ASRock Industrial iEP-9010E User manual

iEPF-9010S-EY4
iEPF-9012S-EY4
iEP-9010E
iEP-9012E
User Manual
Version 1.0
Published June 2022
Copyright©2022 ASRockInd INC. All rights reserved.
IEPF-9010S-EY4
IEPF-9012S-EY4
I E P - 9 010 E
I E P - 9 012 E
IEPF-9020S-EY4
IEPF-9022S-EY4
IEP-9020E
IEP-9022E
User Manual

Version 1.0
Published March, 2023.
Copyright©2023 ASRockInd Inc. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated
in any language, in any form or by any means, except duplication of documentation by the
purchaser for backup purpose, without written consent of ASRockInd Inc.
Products and corporate names appearing in this documentation may or may not be
registered trademarks or copyrights of their respective companies, and are used only for
identication or explanation and to the owners’ benet, without intent to infringe.
Disclaimer:
Specifications and information contained in this documentation are furnished for
informationa l use only and subject to change without notice, and should not be
constructed as a commitment by ASRockInd. ASRockInd assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRockInd does not provide
warranty of any kind, either expressed or implied, including but not limited to the implied
warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRockInd, its directors, officers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for loss
of profits, loss of business, loss of data, interruption of business and the like), even if
ASRockInd has been advised of the possibility of such damages arising from any defect or
error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
1. this device may not cause harmful interference, and
2. this device must accept any interference received, including interference that may cause
undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRockInd Website: http://www.asrockind.com

Important Safety Instructions
For user safety, please read and follow all instructions, Warnings, Cautions, and Notes
marked in this manual and on the associated device before handling/operating the device,
to avoid injury or damage.
1. Read these safety instructions carefully.
2. Retain this user manual for future reference.
3. Read the Specifications section of this manual for detailed information on the
recommended operating environment.
4. Disconnect the equipment from all AC outlets before cleaning. Use only a damp cloth
for cleaning. Do not use liquid or sprayed detergent.
5. Place the equipment on a reliable surface during installation. Dropping or letting the
equipment fall may cause damage.
6. Do not leave the equipment in an environment with a storage temperature of below
-40 °C (-40 °F) or above 85 °C (185 °F) as this may cause damage. The equipment
should be stored in a controlled environment.
7. Ensure that the voltage of the power source is correct before connecting the
equipment to a power outlet.
8. Position the power cord away from high-trac areas. Do not place anything over the
power cord.
9. If the equipment is not used for a long time, disconnect the equipment from the
power source to avoid damage from transient over-voltage.
10. All cautions and warnings on the equipment should be noted.
11. To avoid electrical shock and/or damage to the device:
• Keep the device away from water or liquid sources.
• Keep the device away from high heat or humidity.
• Keep device properly ventilated (do not block or cover ventilation openings).
• Always use designated voltage and power source settings.
• Always install and operate the device near an easily accessible electrical outlet.
• Secure the power cord (do not place any object on/over the power cord).
• Only install/attach and operate the device on stable surfaces and/or designated
mountings.
• e power cord must be connected to a socket or outlet with a ground connection.
12. If one of the following occurs, have the equipment checked by service personnel:
• e power cord or plug is damaged.
• Liquid has penetrated into the equipment.
• e equipment has been exposed to moisture.
• The equipment is malfunctioning or does not operate according to the user
manual.
• e equipment has been dropped and damaged.
• e equipment shows obvious signs of breakage.

