ADLINK Technology MXM-AXe User manual

MXM-AXe User’s Guide MXM V3.1
Page 1 Copyright © 2023 ADLINK Technology, Inc.
MXM-AXe
Revision: Rev. 0.1
Date: 2023-07-31
Part Number: 50M-74000-1000
User’s Guide

MXM-AXe User’s Guide MXM V3.1
Page 2 Copyright © 2023 ADLINK Technology, Inc.
Revision History
Revision
Description
Date
Author
0.1
Preliminary release
2023-07-31
CC

MXM-AXe User’s Guide MXM V3.1
Page 3 Copyright © 2023 ADLINK Technology, Inc.
Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK
assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product
descriptions at any time, without notice.
Environmental Responsibility
ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product
disposal and/or recovery programs prescribed by their nation or company.
California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3-
dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known
to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP,
BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more
information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.
Copyright © 2023 ADLINK Technology Incorporated
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

MXM-AXe User’s Guide MXM V3.1
Page 4 Copyright © 2023 ADLINK Technology, Inc.
Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment
before handling/operating the equipment.
Read these safety instructions carefully.
•Keep this manual for future reference.
•Read the specifications section of this manual for detailed information on the operating environment of this equipment.
•Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
•To avoid electrical shock and/or damage to equipment:
•Keep equipment away from water or liquid sources;
•Keep equipment away from high heat or high humidity;
•Keep equipment properly ventilated (do not block or cover ventilation openings);
•Make sure to use recommended voltage and power source settings;
•Always install and operate equipment near an easily accessible electrical socket outlet;
•Secure the power cord (do not place any object on/over the power cord);
•Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
•If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.

MXM-AXe User’s Guide MXM V3.1
Page 5 Copyright © 2023 ADLINK Technology, Inc.
Conventions
The following conventions may be used throughout this manual, denoting special levels of information
Note: This information adds clarity or specifics to text and illustrations.
Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.
Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

MXM-AXe User’s Guide MXM V3.1
Page 6 Copyright © 2023 ADLINK Technology, Inc.
Getting Service
Ask an Expert: https://www.adlinktech.com/en/Askanexpert
ADLINK Technology, Inc.
No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan
Tel: [phone]
Fax: [phone]
Email: [e-mail]
Ampro ADLINK Technology, Inc.
6450 Via Del Oro, San Jose, CA 95119-1208, USA
Tel: [phone]
Toll Free: [phone] (USA only)
Fax: [phone]
Email: [e-mail]
ADLINK Technology (China) Co., Ltd.
300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China
Tel: [phone]
Fax: [phone]
Email: [e-mail]
ADLINK Technology GmbH
Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany
Tel: [phone]
Fax: [phone]
Email: [e-mail]
Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.

MXM-AXe User’s Guide MXM V3.1
Page 7 Copyright © 2023 ADLINK Technology, Inc.
Table of Contents
Revision History ................................................................................................................................................................................................................................................................................................................ 2
Preface .................................................................................................................................................................................................................................................................................................................................. 3
List of Figures.....................................................................................................................................................................................................................................................................................................................8
1. Introduction ................................................................................................................................................................................................................................................................................................................. 9
2. Specifications.............................................................................................................................................................................................................................................................................................................10
2.1. Core System...................................................................................................................................................................................................................................................................................................................................10
2.2. Display Output..............................................................................................................................................................................................................................................................................................................................10
2.3. Hardware Acceleration...............................................................................................................................................................................................................................................................................................................10
2.4. Application Programming Interface —API ........................................................................................................................................................................................................................................................................11
2.5. Operation System ........................................................................................................................................................................................................................................................................................................................11
2.6. Debug...............................................................................................................................................................................................................................................................................................................................................11
2.7. Mechanical and Environmental...............................................................................................................................................................................................................................................................................................11
3. Block Diagram...........................................................................................................................................................................................................................................................................................................12
4. Pinout and Signal Descriptions ..........................................................................................................................................................................................................................................................................13
5. Additional Features.................................................................................................................................................................................................................................................................................................16
5.1. Module Feature Locations........................................................................................................................................................................................................................................................................................................16
5.2. HDMI Mode Select ......................................................................................................................................................................................................................................................................................................................18
5.3. MIPI20 Debug Connector .........................................................................................................................................................................................................................................................................................................18
6. Mechanical..................................................................................................................................................................................................................................................................................................................19
6.1. Module Dimensions – Top View.............................................................................................................................................................................................................................................................................................19
6.2. Module Dimensions – Bottom View .....................................................................................................................................................................................................................................................................................20
6.3. Module Dimensions – Side View............................................................................................................................................................................................................................................................................................21
6.4. GPU Height ....................................................................................................................................................................................................................................................................................................................................21
7. Thermal Solution......................................................................................................................................................................................................................................................................................................22
7.1. Heatsink with Fan: THSF............................................................................................................................................................................................................................................................................................................22

