Advansus TC2220-CX700M User manual

TC2220-CX700M
VIA CX700M NanoITX Motherboard
User’s Manual
Ver. 1.01

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Contents
Notices................................................................................................................................4
Safety information .............................................................................................................5
About this guide ................................................................................................................6
Typography........................................................................................................................7
TC2220-CX700M specifications summary.......................................................................8
1.1 Welcome!....................................................................................................................10
1.2 Package contents ......................................................................................................11
1.3 Special features .........................................................................................................12
1.3.1 Product highlights .....................................................................................................12
1.4 Before you proceed...................................................................................................14
1.5 Motherboard overview...............................................................................................15
1.5.1 Placement Direction..................................................................................................15
1.5.2 Screw Holes..............................................................................................................15
1.5.3 Motherboard Layout..................................................................................................16
1.6 System memory.........................................................................................................17
1.6.1 Overview...................................................................................................................17
1.6.2 Memory Configurations.............................................................................................17
1.6.3 Installing a SO-DIMM................................................................................................18
1.6.4 Removing a SO-DIMM..............................................................................................19
1.7 Expansion slots .........................................................................................................20
1.7.1 Installing an Expansion Card....................................................................................20
1.7.2 Configuring an Expansion Card................................................................................20
1.7.3 Mini PCI x 1 ..............................................................................................................21
1.8 Jumpers......................................................................................................................22
1. Clear RTC RAM (CLRTC)..............................................................................................22
2. COM1 +5V and +12V Power Select (COMAPJ1) ..........................................................23
3. COM1 RI Pin with Power Select (COMAJ1) ..................................................................23
1.9 Connectors.................................................................................................................24
1.9.1 Rear panel connectors..............................................................................................24
1.9.2 Internal connectors ...................................................................................................25
2.1 Managing and updating your BIOS..........................................................................32
2.1.1 Creating a bootable floppy disk.................................................................................32
2.2 BIOS setup program..................................................................................................33
2.2.1 Legend Box...............................................................................................................34
2.2.2 List Box.....................................................................................................................34
2.2.3 Sub-menu .................................................................................................................34

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2.3 BIOS menu screen.....................................................................................................35
2.3.1 Standard CMOS Features.........................................................................................36
2.3.2 Advanced BIOS Features.......................................................................................38
2.3.3 Advanced Chipset Features......................................................................................43
2.3.4 Integrated Peripherals...............................................................................................45
2.3.5 Power Management Setup........................................................................................50
2.3.6 PnP/PCI Configurations............................................................................................53
2.3.7 PC Health Status ......................................................................................................54
2.3.8 Frequency/Voltage Control .......................................................................................55
2.3.9 Load Setup Defaults .................................................................................................56
2.3.10 Set Supervisor Password........................................................................................57
2.3.11 Set User Password.................................................................................................58
2.3.12 Save & Exit Setup...................................................................................................59
2.3.13 Exit Without Saving.................................................................................................60

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Notices
Federal Communications Commission Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
yThis device may not cause harmful interference, and
yThis device must accept any interference received including interference that may
cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with manufacturer’s instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If his equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
yReorient or relocate the receiving antenna.
yIncrease the separation between the equipment and receiver.
yConnect the equipment to an outlet on a circuit different from that to which the receiver
is connected.
yConsult the dealer or an experienced radio/TV technician for help.
The use of shielded cables for connection of the monitor to the
graphics card is required to assure compliance with FCC
regulations. Changes or modifications to this unit not expressly
approved by the party responsible for compliance could void the
user’s authority to operate this equipment.
Canadian Department of Communications Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian Department
of Communications.
This class B digital apparatus complies with Canadian ICES-003.

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Safety information
Electrical safety
yTo prevent electrical shock hazard, disconnect the power cable from the electrical
outlet before relocating the system.
yWhen adding or removing devices to or from the system, ensure that the power cables
for the devices are unplugged before the signal cables are connected. If possible,
disconnect all power cables from the existing system before you add a device.
yBefore connecting or removing signal cables from the motherboard, ensure that all
power cables are unplugged.
ySeek professional assistance before using an adapter or extension cord. These
devices could interrupt the grounding circuit.
yMake sure that your power supply is set to the correct voltage in your area.
yIf you are not sure about the voltage of the electrical outlet you are using, contact your
local power company.
yIf the power supply is broken, do not try to fix it by yourself. Contact a qualified service
technician or your retailer.
Operation safety
yBefore installing the motherboard and adding devices on it, carefully read all the
manuals that came with the package.
yBefore using the product, make sure all cables are correctly connected and the power
cables are not damaged. If you detect any damage, contact your dealer immediately.
yTo avoid short circuits, keep paper clips, screws, and staples away from connectors,
slots, sockets and circuitry.
yAvoid dust, humidity, and temperature extremes. Do not place the product in any area
where it may become wet.
yPlace the product on a stable surface.
yIf you encounter technical problems with the product, contact a qualified service
technician or your retailer.
The symbol of the crossed out wheeled bin indicates that the
product (electrical and electronic equipment) should not be placed
in municipal waste. Check local regulations for disposal of
electronic products.