13. Never attempt to repair the device, which should only be serviced by qualified
technical personnel using suitable tools.
14. Any unverified component may cause unexpected damage. To ensure correct
installation, always use the components (e.g., screws) provided in the accessory box.
15. This equipment is not suitable for use in locations where children are likely to be
present.
16. e equipment should only be installed in a restricted access area.
17. Restricted Access Location:
e device must be installed only in a server room or computer room where access is:
• Access can only be gained by service persons or by users who have been
instructed about the reasons for the restrictions applied to the location and about
any precautions that shall be taken.
• Access is through the use of a tool or lock and key, or other means of security, and
is controlled by the authority responsible for the location.
• Leave enough clearance (25 inches in the front and 30 inches in the back of the
rack) to allow the front door to be opened completely and to allow for sucient
airow.
• is product is for installation merely in a Restricted Access Location.
• This product is not suitable for use with visual display workplace devices
according to §2 of "the German Ordinance for Work with Visual Display Units".
18. e equipment is intended to be supplied by the external power source (UL listed/
IEC 60950-1/ IEC 62368-1 approved) whose output complies with ES1/SELV. To
reduce potential safety issues, only the AC adapter provided with the product, a
replacement AC adapter provided by ASRock Industrial or agency, or an AC adapter
purchased as an accessory from ASRock Industrial or agency should be used with the
product.
19. This power adapter (FSP330-AAAN3) is intended to be supplied based on a UL-
certied and suitable for use at an operating/storage temperature of 0 °C (32 °F)~ 40
°C (104 °F)/ -20 °C (-4 °F)~80 °C (176 °F), and the current output is rated 13.75A. If
you need further assistance, contact ASRock Industrial for additional information.
20. e ambient temperature of the iEP-9000E series: 70 °C (158°F) max.; the ambient
temperature of the iEPF-9000S series: 75 °C (167°F) max.
21. e terminal block is suitable for V+& V-, 3 units for each (16~18AWG) which means
6 units in total. e torque value is 0.69Nm. And use copper conductors only. Kindly
note that must be installed by a skilled person.
22. LAN port must use shielded LAN cable.

Replaceable Batteries
BURN HAZARD
Hot surface! Do not touch! Touching this surface could result in bodily injury. To reduce
risk, allow the surface to cool before touching.
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS
CAUTION
e equipment is equipped with a battery-powered real-time clock circuit. ere is a risk
of explosion if a battery is incorrectly replaced. Replace only with the same or equivalent
type as designated by the manufacturer. Discard all used batteries according to the
manufacturer's instructions.
LITHIUM-METAL BATTERY WARNING
Danger of explosion if the battery is incorrectly replaced. Replace only with the same or
equivalent type designated by the manufacturer. Dispose of used batteries according to the
manufacturer's instructions.
WARNING
All interconnection to the EUT is for indoor location and therefore PoE network
interconnected to the EUT is considered as ES1/SELV for connected only to PoE network
without routing to the outside plant.
WARNING
Input voltage rated 9~36V, 30~18A
Packing: e unit should be carried with both hands and handled with care.
Maintenance: Use only approved products or a dry applicator to clean and maintain the
surfaces.

e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
Contact Information
If you need to contact ASRock Industrial or want to know more about ASRock Industrial,
you’re welcome to visit ASRock Industrial’s website at www.asrockind.com; or you may
contact your dealer for further information.
ASRock Industrial Incorporation
Email: [e-mail]

Contents
Chapter 1 Introduction 1
1.1 Key Features 1
1.2 Package List 4
1.3 Specications 7
1.4 Dimensions 23
1.5 Block Diagram 31
Chapter 2 System Overview 33
2.1 System Front Panel 33
2.1.1 Control Panel Buttons and LED Indicators 35
2.1.2 I/O Connectors 37
2.2 HDD Panel 38
2.3 Drive Tray LEDs 39
Chapter 3 Hardware Installation and Maintenance 40
3.1 How to Install the Hard Disk Drive 41
3.2 How to Install the SIM Card 43
3.3 How to Disassemble the System 45
3.4 How to Install the Desk Mount Bracket 50
3.5 How to Install the Rubber Foot 51
Chapter 4 Motherboard 52
4.1 Motherboard Layout 52
4.2 Jumpers Setup 58
4.3 Onboard Headers and Connectors 60
4.4 Expansion Slots 65

