ADLINK Technology cExpress-AR User manual

cExpress-AR User’s Guide PICMG COM.0 R3.0
Page 1 Copyright © 2021 ADLINK Technology, Inc.
cExpress-AR
Revision: Rev. 1.2
Date: 2021-08-31
Part Number: 50M-00014-1020
User’s Guide

cExpress-AR User’s Guide PICMG COM.0 R3.0
Page 2 Copyright © 2021 ADLINK Technology, Inc.
Revision History
Revision Description Date Author
1.0 Initial release 2021-05-17
1.1 Update specifications, AB/CD Connector Signal Descriptions 2021-08-03
1.2 Remove Yocto Linux support 2021-08-31

cExpress-AR User’s Guide PICMG COM.0 R3.0
Page 3 Copyright © 2021 ADLINK Technology, Inc.
Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK
assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product
descriptions at any time, without notice.
Environmental Responsibility
ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product
disposal and/or recovery programs prescribed by their nation or company.
California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3-
dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known
to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP,
BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more
information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.
Copyright © 2021 ADLINK Technology Incorporated
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

cExpress-AR User’s Guide PICMG COM.0 R3.0
Page 4 Copyright © 2021 ADLINK Technology, Inc.
Safety Instructions
For user safety, please read and follow all Instructions, Warnings, Cautions, and Notes marked in this manual and on the associated equipment before
handling/operating the equipment.
Read these safety instructions carefully.
•Keep this manual for future reference.
•Read the specifications section of this manual for detailed information on the operating environment of this equipment.
•Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
•To avoid electrical shock and/or damage to equipment:
•Keep equipment away from water or liquid sources;
•Keep equipment away from high heat or high humidity;
•Keep equipment properly ventilated (do not block or cover ventilation openings);
•Make sure to use recommended voltage and power source settings;
•Always install and operate equipment near an easily accessible electrical socket outlet;
•Secure the power cord (do not place any object on/over the power cord);
•Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
•If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.

cExpress-AR User’s Guide PICMG COM.0 R3.0
Page 5 Copyright © 2021 ADLINK Technology, Inc.
Conventions
The following conventions may be used throughout this manual, denoting special levels of information
Note: This information adds clarity or specifics to text and illustrations.
Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.
Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

cExpress-AR User’s Guide PICMG COM.0 R3.0
Page 6 Copyright © 2021 ADLINK Technology, Inc.
Getting Service
Ask an Expert: http://askanexpert.adlinktech.com
ADLINK Technology, Inc.
No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan
Tel: [phone]
Fax: [phone]
Email: [email protected]
Ampro ADLINK Technology, Inc.
6450 Via Del Oro, San Jose, CA 95119-1208, USA
Tel: [phone]
Toll Free: [phone] (USA only)
Fax: [phone]
Email: [email protected]
ADLINK Technology (China) Co., Ltd.
300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China
Tel: [phone]
Fax: [phone]
Email: [email protected]
ADLINK Technology GmbH
Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany
Tel: [phone]
Fax: [phone]
Email: [email protected]
Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.

