Aerotech WaferMaxT Series User manual

Revision: 1.01.00
WaferMaxTHardware Manual

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provides downloadable resources (such as up-to-date software, product manuals, and Help files), training schedules, and
PC-to-PC remote technical support. You can also complete Product Return (RMA) forms and get information about repairs
and spare or replacement parts. For immediate help, contact a service office or your sales representative. Have your
customer order number available before you call or include it in your email.
United States (World Headquarters)
Phone: [phone]
Fax: [phone]
Email: [e-mail]
101 Zeta Drive
Pittsburgh, PA 15238-2811
www.aerotech.com
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This manual contains proprietary information and may not be reproduced, disclosed, or used in whole or in part without the
express written permission of Aerotech, Inc. Product names mentioned herein are used for identification purposes only and
may be trademarks of their respective companies.
Copyright © 2016-2017, Aerotech, Inc., All rights reserved.

WaferMaxT Hardware Manual Table of Contents
Table of Contents
WaferMaxTHardware Manual 1
Table of Contents 3
List of Figures 4
List of Tables 5
EC Declaration of Incorporation 6
Safety Procedures and Warnings 7
Chapter 1: Overview 9
1.1. Environmental Specifications 10
1.2. Accuracy and Temperature Effects 10
1.3. Basic Specifications 11
Chapter 2: Installation 13
2.1. Unpacking and Handling the Stage 13
2.2. Dimensions 14
2.3. Securing the Stage to the Mounting Surface 15
2.4. Attaching the Payload to the Stage 17
Chapter 3: Electrical Installation 19
3.1. Motor and Feedback Connectors 20
3.2. Motor and Feedback Wiring 23
3.3. Motor and Feedback Specifications 24
3.4. Machine Direction 26
3.5. Motor and Feedback Phasing 27
Chapter 4: Maintenance 29
4.1. Service and Inspection Schedule 29
4.2. Cleaning and Lubrication 30
4.3. Troubleshooting 31
Appendix A: Warranty and Field Service 33
Appendix B: Revision History 35
Index 37
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Table of Contents WaferMaxT Hardware Manual
List of Figures
Figure 2-1: WaferMaxT Dimensions 14
Figure 2-2: Mounting Hole Locations 16
Figure 2-3: Stage Orientations 17
Figure 2-4: Cantilevered Load Capability 18
Figure 3-1: Motor and Feedback Wiring 23
Figure 3-2: Machine Direction 26
Figure 3-3: Hall Phasing 27
Figure 3-4: Analog Encoder Phasing Reference Diagram 28
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WaferMaxT Hardware Manual Table of Contents
List of Tables
Table 1-1: Model Numbering System 9
Table 1-2: Environmental Specifications 10
Table 1-3: WaferMaxT Series Specifications 11
Table 2-1: Stage to Mounting Surface Hardware 16
Table 3-1: Motor Pin Assignments 21
Table 3-2: Feedback Pin Assignments 22
Table 3-3: Feedback Specifications 24
Table 3-4: WaferMaxT Motor Specifications (S-180-44-A Slotless Motor) 25
Table 3-5: Encoder Specifications 25
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Table of Contents WaferMaxT Hardware Manual
EC Declaration of Incorporation
Manufacturer: Aerotech, Inc.
101 Zeta Drive
Pittsburgh, PA 15238-2811
USA
herewith declares that the product:
WaferMaxT Rotary Stage
is intended to be incorporated into machinery to constitute machinery covered by the Directive
2006/42/EC as amended;
and that the following harmonized European standards have been applied:
EN ISO 12100:2010
Safety of machinery - Basic concepts, general principles for design
EN 60204-1:2010
Safety of machinery - Electrical equipment of machines - Part 1:General requirements
and further more declares that
it is not allowed to put the equipment into service until the machinery into which
it is to be incorporated or of which it is to be a component has been found and
declared to be in conformity with the provisions of the Directive 2006/42/EC and
with national implementing legislation, i.e., as a whole, including the equipment
referred to in this Declaration.
