AMD 780E Product manual

AMD 780E
Databook
Technical Reference Manual
Rev. 3.10
P/N: 45732_rs780e_ds_pub
© 2009 Advanced Micro Devices, Inc.

Please note that in this databook, references to "DVI" and "HDMI" refer to the capability of the TMDS interface, multiplexed on the PCI-E external graphics interface, to enable
DVI or HDMI through passive enabling circuitries. Any statement in this databook on any DVI or HDMI-related functionality must be understood in that context.
Advanced Micro Devices, Inc., will not provide any indemnity, pay any royalty, nor provide any license/sublicense to any:
(a) Intellectual property rights relating to any of the following: (i) Macrovision for its Analog Protection System ("APS") technologies; (ii) Advanced Television Systems
Committee (ATSC) standard and related technologies; or (iii) the High Definition Multimedia Interface (HDMI) standard and related technologies; or
(b) Audio and/or video codecs or any industry standard technology (e.g., technology or specifications promulgated by any standards development organization, consortium,
trade association, special interest group or like entity).
This device is protected by U.S. patent numbers 5,583,936; 6,516,132; 6,836,549; and 7,050,698 and other intellectual property rights. The use of Macrovision's copy protection
technology in the device must be authorized by Macrovision and is intended for home and other limited pay-per-view uses only, unless otherwise authorized in writing by
Macrovision. Reverse engineering or disassembly is prohibited.
This device may only be sold or distributed to: (i) a Macrovision Authorized Buyer, (ii) a customer (PMA Customer) who has executed a Proprietary Materials Agreement
(PMA) with Macrovision that is still in effect, (iii) a contract manufacturer approved by Macrovision to purchase this device on behalf of a Macrovision Authorized Buyer or
a PMA Customer, or (iv) a distributor who has executed a Macrovision-specified distribution agreement with ATI.
Trademarks
AMD, the AMD Arrow logo, AMD Athlon, and combinations thereof, ATI, ATI logo, ATI Radeon, ATI Avivo, PowerPlay, PowerShift, PowerXpress, ATI HyperMemory,
3Dc, Cool'n'Quiet, AMD OverDrive, and AMD PowerNow! are trademarks of Advanced Micro Devices, Inc.
DisplayPort is a trademark of VESA.
HDMI, the HDMI Logo and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC.
HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.
I2C is a trademark of Philips.
Linux is a registered trademark of Linus Torvalds.
Macrovision is a registered trademark of Macrovision Corporation in the United States and/or other countries.
Microsoft, Windows, Windows Vista, DirectDraw, and DirectX are registered trademarks of Microsoft Corporation.
OpenGL is a registered trademark of SGI.
PCI Express is a registered trademark of PCI-SIG.
WinBench is a registered trademark of Ziff Davis, Inc.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
Disclaimer
The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with respect
to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.
No license, whether express, implied, arising by estoppel, or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD's Standard
Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the
implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
AMD's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications
intended to support or sustain life, or in any other application in which the failure of AMD's product could create a situation where personal injury, death, or severe property or
environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice.
© 2009 Advanced Micro Devices, Inc. All rights reserved.

© 2009 Advanced Micro Devices, Inc. AMD 780E Databook 3.10
Proprietary Table of Contents-1
Table of Contents
Chapter 1: Overview
1.1 Introducing the AMD 780E ................................................................................................................................................1-1
1.2 RS780E Features.................................................................................................................................................................1-2
1.2.1 CPU HyperTransport™ Interface.........................................................................................................................1-2
1.2.2 Memory Interface .................................................................................................................................................1-2
1.2.3 ATI HyperMemory™...........................................................................................................................................1-2
1.2.4 PCI Express® Interface ........................................................................................................................................1-3
1.2.5 A-Link Express II Interface..................................................................................................................................1-4
1.2.6 2D Acceleration Features .....................................................................................................................................1-4
1.2.7 3D Acceleration Features .....................................................................................................................................1-4
1.2.8 Motion Video Acceleration Features....................................................................................................................1-5
1.2.9 Multiple Display Features ....................................................................................................................................1-5
1.2.10 Integrated LVDS/TMDS (LVTM) Interface ........................................................................................................1-7
1.2.11 DVI/HDMI™ .......................................................................................................................................................1-7
1.2.12 DisplayPort™ Interface........................................................................................................................................1-7
1.2.13 Integrated HD Audio Controller and Codec.........................................................................................................1-8
1.2.14 Clock Generation..................................................................................................................................................1-8
1.2.15 Power Management Features ...............................................................................................................................1-8
1.2.16 PC Design Guide Compliance..............................................................................................................................1-8
1.2.17 Test Capability Features .......................................................................................................................................1-9
1.2.18 Additional Features ..............................................................................................................................................1-9
1.2.19 Packaging .............................................................................................................................................................1-9
1.3 Software Features................................................................................................................................................................1-9
1.4 Branding Diagram.............................................................................................................................................................1-10
1.5 Graphics Device ID and Graphics Engine Clock Speed...................................................................................................1-10
1.6 Conventions and Notations ...............................................................................................................................................1-10
1.6.1 Pin Names...........................................................................................................................................................1-10
1.6.2 Pin Types ............................................................................................................................................................1-10
1.6.3 Numeric Representation ..................................................................................................................................... 1-11
1.6.4 Register Field...................................................................................................................................................... 1-11
1.6.5 Hyperlinks .......................................................................................................................................................... 1-11
1.6.6 Acronyms and Abbreviations ............................................................................................................................. 1-11
Chapter 2: Functional Descriptions
2.1 Host Interface ......................................................................................................................................................................2-1
2.2 Side-Port Memory Interface................................................................................................................................................2-3
2.2.1 DDR2 Memory Interface......................................................................................................................................2-3
2.2.1.1 Supported DDR2 Components 4
2.2.1.2 Row and Column Addressing 4
2.2.2 DDR3 Memory Interface......................................................................................................................................2-5
2.2.2.1 Supported DDR3 Components 5
2.2.2.2 Row and Column Addressing 5
2.3 LVTM (LVDS/TMDS) Interface........................................................................................................................................2-6
2.4 LVDS ..................................................................................................................................................................................2-7
2.4.1 LVDS Data Mapping............................................................................................................................................2-7
2.4.2 LVDS Spread Spectrum .....................................................................................................................................2-12
2.5 DVI/HDMI™....................................................................................................................................................................2-13
2.5.1 DVI/HDMI™ Data Transmission Order and Signal Mapping ..........................................................................2-13