cExpress-AR User’s Guide PICMG COM.0 R3.0
Page 7 Copyright © 2021 ADLINK Technology, Inc.
Table of Contents
Revision History................................................................................................................................................................................................................................................................................................................. 2
Preface .................................................................................................................................................................................................................................................................................................................................. 3
List of Figures..................................................................................................................................................................................................................................................................................................................... 9
1. Introduction ...............................................................................................................................................................................................................................................................................................................10
2. Specifications.............................................................................................................................................................................................................................................................................................................11
2.1. Core System...................................................................................................................................................................................................................................................................................................................................11
2.2. Video ................................................................................................................................................................................................................................................................................................................................................12
2.2.1 Display Interface Support .............................................................................................................................................................................................................................................................................................12
2.3. Audio................................................................................................................................................................................................................................................................................................................................................13
2.4. Expansion Busses .........................................................................................................................................................................................................................................................................................................................13
2.5. Ethernet ...........................................................................................................................................................................................................................................................................................................................................13
2.6. Multi I/O and Storage ................................................................................................................................................................................................................................................................................................................14
2.7. Trusted Platform Module (TPM).............................................................................................................................................................................................................................................................................................15
2.8. SEMA Board controller...............................................................................................................................................................................................................................................................................................................15
2.9. Debug...............................................................................................................................................................................................................................................................................................................................................15
2.10. Power................................................................................................................................................................................................................................................................................................................................................15
2.11. Mechanical and Environmental...............................................................................................................................................................................................................................................................................................16
3. Block Diagram...........................................................................................................................................................................................................................................................................................................17
4. Pinout and Signal Descriptions ..........................................................................................................................................................................................................................................................................18
4.1. Pin Summary..................................................................................................................................................................................................................................................................................................................................18
4.2. Signal Terminology Descriptions ...........................................................................................................................................................................................................................................................................................23
4.3. AB Connector Signal Descriptions.........................................................................................................................................................................................................................................................................................24
4.3.1 Audio....................................................................................................................................................................................................................................................................................................................................24
4.3.2 Analog VGA........................................................................................................................................................................................................................................................................................................................25
4.3.3 LVDS or eDP.......................................................................................................................................................................................................................................................................................................................26
4.3.4 Gigabit Ethernet ...............................................................................................................................................................................................................................................................................................................29
4.3.5 SATA .....................................................................................................................................................................................................................................................................................................................................30
4.3.6 PCI Express .........................................................................................................................................................................................................................................................................................................................31
4.3.7 LPC bus................................................................................................................................................................................................................................................................................................................................33
4.3.8 USB........................................................................................................................................................................................................................................................................................................................................34
4.3.9 SPI Bus (BIOS only)..........................................................................................................................................................................................................................................................................................................36

cExpress-AR User’s Guide PICMG COM.0 R3.0
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4.3.10 Miscellaneous....................................................................................................................................................................................................................................................................................................................37
4.3.11 SMBus ..................................................................................................................................................................................................................................................................................................................................38
4.3.12 I2C bus.................................................................................................................................................................................................................................................................................................................................38
4.3.13 General Purpose I/O (GPIO).........................................................................................................................................................................................................................................................................................39
4.3.14 Serial Interface Signals...................................................................................................................................................................................................................................................................................................39
4.3.15 Power and System Management...............................................................................................................................................................................................................................................................................40
4.3.16 Power and Ground ..........................................................................................................................................................................................................................................................................................................41
4.4. CD Connector Signal Descriptions.........................................................................................................................................................................................................................................................................................42
4.4.1 USB 3.0 Extensions ..........................................................................................................................................................................................................................................................................................................42
4.4.2 PCI Express .........................................................................................................................................................................................................................................................................................................................43
4.4.3 DDI1 Port ............................................................................................................................................................................................................................................................................................................................45
4.4.4 DDI2 Port ............................................................................................................................................................................................................................................................................................................................48
4.4.5 DDI3 Port ............................................................................................................................................................................................................................................................................................................................51
4.4.6 PCIe Graphics Port (PEG)...............................................................................................................................................................................................................................................................................................54
4.4.7 Module Type Definition.................................................................................................................................................................................................................................................................................................56
4.4.8 Power and Ground ..........................................................................................................................................................................................................................................................................................................57
5. Additional Features.................................................................................................................................................................................................................................................................................................58
5.1. Debug Connector ........................................................................................................................................................................................................................................................................................................................59
5.2. Status LEDs.....................................................................................................................................................................................................................................................................................................................................60
5.3. Exception Codes...........................................................................................................................................................................................................................................................................................................................61
5.4. Fan Connector...............................................................................................................................................................................................................................................................................................................................62
5.5. BIOS Default Reset Button........................................................................................................................................................................................................................................................................................................63
5.6. BIOS Boot Select...........................................................................................................................................................................................................................................................................................................................64
6. BIOS Checkpoints, Beep Codes..........................................................................................................................................................................................................................................................................65
7. Software Support.....................................................................................................................................................................................................................................................................................................66
7.1. Operating Systems ......................................................................................................................................................................................................................................................................................................................66
8. Mechanical and Thermal.......................................................................................................................................................................................................................................................................................67
8.1. Module Dimensions....................................................................................................................................................................................................................................................................................................................67
8.2. Thermal Solutions........................................................................................................................................................................................................................................................................................................................68
8.2.1 Heatspreader: HTS...........................................................................................................................................................................................................................................................................................................68
8.2.2 Heatsink: THS ....................................................................................................................................................................................................................................................................................................................69
8.2.3 Heatsink High Profile: THSH ........................................................................................................................................................................................................................................................................................70
8.2.4 Heatsink with Fan: THSF................................................................................................................................................................................................................................................................................................71

