Agilent Technologies HP 83711A User manual

Printed in USA March 2000
Notice
Hewlett-Packard to Agilent Technologies Transition
This documentation supports a product that previously shipped under the Hewlett-
Packard company brand name. The brand name has now been changed to Agilent
Technologies. The two products are functionally identical, only our name has changed. The
document still includes references to Hewlett-Packard products, some of which have been
transitioned to Agilent Technologies.

2Chapter1
Contacting Agilent
By internet, phone, or fax, get assistance with all your test and measurement needs.
Table 1-1 Contacting Agilent
Online assistance: www.agilent.com/find/assist
United States
(tel) 1 800 452 4844 Latin America (tel) [phone]
(fax) [phone]
Canada
(tel) 1 877 894 4414
(fax) [phone]
Europe
(tel) ([phone]
(fax) ([phone]
New Zealand
(tel) 0 800 738 378
(fax) ([phone]
Japan
(tel) ([phone]
(fax) ([phone]
Australia
(tel) 1 800 629 485
(fax) ([phone]
Asia Call Center Numbers
Country Phone Number Fax Number
Singapore 1-800-375-8100 (65) 836-0252
Malaysia 1-800-828-848 1-800-801664
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1-800-16510170 (PLDT
Subscriber Only)
(632) 8426809
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Subscriber Only)
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[phone] (within Bangkok) (66) 1-661-3714
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India 1-600-11-2929 000-800-650-1101

Service Guide
HP 83711A/12A and HP 83711B/12B
Synthesized CW Generators
SERIAL NUMBERS
This manual applies directly to instruments with serial number prex US3449 and above
.
ABCDE
HP Part No. 83711-90134
Printed in USA July 1997 Supersedes April 1995

Notice.
The information contained in this document is subject to change without notice
.
Hewlett-P
ackard makes no warranty of any kind with regard to this material, including
but not limited to, the implied warranties of merchantability and tness for aparticular
purpose
.Hewlett-P
ackard shall not be liable for errors contained herein or for incidental or
consequential damages in connection with the furnishing, performance
,or use of this material.
c
 Copyright Hewlett-Packard Company 1995, 1997
All Rights Reserved. Reproduction, adaptation, or translation without prior written permission
is prohibited, except as allowed under the copyright laws.
1400 Fountaingrove Parkway, Santa Rosa CA, 95403-1799, USA

Introduction
The HP 83711A/12A and HP 83711B/12B synthesized CW generators have dierent frequency
ranges
.The HP 83711A/11B has afrequency range of 1to20 GHz, and the HP 83712A/12B has
afrequency range of 10 MHz to 20 GHz.
The service information for the HP 83711A/12A and HP 83711B/12B synthesized CW generators
comes in two manuals
.
The
HP 83711A/12A and HP 83711B/12B Synthesized CW Generators Service Guide
provides
information needed to repair the synthesizer to the assembly level. The
HP 83711A/12A,
HP 83711B/12B
,HP 83731A/32A and HP 83731B/32B Synthesized Signal Generators
Component-Level Information
manual provides component-level information for the repair of
individual instrument assemblies
.The manual contains Component-Level Information P
ackets
(CLIP
s) for selected assemblies. Each CLIP contains component-level schematics, acomponent
parts list, and illustrations for component location by reference designator
.
Calibration information is in the
HP 83711A/12A, HP 83711B/12B, HP 83731A/32A and
HP 83731B/32B Synthesized Signal Generators Calibration Guide
.The calibration guide
contains the performance tests and adjustments for the synthesizer
.
The service guide is what you receive when you order Option OBW
,service documentation.
iii

In This Guide
The service guide includes the following chapters:
Chapter 1
,\Troubleshooting," contains the troubleshooting information needed to isolate a
failed major assembly
.
Chapter 2
,\Block Diagrams
," contains the block diagram that is to be used for the HP
83711A/12A and HP 83731B/32B
.
Chapter 3
,\Major Assembly and Cable Locations
," contains drawings that show the major
assemblies and cable locations
.
Chapter 4
,\P
arts List," contains information needed to order assemblies and parts for the
instrument.
Chapter 5
,\Assembly Replacement," contains information needed to remove or replace a
major assembly
.
Chapter 6
,\P
ost-Repair Procedures
," contains the procedures to be followed after arepair has
been made
.
Chapter 7
,\Error Messages
," contains alist of all of the error messages that might be
generated during use of the instrument. Each entry in the list contains asequence that can be
followed to recover from the error condition.
Chapter 8
,\Options
," contains adescription of the various options available for use with the
synthesizers
.
Chapter 9
,\Contacting Hewlett-P
ackard," provides information on how to contact HP as well
as how to package and ship the instrument.
Chapter 10
\Legal and Regulatory Information," contains the information about manual
updates
,operating environment, storage environment, ESD precautions
,safety considerations,
etc
.
Assumptions About Y
ou
The procedures in this guide assume that you have the tools and equipment to perform each
service task. To nd what tools and equipment belong to each service task, refer to the chapter
containing the task.
iv