AMD 780E Databook 3.10 © 2009 Advanced Micro Devices, Inc.
Table of Contents-2 Proprietary
Table of Contents
2.5.2 Support for HDMI™ Packet Types................................................................................................................... 2-16
2.6 VGA DAC Characteristics ............................................................................................................................................... 2-17
2.7 DVI-I Support .................................................................................................................................................................. 2-18
2.8 Clock Generation.............................................................................................................................................................. 2-18
Chapter 3: Pin Descriptions and Strap Options
3.1 Pin Assignment Top View ................................................................................................................................................. 3-2
3.1.1 RS780E Pin Assignment Top View .................................................................................................................... 3-2
3.2 Interface Block Diagram .................................................................................................................................................... 3-4
3.3 CPU HyperTransport™ Interface ...................................................................................................................................... 3-5
3.4 Side-port Memory Interface ............................................................................................................................................... 3-5
3.5 PCI Express® Interfaces .................................................................................................................................................... 3-6
3.5.1 1 x 16 or 2 x 8 Lane Interface for External Graphics .......................................................................................... 3-6
3.5.2 A-Link Express II Interface for Southbridge....................................................................................................... 3-6
3.5.3 6 x 1 Lane Interface for General Purpose External Devices .............................................................................. 3-6
3.5.4 Miscellaneous PCI Express® Signals ................................................................................................................. 3-6
3.6 Clock Interface ................................................................................................................................................................... 3-7
3.7 CRT Interface ..................................................................................................................................................................... 3-7
3.8 LVTM Interface ................................................................................................................................................................. 3-8
3.8.1 LVTM Interface in LVDS Mode......................................................................................................................... 3-8
3.8.2 LVTM Interface in TMDS Mode ........................................................................................................................ 3-9
3.9 TMDS Interface Multiplexed on the PCI Express® Graphics Lanes .............................................................................. 3-10
3.10 DisplayPort™ Interface.................................................................................................................................................. 3-10
3.11 Power Management Pins................................................................................................................................................3-11
3.12 Miscellaneous Pins ......................................................................................................................................................... 3-12
3.13 Power Pins...................................................................................................................................................................... 3-12
3.14 Ground Pins.................................................................................................................................................................... 3-13
3.15 Strapping Options........................................................................................................................................................... 3-14
Chapter 4: Timing Specifications
4.1 HyperTransportTM Bus Timing ........................................................................................................................................ 4-1
4.2 HyperTransportTM Reference Clock Timing Parameters ................................................................................................. 4-1
4.3 PCI Express® Differential Clock AC Specifications......................................................................................................... 4-2
4.4 Timing Requirements for REFCLK_P Used as OSCIN (14.3181818MHz) ..................................................................... 4-2
4.5 Side-port Memory Timing for DDR2 Mode...................................................................................................................... 4-2
4.5.1 Read Cycle DQ/DQS Delay ................................................................................................................................4-2
4.5.2 Write Cycle DQ/DQS Delay ............................................................................................................................... 4-3
4.6 LVDS Timing..................................................................................................................................................................... 4-3
4.7 Power Rail Power-up Sequence ......................................................................................................................................... 4-4
4.8 LCD Panel Power Up/Down Timing ................................................................................................................................. 4-5
Chapter 5: Electrical Characteristics and Physical Data
5.1 Electrical Characteristics.................................................................................................................................................... 5-1
5.1.1 Maximum and Minimum Ratings........................................................................................................................ 5-1
5.1.2 DC Characteristics............................................................................................................................................... 5-2
5.2 RS780E Thermal Characteristics ....................................................................................................................................... 5-7
5.2.1 RS780E Thermal Limits ...................................................................................................................................... 5-7
5.2.2 Thermal Diode Characteristics ............................................................................................................................ 5-8

Table of Contents
© 2009 Advanced Micro Devices, Inc. AMD 780E Databook 3.10
Proprietary Table of Contents-3
5.3 Package Information ...........................................................................................................................................................5-9
5.3.1 Physical Dimensions ............................................................................................................................................5-9
5.3.2 Pressure Specification ........................................................................................................................................5-10
5.3.3 Board Solder Reflow Process Recommendations .............................................................................................. 5-11
5.3.3.1 Stencil Opening Size for Solder Paste Pads on PCB 11
5.3.3.2 Reflow Profile 11
Chapter 6: Power Management and ACPI
6.1 ACPI Power Management Implementation ........................................................................................................................6-1
6.2 Power Management for the Graphics Controller ................................................................................................................6-2
6.2.1 PCI Function Power States...................................................................................................................................6-2
6.2.2 PCI Power Management Interface........................................................................................................................6-2
6.2.3 Capabilities List Data Structure in PCI Configuration Space ..............................................................................6-2
6.2.4 Register Block Definition.....................................................................................................................................6-3
6.2.5 Capability Identifier: CAP_ID (Offset = 0) .........................................................................................................6-4
6.2.6 Next Item Pointer (Offset = 1) .............................................................................................................................6-5
6.2.7 PMC - Power Management Capabilities (Offset = 2) ..........................................................................................6-6
Chapter 7: Testability
7.1 Test Capability Features......................................................................................................................................................7-1
7.2 Test Interface.......................................................................................................................................................................7-1
7.3 XOR Test ............................................................................................................................................................................7-1
7.3.1 Description of a Generic XOR Tree.....................................................................................................................7-1
7.3.2 Description of the RS780E XOR Tree .................................................................................................................7-2
7.3.3 XOR Tree Activation ...........................................................................................................................................7-2
7.3.4 XOR Tree for the RS780E ...................................................................................................................................7-2
7.4 VOH/VOL Test...................................................................................................................................................................7-4
7.4.1 Description of a Generic VOH/VOL Tree ...........................................................................................................7-4
7.4.2 VOH/VOL Tree Activation ..................................................................................................................................7-5
7.4.3 VOH/VOL Pin List...............................................................................................................................................7-6
Appendix A: Pin Listings
A.1 RS780E Pin List Sorted by Ball Reference........................................................................................................................1-2
A.2 RS780E Pin List Sorted by Pin Name................................................................................................................................1-7
Appendix B: Revision History

AMD 780E Databook 3.10 © 2009 Advanced Micro Devices, Inc.
Table of Contents-4 Proprietary
Table of Contents
This page is left blank intentionally.