This is to certify that the aforementioned product is in accordance with the applicable requirements of the
following Directive(s):
2011/65/EU RoHS2 Directive
Authorized Representative: Simon Smith, European Director
Address: Aerotech Ltd
The Old Brick Kiln
Ramsdell, Tadley
Hampshire RG26 5PR
UK
Name
/ Alex Weibel
Position Engineer Verifying Compliance
Location Pittsburgh, PA
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WaferMaxT Hardware Manual Table of Contents
Safety Procedures and Warnings
Read this manual in its entirety before installing, operating, or servicing this product. If you do not understand
the information contained herein, contact an Aerotech representative before proceeding. Strictly adhere to
the statements given in this section and other handling, use, and operational information given throughout
the manual to avoid injury to you and damage to the equipment.
The following statements apply wherever the Warning or Danger symbol appears within this manual. Failure
to observe these precautions could result in serious injury to those individuals performing the procedures
and/or damage to the equipment.
D A N G E R : This product contains potentially lethal voltages. To reduce the possibility of
electrical shock, bodily injury, or death the following precautions must be followed.
1. Access to the WaferMaxT and component parts must be restricted while connected to a
power source.
2. Do not connect or disconnect any electrical components or connecting cables while
connected to a power source.
3. Disconnect electrical power before servicing equipment.
4. All components must be properly grounded in accordance with local electrical safety
requirements.
5. Operator safeguarding requirements must be addressed during final integration of the
product.
W A R N I N G : To minimize the possibility of electrical shock, bodily injury or death the
following precautions must be followed.
1. Moving parts can cause crushing or shearing injuries. Access to all stage and motor parts
must be restricted while connected to a power source.
2. Cables can pose a tripping hazard. Securely mount and position all system cables to
avoid potential hazards.
3. Do not expose this product to environments or conditions outside of the listed
specifications. Exceeding environmental or operating specifications can cause damage to
the equipment.
4. The WaferMaxT must be mounted securely. Improper mounting can result in injury and
damage to the equipment.
5. Use care when moving the WaferMaxT . Lifting or transporting the WaferMaxT improperly
can result in injury or damage to the WaferMaxT.
6. This product is intended for light industrial manufacturing or laboratory use. Use of this
product for unintended applications can result in injury and damage to the equipment.
7. If the product is used in a manner not specified by the manufacturer, the protection
provided by the product can be impaired and result in damage, shock, injury, or death.
8. Operators must be trained before operating this equipment.
9. All service and maintenance must be performed by qualified personnel.
10. Eye protection must be worn when in the proximity of compressed air components.
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Table of Contents WaferMaxT Hardware Manual
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WaferMaxT Hardware Manual Overview
Chapter 1: Overview
N O T E : Aerotech continually improves its product offerings; listed options may be superseded at any
time. All drawings and illustrations are for reference only and were complete and accurate as of this
manual’s release. Refer to www.aerotech.com for the most up-to-date information.
Table 1-1: Model Numbering System
Model
WaferMaxT Direct-drive rotary stage with 25 mm clear aperture
Feedback
-E1 Incremental Encoder; 2048 lines/rev; 1 Vpp output
-E2 Incremental Encoder; 10000 lines/rev; 1 Vpp output
Rotary Union
None
-RU1 Rotary union for feed-through of air/vacuum, single port
Integration
-TAC Test as Component
-TAS Test as System
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Overview WaferMaxT Hardware Manual
1.1. Environmental Specifications
W A R N I N G : Do not expose this product to environments or conditions outside of the listed
specifications. Exceeding environmental or operating specifications can cause damage to the
equipment.
Table 1-2: Environmental Specifications
Ambient
Temperature
Operating: 10° to 35° C (50° to 95° F)
The optimal operating temperature is 20° C ±2° C (68° F ±4° F). If at any time the
operating temperature deviates from 20° C degradation in performance could occur.
Storage: 0° to 40° C (32° to 104° F) in original shipping packaging
Humidity Operating: 20% to 60% RH
Storage: 10% to 70% RH, non-condensing in original packaging. The stage should be
packaged with desiccant if it is to be stored for an extended time.