Contents
1. Troubleshooting
Introduction . .....................
..
..
.......1-1
Prior to Beginning Troubleshooting ...................
.. 1-1
The Service Position ................... .. .. .. ..1-1
Power Supply V
erication .................... ..
.. 1-1
Safety Considerations ..
..................... ..
..
.1-2
W
arnings and Cautions ...............
..
..
..
......1-2
Before Applying P
ower ...............
..
..
..
.....1-2
After-Service Safety Checks .................... ....1-3
ESD Precautions ...............................1-3
Recommended T
est Equipment .... .. ..................1-3
Service A
ccessories ........................ .....1-4
TORX
R

Screwdrivers . ..
...................
..
..
. 1-4
Pozidrive Screwdrivers ......................
..
...1-4
Hardware . .......................
..
.......1-4
Major Assemblies
,P
arts
,and Cable Locations ................ 1-4
Test P
oint Locations ............................1-4
Service Aids on Printed Circuit Boards .............
......1-5
Other Service Documents .................
........1-5
Cleaning ....................
..............1-5
Cleaning Intervals ...................
..........1-5
Cleaning Solution ..................... ........1-5
12-Month Cleaning ............. ................1-5
After Repair Calibration ............ ...............1-6
Main Troubleshooting .........
..
..
..
.............1-7
Microprocessor Assembly (A3) Troubleshooting .........
..
..
..1-9
ABUS Errors ...........
..
..
...............1-9
0.5 V/GHz Output Errors . ..
..
..
.................. 1-10
LO Synthesizer and Reference Assembly (A6) Troubleshooting ..
......1-11
Data Readback Errors ...... .. .. .. .............
. 1-11
ABUS Errors ..............................1-11
Oscillator Cold Error . . . . . . . . . . . .. .. .. .. .. .. .. .. 1-12
LO Synthesizer and Reference Unlocked/Divide V
oltage Errors ....... 1-13
YO Loop and Oset Synthesizer Assembly (A7) Troubleshooting . . . . . . . . 1-16
Data Readback Errors .. .. .. .. .. .. .. .. .. .. .. .. .. 1-16
ABUS Error........................
....... 1-17
Oset Synthesizer Incorrect Frequency/Unlocked Errors . . . . . . . . . . 1-18
YIG Driver Assembly (A9) Troubleshooting .... .. .. .. .. .. .. . 1-20
Data Readback Errors .. .. .. .. .................. 1-20
ABUS Errors .... .. .. .. .. .. .. .. . .. .. .. .. .. . 1-20
MSB Errors .... .. .. .. .. .. .. .. .. .. .. .. . .. .. 1-21
Low/High Band Voltage Errors ...................... 1-23
ALC Assembly (A10) Troubleshooting . . . . . . . . . . . . . . . . . . . . 1-25
Data Readback Errors .. .. .. .. .. .. .. .. .. .. .. .. .. 1-25
ABUS Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-25
DAC Errors ............................... 1-26
Contents-1

