ASRock Industrial SBC-260 User manual

SBC-260
User Manual
Version 1.0
Published August 22, 2023
Copyright©2023 ASRockInd INC. All rights reserved.

Version 1.0
Published August, 2023
Copyright©2023 ASRockInd INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated
in any language, in any form or by any means, except duplication of documentation by the
purchaser for backup purpose, without written consent of ASRockInd Inc.
Products and corporate names appearing in this documentation may or may not be
registered trademarks or copyrights of their respective companies, and are used only for
identication or explanation and to the owners’ benet, without intent to infringe.
Disclaimer:
Specifications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRockInd. ASRockInd assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRockInd does not provide
warranty of any kind, either expressed or implied, including but not limited to the implied
warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRockInd, its directors, officers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for loss
of profits, loss of business, loss of data, interruption of business and the like), even if
ASRockInd has been advised of the possibility of such damages arising from any defect or
error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
1. this device may not cause harmful interference, and
2. this device must accept any interference received, including interference that may cause
undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRockInd Website: http://www.asrockind.com

e terms HDMI®and HDMI High-Denition Multimedia Interface, and the HDMI logo
are trademarks or registered trademarks of HDMI Licensing LLC in the United States and
other countries.
CAUTION:
RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS.

Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 4
1.4 I/O Panel 7
1.5 Block Diagram 8
Chapter 2 Installation 9
2.1 Screw Holes 9
2.2 Pre-installation Precautions 9
2.3 Installation of Memory Modules (SO-DIMM) 10
2.4 Expansion Slots 11
2.5 Jumpers Setup 12
2.6 Onboard Headers and Connectors 15
Chapter 3 UEFI SETUP UTILITY 21
3.1 Introduction 21
3.1.1 Entering BIOS Setup 21
3.1.2 UEFI Menu Bar 22
3.1.3 Navigation Keys 23
3.2 Main Screen 24
3.3 Advanced Screen 25
3.3.1 CPU Conguration 26
3.3.2 Chipset Conguration 29
3.3.3 Storage Conguration 31

3.3.4 Super IO Conguration 33
3.3.5 ACPI Conguration 34
3.3.6 USB Conguration 35
3.3.7 Trusted Computing 36
3.4 Hardware Health Event Monitoring Screen 38
3.5 Security Screen 39
3.6 Boot Screen 44
3.7 Exit Screen 45

1
SBC-260
Chapter 1 Introduction
ank you for purchasing ASRockInd SBC-260 motherboard, a reliable motherboard pro-
duced under ASRockInd’s consistently stringent quality control. It delivers excellent perfor-
mance with robust design conforming to ASRockInd’s commitment to quality and endur-
ance.
In this manual, chapter 1 and 2 contain introduction of the motherboard and step-by-step
guide to the hardware installation. Chapter 3 contains the conguration guide to BIOS setup.
Because the motherboard specications and the BIOS soware might be updated, the
content of this manual will be subject to change without notice. In case any modica-
tions of this manual occur, the updated version will be available on ASRockInd website
without further notice. You may nd the latest CPU support lists on ASRockInd web-
site as well.
ASRockInd website https://www.asrockind.com/
If you require technical support related to this motherboard, please visit our website for
specic information about the model you are using.
https://www.asrockind.com/support/index.asp
1.1 Package Contents
ASRockInd SBC-260 Motherboard (3.5”SBC (5.8-in x 4-in x 1.02-in, 14.7 cm x 10.2 cm x 2.60
cm))
ASRockInd SBC-260 Jumper Setting Instruction
Gi Package:
1 x Heat Spreader 147*102.2mm
3 x SCREW M2*2, D=5
2 x COM Cable
1 x SATA Data Cable
1 x SATA Power Cable
1 x DC-in Cable
Bulk Package:
3 x SCREW M2*2, D=5