Altitude Operating: 0 m to 2,000 m (0 ft to 6,562 ft) above sea level
Contact Aerotech if your specific application involves use above 2,000 m or below sea
level.
Vibration Use the system in a low vibration environment. Excessive floor or acoustical vibration
can affect system performance. Contact Aerotech for information regarding your
specific application.
Protection
Rating
The WaferMaxT is not suitable for dusty or wet environments. This equates to an
ingress protection rating of IP00.
Use Indoor use only
1.2. Accuracy and Temperature Effects
Aerotech products are designed for and built in a 20°C (68°F) environment. Extreme temperature changes
could cause a decrease in performance or permanent damage to the WaferMaxT. At a minimum, the
environmental temperature must be controlled to within 0.25ºC per 24 hours to ensure the WaferMaxT
specifications are repeatable over an extended period of time. The severity of temperature effects on all
specifications depends on many different environmental conditions, including how the WaferMaxT is
mounted. Contact the factory for more details.
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WaferMaxT Hardware Manual Overview
1.3. Basic Specifications
N O T E : Aerotech continually improves its product offerings; listed options may be superseded at any
time. All drawings and illustrations are for reference only and were complete and accurate as of this
manual’s release. Refer to www.aerotech.com for the most up-to-date information.
Table 1-3: WaferMaxT Series Specifications
WaferMaxT
Travel 360 degrees, continuous
Tabletop Diameter 106.7 mm
Drive System Direct-Drive Brushless Servomotor
Maximum Bus Voltage up to 340 VDC
Maximum Torque
(Continuous) 5.99 N·m
Encoder 2048 lines/rev fundamental;
10000 lines/rev fundamental
Accuracy (1) ±25 µrad (±5 arc sec)
Bidirectional
Repeatability (3) ±10 µrad (±2 arc sec)
Tilt Error Motion 97 µrad (20 arc sec)
Axial Error Motion 5 µm
Radial Error Motion 5 µm
Maximum Speed 400 rpm (unloaded)
Maximum
Load (2)
Axial 40 kg
Radial 20 kg
Inertia 0.008130 kg·m2
Mass 7.0 kg
Material Aluminum
Finish Black Anodize
1. Available with Aerotech controllers
2. Maximum loads are mutually exclusive.
3. Specifications are per axis measured 25 mm above the tabletop without a payload. Performance is payload and work-point
dependent. Consult factory for multi-axis or non-standard applications.
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Overview WaferMaxT Hardware Manual
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WaferMaxT Hardware Manual Mechanical Specifications and Installation
Chapter 2: Installation
W A R N I N G : WaferMaxT installation must be in accordance to instructions provided by this
manual and any accompanying documentation. Failure to follow these instructions could result
in injury or damage to the equipment.
2.1. Unpacking and Handling the Stage
W A R N I N G : It is the customer's responsibility to safely and carefully lift and move the
WaferMaxT.
lSecure all moving parts before lifting or moving the WaferMaxT to a new location.
Unsecured moving parts could shift and cause bodily injury.
lImproper handling could adversely affect the WaferMaxT’s performance. Use care when
lifting or moving the WaferMaxT.
Carefully remove the WaferMaxTfrom its protective shipping container. Gently set the WaferMaxT on a
smooth, flat, and clean surface.
Before operating the WaferMaxT, it is important to let it stabilize at room temperature for at least 12 hours.
Allowing it to stabilize to room temperature will ensure that all of the alignments, preloads, and tolerances are
the same as they were when tested at Aerotech. Use compressed nitrogen or clean, dry, oil-less air to
remove any dust or debris that has collected during shipping.
Each WaferMaxT has a label listing the system part number and serial number. These numbers contain
information necessary for maintaining or updating system hardware and software. Locate this label and
record the information for later reference.
If the WaferMaxT has shipped as part of a system, shipping clamps (typically red, anodized aluminum) may
have been installed to secure the system prior to shipment. The shipping clamps, if installed, will need to be
removed prior to machine start up.