Integrator Errors . ..
..
..
............... .. .. .. 1-27
Integrator Errors (Revision 10.01 and Above Only) ...........
.. 1-27
Leveled Indicator Trip Point Errors ............
..
..
..
.. 1-27
Leveled Indicator Trip Point Errors (Revision 10.01 and Above Only) ....1-27
RF/Reference Detector Errors ..
...............
..
..
. 1-27
Input/Output Switching Errors .. ...............
..
..
. 1-29
Input/Output Switching Errors (Revision 10.01 and Above Only) ......1-29
Track and Hold Errors ..............
..
..........1-29
Track and Hold Errors (Revision 10.01 and Above Only) .......... 1-29
Output Module (A8A1) Troubleshooting ................
..
. 1-30
Combiner/High Band/Low Band Errors ................
.. 1-30
SLPF
A(A8A3) Troubleshooting ............
..
..
.......1-31
Input/Output Bias Errors .............
..
..
..
......1-31
Y
OLoop and Oset Synthesizer Assembly (A7) Troubleshooting .......
. 1-34
Sampler (A8T1) Troubleshooting ............... .. .. ...1-41
LO Unlocked Errors ............... .. .. ........1-41
Oset Synthesizer Unlocked Errors .............. .. .. ..1-42
Y
OLoop Unlocked Errors .........
..
.............1-42
SLPF
A(A8A3) Troubleshooting .......................1-50
Unleveled at Minimum V
ernier Errors ...................1-50
Unleveled at Maximum V
ernier Errors ...........
..
.....1-51
Divider and Modulation Assembly (A4) Troubleshooting ........... 1-52
Symptom Troubleshooting .........
..
...............1-56
Checking the P
ower Supply ........ ................1-57
Checking the Front P
anel Display .....
..
...............1-57
Checking the Hewlett-P
ackard Interface Bus (HP-IB) ......
.......1-58
Checking the Microprocessor ..........
..............1-58
Checking the 10 MHz Output . .......................1-59
Checking the 10 MHz Input ..
.......................1-59
Checking the 0.5V/GHz Output .......................1-60
Checking the Output P
ath .... .....................1-60
T
oTroubleshoot the Option 1E1 Output Path ...............1-60
T
oTroubleshoot the Non-Option 1E1 Output Path .............1-61
Checking External ALC ...................
..
..
..
.1-62
2. Block Diagrams
3. Major Assembly and Cable Locations
Introduction ...............
..
..
..
..
..
........3-1
4. Parts List
Introduction..........
... . .. .. .. .. .. .. .. .. .. . 4-1
Abbreviations . . . . . . . . . . . . . . . . . . . . .. .. .. .. .. . . 4-1
Replaceable P
arts T
able F
ormat.... .. .. .. .. .. .......... 4-1
Illustrated P
arts Breakdowns . . . . . . . . . . . . . . . . . . .. .. .. . 4-2
Ordering Information .... .. .. . .. .. .. .. .. .. .. .. .. . 4-2
Optional Congurations .... .. .. .. .. . .. .. .. .. ...... 4-3
Parts List Backdating ......................... . .. 4-3
Parts Identication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
Other Documentation .... .. .. .. .. .. .. .. .. .. . .. .. . 4-4
Exchange Assemblies . .. .. .. .. .. . .. .. .. .. .. .. .. .. 4-5
Contents-2

5. Assembly Replacement
Introduction ..
..
............... .. .. .. .. .. ....5-1
Assembly and P
art Locations .............
..
..
...... .. 5-7
Major Assembly and Cable Locations ............... .. .. . 5-7
Service Position ..
...............
..
..
..
..
..
...5-7
T
ools . .. ...............
..
..
..
..
.........5-7
Special T
echniques ................. .. .. .........5-9
Safety ................... .. .. ............5-9
F
asteners (Screws and Nuts) ...............
..
..
.....5-9
Cable and Connector Identication .................. .. .5-9
Semi-Rigid Coaxial Cables ................... .. ....5-10
Flexible Coaxial Cables .............
..
..
..........5-11
SMC Connectors ................ .. .. .........5-11
SMA Connectors ..............
..
..
..
.........5-11
SMB Connectors ................ .. .. .........5-11
Multi-wire Cables ................ .. .. .........5-11
Synthesizer Covers ..............
..
..
..
..........5-13
T
oRemove the T
op Cover .......
..
................5-13
T
oRemove the Bottom Cover ........................5-15
P
ower Supply (A11) .............................5-17
T
oDisconnect the P
ower Supply Cables .........
..
..
......5-17
T
oRemove the P
ower Supply ..........
..
..
..
........5-18
Reassembly Tips .........
..
...................5-19
Fuse ............ .......................
. 5-20
T
oRemove (and Replace) the Fuse ....
..
...............5-20
F
an Assembly ..........
......................5-21
T
oDisconnect the F
an Cable ........................5-21
T
oRemove the Fan .........................
...5-22
Reassembly Tips .............................. 5-23
Divider and Modulation Board Assembly (A4) . ................5-23
T
oA
ccess the Service P
osition . ...................... 5-23
T
oRemove the Assembly ..
..
...................... 5-23
Reassembly Tips .......
....................... 5-24
Microprocessor Board Assembly (A3) ..................... 5-26
T
oA
ccess the Service P
osition .................. .. ...5-26
T
o Disconnect the Cables ...................
.......5-26
T
o Remove the Microprocessor Assembly .................. 5-27
Reassembly Tips . ..................... .. .. .. ..5-27
Battery (A3BT1) ............
..
..
..
..
..
..
.......5-29
T
oA
ccess the Service P
osition .......................5-29
To Remove the P
art ....
........................ 5-29
To Reassemble the Instrument .... .. .. .. .. .. .. .. .. .. . 5-30
Crystal Oscillator (Option 1E5) ............ .. .. .. .. .. .. 5-31
To Disconnect the Oscillator Cables .... .. ............... 5-31
To Remove the Oscillator . . . . . . . . . . . . . . . . . ......... 5-31
Reassembly Tips . . . . . . . . . . . . . . . . . . . . . ......... 5-32
ALC Board Assembly (A10) . . . . . . . . . . . . . . . . . . . . ...... 5-33
To Remove the Assembly . . . . . . . . . . . . . . . . . . . . ...... 5-33
Reassembly Tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-33
YIG Driver Board Assembly (A9) .. .. .. .. .. .. .. .. .. .. .. . 5-35
ToAccess the Service Position .... .. .. .. .. .. .. .. .. .. . 5-35
To Remove the Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . 5-36
YO (YIG Oscillator) Loop/Oset Synthesizer Board Assembly (A7) . . . . . . . . 5-38
To Remove the Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . 5-38
Reassembly Tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-38
Contents-3