2
1.2 Specications
Form
Factor Dimensions 3.5”SBC (5.8-in x 4-in x 1.02-in, 14.7 cm x 10.2 cm x 2.60 cm)
Processor
System
CPU
Intel® Alder Lake-N SoC Processors
SBC-260J (N97, QC, max speed up to 3.6GHz, 12W)
*For other CPU SKUs request, please contact regional
Sales for availability.
Chipset SoC
BIOS AMI SPI 256 Mbit
Memory
Technology Single Channel DDR4 3200 MHz
Capacity 16GB
Socket 1 x 260-pin SO-DIMM
Graphics
Controller Intel® UHD Graphics
HDMI HDMI 2.0b
Max resolution up to 4096x2160@60Hz
DisplayPort DP 1.4a
Max resolution up to 4096x2160@60Hz
VGA Max resolution up to 1920x1200
LVDS Dual channel 24 bit up to 1920x1200@60Hz
(connector shared with eDP)
eDP Max resolution up to 1920x1080@60Hz
(connector shared with LVDS)
Multi Display Triple display
Expansion
Slot
M.2
1 x M.2 (Key E, 2230) with PCIe Gen3 x1, USB 2.0
and CNVi for Wireless
1 x M.2 (Key B, 3042/3052) with PCIe Gen3 x1/USB
3.2/USB 2.0 and SIM for 4G/5G
SIM Socket 1 x SIM socket connected to M.2 key B
Audio Interface Realtek ALC256 HD, High Denition Audio
Ethernet
Controller/
Speed
LAN1: Intel® I226V with 10/100/1000/2500 Mbps
LAN2: Intel® I210AT with 10/100/1000 Mbps
Controller 2 x RJ-45
Rear I/O
HDMI 1 x HDMI 2.0b
DisplayPort 1 x DP 1.4a
VGA 1
Ethernet 1 x 1 Gigabit LAN, 1 x 2.5 Gigabit LAN
USB 2 x USB 3.2 Gen2

3
SBC-260
Internal
Connector
USB 4 x USB 2.0 (2 x 2.54 pitch header)
COM COM1, COM2 (RS-232/422/485)
COM3, COM4 (RS-232)
GPIO 4 x GPI, 4 x GPO
LVDS 1 (connector with LVDS/eDP signal, switch by
BIOS)
SATA PWR
Output 1
Speaker
Header 1
MIPI Camera
Header 1 (optional)
Storage M.2 1 x M.2 (Key M, 2242/2260/2280) with PCIe
Gen3 x1 or SATA3 for SSD
SATA 1 x SATA3
Security TPM TPM 2.0 onboard IC
Watchdog
Timer
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, ...255 Sec
Power
Requirements
Input PWR 9~36V DC-In with 4-pin wafer PWR
Power On
AT/ATX Supported
-AT: Directly PWR on as power input ready
-ATX: Press button to PWR on aer power input
ready
Environment
Operating
Temp -20ºC - 70ºC
Storage Temp -40ºC - 85ºC
Operating
Humidity 5% - 90%
Storage
Humidity 5% - 90%

4
1.3 Motherboard Layout
Top:
1
JGPIO1
SPEAKER1
1
PANEL1
RESET HDLED
PWRB TN P LE D
1
SATA_PWR1
LVDS 1
1
1
BLT_VOL1
PNL_PWR1
1
1
DC_IN1
1
JGPIO_SET1
1
HD_AUDIO1
CPU_FAN1
M2_M1
DDR4_A1 (Support DDR4 Only)
BUZZ2
1
BKT_PWR1
1
BLT_PWR1
1
PWR_COM2
1
PWR_COM1
1
BLT_PWM1
1
BIOS
Chip
VGA1
USB 3.2 Gen2:
T: USB3_2
B: USB3_1
LAN1
LAN2
T: DP
B: HDMI
M2_E1
M2_B1
SIM1
1
JGPIO_PWR1
1
USB2_4_5
1
USB2_6_7
1
COM2
1
COM4
1
COM1
1
COM3
1
DACC1
1
CLRMOS1
1
CLRMOS2
1
CI1
SATA3_0
MIPI1
1
BLT_PWM2
SIO_AT1
1
12
9
2567
8
10
15
16
13
14
17
21
22
18
20
23
24
27 25
26
30 28
29
3
11
14
19
Industrial
SBC-260
111 1
1
1
1
1

