Agilent Technologies HP 83711A User manual

Printed in USA March 2000
Notice
Hewlett-Packard to Agilent Technologies Transition
This documentation supports a product that previously shipped under the Hewlett-
Packard company brand name. The brand name has now been changed to Agilent
Technologies. The two products are functionally identical, only our name has changed. The
document still includes references to Hewlett-Packard products, some of which have been
transitioned to Agilent Technologies.

2Chapter1
Contacting Agilent
By internet, phone, or fax, get assistance with all your test and measurement needs.
Table 1-1 Contacting Agilent
Online assistance: www.agilent.com/find/assist
United States
(tel) 1 800 452 4844 Latin America (tel) [phone]
(fax) [phone]
Canada
(tel) 1 877 894 4414
(fax) [phone]
Europe
(tel) ([phone]
(fax) ([phone]
New Zealand
(tel) 0 800 738 378
(fax) ([phone]
Japan
(tel) ([phone]
(fax) ([phone]
Australia
(tel) 1 800 629 485
(fax) ([phone]
Asia Call Center Numbers
Country Phone Number Fax Number
Singapore 1-800-375-8100 (65) 836-0252
Malaysia 1-800-828-848 1-800-801664
Philippines (632) 8426802
1-800-16510170 (PLDT
Subscriber Only)
(632) 8426809
1-800-16510288 (PLDT
Subscriber Only)
Thailand [phone] (outside Bangkok)
[phone] (within Bangkok) (66) 1-661-3714
Hong Kong 800-930-871 (852) 2506 9233
Taiwan 0800-047-866 (886) 2 25456723
People’s Republic
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India 1-600-11-2929 000-800-650-1101

Service Guide
HP 83711A/12A and HP 83711B/12B
Synthesized CW Generators
SERIAL NUMBERS
This manual applies directly to instruments with serial number prex US3449 and above
.
ABCDE
HP Part No. 83711-90134
Printed in USA July 1997 Supersedes April 1995

Notice.
The information contained in this document is subject to change without notice
.
Hewlett-P
ackard makes no warranty of any kind with regard to this material, including
but not limited to, the implied warranties of merchantability and tness for aparticular
purpose
.Hewlett-P
ackard shall not be liable for errors contained herein or for incidental or
consequential damages in connection with the furnishing, performance
,or use of this material.
c
 Copyright Hewlett-Packard Company 1995, 1997
All Rights Reserved. Reproduction, adaptation, or translation without prior written permission
is prohibited, except as allowed under the copyright laws.
1400 Fountaingrove Parkway, Santa Rosa CA, 95403-1799, USA

Introduction
The HP 83711A/12A and HP 83711B/12B synthesized CW generators have dierent frequency
ranges
.The HP 83711A/11B has afrequency range of 1to20 GHz, and the HP 83712A/12B has
afrequency range of 10 MHz to 20 GHz.
The service information for the HP 83711A/12A and HP 83711B/12B synthesized CW generators
comes in two manuals
.
The
HP 83711A/12A and HP 83711B/12B Synthesized CW Generators Service Guide
provides
information needed to repair the synthesizer to the assembly level. The
HP 83711A/12A,
HP 83711B/12B
,HP 83731A/32A and HP 83731B/32B Synthesized Signal Generators
Component-Level Information
manual provides component-level information for the repair of
individual instrument assemblies
.The manual contains Component-Level Information P
ackets
(CLIP
s) for selected assemblies. Each CLIP contains component-level schematics, acomponent
parts list, and illustrations for component location by reference designator
.
Calibration information is in the
HP 83711A/12A, HP 83711B/12B, HP 83731A/32A and
HP 83731B/32B Synthesized Signal Generators Calibration Guide
.The calibration guide
contains the performance tests and adjustments for the synthesizer
.
The service guide is what you receive when you order Option OBW
,service documentation.
iii

In This Guide
The service guide includes the following chapters:
Chapter 1
,\Troubleshooting," contains the troubleshooting information needed to isolate a
failed major assembly
.
Chapter 2
,\Block Diagrams
," contains the block diagram that is to be used for the HP
83711A/12A and HP 83731B/32B
.
Chapter 3
,\Major Assembly and Cable Locations
," contains drawings that show the major
assemblies and cable locations
.
Chapter 4
,\P
arts List," contains information needed to order assemblies and parts for the
instrument.
Chapter 5
,\Assembly Replacement," contains information needed to remove or replace a
major assembly
.
Chapter 6
,\P
ost-Repair Procedures
," contains the procedures to be followed after arepair has
been made
.
Chapter 7
,\Error Messages
," contains alist of all of the error messages that might be
generated during use of the instrument. Each entry in the list contains asequence that can be
followed to recover from the error condition.
Chapter 8
,\Options
," contains adescription of the various options available for use with the
synthesizers
.
Chapter 9
,\Contacting Hewlett-P
ackard," provides information on how to contact HP as well
as how to package and ship the instrument.
Chapter 10
\Legal and Regulatory Information," contains the information about manual
updates
,operating environment, storage environment, ESD precautions
,safety considerations,
etc
.
Assumptions About Y
ou
The procedures in this guide assume that you have the tools and equipment to perform each
service task. To nd what tools and equipment belong to each service task, refer to the chapter
containing the task.
iv