Chapter 5 UEFI Setup Utility 67
5.1 Introduction 67
5.2 Main Screen 70
5.3 Advanced Screen 71
5.3.1 CPU Conguration 72
5.3.2 Chipset Conguration 74
5.3.3 Intel(R) Time Coordinated Computing 76
5.3.4 Storage Conguration 78
5.3.5 Super IO Conguration 80
5.3.6 ACPI Conguration 83
5.3.7 USB Conguration 84
5.3.8 Trusted Computing 85
5.4 Hardware Health Event Monitoring Screen 87
5.5 Security Screen 88
5.6 Boot Screen 89
5.7 Exit Screen 90

iEPF-9010S-EY4 / iEPF-9012S-EY4 /
iEP-9010E / iEP-9012E / iEPF-9020S-EY4 /
iEPF-9022S-EY4 / iEP-9020E / iEP-9022E
PB 1
English
Chapter 1 Introduction
ank you for purchasing iEPF-9010S-EY4 / iEPF-9012S-EY4 / iEP-9010E / iEP-9012E /
iEPF-9020S-EY4 / iEPF-9022S-EY4 / iEP-9020E / iEP-9022E, a reliable barebone system
produced under ASRock Industrial’s consistently stringent quality control. It delivers
excellent performance with robust design conforming to ASRock Industrial’s commitment
to quality and endurance.
1.1 Key Features
iEPF-9010S-EY4
• Intel® 12th Gen Core™ Processors with R680E Chipset
• 4 x 260-pin DDR4 SO-DIMM up to 128GB (32GB per DIMM)
• 1 x PCIe x16 (PCIe Gen4) or 2 x PCIe x8 (PCIe Gen4), 2 x PCIe x4 (PCIe Gen4)
• 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 6 x USB 3.2 Gen2x1, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO
• 5 x Intel 2.5G LAN (2 support PoE, 1 supports vPro)
• 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
• Powerful Edge AI acceleration enabled by the most exible mechanical, thermal, and
power design, with support for 275mm x 124 mm x 60 mm (L x H x D) max. and up to
255W graphic cards
iEPF-9012S-EY4
• Intel® 12th Gen Core™ Processors with H610 Chipset
• 2 x 260-pin DDR4 SO-DIMM up to 64GB (32GB per DIMM)
• 1 x PCIe x16 (PCIe Gen4), 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 2 x USB 3.2 Gen2x1, 2 x USB 3.2 Gen1x1, 2 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, 8 x
DO
• 4 x Intel 2.5G LAN (2 support PoE)
• 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
Because the hardware specications might be updated, the content of this documentation
will be subject to change without notice. In case any modications of this documentation
occur, the updated version will be available on ASRock Industrial’s website without further
notice. If you require technical support related to this product, please visit our website for
specic information about the model you are using.
ASRock Industrial’s Website: www.ASRockInd.com
e illustrations shown in this manual are examples only. e actual system may dier
depending on the product model you purchsed.

2 3
English
• Powerful Edge AI acceleration enabled by the most exible mechanical, thermal, and
power design, with support for 275mm x 124 mm x 60 mm (L x H x D) max. and up to
255W graphic cards
iEP-9010E
• Intel® 12th Gen Core™ Processors with R680E Chipset
• 4 x 260-pin DDR4 SO-DIMM up to 128GB (32GB per DIMM)
• 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 6 x USB 3.2 Gen2x1, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO
• 5 x Intel 2.5G LAN (2 support PoE, 1 supports vPro)
• 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
iEP-9012E
• Intel® 12th Gen Core™ Processors with H610 Chipset
• 2 x 260-pin DDR4 SO-DIMM up to 64GB (32GB per DIMM)
• 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 2 x USB 3.2 Gen2x1, 2 x USB 3.2 Gen1x1, 2 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, 8 x
DO
• 4 x Intel 2.5G LAN (2 support PoE)
• 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
iEPF-9020S -EY4
• Intel® 13th Gen Core™ Processors with R680E Chipset
• 4 x 260-pin DDR4 SO-DIMM up to 128GB (32GB per DIMM)
• 1 x PCIe x16 (PCIe Gen4) or 2 x PCIe x8 (PCIe Gen4), 2 x PCIe x4 (PCIe Gen4)
• 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 6 x USB 3.2 Gen2x1, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO
• 5 x Intel 2.5G LAN (2 support PoE, 1 supports vPro)
• 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
• Powerful Edge AI acceleration enabled by the most exible mechanical, thermal, and
power design, with support for 275mm x 124 mm x 60 mm (L x H x D) max. and up to
255W graphic cards
iEPF-9022S-EY4
• Intel® 13th Gen Core™ Processors with H610 Chipset
• 2 x 260-pin DDR4 SO-DIMM up to 64GB (32GB per DIMM)
e LAN ports also supporting IEEE 802.3AT PoE (PoE output max 30W/port) only use
12~36V DC insource.