MXM-AXe User’s Guide MXM V3.1
Page 8 Copyright © 2023 ADLINK Technology, Inc.
List of Figures
Figure 1 – Module function diagram......................................................................................................................................................................................................................................................................12
Figure 2 – Module feature locations (top side) ..................................................................................................................................................................................................................................................16
Figure 3 – Module feature locations (bottom side)..........................................................................................................................................................................................................................................17
Figure 4 – Module dimensions (top view) ............................................................................................................................................................................................................................................................19
Figure 5 – Module dimensions (bottom view)....................................................................................................................................................................................................................................................20
Figure 6 – Module dimensions (side view)...........................................................................................................................................................................................................................................................21
Figure 7 – Heatsink with Fan (THSF) .......................................................................................................................................................................................................................................................................22

MXM-AXe User’s Guide MXM V3.1
Page 9 Copyright © 2023 ADLINK Technology, Inc.
1. Introduction
The MXM-AXe is an MXM 3.1 Type A-compliant module featuring Intel® Arc™ GPU (formerly “Alchemist”). It offers up to 8 Xe HPG, 8 Ray Tracing cores,
and 128 Execution Units, along with 4GB GDDR6 at maximum bandwidth of 112 GB/s. Configurable up to 50W TGP and supporting PCIe Gen4 x8 lane
connections make it well suit for various graphics-demanding applications, including medical ultrasound, gaming, media streaming, transportation, test
and measurement, data analysis, defense, and more.
Graphics outputs include up to four simultaneous displays at DP 2.0 or HDMI 2.0. For graphics decoding and encoding, the MXM-AXe features DX12
Ultimate/DX12, Vulkan1.1, OpenCL 3.0, OpenGL 4.6 support AV1/VC/VC1/MPEG2/HEVC/H.265/VP9/JPEG HW decode and HEVC/AVC/MPEG2/VP9 HW
encode.
By leveraging the well-established Intel graphics ecosystems, such as Intel OpenVINO for AI, Intel oneAPI (Media SDK inside) management tools, that
edge developers have enjoyed and relied on for years, the MXM-AXe allows you to migrate from integrated to discrete graphics, and up to scale,
smoothly and effortlessly.

MXM-AXe User’s Guide MXM V3.1
Page 10 Copyright © 2023 ADLINK Technology, Inc.
2. Specifications
2.1. Core System
GPU
Intel® Arc™ GPU Mobile (formerly codenamed “Alchemist”)
•Intel® Arc™ A370M 8 Xe cores, 8 Ray Tracing units, 128 Matrix Engines, 128 Vector Engines, 35W (configurable to 50W TGP)
•Intel® Arc™ A350M 6 Xe cores, 6 Ray Tracing units, 96 Matrix Engines, 96 Vector Engines, 25W (configurable to 35W TGP)
Memory
GDDR6 4GB, 112 GB/s bandwidth, 64-bit interface width
2.2. Display Output
4 independent display outputs in varied combinations (4x 4K or 2x 8K, TBC)
•DP 2.0, up to 5K@120Hz or 8K@60Hz
•HDMI 2.0, up to 4K@60Hz (specific VBIOS settings and switch setting on module required; also dependent on carrier board design)
2.3. Hardware Acceleration
•AV1, VC/VC1/MPEG2/HEVC/VP9/JPEG hardware decoding
•HEVC/AVC/MPEG2/VP9/JPEG hardware encodeing
•Ray tracing units and AI engines

MXM-AXe User’s Guide MXM V3.1
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2.4. Application Programming Interface —API
•DirectX 12 Ultimate, DirectX 12
•Vulkan 1.1
•OpenCL 3.0, OpenGL 4.6
2.5. Operation System
Microsoft Windows 11 / 10, Linux
2.6. Debug
MIPI20 on-board debug connector (additional specific fixture and cable required)
2.7. Mechanical and Environmental
Form Factor and Specification
MXM 3.1 Type A: 82mm x 70mm
Operating Temperature
Standard 0°C to 55°C Storage: -40°C to 85°C
Industrial (TBC) -20°C to 70°C Storage: -40°C to 85°C
Humidity
5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating)
HALT tested
Thermal Stress, and Thermal Shock

