Akai S1100 User manual

OOL
US
MIDI STEREO DIGITAL SAMPLER
SPECIFICATIONS MODEL
Display Backlit 320 characters/240 *64
graphic LCD
Disk drive 3.5” dual density drive, 2Mbyte ca-
pacity (2HD), 1Mbyte capacity
(2DD)
Memory 2Mbyte expandable to 32Mbyte
Data format 16 bit linear
Maximum number of
samples 200
Maximum number of
programs 100
Sampling rates 44.1/22.05 kHz, switchable
Sampling time
(unexpanded memory) ... 23.76 sec. (mono/sampling rate
44.1 kHz)
47.52 sec. (mono/sampling rate
22.05
kHz)
11.88 sec. (stereo/sampling rate
44.1 kHz)
23.76 sec. (stereo/sampling rate
22.05
kHz)
Frequency response 20 Hz to 20 kHz (sampling rate
22.05
kHz)
20 Hz to 10 kHz (sampling rate
22.05
kHz)
Pitch shift Interpolation and decimation digi-
tal algorithm (24 bit algorithm/cus-
tom LSI)
±2 octave changeable, 1cent/step
Filter Digital moving low pass filter (-18
dB/oct)
Envelope generator 2sets/digital ADSR
Levels/impedance
REC INPUT HI :-58 dBm
(L. R./MIC PLUG) MID: -38 dBm
LOW: -18 dBm
STEREO OUT
(L/mono &RCH) -5dBm/600 ohms
EFFECT SEND -5dBm/600 ohms
CH 1to CH 8OUT .... -5dBm/600 ohms
AES/EBU
(Digital out) .RS-422 level
Connectors
Front panel .REC INPUT
CANON PLUG x2 (L ch., Rch.)
MIC PLUG x2 (Lch., Rch.)
Rear panel .STEREO HEADPHONE xl
STEREO OUT x2, EFFECT SEND
xl, ASSIGNABLE MIX OUT x8,
EFFECT RETURN x2, FOOT SW xl
,
MIDI IN xl, MIDI OUTxl, MIDI THRU
xl
Power requirement .AC 100 V, 50/60 Hz for Japan
AC 120 V, 60 Hz for USA and Ca-
nada
AC 220 V, 50 Hz for Europe except
UK
AC 240 V, 50 Hz for UK and Austra-
lia
Power consumption .J:32W. A:50W. E,V:32W
Dimensions .483(W) x133(H) x425(D)mm
(EIA3U size)
Weight
Options
.10.1kg
EXM005 .Memory expansion board(2M
bytes)
EXM008 .Memory expansion board(8M
bytes)
IB104 .AES/EBU Digital audio interface
board
BL1000 .3.5 inch 2HD blank disk
Standard accessories
Sound library disk 4
AC cord 1
Operator’s manual 1
*For improvement purposes, specifications and design are subject to change without notice.

SAFETY INSTRUCTIONS
PRECAUTIONS DURING SERVICING
1. Parts indentified by the A(*) symbols are critical for
safety Replace only with parts number specified.
2. In addition to safety, other parts and assemblies are
specified forconformance with such regulations as
those applying to spurious radiation.
These must also be replaced only with specified re-
placements.
Examples: RF converters, tuner units, antenna selector
switches, RF cables, noise blocking capacitors, noise
blocking filters, etc.
3. Use specified internal wiring note especially:
1) Wires covered with PVC tubing
2) Double insulated wires
3) High voltage leads
4. Use specified insulating materials for hazardous live
parts. Note especially:
1) Insulation Tape
2) PVC tubing
3) Spacers (Insulating Barriers)
4) Insulation sheets for transistors
5) Plastic screws for fixing microswitch (especially in
turtable)
5. When replacing AC primary side components(transfor-
mers, power cords, noise blocking capacitors, etc.),
wrap ends of wires securely about the terminals be-
fore soldering.
6.
Observe that wires do not contact heat producing
parts (heatsinks, oxide metal film resistors, fusible re-
sistors, etc.).
7. Check that replaced wires do not contact sharp edged
or pointed parts.
8. Also check areas surrounding repaired locations.
9. Use care that foreign objects (screws, solder droplets,
etc.) do not remain inside the set.
SAFETY CHECK AFTER SERVICING
After servicing, make measurements of leakage-current
or resistance in order to determine that exposed parts
are acceptably insulated from the supply circuit.