iEPF-9010S-EY4 / iEPF-9012S-EY4 /
iEP-9010E / iEP-9012E / iEPF-9020S-EY4 /
iEPF-9022S-EY4 / iEP-9020E / iEP-9022E
2 3
English
• 1 x PCIe x16 (PCIe Gen4), 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 2 x USB 3.2 Gen2x1, 2 x USB 3.2 Gen1x1, 2 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, 8 x
DO
• 4 x Intel 2.5G LAN (2 support PoE)
• 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
• Powerful Edge AI acceleration enabled by the most exible mechanical, thermal, and
power design, with support for 275mm x 124 mm x 60 mm (L x H x D) max. and up to
255W graphic cards
iEP-9020E
• Intel® 13th Gen Core™ Processors with R680E Chipset
• 4 x 260-pin DDR4 SO-DIMM up to 128GB (32GB per DIMM)
• 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 6 x USB 3.2 Gen2x1, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO
• 5 x Intel 2.5G LAN (2 support PoE, 1 supports vPro)
• 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
iEP-9022E
• Intel® 13th Gen Core™ Processors with H610 Chipset
• 2 x 260-pin DDR4 SO-DIMM up to 64GB (32GB per DIMM)
• 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
• 2 x USB 3.2 Gen2x1, 2 x USB 3.2 Gen1x1, 2 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, 8 x
DO
• 4 x Intel 2.5G LAN (2 support PoE)
• 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA

4 5
English
1.2 Package List
iEP(F)-9010 Series
iEP(F)-9020 Series
Item Quantity
iEPF-9010S Series / iEP-9010E Series 1
Rubber foot 4
M3x8L Round Head Bolts for Rubber foot 4
Desk Mount 2
M3x5L Countersunk Screws for Desk Mount 8
M4x10L Round Head Bolts for Desk Mount 4
M3x4L Round Head Bolts for SODIMM Bracket 4
Terminal Block 1X3P ST 7.62m 1
Terminal Block 1X3P ST 5.0m 1
Terminal Block 1X10P ST 3.5m 2
Screw for M.2 I-Head M2*2 3
Screw for MiniPCIe 3.7xM2.0x3.3L 2
Screw M3*4mm for 2.5” Tray 16
M.2 Heatsink 1
SODIMM Bracket w/Mylar 2
SODIMM Heatsink 2
Nut M2 H=3.35mm w/read(Hex) 1
Option: Power Adapter 330W, FSP330-AAAN3 /9NA3300208 1
Item Quantity
iEPF-9020S Series / iEP-9020E Series 1
Rubber foot 4
M3x8L Round Head Bolts for Rubber foot 4
Desk Mount 2
M3x5L Countersunk Screws for Desk Mount 8
M4x10L Round Head Bolts for Desk Mount 4

iEPF-9010S-EY4 / iEPF-9012S-EY4 /
iEP-9010E / iEP-9012E / iEPF-9020S-EY4 /
iEPF-9022S-EY4 / iEP-9020E / iEP-9022E
4 5
English
1. If any items are missing or appear damaged, contact your authorized dealer.
2. Based on dierent conguration, package list may be dierent.
Note:
Please refer to the following for more information about the adapter:
330W Power adapter
- Input voltage: 100-240 Vac
- Input frequency: 47-63 Hz(±1Hz)
- Rating output current: 13.75A
- Rating output voltage: 24.0 V ±5%
M3x4L Round Head Bolts for SODIMM Bracket 4
Terminal Block 1X3P ST 7.62m 1
Terminal Block 1X3P ST 5.0m 1
Terminal Block 1X10P ST 3.5m 2
Screw for M.2 I-Head M2*2 3
Screw for MiniPCIe 3.7xM2.0x3.3L 2
Screw M3*4mm for 2.5” Tray 16
M.2 Heatsink 1
SODIMM Bracket w/Mylar 2
SODIMM Heatsink 2
Nut M2 H=3.35mm w/read(Hex) 1
Option: Power Adapter 330W, FSP330-AAAN3 /9NA3300208 1