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About this guide
This user guide contains the information you need when installing and configuring the
motherboard.
How this guide is organized
This manual contains the following parts:
yChapter 1: Product introduction
This chapter describes the features of the motherboard and the new technology it
supports. This chapter also lists the hardware setup procedures that you have to
perform when installing system components. It includes description of the jumpers and
connectors on the motherboard.
yChapter 2: BIOS setup
This chapter tells how to change system settings through the BIOS Setup menus.
Detailed descriptions of the BIOS parameters are also provided.
Where to find more information
Refer to the following sources for additional information and for product and software
updates.
1. Advansus websites
The Advansus website provides updated information on Advansus hardware and software
products. Refer to the Advansus contact information.
2. Optional documentation
Your product package may include optional documentation, such as warranty flyers, that
may have been added by your dealer. These documents are not part of the standard
package.
Conventions used in this guide
To make sure that you perform certain tasks properly, take note of the following symbols
used throughout this manual.
DANGER/WARNING: Information to prevent injury to yourself
when trying to complete a task.
CAUTION: Information to prevent damage to the components
when trying to complete a task.
IMPORTANT: Instructions that you MUST follow to complete a
task.
NOTE: Tips and additional information to help you complete a
task.

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Typography
Bold text Indicates a menu or an item to select
Italics Used to emphasize a word or a phrase
<Key> Keys enclosed in the less-than and greater-than sign means
that you must press the enclosed key
Example: <Enter> means that you must press the Enter or
Return key
<Key1>+<Key2>+<Key3> If you must press two or more keys simultaneously, the key
names are linked with a plus sign (+)
Example: <Ctrl>+<Alt>+<D>
Command Means that you must type the command exactly as shown,
then supply the required item or value enclosed in brackets
Example: At the DOS prompt, type the command line:
awdflash [Filename]
awdflash CX7BAV10.BIN

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TC2220-CX700M specifications summary
Specifications
System
CPU VIA Eden 1GHz ULV fan-less / C7 1.5GHz with fan(Optional)
FSB 400 MHz
BIOS Award 4 Mb Flash ROM BIOS
System Chipset VIA CX700M
I/O Chipset Winbond W83627DHG-A
Memory 1 x 200-pin SODIMM 1 GB DDR2 400 SDRAM
Watchdog Timer Reset: 1 sec.~255 sec. and 1 sec. or 1 min./step
H/W Status Monitor Monitoring CPU temperature, voltage, and cooling fan status. Auto throttling
control when CPU overheats
Expansion Slots 1 x Mini PCI, 1 x Type I/II CF
DIO 8-bit General Purpose I/O for 4 DI and 4 DO
S3/S4 Yes
Wake up on LAN or Ring Both (PME / RPL / WOR)
Smart Fan Control Yes , support 3 modes (Silent/Optimal/Performance)
I/O
Back Panel I/O Port 1X PS2(KB+MS), 1 x VGA port, 2 x USB 2.0/1.1, 1 x LAN RJ45 port, 1 x Audio
Mic in (1 jack), 1 x Audio Line out (1 jack)
Front Panel I/O port 2 x USB 2.0/1.1
Internal I/O
1 x USB connector support additional 2 USB ports, 1 x Front Panel connector
1 x 6-pin ATX Power connector, 1 x COM port spin header, 1 x Line in
connector, 1 x LVDS connector, 1 x LCD backlight power connector, 1 x CPU
Fan connector, 1 x GPIO connector, 1 x SATA II connector
Display
Chipset Integrated VIA UniChrome Pro II 3D/2D AGP graphics with MPEG-2/4 and
WMV9 accelerator
Display Memory VIA S3 UniChrome Pro II 3D Graphic Engine Shared system memory up to
128MB I/O
Max Resolution 2048x1536 @75Hz
Dual Display Yes(VGA+LVDS)
Audio
Audio Codec Realtek® ALC888 (co-lay 888VC), 2 channel
Audio Interface Mic in , Line out , Line in pin header

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Ethernet
LAN1 Realtek RTL 81110SC Gigabit LAN
Mechanical & Environmental
Power Type 6 pin ATX or (option DC-DC power board)
Operating Temperature 0 - 60℃ (32-104℉)
Operating Humidity 0%~90% relative humidity, non-condensing
Size (L x W) 4.72" x 4.72" (120 mm x 120 mm)
* Specifications are subject to change without notice.