cExpress-AR User’s Guide PICMG COM.0 R3.0
Page 9 Copyright © 2021 ADLINK Technology, Inc.
List of Figures
Figure 1 – Module function diagram......................................................................................................................................................................................................................................................................17
Figure 2 - Module rear side row and pin numbering ......................................................................................................................................................................................................................................18
Figure 3 – Module feature locations.......................................................................................................................................................................................................................................................................58
Figure 4 – cExpress-AR and Debug Module........................................................................................................................................................................................................................................................59
Figure 5 – Module mechanical dimensions .........................................................................................................................................................................................................................................................67
Figure 6 – Heatspreader HTS.....................................................................................................................................................................................................................................................................................68
Figure 7 – Heatsink THS...............................................................................................................................................................................................................................................................................................69
Figure 8 – Heatsink High Profile: THSH.................................................................................................................................................................................................................................................................70
Figure 9 – Heatsink with Fan: THSF.........................................................................................................................................................................................................................................................................71

cExpress-AR User’s Guide PICMG COM.0 R3.0
Page 10 Copyright © 2021 ADLINK Technology, Inc.
1. Introduction
Warning: this is an EA (early available) engineering manual, meaning contents may not properly reflect the actual or final version of this product
The cExpress-AR is the first COM Express® COM.0 R3.0 Compact Size Type 6 module based on Octa-core (8 core) AMD® New Generation Ryzen™
Embedded V-Series SoC (formerly “Ryzen V2000”) with up to 16 threads and an impressive turbo boost up to 4.25GHz. Compared to earlier generation,
the additional cores combined with AMD’s Zen2 architecture result in double the performance-per-watt efficiency. The cExpress-AR also feature a
upgrade high performance graphics core called AMD® Radeon™ with faster frequency and clocking. Typical industries, in need of such high
performance characteristics, are ultrasound image processing, 4K high speed video encoding and streaming, gaming, AI inferencing at the Edge.
The cExpress-AR supports maximum 64GB DDR4 3200 MT/s memory capacity and support ECC memory error correction based on selected SKUs.
Combined with a configurable TDP to 10 watts while still support 8-core/6-core make fanless design achievable and well suited for mission critical or
rugged applications.
Integrated upgrade AMD® Radeon™ Graphics includes features such as OpenGL 4.6 and ES 3.x, DirectX 12, OpenCL 2.1/2.0/1.2, new generation
multimedia engine, VCN2.2, supports for H.265/HEVC 10-bit hardware encode/decode, VP9 10-bit hardware decode. In addition, new generation
display engine, DCN2.1, support maximum four independent display outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and
eDP/VGA as a build option.
Input/output features include up to eight PCIe Gen3 lanes (through a PCIe switch, project basis support) and one PCIe Gen3 x8 lanes that can be used
for NVMe SSD, allowing applications access to the highest speed storage solutions, as well as a single onboard up to 2.5Gigabit Ethernet port
supporting Time Sensitive Network (TSN), four USB 3.2 ports, four USB 2.0 ports, two SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The
module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and
watchdog timer.

cExpress-AR User’s Guide PICMG COM.0 R3.0
Page 11 Copyright © 2021 ADLINK Technology, Inc.
2. Specifications
2.1. Core System
CPU
AMD® Ryzen™ Embedded V2000 processor family, 7nm process
•AMD® V2748 2.9/4.25GHz, 4MB L2, 35-54W (8C/7CU)
•AMD® V2546 3.0/3.95GHz, 3MB L2, 35-54W (6C/6CU)
•AMD® V2718 1.7/4.15GHz, 4MB L2, 10-25W (8C/7CU)
•AMD® V2516 2.1/3.95GHz, 3MB L2, 10-25W (6C/7CU)
Memory
Up to 64GB 3200 MT/s DDR4 in two SODIMM sockets, max. 32GB per socket
ECC, non-ECC support
Cache
L2 Cache 4MB for V2748, V2718, 3MB for V2546, V2516
Embedded BIOS
AMI Aptio V UEFI with CMOS backup in 16MB SPI BIOS (dual BIOS by build option, project basis)