6 7
English
Actual power consumption may differ based on different applications and different
hardware congurations. Sucient power for the entire system is required to meet these
specications. We recommend that 330W adapter (Certied adapter, Output: 24Vdc,
13.75A) is used if there is no PCIe or PCI add-on cards assembled on the iEPF-9010S
Series and iEPF-9020S Series. Users may use a DC source instead of the optional 330W
adapter (Certified adapter, Output: 24Vdc,13.75A) when power consumption is over
330W in an environment where the temperature is 40OC and DC source should be within
9~36 VDC/30~18A.
Ratings: (1) 9-36Vdc, 30-18A (Optional) (2) 24Vdc, 13.75A (Optional)
Kindly refer to 1.3 Specications “Environment -Operation Temperature” for the related
information about CPU.
WARNING! Use ONLY approved NRTL LISTED ITE power supply with electrical ratings.

iEPF-9010S-EY4 / iEPF-9012S-EY4 /
iEP-9010E / iEP-9012E / iEPF-9020S-EY4 /
iEPF-9022S-EY4 / iEP-9020E / iEP-9022E
6 7
English
1.3 Specications
iEPF-9010S-EY4
Processor System
CPU
Chipset
Socket
Intel®12th Gen Core™, Pentium or CeleronProcessors
Intel®R680E
LGA 1700
Memory
Technology
Capacity
Socket
Dual Channel DDR4 2933MHz
(ECC memory supported by R680E + SelectedCPU)
128 GB (32 GB per DIMM)
4 x 260-pin SO-DIMM
Graphics
Controller
DisplayPort
HDMI
VGA
Intel®UHD Graphics
DisplayPort 1.4a , DP++
Max resolution up to 4096x2160@60Hz
HDMI 2.0b
Max resolution up to 4096x2160@60Hz
Max resolution up to1920x1200@60Hz
Audio
Interface Realtek ALC897, High Definition Audio.
Ethernet
Controller/ Speed
Connector
5 x Intel 2.5G LAN (2 support PoE, each port supports IEEE 802.3AF PoE,
PoE output max.15.4W/port),(1 supports vPro)
5 x RJ45
Expansion Slot
PCIe
Mini-PCIe
RF& Antenna
M.2
SIM Socket
1 x PCIe Gen4 x16 (single x16 or dual x8), PCIe x16 slot with
default power cable can support up to 180W graphiccard
(275mm x 111.15 mm x 60 mm (L x H x D), if remove the card
holder, it can be limitedon 275mm x 124mm x 60 mm)
Graphic card can be up to 255W with optional VGA module
1 x PCIe Gen4 x8 (shared with dual x8)
2 x PCIe Gen4 x4
2 x Full/Half size with PCIe Gen3 x1 and USB 2.0
8 x SMA connectorhole reserved
1 x M.2 (Key E, 2230) with CNVI/PCIe Gen3 x1
and USB2.0 for Wi-Fi/BT module
1 x M.2 (Key B, 2280/3042/3052)
with PCIe Gen3 x1 / USB3.2 Gen1x1 for 4G / 5G
2 x Nano SIM Card slot
(1 connected to Mini PCIe, 1 connected to M.2 Key B)

