ADLINK Technology DLAP-411-Orin User manual

Leading EDGE COMPUTING
DLAP-411-Orin
Edge Inference System
User’s Manual
Manual Rev.: 0.6
Revision Date: November 22, 2023
Part No: 50M-45108-1000

Revision History iii
DLAP-411 Orin
Revision History
Revision Release Date Description of Change(s)
0.1 2023-07-19 Preliminary release
0.2 2023-08-15 Updated dimensions and panel I/O
0.3 2023-10-05 Updated Chapter 3
0.4 2023-10-31 Updated installation images and add 3.6
LED Indicators
0.5 2023-11-20 Added Side Panel I/O and Sections 1.5.8,
1.5.9, 3.7 Multi I/O Control
0.6 2023-11-20 Added exterior antenna illustrations for
installing Wi-Fi, 5G module added

Preface v
DLAP-411-Orin
Preface
Copyright © 2023 ADLINK Technology, Inc.
This document contains proprietary information protected by copy-
right. All rights are reserved. No part of this manual may be repro-
duced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, spe-
cial, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global
environmental preservation through compliance with the Euro-
pean Union's Restriction of Hazardous Substances (RoHS) direc-
tive and Waste Electrical and Electronic Equipment (WEEE)
directive. Environmental protection is a top priority for ADLINK.
We have enforced measures to ensure that our products, manu-
facturing processes, components, and raw materials have as little
impact on the environment as possible. When products are at their
end of life, our customers are encouraged to dispose of them in
accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification pur-
poses only and may be trademarks and/or registered trademarks
of their respective companies.

vi Preface
Leading EDGE COMPUTING
Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
instructions properly.
NOTE:
NOTE:
Additional information, aids, and tips that help users perform
tasks.
CAUTION:
Information to prevent minor physical injury, component dam-
age, data loss, and/or program corruption when trying to com-
plete a task.
Informations destinées à prévenir les blessures corporelles
mineures, les dommages aux composants, la perte de don-
nées et/ou la corruption de programme lors de l'exécution
d'une tâche.
WARNING:
Information to prevent serious physical injury, component
damage, data loss, and/or program corruption when trying to
complete a specific task.
Informations destinées à prévenir les blessures corporelles
graves, les dommages aux composants, la perte de données
et/ou la corruption de programme lors de l'exécution d'une
tâche spécifique.

Table of Contents vii
DLAP-411-Orin
Table of Contents
Revision History..................................................................... iii
Preface ..................................................................................... v
List of Tables.......................................................................... ix
List of Figures ........................................................................ xi
1 Introduction ........................................................................ 1
1.1 Features............................................................................... 1
1.2 Specifications....................................................................... 2
1.3 Mechanical Dimensions....................................................... 4
1.4 External Layout.................................................................... 5
1.5 Pin Definitions...................................................................... 8
1.5.1 Ethernet GbE Connectors .......................................... 8
1.5.2 USB 3.2 Gen2 Connectors ......................................... 8
1.5.3 24 Volt DC Connector................................................. 9
1.5.4 CAN (Controller Area Network) Bus ........................... 9
1.5.5 COM Port (Serial Port) ............................................. 10
1.5.6 HDMI Connector....................................................... 11
1.5.7 USB 3.2 Gen2 OTG Connector ................................ 12
1.5.8 Multi I/O .................................................................... 13
1.5.9 Micro SD Card Slot................................................... 15
1.6 DIP Switch Configurations ................................................. 16
1.6.1 AT Power Mode Switch ............................................ 16
2 Getting Started ................................................................. 17
2.1 Unpacking Checklist .......................................................... 17
2.2 Removing the Chassis Cover ............................................ 17
2.3 Installing an M.2 SSD Module ........................................... 19
2.4 Installing a Wi-Fi Module ................................................... 20

viii Table of Contents
Leading EDGE COMPUTING
2.5 Installing a 5G/LTE Module................................................ 22
2.6 Connecting DC Power ....................................................... 24
2.7 Mounting (Optional) ........................................................... 25
3 Using the System.............................................................. 27
3.1 Software Configuration ...................................................... 27
3.2 System Recovery............................................................... 27
3.3 Multi IO Configuration ........................................................ 28
3.4 COM Port Configuration..................................................... 31
3.5 CAN Bus Configuration...................................................... 31
3.6 LED Indicators ................................................................... 32
3.7 Multi I/O Control................................................................. 34
3.7.1 GPIO Map................................................................. 34
3.7.2 SPI I2C ..................................................................... 36
3.8 Temperature Sensor (LM73).............................................. 36
Important Safety Instructions............................................... 37
Getting Service ...................................................................... 39