MXM-AXe User’s Guide MXM V3.1
Page 12 Copyright © 2023 ADLINK Technology, Inc.
3. Block Diagram
AB
MXM 3.1 Golden Finger
11th Generation
Intel Xeon/Core/Celeron Processor
Tiger Lake-H
1 PCIe GEN4 x4
Intel
500 Series Chipset
SATA 6Gb /s (HSIO 19-22)
1 PCI e GEN 3 (HSIO 11)
(HSIO 3) US B 3.2 Ge n2 x1
(HSIO 4) US B 3.2 Ge n2 x1
(HSIO 2) US B 3.2 Ge n2 x1
(HSIO 1) US B 3.2 Ge n2 x1
DMI (x8, Gen3)
4 PCI e GEN 3 (HSIO 15-18)
2 PCI e GEN 3 (HSIO 23-24)
2 PCI e GEN 3 (HSIO 25-26)
VBIOS
SPI
2 PCI e GEN 3 (HSIO 13-14)
Intel Arc GPU
Mobile
(Alchemist)
A370M
A350M
SPI
GDDR6 2GB
memory down
PCIe Gen4
DP_A
DP_B
DP_C
DP_D
Power Management
signals
Power pins
12V/5V/3.3V etc.
x8
GDDR6 2GB
memory down
SMB Report G PU Tj
MIPI 20pin
for diagnostic
purposes
Figure 1 – Module function diagram

MXM-AXe User’s Guide MXM V3.1
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4. Pinout and Signal Descriptions
The table below is a comprehensible list of all signal pins supported as defined by MXM version 3.1 specification. Signals described in the specification
but not supported on the MXM-AXe are marked with strike-through.
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
E1
PWR_SRC
E2
PWR_SRC
55
PEX_RX14#
56
PEX_TX14
E3
GND
E4
GND
57
PEX_RX14
58
GND
1
5V
2
PRSNT_R#
59
GND
60
PEX_TX13#
3
5V
4
WAKE#
61
PEX_RX13#
62
PEX_TX13
5
5V
6
PWR_GOOD
63
PEX_RX13
64
GND
7
5V
8
PWR_EN
65
GND
66
PEX_TX12#
9
5V
10
27MHZ_REF
67
PEX_RX12#
68
PEX_TX12
11
GND
12
GND
69
PEX_RX12
70
GND
13
GND
14
LVDS_U_HPD
71
GND
72
PEX_TX11#
15
GND
16
JTAG_TESTEN
73
PEX_RX11#
74
PEX_TX11
17
GND
18
PWR_LEVEL
75
PEX_RX11
76
GND
19
PEX_STD_SW#
20
TH_OVERT#
77
GND
78
PEX_TX10#
21
VGA_DISABLE#
22
TH_ALERT#
79
PEX_RX10#
80
PEX_TX10
23
PNL_PWR_EN
24
TH_PWM
81
PEX_RX10
82
GND
25
PNL_BL_EN
26
GPIO0
83
GND
84
PEX_TX9#
27
PNL_BL_PWM
28
GPIO1
85
PEX_RX9#
86
PEX_TX9
29
HDMI_CEC
30
GPIO2
87
PEX_RX9
88
GND
31
LVDS_L_HPD
32
SMB_DAT
89
GND
90
PEX_TX8#
33
LVDS_DDC_DAT
34
SMB_CLK
91
PEX_RX8#
92
PEX_TX8
35
LVDS_DDC_CLK
36
GND
93
PEX_RX8
94
GND
37
GND
38
OEM0
95
GND
96
PEX_TX7#
39
OEM1
40
OEM2
97
PEX_RX7#
98
PEX_TX7
41
OEM3
42
OEM4
99
PEX_RX7
100
GND
43
OEM5
44
OEM6
101
GND
102
PEX_TX6#
45
OEM7
46
GND
103
PEX_RX6#
104
PEX_TX6
47
GND
48
PEX_TX15#
105
PEX_RX6
106
GND
49
PEX_RX15#
50
PEX_TX15
107
GND
108
PEX_TX5#
51
PEX_RX15
52
GND
109
PEX_RX5#
110
PEX_TX5
53
GND
54
PEX_TX14#
111
PEX_RX5
112
GND