© 2009 Advanced Micro Devices, Inc. AMD 780E Databook 3.10
Proprietary List of Figures-1
List of Figures
Figure 1-1: Possible Configurations for the x16 PCI-E Graphics Interface .................................................................................. 1-3
Figure 1-2: RS780E Multiple Display Options .............................................................................................................................. 1-6
Figure 1-3: RS780E ASIC A13 Production Branding ................................................................................................................. 1-10
Figure 2-1: RS780E Internal Block Diagram ................................................................................................................................. 2-1
Figure 2-2: Host Interface Block Diagram ..................................................................................................................................... 2-2
Figure 2-3: RS780E Host Bus Interface Signals ............................................................................................................................ 2-3
Figure 2-4: RS780E Side-Port Memory Interface .......................................................................................................................... 2-4
Figure 2-5: LVTM Interface of the RS780E ................................................................................................................................. 2-6
Figure 2-6: Single/Dual Channel 18-bit LVDS Data Transmission Ordering ............................................................................... 2-7
Figure 2-7: Single/Dual Channel 24-bit LVDS Data Transmission Ordering ............................................................................. 2-10
Figure 2-8: Data Transmission Ordering for the TMDS Interfaces ............................................................................................. 2-13
Figure 2-9: Pins for Analog Output on the DVI-I Connector ...................................................................................................... 2-18
Figure 3-1: RS780E Pin Assignment Top View (Left) .................................................................................................................. 3-2
Figure 3-2: RS780E Pin Assignment Top View (Right) ................................................................................................................ 3-3
Figure 3-3: RS780E Interface Block Diagram ............................................................................................................................... 3-4
Figure 4-1: RS780E Power Rail Power-up Sequence .................................................................................................................... 4-4
Figure 4-2.: LCD Panel Power Up/Down Timing ......................................................................................................................... 4-5
Figure 5-1: DC Characteristics of the TMDS Interfaces ................................................................................................................ 5-5
Figure 5-2: DC Characteristics of the LVDS Interface .................................................................................................................. 5-6
Figure 5-1: RS780E 528-Pin FCBGA Package Outline ................................................................................................................ 5-9
Figure 5-2: RS780E Ball Arrangement (Bottom View) ............................................................................................................... 5-10
Figure 5-3: Recommended Stencil Opening Sizes for Solder Paste Pads on PCB ...................................................................... 5-11
Figure 5-4: RoHS/Lead-Free Solder (SAC305/405 Tin-Silver-Copper) Reflow Profile ............................................................ 5-12
Figure 6-1: Linked List for Capabilities ......................................................................................................................................... 6-5
Figure 7-1: Example of a Generic XOR Tree ................................................................................................................................7-2
Figure 7-2: Sample of a Generic VOH/VOL Tree ......................................................................................................................... 7-5

AMD 780E Databook 3.10 © 2009 Advanced Micro Devices, Inc.
List of Figures-2 Proprietary
List of Figures
This page is left blank intentionally.