Contents
1. Troubleshooting
Introduction . .....................
..
..
.......1-1
Prior to Beginning Troubleshooting ...................
.. 1-1
The Service Position ................... .. .. .. ..1-1
Power Supply V
erication .................... ..
.. 1-1
Safety Considerations ..
..................... ..
..
.1-2
W
arnings and Cautions ...............
..
..
..
......1-2
Before Applying P
ower ...............
..
..
..
.....1-2
After-Service Safety Checks .................... ....1-3
ESD Precautions ...............................1-3
Recommended T
est Equipment .... .. ..................1-3
Service A
ccessories ........................ .....1-4
TORX
R

Screwdrivers . ..
...................
..
..
. 1-4
Pozidrive Screwdrivers ......................
..
...1-4
Hardware . .......................
..
.......1-4
Major Assemblies
,P
arts
,and Cable Locations ................ 1-4
Test P
oint Locations ............................1-4
Service Aids on Printed Circuit Boards .............
......1-5
Other Service Documents .................
........1-5
Cleaning ....................
..............1-5
Cleaning Intervals ...................
..........1-5
Cleaning Solution ..................... ........1-5
12-Month Cleaning ............. ................1-5
After Repair Calibration ............ ...............1-6
Main Troubleshooting .........
..
..
..
.............1-7
Microprocessor Assembly (A3) Troubleshooting .........
..
..
..1-9
ABUS Errors ...........
..
..
...............1-9
0.5 V/GHz Output Errors . ..
..
..
.................. 1-10
LO Synthesizer and Reference Assembly (A6) Troubleshooting ..
......1-11
Data Readback Errors ...... .. .. .. .............
. 1-11
ABUS Errors ..............................1-11
Oscillator Cold Error . . . . . . . . . . . .. .. .. .. .. .. .. .. 1-12
LO Synthesizer and Reference Unlocked/Divide V
oltage Errors ....... 1-13
YO Loop and Oset Synthesizer Assembly (A7) Troubleshooting . . . . . . . . 1-16
Data Readback Errors .. .. .. .. .. .. .. .. .. .. .. .. .. 1-16
ABUS Error........................
....... 1-17
Oset Synthesizer Incorrect Frequency/Unlocked Errors . . . . . . . . . . 1-18
YIG Driver Assembly (A9) Troubleshooting .... .. .. .. .. .. .. . 1-20
Data Readback Errors .. .. .. .. .................. 1-20
ABUS Errors .... .. .. .. .. .. .. .. . .. .. .. .. .. . 1-20
MSB Errors .... .. .. .. .. .. .. .. .. .. .. .. . .. .. 1-21
Low/High Band Voltage Errors ...................... 1-23
ALC Assembly (A10) Troubleshooting . . . . . . . . . . . . . . . . . . . . 1-25
Data Readback Errors .. .. .. .. .. .. .. .. .. .. .. .. .. 1-25
ABUS Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-25
DAC Errors ............................... 1-26
Contents-1