The leakage-current measurement should be done be-
tween accessible metal parts (such as chassis, ground
terminal, microphone jacks, signal input/output connec-
tors, etc.) and the earth ground through aresister of
1500ohms paralleled with a0.15 \if capacitor, under the
unit’s normal working condition. The leakage-current
should be less than 0.5 mA rms AC.
The resistance measurement should be done between
accessible exposed metalparts and power cord plug
prongs with the power switch (if included) “ON”. The re-
sistance should be more than 2.2 Mohms.
INFORMATION
SYMBOLS FOR PRIMARY DESTINATION
Alphabet indicates the destination of the units as listed
below.
Symbols Principal Destinations
AUSA
BUK
CCanada
EEurope (except UK)
1JJapan
S\
Australia
VW. Germany only
uUniversal Area
Y* Custom version
SERVICE MANUAL
2

I. DISASSEMBLY
In case of trouble, etc. necessitating dismantling, please dismantle in the order shown in the illustrations.
Reassemble in the reverse order.
3

25X24X23X22) (2 I20 19 18 17 16X15X14
Fig. 2-1
1. SWITCHING REGULATOR BLK
2. FILTER PCB
3. AC INLET
4. POWER SUPPLY PCB
5. POWER TRANSFORMER
6. S1100 SCSI PCB
7. SMPTEPCB
8. DSP PCB
9. CPU PCB
10. MEMORY PCB
11. VOICE (2) PCB
12. VOICE (1) PCB
13. AD PCB
14. INPUT JACK PCB
15. VR PCB
16. REC GAIN PCB
17. ROTARY ENCODER (DATA)
18. PANEL PCB
19. ROTARY ENCODER (CURSOR)
20. LCD BLK
21. HARD DISK DRIVE UNIT (Optional)
22. FDD BLK
23. POWER SW PCB
24. DISPLAY VR PCB
25. INVERTOR PCB
SERVICE MANUAL
4

III. ELECTRICAL ADJUSTMENT
3-1. INSTRUMENT CONNECTION
Fig. 3-1 Instrument connection
3-2. LOCATION OF ADJUSTMENT POINTS
VR201@ £j$VR202
VR 101 :Lch DAC OFF SET ADJ
VR 201 :Rch DAC OFF SET ADJ
VR 301 :SEND DAC OFF SET ADJ
VR 102: LCH DAC MSB ADJ
VR 202: RCH DAC MSB ADJ
VR 302: SEND DAC MSB ADJ
Fig. 3-2 View from right side
©©r
i
i®VR1 01
i
i®VR1 02
i
i
i
i©VR201
i
i©VR202
1
1
1
|®VR301
1
l*55 VR302
1
1®VR401
1
1
1
1
l_ ©VR402
VIEW FROM RIGHT SIDE
(VOICE1, 2PCB)
VR 101 :CH 1.CH 5DAC OFF SET ADJ
VR 201 :CH 2. CH 6DAC OFF SET ADJ
VR 301 :CH 3. CH 7DAC OFF SET ADJ
VR 401 :CH 4. CH 8DAC OFF SET ADJ
VR 102: CH 1.CH 5DAC MSB ADJ
VR 202: CH 2. CH 6DAC MSB ADJ
VR 302: CH 3. CH 7DAC MSB ADJ
VR 402: CH 4. CH 8DAC MSB ADJ
Fig. 3-3 View from right side
SERVICE MANUAL

3-3. HARDWARE TEST
THE HARDWARE TEST MODE
*This test mode is used for inspecting the unit.
[HOW TO SET THE HARDWARE TEST MODE]
1) Turn on the power, press the “MARK/#” and “NAME” buttons at the same time (all red indicators will light), then press
the “+/ <”button.
2) The following menu (refire to Fig. 3-4) will appear on the LC-display when the model S1 100 is set to the HARDWARE
TEST mode.
IHARDWARE TEST
ADJUST CLOCK RATE BEFORE SETTING
THE DAC/ADC TRIMS
[1 cpu][2wav][3dac][4of f][5adl][6adr][7adm][boot]
Fig. 3-4
[THE PROGRAM NUMBERS AND PROGRAM NAMES] [HOW TO RELEASE FROM THE HARDWARE TEST MODE]
PROG. No
S1 100 HARDWARE TEST
CONTENTS
CPU MEMORY TEST
WAVEFORM MEMORY TEST
NOT USED
NOT USED ~
LEFT ADC OFF-SET NULL
~
RIGHT ADC OFF-SET NULL
NOT USED
*During the HARDWARE TEST mode, press the “F8/H”
button.