© 2009 Advanced Micro Devices, Inc. AMD 780E Databook 3.10
Proprietary List of Tables-1
List of Tables
Table 1-1: Possible Configurations for the PCI-E General Purpose Links .....................................................................................1-3
Table 1-2: Graphics Device ID and Graphics Engine Clock Speed .............................................................................................1-10
Table 1-3: Pin Type Codes ............................................................................................................................................................1-10
Table 1-4: Acronyms and Abbreviations ......................................................................................................................................1-11
Table 2-1: Supported DDR2 Components ......................................................................................................................................2-4
Table 2-2: DDR2 Memory Row and Column Addressing ..............................................................................................................2-4
Table 2-3: Supported DDR3 Components ......................................................................................................................................2-5
Table 2-4: DDR3 Memory Row and Column Addressing ..............................................................................................................2-5
Table 2-5: LVDS 18-bit TFT Single Pixel per Clock (Single Channel) Signal Mapping ..............................................................2-8
Table 2-6: LVDS 18-bit TFT Dual Pixel per Clock (Dual Channel) Signal Mapping ...................................................................2-9
Table 2-7: LVDS 24-bit TFT Single Pixel per Clock (Single Channel) Signal Mapping ............................................................2-11
Table 2-8: LVDS 24-bit TFT Dual Pixel per Clock (Dual Channel) Signal Mapping .................................................................2-12
Table 2-9: Single Link Signal Mapping for DVI/HDMI™ .........................................................................................................2-14
Table 2-10: Dual-Link Signal Mapping for DVI ..........................................................................................................................2-15
Table 2-11: Support for HDMI™ Packet Type .............................................................................................................................2-16
Table 2-12: VGA DAC Characteristics ........................................................................................................................................2-17
Table 3-1: CPU HyperTransport™ Interface ..................................................................................................................................3-5
Table 3-2: Side-Port Memory Interface ..........................................................................................................................................3-5
Table 3-3: 1 x 16 or 2 x 8 Lane PCI Express® Interface for External Graphics ............................................................................3-6
Table 3-4: 1 x 4 Lane A-Link Express II Interface for Southbridge ...............................................................................................3-6
Table 3-5: 6 x 1 Lane PCI Express® Interface for General Purpose External Devices ..................................................................3-6
Table 3-6: PCI Express® Interface for Miscellaneous PCI Express® Signals ...............................................................................3-6
Table 3-7: Clock Interface ...............................................................................................................................................................3-7
Table 3-8: CRT Interface ................................................................................................................................................................3-7
Table 3-9: .......................................................................................................................................................................................3-8
Table 3-10: LVTM Interface in TMDS Mode ................................................................................................................................3-9
Table 3-11: TMDS Interface Multiplexed on the PCI Express® Graphics Interface ...................................................................3-10
Table 3-12: DisplayPort™ Interface Multiplexed on the PCI Express® Graphics Interface .......................................................3-11
Table 3-13: Power Management Pins ...........................................................................................................................................3-11
Table 3-14: Miscellaneous Pins ....................................................................................................................................................3-12
Table 3-15: Power Pins .................................................................................................................................................................3-12
Table 3-16: Ground Pins ...............................................................................................................................................................3-13
Table 3-17: Strap Definitions for the RS780E ..............................................................................................................................3-15
Table 4-1: Timing Requirements for HyperTransport Reference Clock (100MHz) Output by the Clock Generator ....................4-1
Table 4-2: PCI-E Differential Clock (GFX_REFCLK, GPPSB_REFCLK, 100MHz) AC Characteristics ...................................4-2
Table 4-3: Timing Requirements for REF_CLKP Used as OSCIN (14.3181818MHz) .................................................................4-2
Table 4-4: Timing Requirements for the LVTM Interface in LVDS Mode ...................................................................................4-3
Table 4-5: RS780E Power Rail Power-up Sequence ......................................................................................................................4-4
Table 4-6: LCD Power Up/Down Timing .......................................................................................................................................4-5
Table 5-1: Maximum and Minimum Ratings ..................................................................................................................................5-1
Table 5-2: DC Characteristics for 3.3V TTL Signals .....................................................................................................................5-2
Table 5-3: DC Characteristics for DDC Signals (DDC Mode) .......................................................................................................5-2
Table 5-4: DC Characteristics for AUX Signals (AUX Mode) ......................................................................................................5-2
Table 5-5: DC Characteristics for POWERGOOD .........................................................................................................................5-3
Table 5-6: DC Characteristics for HyperTransport™ and PCI-E Differential Clock (HT_REFCLK, GFX_REFCLK,
GPPSB_REFCLK, 100MHz) ..........................................................................................................................................................5-3
Table 5-7: DC Characteristics for REFCLK_P Input for OSCIN (14.3181818MHz) ....................................................................5-3
Table 5-8: DC Characteristics for the Memory Interface when Supporting DDR2 ........................................................................5-3
Table 5-9: DC Characteristics for the Memory Interface when Supporting DDR3 ........................................................................5-4
Table 5-10: DC Characteristics for the LVTM Interface in TMDS Mode .....................................................................................5-4
Table 5-11: DC Characteristics for the TMDS Interface Multiplexed on the PCI-E Gfx Lanes ....................................................5-5
Table 5-12: Electrical Requirements for the LVTM Interface in LVDS Mode ..............................................................................5-6

AMD 780E Databook 3.10 © 2009 Advanced Micro Devices, Inc.
List of Tables-2 Proprietary
List of Tables
Table 5-13: Electrical Specifications for the DisplayPort™ Interface ...........................................................................................5-7
Table 5-14: RS780E Thermal Limits ..............................................................................................................................................5-7
Table 5-15: RS780E 528-Pin FCBGA Package Physical Dimensions ...........................................................................................5-9
Table 5-16: Recommended Board Solder Reflow Profile - RoHS/Lead-Free Solder ..................................................................5-12
Table 6-1: ACPI States Supported by the RS780E .........................................................................................................................6-1
Table 6-2: ACPI Signal Definitions ................................................................................................................................................6-1
Table 6-3: Standard PCI Configuration Space Header Type 0 .......................................................................................................6-2
Table 6-4: PCI Status Register ........................................................................................................................................................6-3
Table 6-5: Capabilities Pointer (CAP_PTR) ...................................................................................................................................6-3
Table 6-6: Power Management Register Block ..............................................................................................................................6-3
Table 6-7: Power Management Control/Status Register (PMCSR) ................................................................................................6-4
Table 6-8: Capability Identifier (CAP_ID) .....................................................................................................................................6-4
Table 6-9: Next Item Pointer (NEXT_ITEM_PTR) .......................................................................................................................6-5
Table 6-10: Power Management Capabilities – PMC .....................................................................................................................6-6
Table 7-1: Pins on the Test Interface ..............................................................................................................................................7-1
Table 7-2: Example of an XOR Tree ..............................................................................................................................................7-2
Table 7-3: RS780E XOR Tree ........................................................................................................................................................7-3
Table 7-4: Truth Table for the VOH/VOL Tree Outputs ................................................................................................................7-5
Table 7-5: RS780E VOH/VOL Tree ...............................................................................................................................................7-7