cExpress-AR User’s Guide PICMG COM.0 R3.0
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2.2. Video
GPU
AMD® Radeon™ Graphics core architecture
GPU Feature Support
4 independent and simultaneous combinations of DisplayPort/HDMI/LVDS graphics outputs (up to 4x 4K60).
(eDP optional in place of LVDS, VGA optional in place of DDI 3.)
•HEVC/H.265 8/10b, H.264 8b, VP9 8/10b, JPEG HW decode
•HEVC/H.265 8/10b, H.264 8b HW encode
•DirectX up to 12
•OpenGL up to 4.6 and ES 3.x support
•OpenCL up to 2.1 support
Note: Availability of features dependent on operating system (Windows 10 64-bit, Linux 64-bit).
2.2.1 Display Interface Support
LVDS: Single/dual channel 18/24-bit LVDS through eDP to LVDS IC, supports DE mode and Hsync/Vsync mode.
Max. resolution is 1920x1200@60Hz in dual mode. Pixel clock frequency up to 112 MHz. VESA and JEIDA panel data formats supported.
eDP: eDP 1.3 up to 4 lane support, in place of LVDS (BOM option), max. resolution is 4096x2160 @60Hz, 30bpp
DDI x 3: Digital Display Ports (DDI) support DisplayPort 1.4a, HDMI 2.1 or DVI, max. resolution of Display Port 4096x2160 @60Hz, max. resolution of
HDMI 4096x2160 @60Hz
VGA: VGA BOM option support, in place of DDI 3. Max. resolution is 1920x1200 @60Hz
Note: The achievable maximum resolution dependent on carrier design.

cExpress-AR User’s Guide PICMG COM.0 R3.0
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2.3. Audio
Intel® Audio Co-processor integrated
Located on carrier Express-BASE6 (ALC886 standard support)
2.4. Expansion Busses
6 PCI Express x1 Gen3: Lanes 0,1,2,3 (configurable to x1, x2, x4) and Lanes 4,5 (x1 or x2)
A PCIe switch is HW BOM option by project basis to offer more x1 lanes via Lanes 6,7
1 PCI Express x8 Gen3: Lanes 16-23 (configurable to 1 x8 or 2 x4)
Other: SMBus (system), I2C (user), LPC
Note: General Purpose Ports GPP 2-9 can support up to 6 devices (SATA 0/1 count as one device), refer to Functional Diagram for details.
2.5. Ethernet
Intel® 2.5Gigabit Ethernet Controller i225 series (V or IT version)
Supports up to 2.5Gbits and 1000/100/10 Mbit/s connection
V version supports up to 2.5Gbits
IT version supports up to 2.5Gbits (supports TSN on Linux, by project basis, TBC)
Note: General Purpose Ports GPP 2-9 can support up to 6 devices (SATA 0/1 count as one device), refer to Functional Diagram for details.

cExpress-AR User’s Guide PICMG COM.0 R3.0
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2.6. Multi I/O and Storage
USB
4x USB 3.2/2.0/1.1 (USB 0,1,2,3), 4x USB 2.0/1.1 (USB 4,5,6,7)
SuperSpeedPlus, SuperSpeed, High-Speed, Full-Speed and Low-Speed USB signalling
Notes: Carrier board must be designed for Gen2 operation.
USB 3.2 upgrade signal lanes 1,2,3 are from USB Hub.
UART
Two UART interfaces SER0 and SER1 RX/TX on module
Console Redirection COM 1 or COM 2 selectable in BIOS
Up to 4 serial ports are supported in standard BIOS including Super I/O on the carrier
COM Port Description IRQ Address Console Redirection Support
COM 1 Supported by module (SER0, A98/A99), via embedded controller 4 0x3F8 Yes
COM 2 Supported by module (SER1, A101/A102), via embedded controller 3 0x2F8 Yes
COM 3 Supported by Super I/O (W83627DHG) on carrier board 5 0x240 Yes
COM 4 Supported by Super I/O (W83627DHG) on carrier board 7 0x248 Yes
SER0, SER1 from SoC HSUART are BOM option support by project basis
GPIO or SD
4 GPO and 4 GPI (GPI with interrupt)
SATA
2x SATA 6Gb/s (SATA 0,1)
Note: General Purpose Ports GPP 2-9 can support up to 6 devices (SATA 0/1 count as one device), refer to Functional Diagram for details.

