes
3x USB 1.1/2.0
(port 0~2)
1x SATA 3Gb/s
(port 1)
SMBus
USB
Hub
1x USB 1.1/2.0
4x
USB1.1/2.0
(port 3~6)
Figure 1: cExpress-BT2 Functional Block Diagram

8 Specifications
2.16. Mechanical Dimensions
Top View
Side View
All Ø tolerances ± 0.05 mm
Other tolerances ± 0.2 mm
All are dimensions shown in millimeters.
Figure 2: cExpress-BT2 Mechanical Drawing

cExpress-BT2
Pinouts and Signal Descriptions 9
3. Pinouts and Signal Descriptions
3.1. AB/CD Pin Definitions
The cExpress-BT2 is a Type 6 module supporting USB 3.0 upgrade signals and DDI channels on the CD connector
All pins in the COM Express specification are described, including those not supported on the cExpress-BT2.
Those not supported on the cExpress-BT2 module are crossed out.
Table 1: cExpress-BT2 AB/CD Pin Definitions
Row A Row B Row C Row D
Pin Name Pin Name Pin Name Pin Name
A1
GND (FIXED)
B1
GND (FIXED)
C1
GND FIXED)
D1
GND FIXED)
A2
GBE0_MDI3-
B2
GBE0_ACT#
C2
IDE_D7
D2
IDE_D5
A3
GBE0_MDI3+
B3
LPC_FRAME#
C3
IDE_D6
D3
IDE_D10
A4
GBE0_LINK100#
B4
LPC_AD0
C4
IDE_D3
D4
IDE_D11
A5
GBE0_LINK1000#
B5
LPC_AD1
C5
IDE_D15
D5
IDE_D12
A6
GBE0_MDI2-
B6
LPC_AD2
C6
IDE_D8
D6
IDE_D4
A7
GBE0_MDI2+
B7
LPC_AD3
C7
IDE_D9
D7
IDE_D0
A8
GBE0_LINK#
B8
LPC_DRQ0#
C8
IDE_D2
D8
IDE_REQ
A9
GBE0_MDI1-
B9
LPC_DRQ1#
C9
IDE_D13
D9
IDE_IOW#
A10
GBE0_MDI1+
B10
LPC_CLK
C10
IDE_D1
D10
IDE_ACK#
A11
GND (FIXED)
B11
GND (FIXED)
C11
GND (FIXED)
D11
GND (FIXED)
A12
GBE0_MDI0-
B12
PWRBTN#
C12
IDE_D14
D12
IDE_IRQ
A13
GBE0_MDI0+
B13
SMB_CK
C13
IDE_IORDY
D13
IDE_A0
A14
GBE0_CTREF
B14
SMB_DAT
C14
IDE_IOR#
D14
IDE_A1
A15
SUS_S3#
B15
SMB_ALERT#
C15
PCI_PME#
D15
IDE_A2
A16
SATA0_TX+
B16
SATA1_TX+ *
C16
PCI_GNT2#
D16
IDE_CS1#
A17
SATA0_TX-
B17
SATA1_TX- *
C17
PCI_REQ2#
D17
IDE_CS3#
A18
SUS_S4#
B18
SUS_STAT#
C18
PCI_GNT1#
D18
IDE_RESET#
A19
SATA0_RX+
B19
SATA1_RX+ *
C19
PCI_REQ1#
D19
PCI_GNT3#
A20
SATA0_RX-
B20
SATA1_RX- *
C20
PCI_GNT0#
D20
PCI_REQ3#
A21
GND (FIXED)
B21
GND (FIXED)
C21
GND (FIXED)
D21
GND (FIXED)
A22
SATA2_TX+
B22
SATA3_TX+
C22
PCI_REQ0#
D22
PCI_AD1
A23
SATA2_TX-
B23
SATA3_TX-
C23
PCI_RESET#
D23
PCI_AD3
A24
SUS_S5#
B24
PWR_OK
C24
PCI_AD0
D24
PCI_AD5
A25
SATA2_RX+
B25
SATA3_RX+
C25
PCI_AD2
D25
PCI_AD7
A26
SATA2_RX-
B26
SATA3_RX-
C26
PCI_AD4
D26
PCI_C/BE0#
A27
BATLOW#
B27
WDT
C27
PCI_AD6
D27
PCI_AD9
A28
(S)ATA_ACT#
B28
AC/HDA_SDIN2
C28
PCI_AD8
D28
PCI_AD11
A29
AC/HDA_SYNC
B29
AC/HDA_SDIN1
C29
PCI_AD10
D29
PCI_AD13
A30
AC/HDA_RST#
B30
AC/HDA_SDIN0
C30
PCI_AD12
D30
PCI_AD15
A31
GND (FIXED)
B31
GND (FIXED)
C31
GND (FIXED)
D31
GND (FIXED)
A32
AC/HDA_BITCLK
B32
SPKR
C32
PCI_AD14
D32
PCI_PAR
A33
AC/HDA_SDOUT
B33
I2C_CK
C33
PCI_C/BE1#
D33
PCI_SERR#
A34
BIOS_DIS0#
B34
I2C_DAT
C34
PCI_PERR#
D34
PCI_STOP#
A35
THRMTRIP#
B35
THRM#
C35
PCI_LOCK#
D35
PCI_TRDY#