5
SBC-260
Bottom:
ESPI1
1
BUZZ1
32 31

6
1 : 3W Audio AMP Output Wafer (SPEAKER1)
2 : Front Panel Audio Header (HD_AUDIO1)
3 : CPU FAN Connector (+12V) (CPU_FAN1)
4 : SATA Power Output Connector (SATA_PWR1)
5 : SATA3 Connector (SATA3_0)
6 : MIPI Connector (MIPI1)
7 : Panel Power Select (LCD_VCC) (PNL_PWR1)
8 : Backlight Volume Control (BLT_VOL1)
9 : Backlight Power Select (LCD_BLT_VCC) (BKT_PWR1)
10 : Inverter Power Control Wafer (BLT_PWR1)
11 : CON_LBKLT_CTL Voltage Level (BLT_PWM2)
12 : Brightness Control Mode (BLT_PWM1)
13 : LVDS Panel Connector (LVDS1)
14 : M.2 Key-M Socket (M2_M1)
15 : M.2 Key-E Socket (M2_E1)
16 : M.2 Key-B Socket (M2_B1)
17 : Chassis Intrusion Header (CI1)
18 : 4-pin DC-in PWR Connector (Input +9V~+36V) (DC_IN1)
19 : Clear CMOS Header (CLRMOS1)
20 : Auto Clear CMOS Header (CLRMOS2)
21 : ATX/AT Mode Jumper (SIO_AT1)
22 : DACC1
23 : GPIO Default Setting (JGPIO_SET1)
24 : Internal COM Port Headers
COM1, COM2 (RS232/422/485)
COM3, COM4 (RS232)
25 : COM Port Pin9 PWR Setting Jumpers
PWR_COM1 (For COM Port1)
PWR_COM2 (For COM Port2)
26 : Buzzer Header (BUZZ2)
27 : USB 2.0 Connectors (USB2_4_5, USB2_6_7)
28 : System Panel Header (PANEL1)
29 : Digital Input/Output Power Select (JGPIOPWR) (JGPIO_PWR1)
30 : Digital Input/Output Pin Header (JGPIO1)
Back Side:
31 : Buzzer (BUZZ1)
32 : ESPI Connector (ESPI1)

7
SBC-260
1.4 I/O Panel
1 VGA Port (VGA1)
2 USB 3.2 Gen2 Ports (USB3_1_2)
3 DisplayPort (DP)
4 RJ45 LAN Port (LAN1)*
5 RJ45 LAN Port (LAN2)**
6 HDMI Port (HDMI)
* ere are two LEDs next to the LAN1 port. Please refer to the table below for the LAN1 port
LED indications.
LAN1 Port LED Indications
ACT/LINK
LED
SPEED
LED
LAN1 Port
13
245
6
Status Description
O 10Mbps/100Mbps connection
Orange 1Gbps connection
Green 2.5Gbps connection
Activity/Link LED SPEED LED
Status Description
O No Link
Blinking Data Activity
On Link
** ere are two LEDs next to the LAN2 port. Please refer to the table below for the LAN2 port
LED indications.
LAN2 Port LED Indications
ACT/LINK
LED
SPEED
LED
LAN2 Port
Status Description
O 10Mbps connection
Orange 100Mbps connection
Green 1Gbps connection
Activity/Link LED SPEED LED
Status Description
O No Link
Blinking Data Activity
On Link