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This chapter describes the
motherboard features and the
new technologies it supports.
1
Product
Introduction

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1.1 Welcome!
Thank you for buying an ® TC2220-CX700M/VCX-700M-N motherboard!
The motherboard delivers a host of new features and latest technologies, making it another
standout in the long line of quality motherboards!
Before you start installing the motherboard, and hardware devices on it, check the items in
your package with the list below.
1.2 Package contents
Check your motherboard package for the following items.
Before you begin installing your single board, please make sure that the following materials
have been shipped:
z1 x TC2220-CX700M Nano ITX Main board
z1 x CD-ROM contains the followings:
•User’s Manual in PDF file
•Drivers
z1 x KB/MS cable
z1 x COM cable
z1 x SATA cable kit (SATA/Power)
z2 x Copper stud nuts (for COM port)
z1 x 6 to 20 pin ATX power cable
z1 x Startup Manual
If any of the above items is damaged or missing, contact your
retailer.

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1.3 Special features
1.3.1 Product highlights
Latest processor technology
The motherboard incorporates with VIA Eden and VIA C7 processors. The new VIA Eden
processor boasts an ultra-efficient architecture, world-class 90nm production and the highly
efficient VIA V4 bus interface for unprecedented passively-cooled, 'fanless' performance. It
also implements the CX700M system media Chipset, an all-in-one digital media IGP
chipset, integrates premium graphics, audio, memory, storage, and HDTV support all in a
single chip design.
VIA Eden Processor
With its signature fan-less operation, the VIA Eden™ processor targets personal, business,
industrial and commercial embedded computing devices that require ultra low power
consumption, rock solid reliability and compatibility with standard x86 operating systems
and software applications. VIA Eden processors are scalable from 400MHz to 1.5GHz all
within a maximum thermal envelope of 7.5 watts, and are available with a diverse range of
feature sets that enable PC functionality and connectivity from traditionally single function
devices.
CX700M Northbridge Chipset
Complementing the power-efficient VIA C7® and fan-less VIA Eden processors it supports,
the VIA CX700M is based on a highly sophisticated power efficient architecture that
enables such rich integration into a compact package with a maximum power envelope of
just 3.5 watts. A number of key power management technologies are incorporated that
monitor activity and dynamically control power according to system load requirements.
Advanced HDTV Display Support
Flexibility is extended to display technologies, with the VIA CX700M integrating a built in
HDTV encoder for connection to the latest displays, and multi-configuration LVDS/DVI
transmitter.
VIA UniChrome™ Pro Graphics Core
With an internal data flow equivalent to what is available to the latest AGP 8X graphics
cards, VIA UniChrome Pro II has a separate 128-bit data path between the North Bridge for
pixel data flow and texture/command access. Separate 128-bit 2D and 3D graphics
engines ensure optimal performance for all multimedia, entertainment, and productivity
applications.

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Flawless Digital Media Playback
VIA UniChrome Pro II includes native support for the most popular digital video and audio
formats through hardware MPEG-2/MPEG-4/WMV9playback and acclaimed VIA Vinyl HD
Audio suite, supporting up to eight high definition channels delivering a richer all-around
digital media experience.
Advanced Memory Controller
VIA's renowned memory controller technology has been incorporated into the VIA CX700M,
with support for both DDR400 and the high-bandwidth DDR2 533 memory up to 2GB with
ECC capability, and 32-bit as well as 64-bit system memory to extend performance, design
and cost flexibility to developers.
VIA Advanced Connectivity
The VIA CX700M offers broad connectivity with support for SATA, SATA II and PATA
drives, two COM and six USB2.0 ports, and four PCI slots, allowing for considerable
flexibility in board configuration. Additionally, developers can also integrate support for ISA
through an ITE PCI bridge chip, combining legacy ISA connectivity with high bandwidth
DDR2 memort support for more powerful embedded systems.
Unified VIA Hyperion Pro Drivers
VIA's unified approach to drivers has been established for eight generations of chipsets,
allowing end users to benefit from seamless hardware and software compatibility.
DDR2 SO-DIMM
The motherboard supports memory which features data transfer rates of 533/400 MHz to
meet the higher bandwidth requirements of the latest 3D graphics, multimedia, and Internet
applications. The dual-row edge contacts at the module interface are spaced on 0.6mm
pitch. SO-DIMM connectors utilize surface-mount termination to the host PCB.
Serial ATA technology
The motherboard supports the Serial ATA technology through the Serial ATA interfaces
and the VIA CX700M chipset. The SATA specification allows for thinner, more flexible
cables with lower pin count, reduced voltage requirement, and up to 300 MB/s data transfer
rate.
Temperature, fan, and voltage monitoring
The CPU temperature is monitored by the ASIC (integrated in the Winbond Super I/O) to
prevent overheating and damage. The system fan rotations per minute (RPM) is monitored
for timely failure detection. The ASIC monitors the voltage levels to ensure stable supply of
current for critical components.

