ADLINK Technology DLAP-4000 Series User manual

Leading EDGE COMPUTING
DLAP-4000 Series
8th/9th Generation Intel® Core™ i7/i5/i3 Processor
Embedded Computer
User’s Manual
Manual Rev.: 1.0
Revision Date: Dec. 28, 2020
Part No: 50-1Z344-1000

ii
Leading EDGE COMPUTING
Revision History
Revision Release Date Description of Change(s)
1.0 2020-12-28 Initial release

Preface iii
DLAP-4000
Preface
Copyright © 2020 ADLINK Technology Inc.
This document contains proprietary information protected by copy-
right. All rights are reserved. No part of this manual may be repro-
duced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, spe-
cial, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsi-
bility to global environmental preservation
through compliance with the European Union's
Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic
Equipment (WEEE) directive. Environmental pro-
tection is a top priority for ADLINK. We have
enforced measures to ensure that our products,
manufacturing processes, components, and raw
materials have as little impact on the environment as possible.
When products are at their end of life, our customers are encour-
aged to dispose of them in accordance with the product disposal
and/or recovery programs prescribed by their nation or company.
Battery Labels (for products with battery)
ᘄ㟁ụㄳᅇᨲ

iv Preface
Leading EDGE COMPUTING
California Proposition 65 Warning
WARNING: This product can expose you to chemicals
including acrylamide, arsenic, benzene, cadmium,
Tris(1,3-dichloro-2-propyl) phosphate (TDCPP), 1,4-
Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC,
and vinyl materials, which are known to the State of California to
cause cancer, and acrylamide, benzene, cadmium, lead, mercury,
phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and
vinyl materials, which are known to the State of California to cause
birth defects or other reproductive harm. For more information go
to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification pur-
poses only and may be trademarks and/or registered trademarks
of their respective companies.
Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
instructions properly.
NOTE:
NOTE:
Additional information, aids, and tips that help users perform
tasks.
CAUTION:
Information to prevent minor physical injury, component dam-
age, data loss, and/or program corruption when trying to com-
plete a task.
ATTENTION: Informations destinées à prévenir les blessures
corporelles mineures, les dommages aux composants, la perte
de données et/ou la corruption de programme lors de l'exécu-
tion d'une tâche.
WARNING:
Information to prevent serious physical injury, component
damage, data loss, and/or program corruption when trying to
complete a specific task.
AVERTISSEMENT: Informations destinées à prévenir les bles-
sures corporelles graves, les dommages aux composants, la
perte de données et/ou la corruption de programme lors de
l'exécution d'une tâche spécifique.

Table of Contents v
DLAP-4000
Table of Contents
Preface.................................................................................... iii
List of Tables......................................................................... vii
List of Figures........................................................................ ix
1 Introduction ........................................................................ 1
1.1 Overview.............................................................................. 1
1.2 Features............................................................................... 1
1.3 Packing List ......................................................................... 2
2 Specifications..................................................................... 3
2.1 DLAP-4000 Functional Block Diagram ................................ 5
2.2 Display Options.................................................................... 6
2.3 Mechanical Dimensions....................................................... 7
3 System Layout.................................................................. 13
3.1 Front Panel ........................................................................ 13
3.2 Internal I/O Connectors...................................................... 22
4 Getting Started ................................................................. 27
4.1 Attach AC Power Cord....................................................... 27
4.2 Mounting the DLAP-4000 .................................................. 28
4.3 Installing 2.5"/3.5" Storage ................................................ 32
4.4 Installing M.2 Storage ........................................................ 37
4.5 Driver Installation ............................................................... 39
A Appendix: BIOS Setup......................................................41
A.1 BIOS Setup Menu.............................................................. 41
A.2 Menu Structure .................................................................. 43
A.3 Main Menu ......................................................................... 45
A.4 Advanced Menu................................................................. 46

vi Table of Contents
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A.5 Chipset............................................................................... 61
A.6 Security.............................................................................. 70
A.7 Boot ................................................................................... 72
A.8 Save & Exit ........................................................................ 73
Important Safety Instructions............................................... 75
Consignes de Sécurité Importante...................................... 77
Getting Service...................................................................... 81