8
1.5 Block Diagram
Intel
Alder Lake-N
FCBGA 1493
Package (35*24mm)
Chrontel
CH7513 DDIA
LVDS/eDP
HDMI
Connector
eSPI
GPIO
HDMI ITE
IT66318
DDIB
Display port TCP0
VGA
Connector
VGA Realtek
RTD2168
TCP1
2 x USB 3.2 Gen2
Connector
2 x USB 3.2 Gen2
RJ45
Connector
2.5G Intel
I226V
PCIe x1
RJ45
Connector
1G Intel
I210AT
PCIe x1
DDR4 3200MHZ SO-DIMM
Line out & Mic in &
Speaker out
Header
Audio Realtek
ALC256
HDA
2 x USB 2.0
Header
2 x USB 2.0
2 x USB 2.0
Header
2 x USB 2.0
NUVOTON
NCT6126D
COM 232*2
COM 232/422/485*2 UART*4
CPU FAN1
DGIO
FAN
GPIO
SATA SATA Port
PCIe Gen3 x1
M.2 Key E
CNVi
USB 2.0
PCIe Gen3 x1
M.2 Key B
USB 3.2 Gen2
USB 2.0
PCIe Gen3 x1/SATA M.2 Key M
SIM Card
SIM
SPI INFINEON
SLB9672VU2.0
2 x USB 2.0
SBC-260
LVDS/
By pass mode

9
SBC-260
Chapter 2 Installation
is is a 3.5"SBC (5.8-in x 4-in x 1.02-in, 14.7 cm x 10.2 cm x 2.60 cm) form factor mother-
board. Before you install the motherboard, study the conguration of your chassis to ensure
that the motherboard ts into it.
2.1 Screw Holes
Place screws into the holes to secure the motherboard to the chassis.
2.2 Pre-installation Precautions
Take note of the following precautions before you install motherboard components or change
any motherboard settings.
1. Unplug the power cord from the wall socket before touching any component.
2. To avoid damaging the motherboard components due to static electricity, NEVER place
your motherboard directly on the carpet or the like. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle components.
3. Hold components by the edges and do not touch the ICs.
4. Whenever you uninstall any component, place it on a grounded antistatic pad or in the
bag that comes with the component.
5. Heatsink (e thermal solution of whole system needs to be designed additionally.)
Make sure to unplug the power cord before installing or removing the motherboard. Failure to
do so may cause physical injuries to you and damages to motherboard components.
Do not over-tighten the screws! Doing so may damage the motherboard.
Before you install or remove any component, ensure that the power is switched o or the
power cord is detached from the power supply. Failure to do so may cause severe damage to
the motherboard, peripherals, and/or components.

10
2.3 Installation of Memory Modules (SO-DIMM)
SBC-260 provides one 260-pin DDR4 (Double Data Rate 4) SO-DIMM slots, and supports
Single Channel Memory Technology.
Step 1. Align a SO-DIMM on the slot such that the notch on the SO-DIMM matches the
break on the slot.
Step 2. Firmly insert the SO-DIMM into the slot until the retaining clips at both ends fully
snap back in place and the SO-DIMM is properly seated.
e SO-DIMM only ts in one correct orientation. It will cause permanent damage to the
motherboard and the SO-DIMM if you force the SO-DIMM into the slot at incorrect orien-
tation.