*Although displayed,the contents are disregarded. Fig.3-5
3-3-1 .CPU MEMORY TEST
1) During the HARDWARE TEST mode, press the “FI /A” button. The following display will appear on the LC-display(refer
to Fig. 3-6).
HARDWARE TEST] 1. CPU MEMORY TEST
BANK DAT A>1514131211109 876543 210RESULT
1
2
[1 cpu][2wav][3dac][4of f][5adl][6adr][7adm][boot]
Fig. 3-6
2) Afew second later, the LC-display will show the message “OK” as in Fig. 3-7. If the message “OK” does not appear on
the LC-display, it means amalfunction in the memory circuit. In this case check the memory circuit and LSI.
HARDWARE TEST 1. CPU MEMORY TEST
BANK DATA>1 51 41 31 21 11098765432 10RESULT
1OK
2OK
[1 cpu][2wav][3dac][4of f][5adl][6adr][7adm][boot]
Fig. 3-7
SERVICE MANUAL

3-3-2. WAVEFORM MEMORY TEST
1) During the HARDWARE TEST mode, press the “F2/B” button. The following display will appear on the LC-display(refer
to Fig. 3-8).
2. WAVEFORM MEMORY TEST
BANK
1
2
3
4
DAT A>1514131211109 8765432 10RESULT
testing 35s e c
[1 cpu][2wav][3dac][4of f][5adl][6adr][7adm)[boot]
Fig. 3-8
2) After 35 seconds the LC-display will show the message as shown Fig. 3-9. If this message does not appear on the LC-
display, it means amalfunction in the waveform memory circuit. Check the waveform memory circuit and LSI.
2. WAVEFORM MEMORY TEST
BANK
1
2
3
4
DATA>1 5141 31 21 11098765432 10RESULT
OK
NO CARD?
NO CARD?
NO CARD?
[1 cpu][2wav][3dac][4of f][5adl][6adr][7adm][boot]
Fig. 3-9
3-3-3. ADC OFF-SET NULL CONFIRMATION
1) During the HARDWARE TEST mode, press the “F5/E” button. The following display will appear on the LC-display(refer
to Fig. 3-1 0).
5. LEFT ADC OFFSET NULL
SET MIN. REC. LEVEL, LOW GAIN, SHORT INPUTS
ADJUST LEFT INPUT OFFSET TRIM
TO ZERO THE OFFSET:- 0
i11
+1t
[1 cpu][2wav][3dac][4of f)[5adl][6adr][7adm][boot)
ARDWARE TEST
Fig. 3-10
2) Next, press the “F6/F” button. The following display will appear on the LC-display (refer to Fig. 3-1 1).
1HARDWARE TEST| 6. RIGHT ADC OFFSET NULL
SET MIN. REC. LEVEL, LOW GAIN, SHORT INPUTS
ADJUST RIGHT INPUT OFFSET TRIM
TO ZERO THE OFFSET:- 0
II1
+1t
[1 cpu][2wav][3dac][4of f][5adl][6adr][7adm][boot)
Fig. 3-1
1
•Although the display instruct to adjust the OFF-SET TRIM, this is confirmation only. No adjustment is necessary.
3-4. DAC OFF-SET ADJUSTMENT
(PRECAUTIONS BEFORE ADJUSTMENT)
•For connection of test equipment refer to Fig. 3-1
.
•Set the MAIN VOLUME to the maximum position.
•Set the REC LEVEL to the maximum position and the REC GAIN switch to the “MID” position.
•Let the unit warm up for at least 5minutes before proceeding with the following adjustments.
•Be sure to connect the plugs to the LCH and RCH outputs, otherwise L-R mixed output will be obtained from both
outputs.
SERVICE MANUAL
7

3-4-1. DAC OFF-SET ADJUSTMENT
1) After turning the unit on, press the EDIT SAMPLE button. Next use the DATA knob to select “SINE,” then press the
[REC 2] F3/C button. Connect the audio signal generator to the LEFT input and sample aIKHz sine wave. Adjust the
signal level so that the output is -6dBm. Select “tim: s” with the CURSOR knob, then select “10.00” with the DATA
knob. Next press the [ARM] F8/H button to sample a1KHz tone.