Integrator Errors . ..
..
..
............... .. .. .. 1-27
Integrator Errors (Revision 10.01 and Above Only) ...........
.. 1-27
Leveled Indicator Trip Point Errors ............
..
..
..
.. 1-27
Leveled Indicator Trip Point Errors (Revision 10.01 and Above Only) ....1-27
RF/Reference Detector Errors ..
...............
..
..
. 1-27
Input/Output Switching Errors .. ...............
..
..
. 1-29
Input/Output Switching Errors (Revision 10.01 and Above Only) ......1-29
Track and Hold Errors ..............
..
..........1-29
Track and Hold Errors (Revision 10.01 and Above Only) .......... 1-29
Output Module (A8A1) Troubleshooting ................
..
. 1-30
Combiner/High Band/Low Band Errors ................
.. 1-30
SLPF
A(A8A3) Troubleshooting ............
..
..
.......1-31
Input/Output Bias Errors .............
..
..
..
......1-31
Y
OLoop and Oset Synthesizer Assembly (A7) Troubleshooting .......
. 1-34
Sampler (A8T1) Troubleshooting ............... .. .. ...1-41
LO Unlocked Errors ............... .. .. ........1-41
Oset Synthesizer Unlocked Errors .............. .. .. ..1-42
Y
OLoop Unlocked Errors .........
..
.............1-42
SLPF
A(A8A3) Troubleshooting .......................1-50
Unleveled at Minimum V
ernier Errors ...................1-50
Unleveled at Maximum V
ernier Errors ...........
..
.....1-51
Divider and Modulation Assembly (A4) Troubleshooting ........... 1-52
Symptom Troubleshooting .........
..
...............1-56
Checking the P
ower Supply ........ ................1-57
Checking the Front P
anel Display .....
..
...............1-57
Checking the Hewlett-P
ackard Interface Bus (HP-IB) ......
.......1-58
Checking the Microprocessor ..........
..............1-58
Checking the 10 MHz Output . .......................1-59
Checking the 10 MHz Input ..
.......................1-59
Checking the 0.5V/GHz Output .......................1-60
Checking the Output P
ath .... .....................1-60
T
oTroubleshoot the Option 1E1 Output Path ...............1-60
T
oTroubleshoot the Non-Option 1E1 Output Path .............1-61
Checking External ALC ...................
..
..
..
.1-62
2. Block Diagrams
3. Major Assembly and Cable Locations
Introduction ...............
..
..
..
..
..
........3-1
4. Parts List
Introduction..........
... . .. .. .. .. .. .. .. .. .. . 4-1
Abbreviations . . . . . . . . . . . . . . . . . . . . .. .. .. .. .. . . 4-1
Replaceable P
arts T
able F
ormat.... .. .. .. .. .. .......... 4-1
Illustrated P
arts Breakdowns . . . . . . . . . . . . . . . . . . .. .. .. . 4-2
Ordering Information .... .. .. . .. .. .. .. .. .. .. .. .. . 4-2
Optional Congurations .... .. .. .. .. . .. .. .. .. ...... 4-3
Parts List Backdating ......................... . .. 4-3
Parts Identication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
Other Documentation .... .. .. .. .. .. .. .. .. .. . .. .. . 4-4
Exchange Assemblies . .. .. .. .. .. . .. .. .. .. .. .. .. .. 4-5
Contents-2

5. Assembly Replacement
Introduction ..
..
............... .. .. .. .. .. ....5-1
Assembly and P
art Locations .............
..
..
...... .. 5-7
Major Assembly and Cable Locations ............... .. .. . 5-7
Service Position ..
...............
..
..
..
..
..
...5-7
T
ools . .. ...............
..
..
..
..
.........5-7
Special T
echniques ................. .. .. .........5-9
Safety ................... .. .. ............5-9
F
asteners (Screws and Nuts) ...............
..
..
.....5-9
Cable and Connector Identication .................. .. .5-9
Semi-Rigid Coaxial Cables ................... .. ....5-10
Flexible Coaxial Cables .............
..
..
..........5-11
SMC Connectors ................ .. .. .........5-11
SMA Connectors ..............
..
..
..
.........5-11
SMB Connectors ................ .. .. .........5-11
Multi-wire Cables ................ .. .. .........5-11
Synthesizer Covers ..............
..
..
..
..........5-13
T
oRemove the T
op Cover .......
..
................5-13
T
oRemove the Bottom Cover ........................5-15
P
ower Supply (A11) .............................5-17
T
oDisconnect the P
ower Supply Cables .........
..
..
......5-17
T
oRemove the P
ower Supply ..........
..
..
..
........5-18
Reassembly Tips .........
..
...................5-19
Fuse ............ .......................
. 5-20
T
oRemove (and Replace) the Fuse ....
..
...............5-20
F
an Assembly ..........
......................5-21
T
oDisconnect the F
an Cable ........................5-21
T
oRemove the Fan .........................
...5-22
Reassembly Tips .............................. 5-23
Divider and Modulation Board Assembly (A4) . ................5-23
T
oA
ccess the Service P
osition . ...................... 5-23
T
oRemove the Assembly ..
..
...................... 5-23
Reassembly Tips .......
....................... 5-24
Microprocessor Board Assembly (A3) ..................... 5-26
T
oA
ccess the Service P
osition .................. .. ...5-26
T
o Disconnect the Cables ...................
.......5-26
T
o Remove the Microprocessor Assembly .................. 5-27
Reassembly Tips . ..................... .. .. .. ..5-27
Battery (A3BT1) ............
..
..
..
..
..
..
.......5-29
T
oA
ccess the Service P
osition .......................5-29
To Remove the P
art ....
........................ 5-29
To Reassemble the Instrument .... .. .. .. .. .. .. .. .. .. . 5-30
Crystal Oscillator (Option 1E5) ............ .. .. .. .. .. .. 5-31
To Disconnect the Oscillator Cables .... .. ............... 5-31
To Remove the Oscillator . . . . . . . . . . . . . . . . . ......... 5-31
Reassembly Tips . . . . . . . . . . . . . . . . . . . . . ......... 5-32
ALC Board Assembly (A10) . . . . . . . . . . . . . . . . . . . . ...... 5-33
To Remove the Assembly . . . . . . . . . . . . . . . . . . . . ...... 5-33
Reassembly Tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-33
YIG Driver Board Assembly (A9) .. .. .. .. .. .. .. .. .. .. .. . 5-35
ToAccess the Service Position .... .. .. .. .. .. .. .. .. .. . 5-35
To Remove the Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . 5-36
YO (YIG Oscillator) Loop/Oset Synthesizer Board Assembly (A7) . . . . . . . . 5-38
To Remove the Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . 5-38
Reassembly Tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-38
Contents-3