8 9
English
Watchdog Timer
Output
Interval
From Super I/O todrag RESETCON#
256 Segments, 0, 1, 2, ...255sec
Storage
M.2
SATA
CFast (Option)
1 x M.2 (Key M, 2280) with Gen4/Gen3 x4 for NVMe SSD
4 x SATA3 (6Gb/s),support RAID 0/1/5/10
4 x 2.5" HDD/SSD Tray
1 x Type II socket (Shared with SATA3)
Power Requirements
Input PWR9V~36V VDC with Ignitioncontroland remote power on/off switch.
80V Surge Protection,OVP, UVP, OCP andreverse protection
Ignition Power Input w/ 13-mode condition
Front I/O
DisplayPort
HDMI
VGA
Ethernet
USB
Audio
COM
DIO
1
1
1
5 x 2.5G LAN
6 x USB 3.2 Gen2x1, 1 x USB2.0 internal connectorw/ lockfunction
1 x Mic-in, 1 x Line-out
4 x RS232/422/485
2 x RS232
8DIs/8DOs
Mechanical
Construction
Mounting
Dimensions
Net Weight
Aluminum heatsink + Metal chassis
Desk Mount
202mm (W) x 290mm (D) x 209.3mm (H) (7.95" x 11.42"x 8.24")
10kg
Others
OS Support
SW Support
TPM
Real-Time Enablement
Windows 10 & Linux
ACRN (https://projectacrn.org/)
TPM 2.0
TSN, TCC support under YOCTO
Environment
Operating Temperature
Storage Temperature
Humidity
Shock
Vibration
ESD
EMC
Safety
35W CPU: -40°C~75°C ( -40°F~167°F)
46W~65W CPU: -40°C~55°C( -40°F~131°F)
(with FAN inside, without Add-on Card) (w/ air flow 0.5~0.8 m/s)
-40°C~85°C( -40°F~185°F)
~95% @ 40°C(non-condensing)
Operating: 50 G, half sine11ms duration with SSD
Operating: 5 Grms,5-500 Hz, 3 axes with SSD
Contact +/-4kV, Air +/-8kV
EN61000-6-4/-2,CE& FCC Class A
LVD

iEPF-9010S-EY4 / iEPF-9012S-EY4 /
iEP-9010E / iEP-9012E / iEPF-9020S-EY4 /
iEPF-9022S-EY4 / iEP-9020E / iEP-9022E
8 9
English
iEPF-9012S-EY4
Processor System
CPU
Chipset
Socket
Intel®12th Gen Core™, Pentium or CeleronProcessors
Intel®H610
LGA 1700
Memory
Technology
Capacity
Socket
Dual Channel DDR4 2933MHz
64 GB (32 GB perDIMM)
2 x 260-pin SO-DIMM
Graphics
Controller
DisplayPort
HDMI
VGA
Intel®UHD Graphics
DisplayPort 1.4a , DP++
Max resolution up to 4096x2160@60Hz
HDMI 2.0b
Max resolution up to 4096x2160@60Hz
Max resolution up to1920x1200@60Hz
Audio
Interface Realtek ALC897, High Definition Audio.
Storage
SATA
CFast (Option)
4 x SATA3 (6Gb/s)
4 x 2.5" HDD/SSD Tray
1 x Type II socket (Shared with SATA3)
Ethernet
Controller/ Speed
Connector
4xIntel 2.5G LAN(2 support PoE, PoE output max.15.4W/port,
eachport supports IEEE802.3AF PoE)
4 x RJ45
Expansion Slot
PCIe
Mini-PCIe
RF& Antenna
M.2
SIM Socket
1 x PCIe Gen4 x16*, PCIe x16 slot with default power cable
can support up to 180W graphic card
(275mm x 111.15 mm x 60 mm (L x H x D), if remove the card
holder, it can be limitedon 275mm x 124mm x 60 mm)
Graphic card can be up to 255W with optional VGA module
1 x Full/Half size with PCIe Gen3 x1 and USB 2.0
1 x Full/Halfsize with PCIe Gen3 x1
8 x SMA connector hole reserved
1 x M.2 (Key E, 2230) with CNVI/PCIe Gen3 x1
and USB2.0 for Wi-Fi/BT module
1 x M.2 (Key B, 2280/3042/3052) with PCIe Gen3 x1 /
USB2.0 for 4G / 5G
2 x Nano SIM Card slot
(1 connected to Mini PCIe, 1 connected to M.2 Key B)