© 2009 Advanced Micro Devices, Inc. 45732 AMD 780E Databook 3.10
Proprietary 1-1
Chapter 1
Overview
1.1 Introducing the AMD 780E
The AMD 780E (referred to in this document by its codenmae “RS780E”) is an eighth generation Integrated Graphics
Processor (IGP) that integrates a DirectX®10 compliant Shader Model 4.0 graphics core and a system controller in a
single chip. It supports AMD Athlon™ single-core and AMD Athlon X2 dual-core processors, AMD Sempron™
processors, and AMD Turion™ 64 X2 dual-core mobile technology. The RS780E integrates an ATI M72-based graphics
engine, dual display, an LVDS interface, internal or external TMDS, DisplayPort™ capability, and Northbridge
functionality in a single BGA package. This high level of integration and scalability enables manufacturers to offer
enthusiast level capabilities and performance while minimizing board space and system cost.
Robust and Flexible Core Logic Features
The RS780E combines graphics and system logic functions in a single chip using a 21mm body BGA package, reducing
overall solution area. For optimal system and graphics performance, the RS780E supports a high speed HyperTransport™
interface to the AMD processor, running at a data rate of up to 4.4GT/s and supporting both HT 1.0 and HT 3.0 protocols.
The RS780E is ideally suited for 64-bit operating systems, and supports platform configurations with greater than 4GB of
system memory. The rich PCI Express®expansion capabilities of RS780E include support for one x16 or two x8 PCI
Express external graphics controllers and up to six other PCI Express peripherals (up to seven when using only 8 lanes for
external graphics, or up to eight when not using external graphics), all supporting the PCI Express 2.0 standard with data
rates of up to 5.0GT/s. These capabilities are complemented by the advanced I/O features of AMD’s SB710 Southbridge.
Best for Windows Vista®
The RS780E delivers an unmatched Windows Vista®experience. It harnesses the increased bandwidth of HyperTransport
3.0 to a DirectX 10 graphics core, which provides the 3D rendering power needed to generate the Windows Vista desktop
even under the most demanding circumstances. The ATI M72-based graphics core employs a unified shader architecture
to deliver optimal 3D performance across the whole spectrum of 3D applications. This future-proof core ensures
compatibility with both current and upcoming 3D applications, and meets Windows Vista Premium Logo requirements
through 2008 and beyond.
Leading Multimedia Capabilities
The RS780E incorporates AMD’s Unified Video Decoder (UVD) technology, which provides dedicated hardware decode
of the H.264, VC-1, and MPEG-2 video formats used in HD DVD and for Blu-ray disks. The RS780E also incorporates
the innovative ATI Avivo™* display architecture, providing users with visual quality which is second to none. Advanced
scaling and color correction capabilities, along with increased precision through the entire display pipeline, ensure an
optimal image on CRT monitors, LCD panels, and any other display device. Dual DisplayPort output capability provides
the ability to interface to the next generation of digital display devices. That is complemented by two integrated TMDS
interfaces, configurable to enable DVI/HDMI™ and support HDCP, allowing compatibility with even the most modern
high definition televisions without the additional cost of external components.
*Note: ATI Avivo™ is a technology platform that includes a broad set of capabilities offered by certain ATI Radeon™
products. Full enablement of some ATI Avivo™ capabilities may require complementary products.
Low Power Consumption and Industry Leading Power Management
The RS780E is manufactured using the power efficient nm technology, and it supports a whole range of industry
standards and new proprietary power management features. In addition to comprehensive support for the ACPI
specification, the exclusive ATI PowerPlay™ technology (enhanced with new adaptive frame buffer compression and ATI
PowerShift™ features) minimizes the RS780E's power consumption by adjusting graphics core performance and core
voltage to the task and usage environment. System power can be further reduced through the dedicated local frame buffer
interface supported by the RS780E. The integrated UVD dramatically reduces CPU loading and hence overall power
consumption during HD video playback.

45732 AMD 780E Databook 3.10 © 2009 Advanced Micro Devices, Inc.
1-2 Proprietary
RS780E Features
Software Compatibility
The graphics driver for the RS780E is fully compatible with all other Radeon class graphics controllers from AMD. A
single driver can support multiple graphics configurations across AMD’s product lines, including the Radeon family and
the AMD chipset family. In addition, this driver compatibility allows the RS780E to benefit immediately from AMD's
software optimization and from the advanced Windows®XP, Windows Vista®, and Linux®support available in the
Radeon family drivers.
1.2 RS780E Features
1.2.1 CPU HyperTransport™Interface
•Supports 16-bit up/down HyperTransport (HT) 3.0 interface up to 4.4GT/s.
•Supports 200, 400, 600, 800, and 1000MHz HT1 frequencies.
•Supports 1.8, 2.0, and 2.2 GHz HT3 frequencies.
•Supports AMD Athlon single-core and AMD Athlon X2 dual-core processors, AMD Sempron processors, and AMD
Turion 64 X2 dual-core mobile technology.
•Supports power saving features as specified in section 8.6.1 of the HyperTransport I/O Link Specification Rev 3.00a,
including:
•Dynamic link configuration
•Dynamic link disconnection
•Dynamic link width
•Dynamic link frequency
•Disconnected link refresh (HT3 only)
•Inactive link refresh (HT3 only)
•Supports LDTSTOP interface and CPU link frequency throttling and stutter mode.
1.2.2 Memory Interface
•Supports an optional dedicated local frame buffer (side-port) of up to 128MB through a 16-bit interface. Note,
however, that the memory interface is optimized for a 64MB local frame buffer.
•New highly flexible memory architecture allows asymmetric side-port and shared system memory frame buffer sizes.
Supported configurations include UMA only and UMA+side-port (interleave mode).
•New dynamic memory allocation scheme improves performance and reduces power simultaneously.
•Support for DDR2 memories up to DDR2-800, with a maximum memory clock speed of 400MHz. Memory clock is
independent of any other clock source and can therefore be set to any frequency equal to or less than 400MHz
(DDR2-800), allowing the use of lower speed side-port memories.
•Support for DDR3 memories up to DDR3-800, with a maximum memory clock speed of 400MHz (up to
DDR3-1200, with a maximum memory clock speed of 600MHz, when the core voltage is fixed at 1.1V). Memory
clock is independent of any other clock source and can therefore be set to any frequency equal to or less than the
maximum limit, allowing the use of lower speed side-port memories.
•Support one memory device of x16 width (see section 2.2.1.1, “Supported DDR2 Components,” on page 2-4.and
section 2.2.2.1, “Supported DDR3 Components,” on page 2-5, for details).
•Asynchronous HyperTransport and memory controller interface speeds.
•Supports DDR SDRAM self refresh mechanism.
•Supports dynamic CKE and ODT for power conservation.
1.2.3 ATI HyperMemory™
•Supports ATI HyperMemory™*.