LO (Local Oscillator) Synthesizer/ Reference Board Assembly (A6) . ......5-40
T
oA
ccess the Service P
osition ..........
..
..
..
..
..
..
.5-40
T
o Remove the Assembly .............
..
..
..
..
..
..
.5-41
Reassembly Tips . ..
................. .. .. .. .. ..5-42
Step Attenuator, A8AT1 (Option 1E1) ............. .. .. .. .. 5-44
T
o Remove the Assembly ...............
..
..
..
..
..
.5-44
T
oReassemble the Instrument ............... .. .. ....5-44
Sampler Microcircuit, A8T1 ...............
..
..
..
.....5-46
T
oRemove the Subassembly ................. .. .....5-46
T
oReassemble the Instrument ................. .. ....5-48
YIG Oscillator(s) .................... ..
.........5-49
T
oRemove the P
art ..........
..................5-49
T
oReassemble the Instrument ............. .. .. ......5-50
YIG Driver Cable and T
emperature Transducer ........... .. .. .5-53
T
oRemove the P
art ..........
...... ............5-53
T
oReassemble the Instrument ............. .. .. ......5-54
Output Module
,SLPF
AModule
,and Coupler Detector ......
..
..
..
.5-55
T
oRemove the Subassemblies ........... ............5-55
T
oRemove the Coupler Detector Subassembly ................5-56
T
oRemove the Output Module and the SLPF
AModule Subassemblies .....5-58
T
oReassemble the Instrument ............
..
..
.......5-58
RF Output Connector/A
dapter
,CP1 ...........
..
..
..
.....5-60
T
oRemove the Assembly ........ ..................5-60
T
oReassemble the Instrument ........
...............5-62
HP-IB Cable Interface Replacement .......
..
.............5-64
T
oRemove the Assembly ..........................5-64
Reassembly Tips ...........
...................5-65
Front P
anel (A1, A2) . .........................
...5-66
T
oRemove the Front Panel ......................... 5-66
T
oRemove the ALC Cable/Connector . ...................5-66
T
oRemove the Front Frame . ..
.....................5-68
T
oRemove the Display (A2) . ..
.....................5-69
T
oRemove the Keyboard (A1) . ..
....................5-69
T
o Remove the Dress P
anel ...............
..
........5-69
Reassembly Tips . ..................... .. .. ....5-71
6. Post-Repair Procedures
Introduction ..
..
...................
..
..
..
....6-1
7. Error Messages
Introduction . . . . . . . . . ........................ 7-1
Error Messages List .... .. .. .. .. .. .. .. .. .. .. .. .. . 7-2
Messages ...........
....................... 7-3
8. Options
Introduction............................ .. .. . 8-1
Electrical Options ......................
........ 8-2
Option 1E1 - A
dd Output Step Attenuator . . . . . . . . . . . . . . . . . . 8-2
Option 1E5 - Add High Stability Timebase . . . . . . . . . . . . . . . . . . 8-2
Option 1E8 - 1 Hz Frequency Resolution .................. 8-2
Option 1E9 - 3.5 mm RF Output Connector ................. 8-2
Mechanical Options .. .. .. .. .. .. .. .. .. .. .. .. .. .. . 8-3
Option 1CM - Rack Mount Kit . . . . . . . . . . . . . . . . . . . . . . . . 8-3
Option 1CP - Rack Mount and Handle Kit .................. 8-3
Option 1CR - Rack Slide Kit .... .. .. .. .. .. .. .. .. .. .. 8-3
Contents-4