List of Tables vii
DLAP-4000
List of Tables
Table 2-1: DLAP-4000 Specifications.......................................... 3
Table 2-2: Maximum Display Resolutions ................................... 6
Table 3-1: Front/Rear Panel I/O Legend ................................... 14
Table 3-2: Extended Power Connector Pin Definition ............... 15
Table 3-3: DisplayPort Pin Definition ......................................... 16
Table 3-4: HDMI Pin Definition .................................................. 17
Table 3-5: DVI-D Connector Pin Definition ................................ 18
Table 3-6: Ethernet Port Pin Definition ..................................... 19
Table 3-7: Active/Link LED Indicators........................................ 19
Table 3-8: D-Sub 9-pin Signal Function of COM Ports.............. 20
Table 3-9: 8-bit GPIO Pin Definition .......................................... 21
Table 3-10: Mainboard Connector Legend .................................. 24
Table 3-11: Clear CMOS (CLCMOS1) ........................................ 25

viii List of Tables
Leading EDGE COMPUTING
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List of Figures ix
DLAP-4000
List of Figures
Figure 2-1: DLAP-4000 Functional Block Diagram ............................ 5
Figure 2-2: DLAP-4000 Top View ...................................................... 7
Figure 2-3: DLAP-4000 Right Side View............................................ 8
Figure 2-4: DLAP-4000 Left Side View .............................................. 8
Figure 2-5: DLAP-4000 Bottom View ................................................. 9
Figure 2-6: DLAP-4000 Rear View................................................... 10
Figure 2-7: DLAP-4000 Front View .................................................. 11
Figure 3-1: Front Panel I/O .............................................................. 13
Figure 3-2: Rear Panel I/O ............................................................... 14
Figure 3-3: Extended Power Connector Pin Definition..................... 15
Figure 3-4: DisplayPort Connector Pin Definition............................. 16
Figure 3-5: HDMI Connector Pin Definition...................................... 17
Figure 3-6: DVI-D Connector Pin Definition ..................................... 18
Figure 3-7: Ethernet Port and LEDs................................................. 19
Figure 3-8: COM Port Pin Definition................................................. 20
Figure 3-9: 8-bit GPIO Connector Pin Definition .............................. 21
Figure 3-10: Mainboard Front Connectors ......................................... 22
Figure 3-11: Mainboard Rear Connectors.......................................... 23
Figure 4-1: DLAP-4000 Wall-mount Brackets .................................. 31
Figure 4-2: Holes for 1st storage (2.5” HDD/SSD)........................... 34
Figure 4-3: Holes for 2nd storage (2.5” HDD/SSD or 3.5” HDD) ..... 34
Figure 4-4: Storage bracket with 2x 2.5” HDD/SSD......................... 35
Figure 4-5: Storage bracket with 2.5” + 3.5” Drives ......................... 35

xListofFigures
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Introduction 1
DLAP-4000
1 Introduction
1.1 Overview
ADLINK’s DLAP-4000 Series of embedded computing platforms,
incorporating Intel®Core™i7/i5/i3 processors, provides 2 internal
SATA trays, 1 M.2 2280 drive, 1 Mini PCIe slot and 1 PCIe x16
slot optimizing easy maintenance in industrial automation environ-
ments with the most compact size and optimized thermal design,
accommodating the largest graphic cards. The DLAP-4000 series
supports DDR4 memory for more powerful computing and the
Intel®HD Graphics 630 speeds graphics performance.
1.2 Features
X8th/9th Gen Intel® Core™ i7/i5/i3 FCLGA1151 processor
and H310 chipset
X2x DDR4 SODIMM socket, supporting up to 32GB DDR4
2666 SODIMM Module
X1x DisplayPort, 1x HDMI, 1x DVI-D supporting 2 indepen-
dent displays w/ H310
X6 External USB ports (4x USB 3.0, 2x USB 2.0)
X Built-in 8-bit GPIO, 1x RS-232/422/485 and 4x RS-232 ports
XOnboard SATA 6Gb/s port for 2.5” HDD/SSD installation,
and SATA 6Gb/s
XBuilt-in 100V AC to 240V AC, 300W/500W Flex ATX PSU