RS780E Features
© 2009 Advanced Micro Devices, Inc. 45732 AMD 780E Databook 3.10
Proprietary 1-3
* Note: Includes dedicated and shared memory. The amount of HyperMemory available is determined by various factors.
For details, please consult your AMD CSS representative.
1.2.4 PCI Express®Interface
•Supports PCI-E Gen2 (version 2.0).
•Optimized peer-to-peer and general purpose link performance.
•Highly flexible PCI Express implementation to suit a variety of platform needs.
•A dual-port, x16 graphics interface, configurable to any one of the modes illustrated in Figure 1-1:
Figure 1-1 Possible Configurations for the x16 PCI-E Graphics Interface
•Supports programmable lane reversal for the graphics link to ease motherboard layout when the end device does not
support lane reversal.
•Supports six general purpose lanes, for up to six devices on specific ports. Possible configurations are listed in
Table 1-1.
Table 1-1 Possible Configurations for the PCI-E General Purpose Links
Config. B Config. C Config. C2 Config. E Config. K Config. L
GPP1 x4 x4 x2 x2 x2 x1
GPP2-----x1
GPP3 - - x2 x1 x2 x1
GPP4---x1-x1
GPP5 x2 x1 x2 x1 x1 x1
GPP6 - x1 - x1 x1 x1
01 32 456789101112131415
PCI-E x16
PCI-E x 8 External Graphics
DL- DVI
PCI-E x 16 External Graphics
TMDS enabling Dual-Link
DVI(DL- DVI)
LEGEND
Not Used
TMDS enabling Single- Link
DVI(SL- DVI)
DisplayPort (DP)
TMDS enabling HDMI
PCI-E x 16 Interface
HDMI
SL-DVI
Not Used
DP
DP
Not Used
SL-DVI Not Used
HDMI Not Used
DP Not Used
DL-DVI PCI-E x8
SL-DVIHDMI PCI-E x8
PCI-E x8
DPDP
HDMI Not Used
DP Not Used
SL-DVI Not Used PCI-E x8
PCI-E x8
PCI-E x8
DP Not Used
DP Not Used
HDMI
HDMI
PCI-E x8PCI-E x8

45732 AMD 780E Databook 3.10 © 2009 Advanced Micro Devices, Inc.
1-4 Proprietary
RS780E Features
•Supports x1, x2, x4, x8, x12 and x16 polarity inversion.
1.2.5 A-Link Express II Interface
•One x4 A-Link Express II interface for connection to an AMD Southbridge. The A-Link Express II is a proprietary
interface developed by AMD basing on the PCI Express Gen2 version 2.0 technology, with additional
Northbridge-Southbridge messaging functionalities.
•Supports programmable lane reversal to ease motherboard layout.
1.2.6 2D Acceleration Features
•Highly-optimized 128-bit engine, capable of processing multiple pixels per clock.
•Hardware acceleration of Bitblt, line drawing, polygon and rectangle fills, bit masking, monochrome expansion,
panning and scrolling, scissoring, and full ROP support (including ROP3).
•Optimized handling of fonts and text using AMD proprietary techniques.
•Game acceleration including support for Microsoft's DirectDraw®: Double Buffering, Virtual Sprites, Transparent
Blit, and Masked Blit.
•Acceleration in 1/8/15/16/32-bpp modes:
•Pseudocolor mode for 8bpp
•ARGB1555 and RGB565 modes for 16bpp
•ARGB8888 mode for 32bpp
•Significant increase in the High-End Graphics WinBench®score due to capability for C18 color expansion.
•Setup of 2D polygons and lines.
•Support for GDI extensions:
•In Windows XP and Windows Vista: Alpha BLT, Transparent BLT, and Gradient Fill.
•In Windows 7: Alpha BLT, Transparent BLT, Color Fill BLT, Stretch BLT, and Clear Type BLT.
•Hardware cursor (up to 64x64x32bpp), with alpha channel for direct support of Windows XP, Windows Vista
and Windows 7 alpha cursor.
1.2.7 3D Acceleration Features
•Fully DirectX 10.0 compliant, including full speed 32-bit floating point per component operations
•Shader Model 4.0 geometry and pixel support in a unified shader architecture:
•Full speed 32-bit floating point processing per component.
•High dynamic range rendering with floating point blending, texture filtering and anti-aliasing support.
•High performance dynamic branching and flow control.
•Nearly unlimited shader instruction store, using an advance caching system.
•Advanced shader design, with ultra-threading sequencer for high efficiency operations.
•Advanced, high performance branching support, including static and dynamic branching.
•32-bit floating point components for high dynamic range computations.
•Full anti-aliasing on render surfaces up to and including 128-bit floating point formats.
•Support for OpenGL®2.0
•Anti-Aliasing Filtering:
•2x/4x/8x modes.
•Sparse multi-sample algorithm with gamma correction, programmable sample patterns, and centroid sampling.
•Temporal anti-aliasing.
•Adaptive anti-aliasing mode.
•Lossless color compression (up to 8:1) at all resolutions, up to and including widescreen HDTV.
•Anisotropic Filtering:

RS780E Features
© 2009 Advanced Micro Devices, Inc. 45732 AMD 780E Databook 3.10
Proprietary 1-5
•2x/4x/8x/16x modes
•Up to 128-tap texture filtering.
•Adaptive algorithm with performance (bi-linear) and quality (tri-linear) options.
•Improved quality mode due to improved subpixel precision, higher precision LOD computations, and
rotationally invariant LOD computations.
•Advanced Texture Compression (3Dc+™ ):
•High quality 4:1 compression for normal maps and luminance maps.
•Works with any single-channel or two-channel data format.
•HW support to overcome "Small batch" issues in CPU limited applications.
•3D resources virtualized to a 32-bit addressing space, for support of large numbers of render targets and textures.
•New vertex cache and vertex fetch design, to increase vertex throughput from previous generations.
•Full support of 64-bit and 128-bit textures and surfaces, which can be 4x to 8x faster than previous generation of HW.
•Up to 8K x 8K textures, including 128 bpp texture are supported.
•New multi-level texture cache to give optimal performance, greater than 8x the previous designs.
•High efficiency ring bus memory controller:
•Programmable arbitration logic maximizes memory efficiency, software upgradeable.
•Fully associative texture, color, and Z cache design.
•New hierarchical Z and stencil buffers with early Z Test.
•New lossless Z-buffer compression for both Z and stencil.
•Fast Z-Buffer Clear.
•Z cache optimized for real-time shadow rendering.
•Z and color compression resources virtualized to a 32-bit addressing space, for support of multiple render targets
and textures simultaneously.
1.2.8 Motion Video Acceleration Features
•Video scaling and fully programmable YCrCb to RGB color space conversion for full-speed video playback and fully
adjustable color controls.
•Adaptive de-interlacing eliminates video artifacts caused by displaying interlaced video on non-interlaced displays,
and by analyzing image and using optimal de-interlacing function on a per-pixel basis.
•Motion video acceleration for HD DVD/Blu-ray technology.
•Dedicated UVD (Unified Video Decoder) hardware for H.264,VC-1, and MPEG-2 decode:
•H.264 implementation is based on the ISO/IEC 14496-10 spec.
•VC-1 implementation is based on the SMPTE 421M spec.
1.2.9 Multiple Display Features
General
•Dual independent displays. Possible configurations are illustrated in Figure 1-2.

