AMD Richland User manual

“Richland” Client APU
PRAVEEN DONGARA, LLOYD BIRCHER, JOHN DARILEK
HOT CHIPS 25, AUGUST 2013
PRESENTER
PRAVEEN DONGARA
PRINCIPAL MEMBER OF TECHNICAL STAFF
SYSTEM ARCHITECT

2AMD “RICHLAND” APU | HOT CHIPS 25 | PRAVEEN DONGARA | AUGUST 2013
AGENDA
“Richland” Key Features
Overview of AMD Turbo CORE Technology
"Richland" Enhancements to AMD Turbo CORE Technology
Temperature-smart AMD Turbo CORE
Configurable TDP (cTDP)
Intelligent Boost
Additional boost Pstate
"Richland" Improvements to Battery Life
Other Salient Features
AMD Wireless Display
Dock Port Technology
Results: Performance and Battery Life

3AMD “RICHLAND” APU | HOT CHIPS 25 | PRAVEEN DONGARA | AUGUST 2013
"RICHLAND" KEY FEATURES
FLEXIBLE
DESIGN
OPTIONS
Motherboard compatibility with FS1r2, FM2 packages and FCH
Quick TTM, minimize development costs
Configurable TDP
Configure TDP of APU based on design needs
CAN ENABLE OEM FLEXIBILITY FOR 2013
MAINSTREAM SOCKETED PLATFORMS
ALLOWS OEM TO TAILOR THERMAL
DESIGNS BASED ON PLATFORM GOALS
IMPROVED
PERFORMANCE
& POWER
EFFICIENCY
Higher performance:* Up to 29% higher CPU performance and up to 41%
higher GPU performance
Higher frequencies than 2nd Gen A-Series APU (both x86 and GPU) through process
node improvements
New AMD Turbo CORE features
Temperature-smart AMD Turbo CORE, Intelligent Boost, addl. boost P-state
Higher memory speeds: Up to DDR3-1866 on NB and up to DDR3-2133 on DT
Better battery life:** 10 or more hours idle, 7 or more web, 4 or more video
Optimized voltage/frequency
Process-tuning
AMD Start Now technology++
Quick S3, S4 resume and WLAN quick connect
DESIGNED TO ENHANCE OVERALL
PERFORMANCE AND RESPONSIVENESS
WHILE EXTENDING BATTERY LIFE
PROVIDES TABLET-LIKE RESPONSIVENESS,
TAKING ADVANTAGE OF WINDOWS® 8
IMPROVEMENTS
ENHANCED
GRAPHICS AND
ENTERTAINMENT
Next-generation AMD media features
Wi-Fi standards-based wireless display
Dock Port technology
DELIVERING BEST VIDEO PLAYBACK
EXPERIENCE
New discrete graphics support
AMD Radeon™ Dual graphics*** with the “Solar System” family
Power-optimized for media consumption
Up to 51% improvement in HD video playback power**
UNIQUELY SCALABLE GRAPHICS
LEADERSHIP
WATCH MORE MOVIES ON ONE CHARGE
*Refer to slides 22-23 for performance results; **Refer to slide 24 for power results
++AMD Start Now technology is a BIOS optimized solution designed to deliver a highly responsive system by minimizing the time to wake up the system from sleep mode, boot the system to desktop and connect to a wireless local area network. Actual times will vary based on operating system, APU,
driver, disk drive and memory speed. AMD Start Now technology is available with select AMD APUs when running Windows® 7 or Windows® 8. Check with your component or system manufacturer or retailer for specific model capabilities.
***AMD Radeon™ Dual Graphics requires an AMD “A” Series APU plus an AMD Radeon™ discrete graphics configuration and is available on Windows® 7 and/or Windows 8 OS. Linux OS supports manual switching which requires restart of X-Server to engage and/or disengage the discrete graphics
processor for dual graphics capabilities. With AMD Radeon™ Dual Graphics, full enablement of all discrete graphics video and display features may not be supported on all systems and may depend on the master device to which the display is connected. AMD Radeon™ “G” series and AMD
Radeon™ “G2” Dual Graphics series don not support AMD Eyefinity technology. Check with your component or system manufacturer for specific mode capabilities and supported technologies.

4AMD “RICHLAND” APU | HOT CHIPS 25 | PRAVEEN DONGARA | AUGUST 2013
AMD TURBO CORE TECHNOLOGY
MOTIVATION
Workload1
APU
Pwr
APU Pwr 
APU
Pwr
APU
Pwr
Workload2 Workload3
APU Temp 
Die Temp
Without AMD Turbo CORE technology,
power and temperature headroom may be left untapped
in many workload scenarios.