W
arranty Options .... .. .............
..
..
..
..
..
. 8-3
Option W30 - Two A
dditional Y
ears Return-to-HP Service .......... .8-3
Option W32 - Three Y
ear Return to HP Calibration Service .......
..
.8-3
Documentation Options . ................. .. .. .. .. .8-4
Option OB0 - Delete Operating Documentation ..............
.. 8-4
Option OB1 - Extra Operating Documentation ..............
.. 8-4
Option OBV -Component-Level Information P
acket (CLIP) .......... 8-4
Option OBW -Service Documentation .............
..
..
..
.8-4
Option OBX -Component-Level Information P
acket (CLIP)/Service
Documentation ...................
..
..
......8-4
9. Contacting Hewlett-P
ackard
Introduction ................. .. .. ............9-1
Returning Instruments for Service .............. .. .. ....9-2
Service T
ag ............... .. .. .............9-2
Original P
ackaging ............... .. .. ..........9-2
Other P
ackaging ............. .. ...............9-2
Sales and Service Oces ............ ...............9-3
10. Legal and Regulatory Information
Introduction ................
..
..
.............10-1
Safety Considerations ......... .. .. ...............10-2
Before Applying P
ower .......
..
.................10-2
Safety Earth Ground ........
..
..................10-2
Safety Symbols and Notes .......
..
................10-3
Electrostatic Discharge ............................10-4
PC Board Assemblies and Electronic Components ..............10-4
T
est Equipment ...
...........................10-5
ESD A
ccessories ..............................10-5
Certication ......
.........................
..10-6
W
arranty .....
..
.......................
..
..10-6
Limitation of W
arranty ..... ......................10-6
Exclusive Remedies ........................ ....10-6
Assistance .....................
..
..
..
.......10-6
Index
Contents-5

Figures
2. HP 83731A/B, HP 83732A/B Overall Block Diagram F
oldout .........2-3
3-1. Major Assemblies { T
op View .................... .. ..3-2
3-2. Major Assemblies { Bottom View ...................
..
. 3-3
3-3. Cable Assemblies { Top View ..................
..
..
.. 3-4
3-4. Cable Assemblies { Bottom View ................... .. . 3-5
4-1. Major Assemblies Location Diagram (T
op View) .............
.. 4-8
4-2. Major Assemblies Location Diagram (Bottom View) .............. 4-10
4-3. Cable Assemblies Location Diagram (T
op View) ............... 4-12
4-4. Cable Assemblies Location Diagram (Bottom View) ..............4-14
4-5. Figures Orientation Diagram, T
op View ...................4-15
4-6. Figures Orientation Diagram, Bottom View .................4-16
4-7. T
op and Bottom Cover Illustrated P
arts Breakdown .............4-18
4-8. Front Panel Illustrated P
arts Breakdown .................. 4-20
4-9. Front Frame and Display/Keyboard Illustrated P
arts Breakdown .......4-22
4-10. Front Dress P
anel Illustrated P
arts Breakdown ................4-24
4-11. T
op Side Circuit Board Illustrated P
arts Breakdown .............4-26
4-12. F
an, P
ower Supply
,and Rear P
anel Connector Illustrated P
arts Breakdown ..4-28
4-13. YIG, Crystal Oscillator
,and Sampler Microcircuit Illustrated P
arts Breakdown .4-30
4-14. Attenuator
,Bottom Side Circuit Board, and Rails Illustrated P
arts Breakdown .4-32
4-15. Microwave Output and SLPF
AIllustrated P
arts Breakdown ..........4-34
4-16. Microwave Deck Illustrated P
arts Breakdown ................4-36
5-1. Location of Major Assemblies{T
op View ..........
..
.......5-3
5-2. Location of Major Assemblies{Bottom View ............. ....5-4
5-3. Cable Locations{T
op View ............
..
...........5-5
5-4. Cable Locations{Bottom View ............. .. .. ......5-6
5-5. T
op or Bottom Cover Removal ..........
..
..
.........5-12
5-6. Service P
osition{T
op Cover Removed ..
..
..
..............5-14
5-7. Service P
osition{Bottom Cover Removed ..... .. .. .........5-16
5-8. P
ower Supply Cables ....
..
..
..
.................. 5-18
5-9. P
ower Supply Screws ..
..
..
..
..
..
............... 5-19
5-10. Line Fuse Removal and Replacement ....................5-20
5-11. F
an Cable Location ................
............ 5-21
5-12. F
an Assembly Removal . .........................
. 5-22
5-13. Divider and Modulation Board Assembly Removal .............. 5-25
5-14. Microprocessor Board Assembly Cable Location ..
............. 5-27
5-15. Microprocessor Board Assembly Removal .................. 5-28
5-16. Microprocessor Board Battery Removal .......... .. .. .. .. . 5-30
5-17. Crystal Oscillator Cables ................... .. .. .. . 5-31
5-18. Crystal Oscillator Removal .................... .. .. . 5-32
5-19. ALC Board Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-34
5-20. YIG Driver Board Service Position ..................... 5-35
5-21. YIG Driver Board Removal . . . . . . . . . . . . . . . . . . . . . . . . . 5-37
5-22. YO Loop and Oset Synthesizer Board Removal .... .. .. .. .. .. . 5-39
5-23. LO Synthesizer and Reference Board Service Position .... .. .. .. .. 5-41
5-24. LO Synthesizer and Reference Board Removal . . . . . . . . . . . . . . . . 5-43
5-25. Step Attenuator Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-45
Contents-6