45732 AMD 780E Databook 3.10 © 2009 Advanced Micro Devices, Inc.
1-6 Proprietary
RS780E Features
Figure 1-2 RS780E Multiple Display Options
•Resolution, refresh rates, and display data can be completely independent for the two display paths.
•Each display controller supports true 30 bits per pixel throughout the display pipe.
•Each display path supports VGA and accelerated modes, video overlay, hardware cursor, hardware icon, and palette
gamma correction.
•Supports both interlaced and non-interlaced displays.
•Full ratiometric expansion ability is supported for source desktop modes up to 1920 pixels/line.
•Maximum DAC frequency of 400 MHz.
•Supports 8, 16, 32, and 64-bpp depths for the main graphics layer:
•For 32-bpp depth, supports xRGB 8:8:8:8, xRGB 2:10:10:10, sCrYCb 8:8:8:8, and xCrYCb 2:10:10:10 data
formats.
•For 64-bpp depth, supports xRGB 16:16:16:16 data format.
•Independent gamma, color conversion and correction controls for main graphics layer.
•Support for DDC1 and DDC2B+ for plug and play monitors.
•8-bit alpha blending of graphics and video overlay.
•Hardware cursor up to 64x64 pixels in 2 bpp, full color AND/XOR mix, and full color 8-bit alpha blend.
•Hardware icon up to 128x128 pixels in 2 bpp, with two colors, transparent, and inverse transparent. AND/XOR
mixing. Supports 2x2 icon magnification.
•Virtual desktop support.
•Support for flat panel displays via VGA.
•Configurable to support flat panel displays or TVs via DVI/HDMI.
•Integrated HD audio controller for HDMI audio data.

RS780E Features
© 2009 Advanced Micro Devices, Inc. 45732 AMD 780E Databook 3.10
Proprietary 1-7
VGA Output
•Maximum resolutions supported by the VGA output for different refresh rates are:
•2048x1536 @85Hz (pixel clock at 388.5MHz) for 4:3 format
•2560x1440 @75Hz (pixel clock at 397.25MHz) for 16:9 format
•2456x1536 @60Hz (pixel clock at 320MHz) for 16:10 format
1.2.10 Integrated LVDS/TMDS (LVTM) Interface
•Configurable to output either LVDS or TMDS signals.
•LVDS mode:
•Integrated dual-link 18-/24-bit LVDS interface.
•805 Mbps/channel with 115 MHz pixel clock rate per link (230 MHz maximum pixel clock).
•FPDI-2 compliant; compatible with receivers from National Semiconductor, Texas Instruments, and THine.
•OpenLDI compliant excluding DC balancing.
•Programmable internal spread spectrum controller for the signals.
•TMDS Mode, enabling DVI or HDMI™:
•See Section 1.2.11, “DVI/HDMI™,” for details.
1.2.11 DVI/HDMI™
•Supports two TMDS interfaces, one multiplexed on the PCI-E graphics interface and the other on the LVTM
interface, enabling DVI or HDMI™*§(passing HDMI CTS v1.3b). ‡
•1620 Mbps/channel with 162 MHz pixel clock rate per link.
•Supports industry standard EIA-861B video modes including 480p, 720p, 1080i, and 1080p (for a full list of currently
supported modes, contact you AMD CSS representative). Maximum resolutions supported by various modes are:
•Single-link DVI: 1600x1200 @60Hz with standard timings, and 1920x1200 @60Hz with reduced blanking
timings.
•Dual-link DVI: 2560x1600 @60Hz.
•HDMI: 1080p.
•Supports YCbCr 4:4:4 and 4:2:2 modes with HDMI.
•HDMI basic audio support at 32, 44.1 or 48 kHz. Supports two-channel uncompressed audio data, and, for Windows
Vista platforms only, 5.1-channel audio data and DTS. HD audio device compatible with the Microsoft HD audio
driver.
•HDCP support for two independent display streams with on-chip key storage. Also available when the TMDS
interfaces run in dual-link mode.**
Notes: * HDMI must only be enabled on systems that are legally entitled. It is the responsibility of the system designer to
ensure that the system is entitled to support this feature.
§CEC is not supported.
‡ The TMDS interface multiplexed on the PCI-E graphics lanes cannot enable HDMI when the LVTM interface is
enabling HDMI, and vice versa.
** HDCP content protection is only available to licensed buyers of the technology and can only be enabled when
connected to an HDCP-capable receiver.
1.2.12 DisplayPort™ Interface
•Supports all mandatory features of DisplayPort™ Standard, Version 1.1, plus the following optional features:
•10-bit support.