LO (Local Oscillator) Synthesizer/ Reference Board Assembly (A6) . ......5-40
T
oA
ccess the Service P
osition ..........
..
..
..
..
..
..
.5-40
T
o Remove the Assembly .............
..
..
..
..
..
..
.5-41
Reassembly Tips . ..
................. .. .. .. .. ..5-42
Step Attenuator, A8AT1 (Option 1E1) ............. .. .. .. .. 5-44
T
o Remove the Assembly ...............
..
..
..
..
..
.5-44
T
oReassemble the Instrument ............... .. .. ....5-44
Sampler Microcircuit, A8T1 ...............
..
..
..
.....5-46
T
oRemove the Subassembly ................. .. .....5-46
T
oReassemble the Instrument ................. .. ....5-48
YIG Oscillator(s) .................... ..
.........5-49
T
oRemove the P
art ..........
..................5-49
T
oReassemble the Instrument ............. .. .. ......5-50
YIG Driver Cable and T
emperature Transducer ........... .. .. .5-53
T
oRemove the P
art ..........
...... ............5-53
T
oReassemble the Instrument ............. .. .. ......5-54
Output Module
,SLPF
AModule
,and Coupler Detector ......
..
..
..
.5-55
T
oRemove the Subassemblies ........... ............5-55
T
oRemove the Coupler Detector Subassembly ................5-56
T
oRemove the Output Module and the SLPF
AModule Subassemblies .....5-58
T
oReassemble the Instrument ............
..
..
.......5-58
RF Output Connector/A
dapter
,CP1 ...........
..
..
..
.....5-60
T
oRemove the Assembly ........ ..................5-60
T
oReassemble the Instrument ........
...............5-62
HP-IB Cable Interface Replacement .......
..
.............5-64
T
oRemove the Assembly ..........................5-64
Reassembly Tips ...........
...................5-65
Front P
anel (A1, A2) . .........................
...5-66
T
oRemove the Front Panel ......................... 5-66
T
oRemove the ALC Cable/Connector . ...................5-66
T
oRemove the Front Frame . ..
.....................5-68
T
oRemove the Display (A2) . ..
.....................5-69
T
oRemove the Keyboard (A1) . ..
....................5-69
T
o Remove the Dress P
anel ...............
..
........5-69
Reassembly Tips . ..................... .. .. ....5-71
6. Post-Repair Procedures
Introduction ..
..
...................
..
..
..
....6-1
7. Error Messages
Introduction . . . . . . . . . ........................ 7-1
Error Messages List .... .. .. .. .. .. .. .. .. .. .. .. .. . 7-2
Messages ...........
....................... 7-3
8. Options
Introduction............................ .. .. . 8-1
Electrical Options ......................
........ 8-2
Option 1E1 - A
dd Output Step Attenuator . . . . . . . . . . . . . . . . . . 8-2
Option 1E5 - Add High Stability Timebase . . . . . . . . . . . . . . . . . . 8-2
Option 1E8 - 1 Hz Frequency Resolution .................. 8-2
Option 1E9 - 3.5 mm RF Output Connector ................. 8-2
Mechanical Options .. .. .. .. .. .. .. .. .. .. .. .. .. .. . 8-3
Option 1CM - Rack Mount Kit . . . . . . . . . . . . . . . . . . . . . . . . 8-3
Option 1CP - Rack Mount and Handle Kit .................. 8-3
Option 1CR - Rack Slide Kit .... .. .. .. .. .. .. .. .. .. .. 8-3
Contents-4