2Introduction
Leading EDGE COMPUTING
1.3 Packing List
Before unpacking, check the shipping carton for any damage. If
the shipping carton and/or contents are damaged, inform your
dealer immediately. Retain the shipping carton and packing mate-
rials for inspection. Obtain authorization from your dealer before
returning any product to ADLINK. Ensure that the following items
are included in the package.
XDLAP-4000 Embedded Computer
XAccessory Box
ZUS power cord
ZWall-mount brackets
ZScrew pack

Specifications 3
DLAP-4000
2 Specifications
DLAP-4000
System Core
Processor
XIntel® Core™ i7-9700E, 2.6GHz, 12M Cache, 65W TDP,
LGA1151, DDR4 2666MHz support (8C/8T)
XIntel® Core™ i5-9500E, 3.0GHz, 9M Cache, 65W TDP,
LGA1151, DDR4 2666MHz support (6C/6T)
XIntel® Core™ i3-9100E, 3.1GHz, 6M Cache, 65W TDP,
LGA1151, DDR4 2666MHz support (4C/4T)
XIntel® Core™ i7-9700TE, 1.8GHz, 12M Cache, 35W TDP,
LGA1151, DDR4 2666MHz support (8C/8T)
XIntel® Core™ i5-9500TE, 2.2GHz, 9M Cache, 35W TDP,
LGA1151, DDR4 2666MHz support (6C/6T)
XIntel® Core™ i3-9100TE, 2.2GHz, 6M Cache, 35W TDP,
LGA1151, DDR4 2666MHz support (4C/4T)
XIntel® Core™ i7-8700, 3.2GHz, 12M Cache, 65W TDP,
LGA1151, DDR4 2666MHz support (6C/12T)
XIntel® Core™ i5-8500, 3.0GHz, 9M Cache, 65W TDP,
LGA1151, DDR4 2666MHz support (6C/6T)
XIntel® Core™ i3-8100, 3.6GHz, 6M Cache, 65W TDP,
LGA1151, DDR4 2400MHz support (4C/4T)
XIntel® Core™ i7-8700T, 2.4GHz 12M Cache, 35W TDP,
LGA1151, DDR4 2666MHz support (6C/12T)
XIntel® Core™ i5-8500T, 2.1GHz, 9M Cache, 35W TDP,
LGA1151, DDR4 2666MHz support (6C/6T)
XIntel® Core™ i3-8100T, 3.1GHz, 6M Cache, 35W TDP,
LGA1151, DDR4 2400MHz support (4C/4T)
Chipset Intel® H310 Chipset
Memory Non-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 32GB
(dependent on CPU) system memory
PEG Card
Support
NVIDIA®
Quadro®
P2200
NVIDIA®
Quadro®
RTX 4000
NVIDIA®
Quadro®
RTX 5000
NVIDIA®
Quadro®
RTX 6000
NVIDIA®
Quadro®
RTX 8000
Table 2-1: DLAP-4000 Specifications

4 Specifications
Leading EDGE COMPUTING
I/O Interface
Display
1x DVI-D connector (rear), resolution up to 1920 x 1200 @ 60 Hz
1x DP connector (rear), resolution up to 4096 x 2304 @ 60 Hz
1x HDMI connector (rear) resolution up to 4096 x 2160 @ 30 Hz
Additional display output from PEG cards
Ethernet 2x GbE (Realtek RTL8111G)
Serial Ports 1x RS-232/422/485, 4x RS-232
USB 4x USB 3.1 Gen1 ports, 2x USB 2.0 ports
DIO 1x 8-bit GPIO
Mini PCIe 1x Mini PCIe slot (USB 2.0 and PCIe x1)
M.2 1x M.2 M key (SATA 6Gb/s)
Expansion 1x PCIe x16 slot
Audio Mic-in, Line-out, Line-in
TPM 2.0 Optional
Storage
2.5" SATA 2x 2.5" SATA 6Gb/s internal drive bays
Mechanical
Dimensions 220 x 300 x 150 mm (W x D x H)
Power Supply
AC Input 100V to 240V AC
Output
Rating 300W 500W 500W 500W 500W
Environmental
Operating
Temperature 0°C to 50°C 0°C to 50°C 0°C to 40°C 0°C to 40°C 0°C to 40°C
Storage
Temperature -20°C to 60°C
Humidity 5% to 90%, non-condensing
Vibration Operating: 1Grms, 5-500Hz, 3 axes (with 2.5" SSD and PEG card)
Non-operating: 2Grms, 5-500Hz, 3 axes
Shock Operating: 20G, 11ms duration, half sine
Non-operating: 30G, 11ms duration, half sine
EMC EN55032/35, EN61000-6-2/-4, CE, FCC Part 15B Class B
Safety UL/cUL, CB
DLAP-4000
Table 2-1: DLAP-4000 Specifications