List of Tables ix
DLAP-411-Orin
List of Tables
Table 1-1: Specifications ............................................................. 3
Table 1-2: Front Panel I/O Connectors & Controls ...................... 5
Table 1-3: Rear Panel I/O Connectors ........................................ 6
Table 1-4: Rear Panel I/O Connectors ........................................ 7
Table 1-5: USB 3.2 Gen2 Pin Definition ...................................... 8
Table 1-6: 24 Volt DC Connector Pin Definition .......................... 9
Table 1-7: CAN Bus Pin Definition............................................... 9
Table 1-8: RS-232/422/485 Connector Pin Definition................ 10
Table 1-9: HDMI Connector Pin Definition................................. 11
Table 1-10: USB 3.2 Gen2 OTG Connector Pin Information....... 12
Table 1-11: Multi IO 1 Connector Pin Information ....................... 13
Table 1-12: Multi IO 2 Connector Pin Information ....................... 14
Table 1-13: AT Power Mode Switch ............................................ 16

xListofTables
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List of Figures xi
DLAP-411-Orin
List of Figures
Figure 1-1: Front View Dimensions............................................... 4
Figure 1-2: Rear View Dimensions ............................................... 4
Figure 1-3: Front Panel I/O Connectors & Controls ...................... 5
Figure 1-4: Rear Panel I/O Connectors ........................................ 6
Figure 1-5: Side Panel I/O Connectors ......................................... 7
Figure 2-1: M.2 Slot .................................................................... 19
Figure 2-2: Mini PCIe Wi-Fi Slot ................................................. 20
Figure 2-3: M.2 Key Slot ............................................................. 22
Figure 2-4: Wall Mount................................................................ 25

xii List of Figures
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Introduction 1
DLAP-411-Orin
1 Introduction
ADLINK’s DLAP-Orin Edge Inference System harnesses the
power of NVIDIA® Jetson™ AGX Orin modules to realize industry-
leading smart automation across a wide range of applications,
enabling tasks such as automatic obstacle identifying, collision
avoiding, safety navigation, detour adjustments, and automatic
adjustments to a number of environmental factors.
DLAP-411-Orin features intelligent, flexible, and robust computing
power to automate intralogistic workflows in both industrial and
commerical environments alike.
Boasting comprehensive industrial I/O and visual inferencing
capabilities all in a compact system, DLAP-411-Orin supports 1x
HDMI display, 4x GbE PSE ports (optional), 4x USB 3.2 Gen 2
ports (plus a USB 3.2 Gen 2 Type-C OTG port for BSP flashing),
1x isolated CAN bus, 1x COM (RS-232/422/485), 1x M.2 M key
NVME (for additional storage options), 1x M.2 2230 E key slot to
support Wi-Fi communications, and 1x 3042/3052 B key for 4/5G
communications.
1.1 Features
Deep learning acceleration with NVIDIA® Jetson™ AGX
Orin
4x USB 3.2 Gen 2, 4x GbE PSE ports (optional), 1x Type-C
USB 3.2 Gen 2
Internal function expansions by M.2 E key 2230, 3042/3052
B key
Compact system: 175(W) x 145(D) x 85(H) mm
24V DC input
Additional storage by M.2 key 2242/2280

2Introduction
Leading EDGE COMPUTING
1.2 Specifications
Item Description
System Core
Module NVIDIA® Jetson™ AGX Orin
Memory 32/64GB LPDDR5 (on module)
Storage 64GB eMMC 5.1 (on module)
Front Panel I/O Interface
USB 3.2 Gen 2 4x Type-A
Ethernet 4x GbE PSE ports (optional)
Pushbuttons
1x Power button
1x Reset button
1x Recovery button
Side Panel I/O Interface
CAN Bus 1x CAN bus (DB-9 male)
USB 3.2 Gen 2 1x Type-C
HDMI 1x HDMI 2.0a Type A
COM 1x RS-232/422/485 (DB9 male D-sub connector)
Internal I/O Interface
M.2 E Key 1x (2230)
M.2 B Key 1x (2242 / 3042)
M.2 M Key 1x (2242 / 2280)
USIM 1x USIM
Power
DC Input 24V
AC Input Optional 160W (up to 220W) AC-DC adapter
Fail Reset Reset and recovery buttons
Buttons Power button w/ LED indicator
Mechanical
Antenna Holes 6x SMA
Dimensions 175(W) x 145(D) x 85(H) mm
Weight 2.2kg

Introduction 3
DLAP-411-Orin
Table 1-1: Specifications
Environmental
Operating
Temperature
32G:
-20°C to 60°C with 0.6m/s airflow, at 40W
(not including Wi-Fi module, M.2 SSD)
-20°C to 55°C with 0.6m/s airflow, at max power, MAXN
(not including Wi-Fi module, M.2 SSD)
64G:
-20°C to 55°C with 0.6m/s airflow, at 50W
(not including Wi-Fi module, M.2 SSD)
-20°C to 40°C with 0.6m/s airflow, at max power, MAXN
(not including Wi-Fi module, M.2 SSD)
Operating
Humidity 93% RH @40°C (non-condensing)
Storage
Temperature -20°C to 80°C (-4°F to 176°F)
Altitude Operating: < 2000 m
Vibration Operating: 5 to 500 Hz, 1 G acceleration (IEC 60068-2-6)
Shock Operating: 15G, half sine 11 ms (IEC 60068-2-6)
EMC CE & FCC class B, (EN61000-6-4/-6-2/-3-3/-3-2)
Safety IEC/CE standard
Substance
Regulations WEEE/ROHS/REACH compliant
Operating System Support
Linux Ubuntu for Tegra