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Mechanical Specifications and Installation WaferMaxT Hardware Manual
2.2. Dimensions
N O T E : Aerotech continually improves its product offerings; listed options may be superseded at any
time. All drawings and illustrations are for reference only and were complete and accurate as of this
manual’s release. Refer to www.aerotech.com for the most up-to-date information.
75.0 [2.95]
175.0 [6.89]
75.0 [2.95]
175.0 [6.89]
Ø5.8 [0.228] DRILL THRU
Ø9.5 [0.375] C'BORE AS SHOWN
(8) PLACES
STAGE MOUNTING HOLES
35.0 [1.38]
TYP.
M4x0.7 THREAD X 6.0 [0.24] DP.
(6) PLACES EQUALLY SPACED ON
Ø60.0 [2.36] BOLT CIRCLE
CUSTOMER MOUNTING HOLES
Ø25.4 [1.00] APERTURE
-OR-
OPTIONAL ROTARY UNION WITH #10-32 X 6.0 [.24] DP.
THREADED FITTING INTERFACE
Ø203.2 [8.00]
50.0 [1.97]
222.3 [8.75]
Ø106.7 [4.20]
TABLETOP
222.3 [8.75]
STAGE CABLE CONNECTIONS
AND 1/8" BARB FITTING FOR
-RU1 OPTION ONLY
DIMENSIONS - MM [INCHES]
Figure 2-1: WaferMaxT Dimensions
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WaferMaxT Hardware Manual Mechanical Specifications and Installation
2.3. Securing the Stage to the Mounting Surface
W A R N I N G : The WaferMaxT must be mounted securely. Improper mounting can result in
injury and damage to the equipment.
W A R N I N G : Make sure that all moving parts are secure before moving the WaferMaxT.
Unsecured moving parts may shift and cause bodily injury.
The mounting surface must be flat and have adequate stiffness in order to achieve the maximum
performance from the WaferMaxT stage. When it is mounted to a non-flat surface, the stage can be distorted
as the mounting screws are tightened. This distortion will decrease overall accuracy. Adjustments to the
mounting surface must be done before the stage is secured.
Inspect the mounting surface for dirt or unwanted residue and clean if necessary. Use precision flatstones
on the mounting surface to remove any burrs or high spots. Clean the mounting surface with a lint free cloth
and acetone or isopropyl alcohol and allow the cleaning solvent to completely dry. Gently place the stage on
the mounting surface.
N O T E : To maintain accuracy, the mounting surface must be flat to within 5 µm.
N O T E : The WaferMaxT is precision machined and verified for flatness prior to product assembly at the
factory. If machining is required to achieve the desired flatness, it should be performed on the mounting
surface rather than the WaferMaxT. Shimming should be avoided if possible. If shimming is required, it
should be minimized to retain maximum rigidity of the system.
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Mechanical Specifications and Installation WaferMaxT Hardware Manual
This stage is designed to use socket head cap screws (SHCS)to secure the base to the mounting surface
(refer to Figure 2-2).
Tightening torque values for the mounting hardware are dependent on the properties of the surface to which
the stage is being mounted. Values provided in Table 2-1 are typical values and may not be accurate for your
mounting surface. Refer to Section 2.2. for specific model mounting locations and dimensions.
Table 2-1: Stage to Mounting Surface Hardware
Mounting Hardware Typical Screw Torque
M5 SHCS 4 N·m
Mounting Holes
[QTY 8]
Figure 2-2: Mounting Hole Locations
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WaferMaxT Hardware Manual Mechanical Specifications and Installation
2.4. Attaching the Payload to the Stage
Inspect the mounting surface for dirt or unwanted residue and clean if necessary. Clean the mounting
surface with a lint free cloth and acetone or isopropyl alcohol and allow the cleaning solvent to completely
dry.
To prevent damage to the payload or stage, test the operation of the stage before the payload is attached.
Aerotech recommends that customers use a representative payload during start-up to prevent accidental
damage to the stage and the payload. Proceed with the electrical installation and test the motion control
system in accordance with the system documentation. Document all results for future reference. For
information on electrical installation refer to Chapter 3 and the documentation delivered with the stage.