cExpress-AR User’s Guide PICMG COM.0 R3.0
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2.7. Trusted Platform Module (TPM)
Chipset: Infineon solution
Type: TPM 2.0 (LPC bus based)
TPM chip is BOM option
2.8. SEMA Board controller
Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control,
general purpose I2C, failsafe BIOS (dual BIOS, opt. support), watchdog timer and fan control
2.9. Debug
30-pin flat cable connector for use with DB-30 x86 debug module
Supports BIOS POST code LED, embedded controller access, SPI BIOS flashing, internal power rail test points, debug LEDs
2.10. Power
Power Modes: AT and ATX mode (AT mode startup controlled by SEMA Board Controller)
Standard Voltage Input: ATX: 12V±5% / 5Vsb ±5% or AT: 12V±5%
Wide Voltage Input: ATX: 8.5-20V, 5Vsb ±5% or AT: 8.5-20V
Power Management: ACPI 5.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake-on-USB S3/S4, WoL S3/S4/S5)
ECO Mode support for deep S5 for 5Vsb power saving
Power Consumption
Please contact your ADLINK representative for the document “COM Express Module Power Consumption”.

cExpress-AR User’s Guide PICMG COM.0 R3.0
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2.11. Mechanical and Environmental
Form Factor and specification
PICMG COM Express Rev 3.0 (COM.0 R3.0), Type 6, Compact size 95 x 95 mm
Operating Temperature
Standard 0°C to +60°C (Wide Voltage Input) Storage: -20°C to +80°C
Humidity
5-90% RH operating, non-condensing, 5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
HALT tested
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

cExpress-AR User’s Guide PICMG COM.0 R3.0
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3. Block Diagram
C
DDI 1
DDI 2
DDI 3
USB 3.0 Lane 3
USB 3.0 Lane 2
USB 3.0 Lane 1
USB 3.0 Lane 0
PCIe Lane 6
PCIe Lane 7
PEG Port
PCIe 16-23
PCIe 24-27
PCIe 28-31
AMD Ryzen™ Embedded
V2000 Series
DP to VGA
eDP to
LVDS
DP 0
build option
build option, eDP 4 lanes
GPP 8, 9
DDR4 SODIMM (top side)
3200 MT/s, non-ECC/ECC
GPP 4, 5, 6, 7
VGA
eDP/LVDS
USB 2.0 Lane 0-7
SATA Port 0-1
SATA Port 2-3
PCIe Lane 0-3
PCIe Lane 4-5
2.5GbE/GbE
HDA
SPI
SMBus
I2C
GPIO/SDIO
UART/CAN
LPC/eSPI
USB 3.2 (10Gbps)
USB 3.2 (10Gbps)
GPP 0
LPC
TPM 2.0
build option
UART
TM102
(board)
GFX [0:7]
DDI B
(DP, HDMI)
DP 1
Embedded Controller
DP 2 DP 3
USB
Hub
4 x1, 2 x2, 1 x4
LAN
I225 V/IT
1 x8, 2 x4
GPP 2-3
BIOS
Flash BIOS Flash
Gen3/2
switch
DDR4 SODIMM (bottom side)
3200 MT/s, non-ECC/ECC
Figure 1 – Module function diagram

cExpress-AR User’s Guide PICMG COM.0 R3.0
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4. Pinout and Signal Descriptions
4.1. Pin Summary
The table below is a comprehensible list of all signal pins supported on the dual 220-pin COM Express connectors as defined for Type 6 in the PICMG
COM.0 R3.0 specification. Signals described in the specification but not supported on the cExpress-AR are strikethrough STRIKETHROUGH.
CD
AB
A1
B1
C1
D1
A110
Figure 2 - Module rear side row and pin numbering