5-26. Sampler Removal ....
..
............... .. .. .. .. 5-46
5-27. YIG Oscillator Removal . ............. .. .. .. .. .. .. .5-51
5-28. Output Module
, SLPF
AModule
,and Coupler Detector Removal ......
.. 5-56
5-29. Output Module
, SLPF
AModule
,and Coupler Detector Separation .......5-57
5-30. RF Output Connector Removal{Standard ................. . 5-61
5-31. RF Output Connector Removal{Option 1E1 .............. .. . 5-62
5-32. HP-IB Cable Removal ................ .. .. .......5-64
5-33. Front P
anel and BNC Connector Removal ............ .. .. ..5-67
5-34. Front Frame Removal .................. .. .......5-68
5-35. Display and Keyboard Removal ................. .. ....5-70
5-36. Dress P
anel Removal ...............
..
..
.........5-71
10-1. Static-Safe W
orkstation .............. .. ...........10-4
Contents-7

T
ables
1-1. Recommended Test Equipment . ...................... 1-6
1-2. YIG Continuity .................... ..
..
......1-39
1-5. A2J1 V
oltages ...................
..
..
........1-57
4-1. P
art Numbers for Exchange Assemblies ................
..
. 4-5
4-2. Reference Designations . ...................
..
..
.. 4-6
4-3. Abbreviations ..
..................... .. .. ....4-6
4-4. Multipliers ..................... .. .. .. .....4-7
4-5. Major Assemblies
,T
op View .............. .. .. ......4-8
4-6. Major Assemblies
,Bottom View ................. ......4-9
4-7. Cable Assemblies
,T
op View ........................4-11
4-8. Cable Assemblies
,Bottom View .......................4-13
4-9. Illustrated Replaceable P
arts . ..
..
...................4-17
5-1. T
ools ...................... .. .. .........5-8
5-2. F
astener T
orque V
alues ................
..
..
..
.....5-9
9-1. Hewlett-P
ackard Sales and Service Oces .................. 9-4
Contents-8

1
Troubleshooting
Introduction
This chapter contains troubleshooting procedures that isolate problems to the assembly level.
Always begin troubleshooting by following the procedure titled \Main Troubleshooting." At the
start of the main troubleshooting procedure, run the synthesizer internal self test. Depending
on the error messages returned by the self test routine, follow the procedures that verify the
detected error condition. These procedures are self-contained and also verify the inputs that
can have an eect on the detected error. If the self test does not detect any errors
,aset of
procedures at the end of this chapter veries circuits that are not checked with the self tests
.
These procedures are referenced by symptom.
Prior to Beginning Troubleshooting
The following paragraphs present information that must be understood prior to beginning
troubleshooting. This information is important to know regardless of the path taken by the
troubleshooting.
The Service P
osition
T
oaccess many of the measurement points on an assembly
,the assembly must be installed
in the service position. Refer to procedures in Chapter 5, \Assembly Replacement," for
instructions on how to install agiven assembly in the service position. These procedures are
grouped by assembly
.The individual troubleshooting procedures note when it is necessary to
install an assembly in the service position.
P
ower Supply V
erication
Occasionally
,anapparent failure on an assembly might be caused by avoltage that is out of
specication on the power supply assembly.
On the end of the power supply facing the front of the synthesizer
,there are seven green
LEDs
. When an LED is on, that supply is operating within its specied tolerance
.If the LED is
o, the supply has failed or the supply is being loaded down by one of the assemblies
.
Troubleshooting 1-1