4Introduction
Leading EDGE COMPUTING
1.3 Mechanical Dimensions
All dimensions shown in millimeters (mm).
Figure 1-1: Front View Dimensions
Figure 1-2: Rear View Dimensions

Introduction 5
DLAP-411-Orin
1.4 External Layout
Front Panel
Figure 1-3: Front Panel I/O Connectors & Controls
Table 1-2: Front Panel I/O Connectors & Controls
Item Name Description
A Recovery button Press this button to force the system into recovery
mode. See Section 3.2 System Recovery.
B Reset button The reset button executes a hard reset on the
system.
C Power button
The power button is a non-latched push button
with a green LED power indicator. If the system is
powered off when the button is pressed, the
system powers up and the blue LED lights up. If
the system hangs, pressing and holding the
button continuously for 5 seconds performs a hard
shutdown on the system.
D Audio connector Mic-in (mono). Line-out (stereo)
EOut-of-Band (OOB)
module.
OOB is a hardware-based technology that helps
service providers manage devices remotely with
monitoring and management features.
FUser-define LEDs
x6 See Section 3.6 LED Indicators.
G GbE connector See Section 1.5.1 Ethernet GbE Connectors.
H USB 3.2 Gen2 x4 See Section 1.5.2 USB 3.2 Gen2 Connectors.
I 24V DC connector 24V DC screw-type connector. See Section 1.5.3
24 Volt DC Connector.

6Introduction
Leading EDGE COMPUTING
Rear Panel
Figure 1-4: Rear Panel I/O Connectors
Table 1-3: Rear Panel I/O Connectors
Item Name Description
JUSB 3.2 Gen2 OTG
Type-C
See Section 1.5.7 USB 3.2 Gen2 OTG
Connector.
K HDMI port HDMI 2.0
L Serial port COM port (DB9 male D-sub connector)
RS-232/422/485 (software programmable)
MCANbus CAN 2.0B (only supported with Jetson AGX Orin,
backward compatible with 2.0A)

Introduction 7
DLAP-411-Orin
Side Panels
Figure 1-5: Side Panel I/O Connectors
Table 1-4: Rear Panel I/O Connectors
Item Name Description
N Multi IO 1 See Section 1.5.8 Multi I/O.
O Multi IO 2
P micro SD card slot See Section 1.5.9 Micro SD Card Slot.
QWi-Fi antenna
connectors See Section 2.4 Installing a Wi-Fi Module.
R
S
5G/LTE antenna
connectors See Section 2.5 Installing a 5G/LTE Module.
T
U
V

8Introduction
Leading EDGE COMPUTING
1.5 Pin Definitions
1.5.1 Ethernet GbE Connectors
The DLAP-411-Orin comes with four RJ-45 connectors. When
these Ethernet connectors support PoE, you will get an output of
48V DC, 0.3125A, and 15W from each.
Intel® I210 (LAN1-3)
NVIDIA® Jetson™ AGX Orin (LAN 4)
LAN LED connection speed color indicators:
1.5.2 USB 3.2 Gen2 Connectors
The USB 3.2 Gen2 ports support a USB Type-A connection, com-
patible with SuperSpeed, Hi-Speed, full-speed, and low-speed
USB peripherals including USB cameras..
Table 1-5: USB 3.2 Gen2 Pin Definition
Rate Speed (left) LED Active & Link (right) LED
10Mbps N/A Blinks yellow
100Mbps Lights green
1Gbps Lights orange
Pin # Signal Name
1 USB3.0_P5VA
2 USB2_CMAN
3 USB2_CMAP
4GND
5 USB3A_CMRXN
6 USB3A_CMRXP
7GND
8 USB3A_CMTXN
9 USB3A_CMTXP

Introduction 9
DLAP-411-Orin
1.5.3 24 Volt DC Connector
The system requires a DC power source via a Eurostyle terminal
block.
Table 1-6: 24 Volt DC Connector Pin Definition
1.5.4 CAN (Controller Area Network) Bus
The Controller Area Network (CAN) enables communication
among devices. The table below provides CAN bus pin informa-
tion.
Table 1-7: CAN Bus Pin Definition
Pin Signal
1 DC in P
2DGND
3 DC in N
Pin Signal Description
1 NC (Not connected)
2 CAN_Low Differential CAN signal negative level
3 GND CAN interface ground
4 NC (Not connected)
5 NC (Not connected)
6 NC CAN interface ground
7 CAN_High Differential CAN signal positive level
8 NC (Not connected)
9 NC (Not connected)
1
5
6

10 Introduction
Leading EDGE COMPUTING
1.5.5 COM Port (Serial Port)
RS-232/422/485 are supported by jumper selection.
Table 1-8: RS-232/422/485 Connector Pin Definition
Pin RS-232 RS-422 RS-485
1NC (not
connected) COM_TXD_N COM_D-
2 COM_RXD COM_TXD_P COM_D+
3 COM_TXD COM_RXD_P NC
4NC COM_RXD_
NNC
5 COM_GND NC NC
6NC NC NC
7COM_RTS#NC NC
8COM_CTS#NC NC
9NC NC NC
1
5
6