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Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
113
GND
114
PEX_TX4#
183
LVDS_UTX2
184
LVDS_LTX3
115
PEX_RX4#
116
PEX_TX4
185
GND
186
GND
117
PEX_RX4
118
GND
187
LVDS_UTX1#
188
LVDS_LTX2#
119
GND
120
PEX_TX3#
189
LVDS_UTX1
190
LVDS_LTX2
121
PEX_RX3#
122
PEX_TX3
191
GND
192
GND
123
PEX_RX3
124
GND
193
LVDS_UTX0#
194
LVDS_LTX1#
125
GND
126
KEY
195
LVDS_UTX0
196
LVDS_LTX1
127
KEY
128
KEY
197
GND
198
GND
129
KEY
130
KEY
199
DP_C_L0#
200
LVDS_LTX0#
131
KEY
132
KEY
201
DP_C_L0
202
LVDS_LTX0
133
GND
134
GND
203
GND
204
GND
135
PEX_RX2#
136
PEX_TX2#
205
DP_C_L1#
206
DP_D_L0#
137
PEX_RX2
138
PEX_TX2
207
DP_C_L1
208
DP_D_L0
139
GND
140
GND
215
GND
216
GND
141
PEX_RX1#
142
PEX_TX1#
217
DP_C_L3#
218
DP_D_L2#
143
PEX_RX1
144
PEX_TX1
219
DP_C_L3
220
DP_D_L2
145
GND
146
GND
221
GND
222
GND
147
PEX_RX0#
148
PEX_TX0#
223
DP_C_AUX#
224
DP_D_L3#
149
PEX_RX0
150
PEX_TX0
225
DP_C_AUX
226
DP_D_L3
151
GND
152
GND
227
RSVD
228
GND
153
PEX_REFCLK#
154
PEX_CLK_REQ#
229
RSVD
230
DP_D_AUX#
155
PEX_REFCLK
156
PEX_RST#
231
RSVD
232
DP_D_AUX
157
GND
158
VGA_DDC_DAT
233
RSVD
234
DP_C_HPD
159
JTAG_TDO
160
VGA_DDC_CLK
235
RSVD
236
DP_D_HPD
161
JTAG_TDI
162
VGA_VSYNC
237
RSVD
238
RSVD
163
JTAG_TCLK
164
VGA_HSYNC
239
RSVD
240
3V3
165
JTAK_TMS
166
GND
241
RSVD
242
3V3
167
JTAG_TRST#
168
VGA_RED
243
RSVD
244
GND
169
JTAG_UCLK#
170
VGA_GREEN
245
RSVD
246
DP_B_L0#
171
JTAG_UCLK
172
VGA_BLUE
247
RSVD
248
DP_B_L0
173
GND
174
GND
249
RSVD
250
GND
175
LVDS_UTX3#
176
LVDS_LCLK#
251
GND
252
DP_B_L1#
177
LVDS_UTX3
178
LVDS_LCLK
253
DP_A_L0#
254
DP_B_L1
179
GND
180
GND
255
DP_A_L0
256
GND
181
LVDS_UTX2#
182
LVDS_LTX3#
257
GND
258
DP_B_L2#

MXM-AXe User’s Guide MXM V3.1
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Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
259
DP_A_L1#
260
DP_B_L2
269
GND
270
DP_B_AUX#
261
DP_A_L1
262
GND
271
DP_A_L3#
272
DP_B_AUX
263
GND
264
DP_B_L3#
273
DP_A_L3
274
DP_B_HPD
265
DP_A_L2#
266
DP_B_L3
275
GND
276
DP_A_HPD
267
DP_A_L2
268
GND
277
DP_A_AUX#
278
3V3

MXM-AXe User’s Guide MXM V3.1
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5. Additional Features
This chapter describes connectors, switches, and additional items located on the module and not necessarily included in the MXM standard specifica-
tion. The locations of these items are as below:
5.1. Module Feature Locations
Figure 2 – Module feature locations (top side)
HDMI Mode Select

MXM-AXe User’s Guide MXM V3.1
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Figure 3 – Module feature locations (bottom side)
MIPI20 Debug Connector
(for debug purposes only)

MXM-AXe User’s Guide MXM V3.1
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5.2. HDMI Mode Select
The HDMI Mode Select Switch allows you to configure the display outputs to be HDMI signals. A specific VBIOS setting and level shift for HDMI usage
on carrier board are also required
Mode
Pin 1
(DP_A Port)
Pin 2
(DP_B Port)
Pin 3
(DP_C Port)
Pin 4
(DP_D Port)
DP (default)
On
On
On
On
HDMI
Off
Off
Off
Off
5.3. MIPI20 Debug Connector
This connector is particular useful during bring up phase. It will require additional MIPI20 to MIPI60 cable and a dedicated debug card with specific SW
tool. This is only for ADLINK internal debug usage.
Pin 1
Pin 2
Pin 3
Pin 4

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6. Mechanical
All dimensions are shown in millimetres, with a tolerance of ± 0.25mm unless otherwise noted.
6.1. Module Dimensions – Top View
Figure 4 – Module dimensions (top view)

MXM-AXe User’s Guide MXM V3.1
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6.2. Module Dimensions – Bottom View
Figure 5 – Module dimensions (bottom view)