45732 AMD 780E Databook 3.10 © 2009 Advanced Micro Devices, Inc.
1-8 Proprietary
RS780E Features
•YCbCr 4:4:4 and 4:2:2 support.
•HDCP support
•Optional test pattern support.
•Supports two independent displays over the PCI-E interface for external graphics (see Figure 1-1,“Possible
Configurations for the x16 PCI-E Graphics Interface,” on page 1-3 for details).
•Supports 4, 2, or 1-lane transmission.
•Supports both the 2.7Gbps and 1.62Gbps link symbol rates.
•Supports the Auxiliary Channel (AUX CH).
•Supports a maximum resolution of 2560x1600 @60Hz with 4 lanes.
1.2.13 Integrated HD Audio Controller and Codec
•Integrated HD Audio codec supports linear PCM and AC3 (5.1) audio formats for HDMI output.
•Separate logical chip function.
•Can encrypt data onto one associated HDMI output.
•Uses Microsoft UAA driver.
•Internally connected to the integrated HDMI, or HDMI-enabled interface, hence no external cable required.
•Support for basic audio (32, 44.1 or 48 KHz stereo) and AC3 or DTS at the same sample rates.
1.2.14 Clock Generation
•Support for an external clock chip to generate side-port memory, PCI-E, and A-Link Express II clocks.
1.2.15 Power Management Features
•Single chip solution in 55nm, 1.1V CMOS technology.
•Supports ACPI 2.0 for S0, S3, S4, and S5 states.
•Full IAPC (Instantly Available PC) power management support.
•Static and dynamic power management support (APM as well as ACPI) with full VESA DPM and Energy Star
compliance.
•The Chip Power Management Support logic supports four device power states defined for the OnNow Architecture—
On, Standby, Suspend, and Off. Each power state can be achieved by software control bits.
•Hardware controlled intelligent clock gating enables clocks only to active functional blocks, and is completely
transparent to software.
•Dynamic self-refresh for the side-port memory.
•Support for Cool'n'Quiet™ via FID/VID change.
•Support for AMD PowerNow!™.
•Clocks to every major functional block are controlled by a unique dynamic clock switching technique that is
completely transparent to the software. By turning off the clock to the block that is idle or not used at that point, the
power consumption is significantly reduced during normal operation.
•Supports PowerExpress™ and PowerPlay™ (enhanced with the PowerShift™ feature).
•Supports dynamic lane reduction for the PCI-E graphics interface when coupled with an AMD-based graphics
device, adjusting lane width according to required bandwidth.
1.2.16 PC Design Guide Compliance
The RS780E complies with all relevant Windows Logo Program (WLP) requirements from Microsoft for WHQL
certification.

Software Features
© 2009 Advanced Micro Devices, Inc. 45732 AMD 780E Databook 3.10
Proprietary 1-9
1.2.17 Test Capability Features
The RS780E has a variety of test modes and capabilities that provide a very high fault coverage and low DPM (Defect Per
Million) ratio:
•Full scan implementation on the digital core logic through ATPG (Automatic Test Pattern Generation Vectors).
•Dedicated test logic for the on-chip custom memory macros to provide complete coverage on these modules.
•A JTAG test mode to allow board level testing of neighboring devices.
•An EXOR tree test mode on all the digital I/O's to allow for proper soldering verification at the board level.
•A VOH/VOL test mode on all digital I/O’s to allow for proper verification of output high and output low values at the
board level.
•Access to the analog modules to allow full evaluation and characterization.
•IDDQ mode support to allow chip evaluation through current leakage measurements.
These test modes can be accessed through the settings on the instruction register of the JTAG circuitry.
1.2.18 Additional Features
•Integrated spread spectrum PLLs on the memory and LVDS interface.
1.2.19 Packaging
•Single chip solution in 55nm, 1.1V low power CMOS technology.
•528-FCBGA package, 21mmx21mm.
1.3 Software Features
•BIOS ability to read EDID 1.1, 1.2, and 1.3.
•Ability to selectively enable and disable several devices including CRT, LCD, and DFP.
•Register-compatible with VGA standards, BIOS-compatible with VESA VBE2.0.
•Supports corporate manageability requirements such as DMI.
•ACPI support.
•Full Write Combining support for maximum performance of the CPU.
•Full-featured, yet simple Windows utilities:
•Calibration utility for WYSIWYG color
•Independent brightness control of desktop and overlay
•End user diagnostics
•Drivers meet Microsoft's rigorous WHQL criteria and are suitable for systems with the "Designed for Windows"
logos.
•Comprehensive OS and API support.
•Hot-key support (Windows ACPI 2.0 or AMD Event Handler Utility where appropriate).
•Extensive power management support.
•Rotation mode support in software.
•Dual CRTC, simultaneous view, extended desktop support (Windows XP and Windows Vista)
•DirectX 10.0 support.
•Switchable overlay support.
•H.264 playback support.

45732 AMD 780E Databook 3.10 © 2009 Advanced Micro Devices, Inc.
1-10 Proprietary
Branding Diagram
•Supports AMD OverDrive™ utility*.
*Note: AMD’s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via
the AMD OverDrive utility.
1.4 Branding Diagram
Figure 1-3 RS780E ASIC A13 Production Branding
1.5 Graphics Device ID and Graphics Engine Clock Speed
Table 1-2 Graphics Device ID and Graphics Engine Clock Speed
1.6 Conventions and Notations
The following conventions are used throughout this manual.
1.6.1 Pin Names
Pins are identified by their pin names or ball references. Multiplexed pins sometimes assume alternate “functional names”
when they perform their alternate functions, and these “functional names” are given in Chapter 3, “Pin Descriptions and
Strap Options.”
All active-low signals are identified by the suffix ‘#’ in their names (e.g., MEM_RAS#).
1.6.2 Pin Types
The pins are assigned different codes according to their operational characteristics. These codes are listed in Table 1-3.
Variant Graphics
Device ID
Graphics Engine Clock Speed (MHz)
Min. Max.
RS780E 0x9615 200 500
Table 1-3 Pin Type Codes
Code Pin Type
I Digital Input
O Digital Output
OD Open Drain
I/O Bi-Directional Digital Input or Output
I/OD Digital Input or Open Drain
M Multifunctional
RADEON IGP
YYWW
MADE IN TAIWAN
WXXXXX
216-0674040
* YY - Assembly Start Year
WW - Assembly Start Week
Part Number
Date Code*
AMD Product Type
AMD Logo
Wafer Lot Number
Country of Origin