2) Press the EDIT PROGRAM button, then press the [KGRP] F2/B button. Select “change number of KEYGROUPS” with
the CURSOR knob, then select “12” with the +/< button. Next select “note on sample COHERENCE” with the CURSOR
knob and select “ON” with the DATA knob.
3) Press the [SLCT] FI /A button, then press the [OUT] F4/D button. Next select “loudness” with the CURSOR knob and
press the ENT/PLAY button. Set the DATA knob so that the output from OUTPUT (L CH, RCH) is +11 dBm. Select
“eft out” with the CURSOR knob, and 14% with the DATA knob only when adjusting the send level.
4) Press the ENT/PLAY button and adjust the VR101 (LEFT), VR201 (RIGHT) and VR301 (SEND) on the AD PCB so that
DISTORTION is less than 1%.
5) Select “mono out” with the CURSOR knob. Use the DATA knob to select channels between CH1-CH8 and adjust the
appropriate VR (refer to following list) so that the distortion of each channel is less than 1%.
On VOICE 1PCB:
VR101 (CH 1)
VR201 (CH 2)
VR301 (CH 3)
VR401 (CH 4)
On VOICE 2PCB:
VR101 (CH 5)
VR201 (CH 6)
VR301 (CH 7)
VR401 (CH 8)
3-4-2. DAC MSB ADJUSTMENT
1) Press the “MARK/#” and “NAME” buttons at the same time then press the “~/\> ”button to set the default values.
Press the EDIT SAMPLE button. Next use the DATA knob to select “SINE”, then press the [REC 2] F3/C button. Con-
nect the audio signal generator to the LEFT input and sample a100Hz sine wave. Adjust the signal level so that the
output is -20dBm. Select “tim: s” with the CURSOR knob, then select “10.00” with the DATA knob. Next press the
[ARM] F8/H button to sample a100Hz tone.
2) Press the EDIT PROGRAM button, then press the [OUT] F4/D button. Select “loudness” with the CURSOR knob and
press the ENT/PLAY button. Set the output to -60dBm with the DATA knob.
3) Adjust the VR102 (LEFT), VR202 (RIGHT), VR302 (SEND) on AD PCB so that the waveform becomes acontinuous
sine wave at -60dBm output level.
INCORRECT
iiCOmV Ptr.
AA
CORRECT
Fig. 3-12
4)
Select “mono out” with the CURSOR knob. Use the DATA knob to select channels between CH1-CH8 and adjust the
appropriate VR (refer to following list) so that the waveform of each channel becomes acontinuous sine wave at
-60dBm output level.
On VOICE 1PCB:
VR102 (CHI)
VR202 (CH2)
VR302 (CH3)
VR402 (CH4)
On VOICE 2PCB:
VR102 (CH5)
VR202 (CH6)
VR302 (CH7)
VR402 (CH8)
SERVICE MANUAL

IV. PARTS LIST
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.
HOW TO USE THIS PARTS LIST
1. This Parts List lists those parts which are considered necessary for repairs. Other common parts, such as resis-
tors and capacitors, are listed in the “Common List for Service Parts” from which these parts should be selected
and stocked.
2. The Recommended Spare Parts List shows those parts in the Parts List which are considered particularly import-
ant for service.
3. Parts not shown in the Parts List and “Common List for Service Parts” will not in principle be supplied.
4. How to read the Parts List.
a) Mechanism Block
2. HEAD BASE BLOCK
Ref.No. Part No. Description
1BH-T2023A320A HEAD BASE BLOCK
2HP-H2206A010A HEAD R/P PR4-8FU C
3ZS-477876 PAN20*03STL CMT
4ZS-536488 BID20*08STL CMT
5ZG-402895 SP CS ANGLE ADJUST
LSP (Service Parts) Classification
—This number corresponds with the individ
ual parts index number in that figure.