cExpress-AR User’s Guide PICMG COM.0 R3.0
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Row A Row B Row C Row D
A1 GND (FIXED) B1 GND (FIXED) C1 GND FIXED) D1 GND FIXED)
A2 GBE0_MDI3- B2 GBE0_ACT# C2 GND D2 GND
A3 GBE0_MDI3+ B3 LPC_FRAME#/ESPI_CS0# C3 USB_SSRX0- D3 USB_SSTX0-
A4 GBE0_LINK100# B4 LPC_AD0/ESPI_IO_0 C4 USB_SSRX0+ D4 USB_SSTX0+
A5 GBE0_LINK1000# B5 LPC_AD1/ESPI_IO_1 C5 GND D5 GND
A6 GBE0_MDI2- B6 LPC_AD2/ESPI_IO_2 C6 USB_SSRX1- D6 USB_SSTX1-
A7 GBE0_MDI2+ B7 LPC_AD3/ESPI_IO_3 C7 USB_SSRX1+ D7 USB_SSTX1+
A8 GBE0_LINK# B8 LPC_DRQ0#/ESPI_ALERT0# C8 GND D8 GND
A9 GBE0_MDI1- B9 LPC_DRQ1#/ESPI_ALERT1# C9 USB_SSRX2- D9 USB_SSTX2-
A10 GBE0_MDI1+ B10 LPC_CLK/ESPI_CK C10 USB_SSRX2+ D10 USB_SSTX2+
A11 GND (FIXED) B11 GND (FIXED) C11 GND (FIXED) D11 GND (FIXED)
A12 GBE0_MDI0- B12 PWRBTN# C12 USB_SSRX3- D12 USB_SSTX3-
A13 GBE0_MDI0+ B13 SMB_CK C13 USB_SSRX3+ D13 USB_SSTX3+
A14 GBE0_CTREF B14 SMB_DAT C14 GND D14 GND
A15 SUS_S3# B15 SMB_ALERT# C15 DDI1_PAIR6+ D15 DDI1_CTRLCLK_AUX+
A16 SATA0_TX+ B16 SATA1_TX+ C16 DDI1_PAIR6-D16 DDI1_CTRLDATA_AUX-
A17 SATA0_TX- B17 SATA1_TX- C17 RSVD D17 RSVD
A18 SUS_S4# B18 SUS_STAT#/ESPI_RESET# C18 RSVD D18 RSVD
A19 SATA0_RX+ B19 SATA1_RX+ C19 PCIE_RX6+ * D19 PCIE_TX6+ *
A20 SATA0_RX- B20 SATA1_RX- C20 PCIE_RX6- * D20 PCIE_TX6- *
A21 GND (FIXED) B21 GND (FIXED) C21 GND (FIXED) D21 GND (FIXED)
A22 SATA2_TX+ B22 SATA3_TX+ C22 PCIE_RX7+ * D22 PCIE_TX7+ *
A23 SATA2_TX-B23 SATA3_TX-C23 PCIE_RX7- * D23 PCIE_TX7- *
A24 SUS_S5# B24 PWR_OK C24 DDI1_HPD D24 RSVD
A25 SATA2_RX+ B25 SATA3_RX+ C25 DDI1_PAIR4+ D25 RSVD
A26 SATA2_RX-B26 SATA3_RX-C26 DDI1_PAIR4-D26 DDI1_PAIR0+
A27 BATLOW# B27 WDT C27 RSVD D27 DDI1_PAIR0-
A28 (S)ATA_ACT# B28 AC/HDA_SDIN2 C28 RSVD D28 RSVD
A29 AC/HDA_SYNC B29 AC/HDA_SDIN1 C29 DDI1_PAIR5+ D29 DDI1_PAIR1+
A30 AC/HDA_RST# B30 AC/HDA_SDIN0 C30 DDI1_PAIR5-D30 DDI1_PAIR1-
A31 GND (FIXED) B31 GND (FIXED) C31 GND (FIXED) D31 GND (FIXED)
A32 AC/HDA_BITCLK B32 SPKR C32 DDI2_CTRLCLK_AUX+ D32 DDI1_PAIR2+
A33 AC/HDA_SDOUT B33 I2C_CK C33 DDI2_CTRLDATA_AUX- D33 DDI1_PAIR2-
A34 BIOS_DIS0#/ESPI_SAFS B34 I2C_DAT C34 DDI2_DDC_AUX_SEL D34 DDI1_DDC_AUX_SEL
A35 THRMTRIP# B35 THRM# C35 RSVD D35 RSVD