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1.4 Before you proceed
Take note of the following precautions before you install motherboard components or
change any motherboard settings.
yUnplug the power cord from the wall socket before touching
any component.
yUse a grounded wrist strap or touch a safely grounded object
or a metal object, such as the power supply case, before
handling components to avoid damaging them due to static
electricity
yHold components by the edges to avoid touching the ICs on
them.
yWhenever you uninstall any component, place it on a
grounded antistatic pad or in the bag that came with the
component.
yBefore you install or remove any component, ensure that
the ATX power supply is switched off or the power cord is
detached from the power supply. Failure to do so may
cause severe damage to the motherboard, peripherals, and/or
components.

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1.5 Motherboard overview
Before you install the motherboard, study the configuration of your chassis to ensure that
the motherboard fits into it.
Make sure to unplug the power cord before installing or removing
the motherboard. Failure to do so can cause you physical injury and
damage motherboard components.
1.5.1 Placement Direction
When installing the motherboard, make sure that you place it into the chassis in the correct
orientation. The edge with external ports goes to the rear part of the chassis as indicated in
the image below.
1.5.2 Screw Holes
Place four (4) screws into the holes indicated by circles to secure the motherboard to the
chassis.
Place this side towards
the rear of the chassis

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1.5.3 Motherboard Layout

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1.6 System memory
1.6.1 Overview
The motherboard comes with one 200-pin Double Data Rate 2 (DDR2) Small Outline Dual
Inline Memory Modules (SO-DIMM) sockets.
A SO-DIMM module got different physical dimensions from a DDR DIMM, it has a 200-pin
footprint compared to the 240-pin DDR2 DIMM. DDR2 DIMMs are notched differently to
prevent installation on a DDR DIMM socket. The following figure illustrates the location of
the sockets:
200-Pin DDR2 SO-DIMM sockets
1.6.2 Memory Configurations
You may install 64 MB, 128 MB, 256 MB, 512 MB and 1 GB unbuffered ECC or non-ECC
DDR SO-DIMMs into the SO-DIMM sockets using the memory configurations in this
section.

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1.6.3 Installing a SO-DIMM
Make sure to unplug the power supply before adding or removing
SO-DIMMs or other system components. Failure to do so may cause
severe damage to both the motherboard and the components.
1. Unlock a SO-DIMM socket by pressing the retaining ejectors outward
2. Align a SO-DIMM on the socket such that the notch on the SO-DIMM matches the
break on the socket.
3. Firmly insert the SO-DIMM into the socket until the retaining ejectors snap back in
place and the SO-DIMM is properly seated.
zA DDR2 SO-DIMM is keyed with a notch so that it fits in only one
direction. DO NOT force a SO-DIMM into a socket to avoid
damaging the SO-DIMM.
zThe DDR2 SO-DIMM sockets do not support DDR SO-DIMMs. DO
NOT install DDR SO-DIMMs to the DDR2 SO-DIMM socket.

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1.6.4 Removing a SO-DIMM
1. Simultaneously press the retaining clips outward to unlock the SO-DIMM.
Support the SO-DIMM lightly with your fingers when pressing the
retaining clips. The SO-DIMM might get damaged when it flips out with
extra force.
2. Remove the SO-DIMM from the socket.

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1.7 Expansion slots
In the future, you may need to install expansion cards. The following sub-sections describe
the slots and the expansion cards that they support.
Make sure to unplug the power cord before adding or removing
expansion cards. Failure to do so may cause you physical injury and
damage motherboard components.
1.7.1 Installing an Expansion Card
1. Before installing the expansion card, read the documentation that came with it and
make the necessary hardware settings for the card.
2. Remove the system unit cover (if your motherboard is already installed in a chassis).
3. Remove the bracket opposite the slot that you intend to use. Keep the screw for later
use.
4. Align the card connector with the slot and press firmly until the card is completely seated
on the slot.
5. Secure the card to the chassis with the screw you removed earlier.
6. Replace the system cover.
1.7.2 Configuring an Expansion Card
After installing the expansion card, configure it by adjusting the software settings.
1. Turn on the system and change the necessary BIOS settings, if any. See Chapter 2 for
information on BIOS setup.
2. Assign an IRQ to the card if needed. Refer to the tables on the next page.
3. Install the software drivers for the expansion card.