The available PC Board Blocks are listed separately.
b) PC Board
6. MAIN PC BOARD
Ref.No. Part No. Description
1C 1El-324536 1C HD14049BP
IC2 El-336801 1C MB8841-564M
CIA EC-338399 CMMY V223M 250AC [U,E,B,S]
Cl BEC-350949 CMMY V223M 250DC [J]
C1C EC-338397 CMMY V223M 125AC [C,A]
>a El-318384 OSC X’TAL NC-18C ~7
fSymbols for primary destination -
[A] :AAL (U.S.A) [S]
:
SAA (Australia)
[B] :BEAB (England) [U]
:
U/T (Universal Area)
[C] :CSA (Canada)
[E]
:
CEE (Europe) [V]
:
VDE (W. Germany)
[J]: JPN (Japan) [Y]
:
Custom Version
SP (Service Parts) Classification
These reference symbols correspond
with component symbols in the
Schematic Diagrams.
PARTS LIST
9

1.RECOMMENDED SPARE PARTS Ref.No.
We suggest you to stock the following Recommended
Spare Part items listed below since they can cover
most of the routine service.
Ref.No. Part No. Description
1BB-393291
J
FLOPPY DISK FD-235HF-270
2*BP-397454J SW POW PMC50E4XULA 100/200
3*BT-396271J TRANS POW S1 100(C,A)
4*BT-396272J TRANS POW S1 100(E,V,B,S)
5*BT-396269J TRANS POWSIIOO(J)
6ED-359863 DLED LN81 CV-(LF) AK ORANGE
7ED-330319 DSILICON DBA1 0B 100/1 .0A
8ED-389834J DSILICON DS135E-FB2 FI 2100/1
9ED-301911 DSILICON HDS448
10 ED-344280 DSILICON HGMA-01-FY2 F05
11 ED-378219 DETECTOR PC 6N137
12 *EF-358974 FUSE BET T250V 630MA
[B]
13 *EF-601964 FUSE SEMKO T250V 1.60A
[E,V,S]
14 *EF-601942 FUSE SEMKO T250V 630MA
[E,V,S]
15 *EF-306949 FUSE TSC A250V 1.25A
[J]
16 *EF-311839 FUSE TSC A250V 1.60A
[J]
17 *EF-309392 FUSE TSC125V1.25A
[A,C]
18 *EF-308847 FUSE TSC 125V 1.60A
[A,C]
19 EH-388603J COMP REXB-RA13 221
J
20 EH-388604J COMP REXB-RA13 331
J
21 EH-397281
J
FILTER EMI DSS306-54B 101M CUT
22 EH-397365J FILTER EMI DSS306-55B 221 MCUT
23 EH-397279J FILTER EMI DSS310-55B 101M CUT
24 EH-396514J FILTER LC LP 258BLV-5571
N
25 EI-396532J 1C ADR6021
26 EI-386308J 1C AK5326
27 EI-397343J 1C AM27C256-1 50DC
28 El-3891 42J 1C CD74AC541
E
29 EI-396535J 1C CD74AC573E
30 EI-388792J 1C CXD121 IP
31 El-386343
J
1C DSP56001 FE-20
32 EI-384770J 1C FLR-L6009
33 EI-396503J 1C HD63B03RP
34 El-389061 J1C HD74AC04P
35 El-396537
J
1C HD74AC08P
36 EI-396536J 1C HD74AC1 38P
37 EI-386293J 1C HD74AC1 39P
38 EI-386292J 1C HD74AC1 53P
39 EI-386290J 1C HD74AC157P
40 EI-389050J 1C HD74AC32P
41 El-38871 U1C HD74HC00P
42 EI-387934J 1C HD74HC04P
43 EI-386303J 1C HD74HC08P
44 E1-393703
J
1C HD74HC10P
45 EI-386289J 1C HD74HC138P
46 El-393701 J1C HD74HC1 39P
47 EI-397093J 1C HD74HC157P
48 El-39651 3J 1C HD74HC165P
49 El-39651 0J 1C HD74HC173P
50 EI-393699J 1C HD74HC195P
51 EI-393697J 1C HD74HC259P
52 EI-393700J 1C HD74HC279P
53 EI-388709J 1C HD74HC32P
54 EI-393698J 1C HD74HC365P
55 El-39651 2J 1C HD74HC368P