10 Pinouts and Signal Descriptions
Row A Row B Row C Row D
Pin Name Pin Name Pin Name Pin Name
A36
USB6-
B36
USB7-
C36
PCI_DEVSEL#
D36
PCI_FRAME#
A37
USB6+
B37
USB7+
C37
PCI_IRDY#
D37
PCI_AD16
A38
USB_6_7_OC#
B38
USB_4_5_OC#
C38
PCI_C/BE2#
D38
PCI_AD18
A39
USB4-
B39
USB5-
C39
PCI_AD17
D39
PCI_AD20
A40
USB4+
B40
USB5+
C40
PCI_AD19
D40
PCI_AD22
A41
GND (FIXED)
B41
GND (FIXED)
C41
GND (FIXED)
D41
GND (FIXED)
A42
USB2-
B42
USB3-
C42
PCI_AD21
D42
PCI_AD24
A43
USB2+
B43
USB3+
C43
PCI_AD23
D43
PCI_AD26
A44
USB_2_3_OC#
B44
USB_0_1_OC#
C44
PCI_C/BE3#
D44
PCI_AD28
A45
USB0-
B45
USB1-
C45
PCI_AD25
D45
PCI_AD30
A46
USB0+
B46
USB1+
C46
PCI_AD27
D46
PCI_IRQC#
A47
VCC_RTC
B47
EXCD1_PERST#
C47
PCI_AD29
D47
PCI_IRQD#
A48
EXCD0_PERST#
B48
EXCD1_CPPE#
C48
PCI_AD31
D48
PCI_CLKRUN#
A49
EXCD0_CPPE#
B49
SYS_RESET#
C49
PCI_IRQA#
D49
PCI_M66EN GND)
A50
LPC_SERIRQ
B50
CB_RESET#
C50
PCI_IRQB#
D50
PCI_CLK
A51
GND (FIXED)
B51
GND (FIXED)
C51
GND (FIXED)
D51
GND (FIXED)
A52
PCIE_TX5+
B52
PCIE_RX5+
C52
PEG_RX0+
D52
PEG_TX0+
A53
PCIE_TX5-
B53
PCIE_RX5-
C53
PEG_RX0-
D53
PEG_TX0-
A54
GPI0
B54
GPO1
C54
TYPE0#
D54
PEG_LANE_RV#
A55
PCIE_TX4+
B55
PCIE_RX4+
C55
PEG_RX1+
D55
PEG_TX1+
A56
PCIE_TX4-
B56
PCIE_RX4-
C56
PEG_RX1-
D56
PEG_TX1-
A57
GND
B57
GPO2
C57
TYPE1#
D57
TYPE2#
A58
PCIE_TX3+
B58
PCIE_RX3+
C58
PEG_RX2+
D58
PEG_TX2+
A59
PCIE_TX3-
B59
PCIE_RX3-
C59
PEG_RX2-
D59
PEG_TX2-
A60
GND (FIXED)
B60
GND (FIXED)
C60
GND (FIXED)
D60
GND (FIXED)
A61
PCIE_TX2+
B61
PCIE_RX2+
C61
PEG_RX3+
D61
PEG_TX3+
A62
PCIE_TX2-
B62
PCIE_RX2-
C62
PEG_RX3-
D62
PEG_TX3-
A63
GPI1
B63
GPO3
C63
RSVD
D63
RSVD
A64
PCIE_TX1+
B64
PCIE_RX1+
C64
RSVD
D64
RSVD
A65
PCIE_TX1-
B65
PCIE_RX1-
C65
PEG_RX4+
D65
PEG_TX4+
A66
GND
B66
WAKE0#
C66
PEG_RX4-
D66
PEG_TX4-
A67
GPI2
B67
WAKE1#
C67
RSVD
D67
GND
A68
PCIE_TX0+
B68
PCIE_RX0+
C68
PEG_RX5+
D68
PEG_TX5+
A69
PCIE_TX0-
B69
PCIE_RX0-
C69
PEG_RX5-
D69
PEG_TX5-
A70
GND (FIXED)
B70
GND (FIXED)
C70
GND (FIXED)
D70
GND (FIXED)
A71
LVDS_A0+
B71
LVDS_B0+
C71
PEG_RX6+
D71
PEG_TX6+
A72
LVDS_A0-
B72
LVDS_B0-
C72
PEG_RX6-
D72
PEG_TX6-
A73
LVDS_A1+
B73
LVDS_B1+
C73
SDVO_DATA
D73
SDVO_CLK
A74
LVDS_A1-
B74
LVDS_B1-
C74
PEG_RX7+
D74
PEG_TX7+
A75
LVDS_A2+
B75
LVDS_B2+
C75
PEG_RX7-
D75
PEG_TX7-
A76
LVDS_A2-
B76
LVDS_B2-
C76
GND
D76
GND
A77
LVDS_VDD_EN
B77
LVDS_B3+
C77
RSVD
D77
IDE_CBLID#
A78
LVDS_A3+
B78
LVDS_B3-
C78
PEG_RX8+
D78
PEG_TX8+
A79
LVDS_A3-
B79
LVDS_BKLT_EN
C79
PEG_RX8-
D79
PEG_TX8-