Troubleshooting
Safety Considerations
W
arnings and Cautions
P
ay attention to W
ARNINGS and CA
UTIONS. They must be followed for your protection and to
avoid damage to the equipment.
Before Applying P
ower
Caution
V
erify that the instrument is set to match the available line (mains) voltage
and that the correct fuse is installed. An uninterrupted safety earth ground
must be provided from the main power source to the instrument input wiring
terminals or power cable
.
Warning
Maintenance described herein is performed with power supplied to the
instrument and with protective covers removed. Such maintenance
should be performed only by service-trained personnel who are aware
of the hazards involved (for example, re and electrical shock). Where
maintenance can be performed without power supplied, the power
should be removed.
Any interruption of the protective (grounding) conductor (inside or
outside the instrument) or disconnecting the protective earth terminal
will cause a potential shock hazard that could result in personal injury
.
(Grounding one conductor of atwo conductor outlet is not sucient
protection.) In addition, verify that acommon ground exists between
this instrument and the test equipment prior to energizing either unit.
Whenever it is likely that the protection has been impaired, the
instrument must be made inoperative and be secured against any
unintended operation.
If this instrument is to be energized via an autotransformer (for voltage
reduction) make sure that the common terminal is connected to neutral
(that is
,the grounded side of the mains supply).
Servicing instructions are for use by service-trained personnel only
.T
o
avoid dangerous electric shock, do not perform any servicing unless
qualied to do so
.
Energy available at many points may
,if contacted, result in personal
injury.
Capacitors inside the instrument may still be charged even if the
instrument has been disconnected from its source of supply
.
For continued protection against re hazard, replace the line fuse(s)
only with 250 V fuse(s) of the same current rating and type (for example
normal blow
, time delay, etc.). Do not use repaired fuses or short
circuited fuse holders
.
1-2 Troubleshooting

Troubleshooting
Caution
Unplug the instrument before disconnecting or removing any boards
.Some
boards contain devices that can be damaged if the board is removed when
the power is on.
There are several components including MOS and CMOS devices that can
be damaged by electrostatic discharge
.Use conductive foam and grounding
straps when servicing sensitive components
.Carefully unplug ICs in high-grip
sockets
.
After-Service Safety Checks
Visually inspect the interior of the instrument for any signs of abnormal internally generated
heat, such as discolored printed circuit boards or components
,damaged insulation, or evidence
of arcing. Determine and remedy the cause of any such condition.
Using a suitable ohmmeter
,check the resistance from the instrument enclosure to the ground
pin on the power cord plug. The reading must be less than one ohm. Flex the power cable
while making this measurement to determine whether intermittent discontinuities exist.
Check any indicated rear-panel ground terminals that are marked, using the above procedures
.
Check the resistance from the instrument enclosure to line and neutral (tied together) with
the on/o switch in the ON (
j
) position and the power source disconnected. The minimum
acceptable resistance is two megohms. Replace any component that results in afailure
.
Check the line fuse to verify that a correctly rated fuse is installed.
ESD Precautions
There are several components including MOS, CMOS, and microwave devices that can be
damaged by electrostatic discharge (ESD). A sensitive assembly should be stored in an antistatic
container whenever it is not installed. Use astatic free work area and aproperly grounded
wrist strap
. Refer to Chapter 10, \Legal and Regulatory Information," for more detailed
information.
Recommended T
est Equipment
Test equipment and accessories required to maintain the instrument are listed in Table 1-1 ,
\Recommended T
est Equipment." Equipment other than that listed may be used if it meets the
critical specications listed in the table
.
Troubleshooting 1-3