56 EI-396504J 1C HD74HC375P
57 EI-386295J 1C HD74HC541P
58 EI-388567J 1C HD74HC573P
59 EI-393702J 1C HD74HC595P
60 EI-387937J 1C HD74HC74P
61 El-386694
J
1C HM51 1000P-10S
62 El-360954 1C IR931
1
63 El-384771 J1C ITP-L6009
64 El-379461 1C LC3517ASL-15
65 El-378276 1C LC7981
66 El-396550
J
1C LM2940CT-1
2
67 EI-396559J 1C LM7912CT
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
Part No. Description
El-386331 J
EI-396533J
EI-379657J
EI-388602J
El-3561 60
El-360043
El-336995
El-39651 5J
El-360772
El-39651 7J
EI-400855J
El-368612
EI-397345J
EI-397344J
EI-396539J
El-364253
El-4021 27J
El-4021 28J
El-324691
EI-400750J
El-401 064J
EI-384806J
EI-372890J1
EI-384769J
El-379593
EI-386350J
El-396531 J
El-397589
J
EI-397590J
El-396541 J
EI-397320J
EI-384779J
EL-728382J
EM-38231 7J
EO-390188J
EQ-348929
ER-3251 14
ER-382385J
ER-367512
ER-397529J
ES-396542J
ES-365943
*ES-373020
*ES-384812J
ES-38481 1
J
ES-349474
ET-397160J
EV-384808J
1C MBM27C1 001 -20Z-G
[BLANK ROM]
1C MB81 C4256-1 0PSZ-G
1C MB89255A-P-G
1C MB89352-P-G
1C M5216P
1C M5220P
1C NJM78L05A
1C NJM78L06A
1C NJM79L05A
1C NJM79L06A
1C NJM79M05FA
1C PCM56P
1C PEEL1 8CV8PC-25 L6021 B
1C PEEL1 8CV8PC-25 L6021 C
1C PEEL1 8CV8PC-25S L6021
A
1C PST520D-2
1C SCOEF1 0-51 29753-004 LSB
1C SCOEF1 1-51 29753-005 MSB
1C TC4075BP
1C TC55257BSPL-85
1C TC74AC393P
1C TC74HC4053AP
1C TC74HC574AP
1C TE7730
1C UPD5200C
1C UPD7021 6GF-1 0-3B9
1C UPD72068GF-3B9
IC.MBM27C1 001 -20Z-G VI .01 -L
IC.MBM27C1 001 -20Z-G VI .01 -M
OSC X’TAL HC-49/U 32.000000MHZ
OSC X’TAL HC-49/US20.000000MHZ
OSC X’TAL TD308C 33.8688MHZ
EL BACK LIGHT
IND LCD EDM-MPJ2COW
TRANS PULSE CIT0723DIP-340B
RELAY SIG G5A-237P 2TR 12V
RCB HSI 0FS RDS 1/4W 330J
RCB HSI 2FS RDS 1/2W 100J
RCB HS12 FS RDS 1/2W 121
J
RFUSE HSI 2ERQ1 2AJ 1/2W 4R7J
SW DIP SLIDE SSGM14 1-4-2N
SW EWT-XDFK2550B
SW PUSH ESB-8283V
[J AC] [POWER SW]
SW PUSH SDDSA3 02-1
[E,V,B,S] [POWER SW]
SW SLIDE ESD-32243
[REC GAIN SW]
SW TACT SKHHAM004A
[SELECT PROG/1]
TR 2SC3330 R,S,T,U,V
VR ROTARY EWK-E9A027A14 A103X2
[REC VR]
2. P.C BOARD BLOCK
Ref.No. Part No. Description
1BA-L6021 A030A PC CPU BLK S1 100
2BA-L6021 A040A PC AD BLK SHOO
3BA-L6021 A050A PC VOICE1BLK S1 100
4BA-L6021 A060A PC VOICE2 BLK S1 100
5BA-L6021 A070A PC DSP BLK S1100
6BA-L6021 A080A PC PANEL BLK S1 100
7BA-L6021 A100A PC SMPTE BLK S1 100
8BA-L6021 A1 10A PC SCSI BLK S1 100
9A BA-L6021 A020A PC(#) FILT BLKS1100(J)
9B BA-L6021 A020B PC(#) FILT BLK SI 100(E)
10 BA-L6009A020A PC MEMORY BLK SI 000
PC (#) FILT BLK CONSISTS OF FOLLOWING P.C BOARD.
•POWER SUPPLY P.C BOARD
•REC GAIN P.C BOARD
•FILTER P.C BOARD
•DISPLAY VR P.C BOARD
•INPUT JACK P.C BOARD
•POWER SW P.C BOARD
•VR P.C BOARD
PARTS LIST
TO