cExpress-BT2
Pinouts and Signal Descriptions 11
Row A Row B Row C Row D
Pin Name Pin Name Pin Name Pin Name
A80
GND (FIXED)
B80
GND (FIXED)
C80
GND (FIXED)
D80
GND (FIXED)
A81
LVDS_A_CK+
B81
LVDS_B_CK+
C81
PEG_RX9+
D81
PEG_TX9+
A82
LVDS_A_CK-
B82
LVDS_B_CK-
C82
PEG_RX9-
D82
PEG_TX9-
A83
LVDS_I2C_CK
B83
LVDS_BKLT_CT
RL
C83
RSVD
D83
RSVD
A84
LVDS_I2C_DAT
B84
VCC_5V_SBY
C84
GND
D84
GND
A85
GPI3
B85
VCC_5V_SBY
C85
PEG_RX10+
D85
PEG_TX10+
A86
KBD_RST#
B86
VCC_5V_SBY
C86
PEG_RX10-
D86
PEG_TX10-
A87
KBD_A20GATE
B87
VCC_5V_SBY
C87
GND
D87
GND
A88
PCIE0_CK_REF+
B88
BIOS_DIS1#
C88
PEG_RX11+
D88
PEG_TX11+
A89
PCIE0_CK_REF-
B89
VGA_RED
C89
PEG_RX11-
D89
PEG_TX11-
A90
GND (FIXED)
B90
GND (FIXED)
C90
GND (FIXED)
D90
GND (FIXED)
A91
SPI_POWER
B91
VGA_GRN
C91
PEG_RX12+
D91
PEG_TX12+
A92
SPI_MISO
B92
VGA_BLU
C92
PEG_RX12-
D92
PEG_TX12-
A93
GPO0
B93
VGA_HSYNC
C93
GND
D93
GND
A94
SPI_CLK
B94
VGA_VSYNC
C94
PEG_RX13+
D94
PEG_TX13+
A95
SPI_MOSI
B95
VGA_I2C_CK
C95
PEG_RX13-
D95
PEG_TX13-
A96
GND
B96
VGA_I2C_DAT
C96
GND
D96
GND
A97
TYPE10#
B97
SPI_CS#
C97
RSVD
D97
PEG_ENABLE#
A98
RSVD
B98
RSVD
C98
PEG_RX14+
D98
PEG_TX14+
A99
RSVD
B99
RSVD
C99
PEG_RX14-
D99
PEG_TX14-
A100
GND (FIXED)
B100
GND (FIXED)
C100
GND (FIXED)
D100
GND (FIXED)
A101
RSVD
B101
RSVD
C101
PEG_RX15+
D101
PEG_TX15+
A102
RSVD
B102
RSVD
C102
PEG_RX15-
D102
PEG_TX15-
A103
RSVD
B103
RSVD
C103
GND
D103
GND
A104
VCC_12V
B104
VCC_12V
C104
VCC_12V
D104
VCC_12V
A105
VCC_12V
B105
VCC_12V
C105
VCC_12V
D105
VCC_12V
A106
VCC_12V
B106
VCC_12V
C106
VCC_12V
D106
VCC_12V
A107
VCC_12V
B107
VCC_12V
C107
VCC_12V
D107
VCC_12V
A108
VCC_12V
B108
VCC_12V
C108
VCC_12V
D108
VCC_12V
A109
VCC_12V
B109
VCC_12V
C109
VCC_12V
D109
VCC_12V
A110
GND (FIXED)
B110
GND (FIXED)
C110
GND (FIXED)
D110
GND (FIXED)
Note:*Second SATA can be supported by BOM option with loss of PATA IDE