5AMD “RICHLAND” APU | HOT CHIPS 25 | PRAVEEN DONGARA | AUGUST 2013
EVOLUTION OF AMD TURBO CORE TECHNOLOGY
Year
Processor
Boosting
decision
based on
Notes
2010
AMD Phenom™ II

Number of cores active

Single boost Pstate used if half or more cores are inactive

Coarse-grain power margin exploited
2011
1st-Generation
AMD A
-
Series APU

Calculated power

Unidirectional power transfer between thermal entities
GPUCPU

Exploit fine-grain power margin
2012
2nd-Generation
AMD A
-
Series APU

Calculated power

Calculated temperature

Bidirectional power transfer between thermal entities
GPUCPU
CPUGPU

Exploit temperature margin
2013
3rd-Generation
AMD A
-
Series APU
("Richland“)

Calculated power

Calculated temperature

Measured/Sensor temperature

Efficiency of power usage
by individual
entities (CPU, GPU, etc.)

Designed to more effectively exploit temperature margin
by detecting favorable thermal conditions in real time

6AMD “RICHLAND” APU | HOT CHIPS 25 | PRAVEEN DONGARA | AUGUST 2013
BUILDING BLOCKS OF AMD TURBO CORE TECHNOLOGY
THERMAL ENTITIES
•3 main thermal entities (TE)
•TE1: 1st x86 module + L2
•TE2: 2nd x86 module + L2
•TE3: Graphics + Northbridge + Multimedia
•On each TE
•Power and Temperature tracked
•Frequency and Voltage controlled
•Also account for I/O power influence on each of
the other TEs
"Richland" incorporates:
•Two “Piledriver” high-performance
x86 modules (core-pairs)
•2-MB shared L2 cache per x86
module
•AMD Radeon™ HD 8000 series
DirectX®11-capable GPU with six
compute units
•Next-generation media acceleration
technology
•Dual 64-bit memory channel
supporting up to DDR3-2133
•Integrated DisplayPort 1.2 interfaces
•PCI Express® I/O Generation 2
interfaces
"Richland" is implemented in a 32-nm
SOI node2+ high-K metal gate process
technology

7AMD “RICHLAND” APU | HOT CHIPS 25 | PRAVEEN DONGARA | AUGUST 2013
BUILDING BLOCKS OF AMD TURBO CORE TECHNOLOGY
POWER CALCULATION
Activity from Cac
Monitors Power Calculation
Cac * V2* F + Static
Cac = Σweighti * Activityi
Static = Fn(V,T)
Freq
V
Tcalc
P
calculated

8AMD “RICHLAND” APU | HOT CHIPS 25 | PRAVEEN DONGARA | AUGUST 2013
BUILDING BLOCKS OF AMD TURBO CORE TECHNOLOGY
TEMPERATURE CALCULATION
Temp. Calculation
PcalcTemp
+
Worst-case ambient temp
+
Additional offsets
(to account for I/O power, etc.)
Temp.
from other TEs
P
calculated T
calculated
RC MODEL
Using calculated temperature in the AMD Turbo CORE
algorithm is designed to enable AMD to deliver robust,
dependable, and repeatable performance that is
insensitive to part variations.
RC MODEL represents
•Cooling solution (APU heat sink, fan, etc.)
•Temperature influence of other TEs

9AMD “RICHLAND” APU | HOT CHIPS 25 | PRAVEEN DONGARA | AUGUST 2013
BUILDING BLOCKS OF AMD TURBO CORE TECHNOLOGY
PSTATE SELECTION
Tcalc <> Max
Temp.?
Limit
Pboost0
P0
P1
P2
P3
Pmin
...
Pboost1
T
calculated Pstates
Discrete frequency and
voltage operating points
If Tcalc < Limit
Step up a Pstate
(i.e., raise F,V)
If Tcalc > Limit
Step down a Pstate
(i.e., lower F,V)

10AMD “RICHLAND” APU | HOT CHIPS 25 | PRAVEEN DONGARA | AUGUST 2013
AMD TURBO CORE CONTROL LOOPS
PUTTING THE PIECES TOGETHER
Cac
Power Calculation
Freq
V
Tcalc
Temp. Calculation
Temp.
from other
TEs
P
calculated Tcalc <> Max
Temp.?
Limit
Pboost0
P0
P1
P2
P3
Pmin
..
.
Pboost1
T
calculated
Check
against
current (EDC/TDC)
And other
limits
If limits
encroached,
throttle F and V
New Operating F, V
Loop executed
at a specific
interval
Control Loop (similar to above)
Control Loop (similar to above)