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Environment
Operating Temperature
Storage Temperature
Humidity
Shock
Vibration
ESD
EMC
Safety
35W CPU: -40°C~75°C ( -40°F~167°F)
46W~65W CPU: -40°C~55°C ( -40°F~131°F)
-40°C~85°C ( -40°F~185°F)
~95% @ 40°C (non-condensing)
Operating: 50 G, half sine11ms duration with SSD
Operating: 5 Grms,5-500 Hz, 3 axes with SSD
Contact +/-4kV, Air +/-8kV
EN61000-6-4/-2, CE & FCC Class A
LVD
Mechanical
Construction
Mounting
Dimensions
Net Weight
Aluminum heatsink + Metal chassis
Desk Mount
202mm (W) x 290mm (D) x 209.3mm (H) (7.95" x 11.42"x 8.24")
10kg
Watchdog Timer
Output
Interval
From Super I/O todrag RESETCON#
256 Segments, 0, 1, 2, ...255sec
Power Requirements
Input PWR9V~36V VDC with Ignitioncontroland remote power on/off switch.
80V SurgeProtection, OVP, UVP, OCP andreverse protection
Ignition Power Input w/ 13-mode condition
Rear I/O
DisplayPort
HDMI
VGA
Ethernet
USB
Audio
COM
DIO
1
1
1
4 x 2.5G LAN
2xUSB 3.2Gen2x1, 2x USB 3.2Gen1x1, 2 xUSB 2.0,
1xUSB2.0internalconnector w/lock function
1 x Mic-in, 1 x Line-out
4 x RS232/422/485
2 x RS232
8DIs/8DOs
Others
OS Support
TPM
Real-Time Enablement
Windows 10 & Linux
TPM 2.0
TSN, TCC support under YOCTO
*The PCIe x16 slot locates at the third slot from the right hand side.
(with FAN inside, without Add-on Card) (w/ air flow 0.5~0.8 m/s)

iEPF-9010S-EY4 / iEPF-9012S-EY4 /
iEP-9010E / iEP-9012E / iEPF-9020S-EY4 /
iEPF-9022S-EY4 / iEP-9020E / iEP-9022E
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iEP-9010E
Processor System
CPU
Chipset
Socket
Intel®12th Gen Core™, Pentium or CeleronProcessors
Intel®R680E
LGA 1700
Memory
Technology
Capacity
Socket
Dual Channel DDR4 2933MHz
(ECC memory supported by R680E + SelectedCPU)
128 GB (32 GB per DIMM)
4 x 260-pin SO-DIMM
Graphics
Controller
DisplayPort
HDMI
VGA
Intel®UHD Graphics
DisplayPort 1.4a , DP++
Max resolution up to 4096x2160@60Hz
HDMI 2.0b
Max resolution up to 4096x2160@60Hz
Max resolution up to1920x1200@60Hz
Audio
Interface Realtek ALC897, High Definition Audio.
Ethernet
Controller/ Speed
Connector
5 x Intel 2.5G LAN(2 support PoE, each port supports IEEE802.3AFPoE,
PoE output max.15.4W/port), (1 supports vPro)
5 x RJ45
Expansion Slot
Mini-PCIe
RF& Antenna
M.2
SIM Socket
2 x Full/Half size with PCIe Gen3 x1 and USB 2.0
8 x SMA connector hole reserved
1 x M.2 (Key E, 2230) with CNVI/PCIe Gen3 x1
and USB2.0 for Wi-Fi/BT module
1 x M.2 (Key B, 2280/3042/3052)
with PCIe Gen3 x1 / USB3.2 Gen1x1 for 4G / 5G
2 x NanoSIM Card slot
(1 connected to Mini PCIe, 1 connected to M.2 Key B)
Storage
M.2
SATA
CFast (Option)
1 x M.2 (Key M, 2280) with Gen4/Gen3 x4 for NVMe SSD
4 x SATA3 (6Gb/s), support RAID 0/1/5/10
4 x 2.5" HDD/SSD Tray
1 x Type IIsocket (Shared with SATA3)