Troubleshooting
Service A
ccessories
TORX
R

Screwdrivers
Most of the screws in the synthesizer are TORX
R

screws
.Remove these screws with aTORX
R

screwdriver
.The part number of the #10 TORX
R

screwdriver is HP 8710-1623. The part
number of the #15 TORX
R

screwdriver is HP 8710-1622. The part number of the #25 TORX
R

screwdriver is HP 8710-1617.
Pozidrive Screwdrivers
Some screws in the instrument appear to be Phillips type
,but are not. T
oavoid damage to
the screw head slots
,P
ozidrive screwdrivers should be used. The part number of the No
.1
Pozidrive is HP 8710-0899
.The part number of the No
.2P
ozidrive is HP 8710-0900.
Hardware
The instrument has amixture of Unied National (inch) and metric screws
.The metric screws
are dened in Industrial F
asteners publication (IFI 500). Do not use ametric screw in aUnied
National nut, or ametric nut with a Unied National screw because thread damage will occur
.
Major Assemblies
,P
arts
,and Cable Locations
The locations of individual components mounted on printed circuit boards are available
for selected instrument assemblies
.The information for these assemblies is provided in
the accompanying
HP 83711A/12A, HP 83711B/12B
,HP 83731A/32A and HP 83731B/32B
Synthesized Signal Generators Component-Level Information
manual. Each tabbed section in
the Component-Level Information manual contains the parts list, component-location diagram,
and schematic for that specied assembly
.
The part reference designation is the assembly designation plus the part designation. F
or
example
,A6R9 is R9 on the A6 assembly
.F
or specic component descriptions and ordering
information, see the parts list in the Component-Level Information P
acket for that board.
Chassis and frame parts
,as well as mechanical parts and cables (W), are identied in illustrated
parts breakdowns in Chapter 4.
The procedures in this chapter reference cables and assemblies by their reference designator
.
Figures 3-1 to 3-4 show where the assemblies and cables are located in the synthesizer
.The
gures are located in Chapter 3.
Test P
oint Locations
Most test points are indicated on the actual circuit-board assemblies
.T
est and measurement
points called out in the troubleshooting procedures are shown on the component-location
diagrams in the Component-Level Information manual.
1-4 Troubleshooting

Troubleshooting
Service Aids on Printed Circuit Boards
Service aids on printed circuit boards include test points
,indicator lights
, some reference
designations
,and assembly part numbers
.
Other Service Documents
Service notes and other service literature are available through Hewlett-Packard. F
or further
information, contact your nearest Hewlett-P
ackard oce
.
Cleaning
Cleaning Intervals
W
arning
Before cleaning, make sure the instrument is disconnected from the power
source
.This is to eliminate the possibility of electrical shock.
Caution
In procedures that call for a vacuum cleaner to remove dust, do not use a
blower or compressed air
.Doing so will cause the dust to be transferred
throughout the instrument.
Hewlett-P
ackard recommends a12-month interval between cleaning for some parts of the
instrument. But, cleaning intervals are mostly dependent upon where the instrument is used.
The instrument should be cleaned more often if it is in adusty or very humid area.
Cleaning Solution
Hewlett-P
ackard recommends using either of two cleaning solutions on printed circuit (PC)
board edge connectors
.F
or best cleaning results
,we recommend an ammonium hydroxide
solution (NH4OH, 29.5% NH3 by weight). But, aconcentrated solution of ammonia requires
the use of gloves
,eye goggles
,and proper ventilation. The second recommendation is an 80:20
solution of isopropyl alcohol and water (IP
A/H
2
O). This should serve as asatisfactory cleaner if
you do not want to use ammonium hydroxide
.
12-Month Cleaning
At 12-month intervals the instrument covers should be removed to gain access to the cooling
fan.
Wipe the instrument fan with a clean cloth or tissue
, or vacuum for dust.
Remove each printed circuit board, and clean the component side of the board with
compressed air
. Set the air pressure to 20 psi maximum. T
o remove the boards
, refer to
Chapter 5, \Assembly Replacement." Return the boards to the instrument.
After cleaning, reinstall the covers.
Troubleshooting 1-5

Troubleshooting
After Repair Calibration
Once the synthesizer is repaired, it may be necessary to calibrate the instrument. Refer to
the
HP 83711A/12A, HP 83711B/12B
,HP 83731A/32A and HP 83731B/32B Synthesized Signal
Generators Calibration Guide
to determine when it is necessary to use the performance tests
and adjustments
.Chapter 6, \P
ost-Repair Procedures
," should be referred to as well.
The following table contains the list of recommended test equipment that can be used for
troubleshooting.
T
able 1-1. Recommended T
est Equipment
Equipment Critical Specications Recommended
Model
Frequency
Counter
Frequency Range: 1to 20 GHz HP 5343A
Function
Generator
Frequency: 100 kHz
Amplitude: 0to 5Vp-p
HP 3325A
Multimeter No substitute HP 3458A
Oscilloscope HP 54111D
P
ower Meter A ccuracy: 0.02 dB
Frequency range: 100 MHz
HP 437B
P
ower Sensor P ower Meter compatible HP 8482A
P
ower Supply Range: 0 10 Vto +10 VHP 6235A
Signal Generator Frequency Range: 1MHz to 25 MHz
Amplitude:
0
10 dBm to +10 dBm
HP 8663A
Spectrum
Analyzer
HP 8566B
1-6 Troubleshooting