Specifications 5
DLAP-4000
2.1 DLAP-4000 Functional Block Diagram
Figure 2-1: DLAP-4000 Functional Block Diagram
TPM 2.0 (Optional)
SLB9665TT2.0
DP Conn.
(1.2)
DVI-D
BIOS (256Mb UEFI)
Intel®H310
Chipset
NCT6106D
WDT
H/W Monitor
Intel®Core™
i7/i5/i3 Processor
(formerly “Coffee Lake
Refresh”)
LGA 1151 Socket
SATA #0
LPC
Audio
DMI 3.0
Vercal SODIMM
DDR4 (non ECC)
Channel A
SPI
SPI Header
SATA Port 1
DDI1
RTL 8111 G RJ-45
MDIxPCIe x1
ALC892
(ALC888S)
RS-232/422/485
DB9 x1
RS232 Header x4
CPU Fan x1
Sys Fan x1
PCIe x16 slot
Vercal SODIMM
DDR4 (non ECC)
Channel B
PCIe x16
CH5711
Passive Level Shier
HDMI Conn.
(1.4b) ASM1442K Level Shier
TMDS
LVDS
HDA
HDA
Rear I/O Conn. x1
(Line-In, Line-Out, Mic-In)
Front Audio header x1
(Line-Out, Mic-In)
LPC Header
UART1
UART2~5
Fan
Fan
GPIO Header x1 8-bit GPIO
SATA Port 2
SATA #2 M.2
PCIe x1
Mini-PCIe
USB 2.0
USB 2.0
Header
USB 2.0
USB 3.0 Port
x2
USB 3.1 Gen2 (H310: USB 3.1 Gen1)
USB 2.0
RTL 8111 G RJ-45
MDIxGbE
USB 3.0 Port
x2
USB 3.1 Gen2 (H310: USB 3.1 Gen1)
USB 2.0
SPI
HDA
LPC
GPIO
PCIe #11
PCIe #12
PCIe #13
PCIe #14
PCIe #15
PCIe #5
USB 2.0 #10
USB 2.0 #7/#8
USB 2.0 #3/#4
USB 3.1 #3/#4
USB 2.0 #1/#2
USB 3.1 #1/#2

6 Specifications
Leading EDGE COMPUTING
2.2 Display Options
With computing and graphic performance enhancement from its
8th & 9th Generation Intel processors, the DLAP-4000 controller
can support or two independent displays, with configurations as
follows.
Table 2-2: Maximum Display Resolutions
Port Resolution
Display Option 1 DisplayPort1 4096x2304@60Hz
Display Option 2 HDMI 4096x2160@30Hz
Display Option 3 DVI-D 1920x1200@60Hz

Specifications 7
DLAP-4000
2.3 Mechanical Dimensions
All dimensions in millimeters (mm).
Figure 2-2: DLAP-4000 Top View
220
301
12

8 Specifications
Leading EDGE COMPUTING
Figure 2-3: DLAP-4000 Right Side View
Figure 2-4: DLAP-4000 Left Side View

Specifications 9
DLAP-4000
Figure 2-5: DLAP-4000 Bottom View

10 Specifications
Leading EDGE COMPUTING
Figure 2-6: DLAP-4000 Rear View