N O T E : If your WaferMaxT was purchased with Aerotech controls, it might have been tuned with a
representative payload based on the information provided at the time of order. If the WaferMaxT is started
up without a payload, the servo gains provided by Aerotech with the shipment may not be appropriate and
servo instability can occur. Refer to the controller help file for tuning assistance.
The payload must be flat, rigid, and comparable to the stage in quality to maintain optimum performance.
N O T E : For valid system performance, the mounting interface should be flat within 13 µm.
W A R N I N G : Refer to the dimensions in Section 2.2. for maximum allowable thread
engagement. A screw extending through the stage table can affect travel and damage the
stage.
Applied loads should be symmetrically distributed whenever possible (i.e., the payload should be centered
on the stage table and the entire stage should be centered on the support structure).
If cantilevered loads are applied, refer to Figure 2-3 to find the loading condition. Refer to Figure 2-4 to find
the maximum allowable load.
Axial Radial
Figure 2-3: Stage Orientations
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Mechanical Specifications and Installation WaferMaxT Hardware Manual
Axial
0
0
5
10
15
20
30
25
Load (kg)
35
45
40
50 100 150
Distance (mm) from Axis of Rotation (Axial)
Distance (mm) from Tabletop/Shaft (Radial)
200 250 300
Radial
Figure 2-4: Cantilevered Load Capability
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WaferMaxT Hardware Manual Electrical Specifications and Installation
Chapter 3: Electrical Installation
W A R N I N G : Electrical installation must be performed by properly qualified personnel.
Electrical installation requirements will vary depending on product options. Installation instructions in this
section are for WaferMaxTs equipped with standard Aerotech motors intended for use with an Aerotech
motion control system. Contact Aerotech for further information regarding products that are otherwise
configured.
Aerotech motion control systems are adjusted at the factory for optimum performance. When the
WaferMaxT is part of a complete Aerotech motion control system, setup usually involves connecting the
WaferMaxT to the appropriate drive chassis with the cables provided. Labels on the system components
usually indicate the appropriate connections.
If system level integration was purchased, an electrical drawing showing system interconnects has been
supplied with the system (separate from this documentation).
The electrical wiring from the motor and encoder are integrated at the factory. Refer to the following sections
for standard motor wiring and connector pin assignments.
W A R N I N G : Applications requiring access to the stage while it is energized will require
additional grounding and safeguards. The System Integrator or qualified installer is responsible
for determining and meeting all safety and compliance requirements necessary for the
integration of this stage into the final application.
D A N G E R : Remove power before connecting or disconnecting electrical components or
cables. Failure to do so may cause electric shock.
W A R N I N G : Operator access to the base and tabletop must be restricted while connected
to a power source. Failure to do so may cause electric shock.
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Electrical Specifications and Installation WaferMaxT Hardware Manual
3.1. Motor and Feedback Connectors
Stages equipped with standard motors and encoders come from the factory completely wired and
assembled.
N O T E : Refer to the other documentation accompanying your Aerotech equipment. Call your Aerotech
representative if there are any questions on system configuration.
N O T E : If using standard Aerotech motors and cables, motor and encoder connection adjustments are
not required.
The WaferMaxT's protective ground connection provides motor frame ground protection only. Additional
grounding and safety safeguards are required for applications requiring access to the stage while it is
energized. The System Integrator or qualified installer is responsible for determining and meeting all safety
and compliance requirements necessary for the integration of this stage into the final application.
D A N G E R : Remove power before connecting or disconnecting electrical components or
cables. Failure to do so may cause electric shock.
W A R N I N G : The protective ground connection must be properly installed to minimize the
possibility of electric shock.
W A R N I N G : Operator access to the base and tabletop must be restricted while connected
to a power source. Failure to do so may cause electric shock.
C A U TI O N : The stage controller must provide over-current and over-speed protection.
Failure to do so may result in permanent damage to the motor and stage components.
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