12 Pinouts and Signal Descriptions
3.2. Signal Description Terminology
The following terms are used in the COM Express AB/CD Signal Descriptions below.
I Input to the Module
O Output from the Module
I/O Bi-directional input/output signal
OD Open drain output
I 3.3V Input 3.3V tolerant
I 5V Input 5V tolerant
O 3.3V Output 3.3V signal level
O 5V Output 5V signal level
I/O 3.3V Bi-directional signal 3.3V tolerant
I/O 5V Bi-directional signal 5V tolerant
I/O 3.3Vsb Input 3.3V tolerant active in standby state
P Power Input/Output
REF Reference voltage output that may be sourced from a module power plane.
PDS Pull-down strap. This is an output pin on the module that is either tied to GND or not connected.
The signal is used to indicate the PICMG module type to the Carrier Board.
PU ADLINK implemented pull-up resistor on module
PD ADLINK implemented pull-down resistor on module

cExpress-BT2
Pinouts and Signal Descriptions 13
3.3. AB Signal Descriptions
3.3.1. Audio Signals
Signal
Pin #
Description
I/O
PU/PD
Comment
AC_RST# /
HDA_RST# A30 Reset output to CODEC, active low. O 3.3V
AC_SYNC /
HDA_SYNC A29 Sample-synchronization signal to the CODEC(s). O 3.3V
AC_BITCLK /
HDA_BITCLK A32 Serial data clock generated by the
external CODEC(s). I/O 3.3V
AC _SDOUT /
HDA_SDOUT A33 Serial TDM data output to the CODEC. O 3.3V
AC _SDIN[2:0]
HDA_SDIN[2:0] B28 B30 Serial TDM data inputs from up to 3 CODECs. AC_SDIN0: supported
AC_SDIN1: supported
AC_SDIN2: not supported
3.3.2. Analog VGA
Signal Pin # Description I/O PU/PD Comment
VGA_RED B89 Red for monitor.
Analog DAC output, designed to
drive a 37.5-Ohm equivalent load.
O Analog PD 150R shall also be terminated on
the carrier with 150Ω
resistor to ground close to
VGA connector
VGA_GRN B91 Green for monitor
Analog DAC output, designed to
drive a 37.5-Ohm equivalent load.
O Analog PD 150R shall also be terminated on
the carrier with 150Ω
resistor to ground close to
VGA connector
VGA_BLU B92 Blue for monitor.
Analog DAC output, designed to
drive a 37.5-Ohm equivalent load.
O Analog PD 150R shall also be terminated on
the carrier with 150Ω
resistor to ground close to
VGA connector
VGA_HSYNC B93 Horizontal sync output to VGA
monitor O 3.3V
VGA_VSYNC B94 Vertical sync output to VGA
monitor O 3.3V
VGA_I2C_CK B95 DDC clock line (I²C port dedicated
to identify VGA monitor
capabilities)
I/O OD 3.3V PU 2k2
3.3V
VGA_I2C_DAT B96 DDC data line. I/O OD 3.3V PU 2k2
3.3V

14 Pinouts and Signal Descriptions
3.3.3. LVDS
Signal
Pin #
Description
I/O
PU/PD
Comment
LVDS_A0+
LVDS_A0-
LVDS_A1+
LVDS_A1-
LVDS_A2+
LVDS_A2-
LVDS_A3+
LVDS_A3-
A71
A72
A73
A74
A75
A76
A78
A79
LVDS Channel A differential pairs O LVDS
LVDS_A_CK+
LVDS_A_CK- A81 A82 LVDS Channel A differential clock O LVDS
LVDS_B0+
LVDS_B0-
LVDS_B1+
LVDS_B1-
LVDS_B2+
LVDS_B2-
LVDS_B3+
LVDS_B3-
B71
B72
B73
B74
B75
B76
B77
B78
LVDS Channel B differential pairs O LVDS
LVDS_B_CK+
LVDS_B_CK- B81 B82 LVDS Channel B differential clock O LVDS
LVDS_VDD_EN A77 LVDS panel power enable O 3.3V
LVDS_BKLT_EN B79 LVDS panel backlight enable O 3.3V
LVDS_BKLT_CTRL B83 LVDS panel backlight brightness control O 3.3V PD 100K
LVDS_I2C_CK A83 DDC lines used for flat panel detection and
control. O 3.3V PU 2k2 3.3V
LVDS_I2C_DAT A84 DDC lines used for flat panel detection and
control. I/O 3.3V PU 2k2 3.3V