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Row A Row B Row C Row D
A36 USB6- B36 USB7- C36 DDI3_CTRLCLK_AUX+ D36 DDI1_PAIR3+
A37 USB6+ B37 USB7+ C37 DDI3_CTRLDATA_AUX- D37 DDI1_PAIR3-
A38 USB_6_7_OC# B38 USB_4_5_OC# C38 DDI3_DDC_AUX_SEL D38 RSVD
A39 USB4- B39 USB5- C39 DDI3_PAIR0+ D39 DDI2_PAIR0+
A40 USB4+ B40 USB5+ C40 DDI3_PAIR0- D40 DDI2_PAIR0-
A41 GND (FIXED) B41 GND (FIXED) C41 GND (FIXED) D41 GND (FIXED)
A42 USB2- B42 USB3- C42 DDI3_PAIR1+ D42 DDI2_PAIR1+
A43 USB2+ B43 USB3+ C43 DDI3_PAIR1- D43 DDI2_PAIR1-
A44 USB_2_3_OC# B44 USB_0_1_OC# C44 DDI3_HPD D44 DDI2_HPD
A45 USB0- B45 USB1- C45 RSVD D45 RSVD
A46 USB0+ B46 USB1+ C46 DDI3_PAIR2+ D46 DDI2_PAIR2+
A47 VCC_RTC B47 ESPI_EN# C47 DDI3_PAIR2- D47 DDI2_PAIR2-
A48 RSVD B48 USB0_HOST_PRSNT C48 RSVD D48 RSVD
A49 GBE0_SDP B49 SYS_RESET# C49 DDI3_PAIR3+ D49 DDI2_PAIR3+
A50 LPC_SERIRQ/ESPI_CS1# B50 CB_RESET# C50 DDI3_PAIR3- D50 DDI2_PAIR3-
A51 GND (FIXED) B51 GND (FIXED) C51 GND (FIXED) D51 GND (FIXED)
A52 PCIE_TX5+ B52 PCIE_RX5+ C52 PEG_RX0+ D52 PEG_TX0+
A53 PCIE_TX5- B53 PCIE_RX5- C53 PEG_RX0- D53 PEG_TX0-
A54 GPI0 B54 GPO1 C54 TYPE0# D54 PEG_LANE_RV#
A55 PCIE_TX4+ B55 PCIE_RX4+ C55 PEG_RX1+ D55 PEG_TX1+
A56 PCIE_TX4- B56 PCIE_RX4- C56 PEG_RX1- D56 PEG_TX1-
A57 GND B57 GPO2 C57 TYPE1# D57 TYPE2#
A58 PCIE_TX3+ B58 PCIE_RX3+ C58 PEG_RX2+ D58 PEG_TX2+
A59 PCIE_TX3- B59 PCIE_RX3- C59 PEG_RX2- D59 PEG_TX2-
A60 GND (FIXED) B60 GND (FIXED) C60 GND (FIXED) D60 GND (FIXED)
A61 PCIE_TX2+ B61 PCIE_RX2+ C61 PEG_RX3+ D61 PEG_TX3+
A62 PCIE_TX2- B62 PCIE_RX2- C62 PEG_RX3- D62 PEG_TX3-
A63 GPI1 B63 GPO3 C63 RSVD D63 RSVD
A64 PCIE_TX1+ B64 PCIE_RX1+ C64 RSVD D64 RSVD
A65 PCIE_TX1- B65 PCIE_RX1- C65 PEG_RX4+ D65 PEG_TX4+
A66 GND B66 WAKE0# C66 PEG_RX4- D66 PEG_TX4-
A67 GPI2 B67 WAKE1# C67 RAPID_SHUTDOWN D67 GND
A68 PCIE_TX0+ B68 PCIE_RX0+ C68 PEG_RX5+ D68 PEG_TX5+
A69 PCIE_TX0- B69 PCIE_RX0- C69 PEG_RX5- D69 PEG_TX5-
A70 GND (FIXED) B70 GND (FIXED) C70 GND (FIXED) D70 GND (FIXED)