11
SBC-260
2.4 Expansion Slots
ere are 3 M.2 sockets and 1 SIM socket on this motherboard.
SIM socket: 1 x SIM socket connected to M.2 key B
M.2 sockets: 1 x M.2 (Key E, 2230) with PCIe Gen3 x1, USB 2.0 and CNVi for Wireless
1 x M.2 (Key B, 3042/3052) with PCIe Gen3 x1/USB 3.2/USB 2.0 and SIM for
4G/5G
1 x M.2 (Key M, 2242/2260/2280) with PCIe Gen3 x1 or SATA3 for SSD
M.2 Key-E Socket M.2 Key-B Socket M.2 Key-M Socket
(M2_E1) (M2_B1) (M2_M1)
Pin Signal Name Signal Name Pin
1 GND +3.3V 2
3 GND +3.3V 4
5NA NA 6
7NA NA 8
9 GND SATA_LED 10
11 NA +3.3V 12
13 NA +3.3V 14
15 GND +3.3V 16
17 NA +3.3V 18
19 NA NA 20
21 GND NA 22
23 NA NA 24
25 NA NA 26
27 GND NA 28
29 NA NA 30
31 NA NA 32
33 GND NA 34
35 NA NA 36
37 NA NA 38
39 GND NA 40
41 PERn0/SATA-B+ NA 42
43 PERp0/SATA-B- NA 44
45 GND NA 46
47 PETn0/SATA-A- NA 48
49 PETp0/SATA-A+ PERST# 50
51 GND CLKREQ# 52
53 PEFCLKn NA 54
55 PEFCLKp NA 56
57 GND NA 58
67 NA NA 68
69 PEDET +3.3V 70
71 GND +3.3V 72
73 GND +3.3V 74
75 GND
Pin Signal Name Signal Name Pin
1 GND +3.3V 2
3 USB_D+ +3.3V 4
5 USB_D- NA 6
7 GND NA 8
9 CNV_WGR_D1- CNV_RF_RESET 10
11 CNV_WGR_D1+ NA 12
13 GND MODEM_
CLKREQ 14
15 CNV_WGR_D0- NA 16
17 CNV_WGR_D0+ GND 18
19 GND NA 20
21 CNV_WGR_
CLK- CNV_BRI_RSP 22
23 CNV_WGR_
CLK+
CNV_BGI_DT 32
33 GND CNV_RGI_RSP 34
35 PE Tp CNV_BRI_DT 36
37 PETn NA 38
39 GND NA 40
41 PERp NA 42
43 PERn NA 44
45 GND NA 46
47 PEFCLKp NA 48
49 PEFCLKn SUSCLK 50
51 GND PERST0# 52
53 CLKREQ# W_DISABLE1# 54
55 NA W_DISABLE2# 56
57 GND SMB_DATA 58
59 CNV_WT_D1- SMB_CLK 60
61 CNV_WT_D1+ NA 62
63 GND NA 64
65 CNV_WT_D0- NA 66
67 CNV_WT_D0+ NA 68
69 GND NA 70
71 CNV_WT_CLK- +3.3V 72
73 CNV_WT_CLK+ +3.3V 74
75 GND
Pin Signal Name Signal Name Pin
1NA +3.3V 2
3 GND +3.3V 4
5 GND FuLL_Card_
Power_o 6
7 USB_D+ W_DISABLE1# 8
9 USB_D- WWAN_LED# 10
11 GND
NA 20
21 GND NA 22
23 NA NA 24
25 NA W_DISABLE2# 26
27 GND NA 28
29 USB3_RX- UIM_RESET 30
31 USB3_RX+ UIM_CLK 32
33 GND UIM_DATA 34
35 USB3_TX- UIM_PWR 36
37 USB3_TX+ NA 38
39 GND NA 40
41 PERn0 NA 42
43 PERP0 NA 44
45 GND NA 46
47 PETn0 NA 48
49 PETP0 PERST# 50
51 GND CLKREQ# 52
53 PEFCLKn NA 54
55 PEFCLKp NA 56
57 GND NA 58
59 NA NA 60
61 NA NA 62
63 NA NA 64
65 NA NA 66
67 NA NA 68
69 PEDET +3.3V 70
71 GND +3.3V 72
73 GND +3.3V 74
75 NA

12
1 2 3
2.5 Jumpers Setup
The illustration shows how jumpers are setup.
When the jumper cap is placed on pins, the
jumper is “Short.” If no jumper cap is placed
on pins, the jumper is “Open.” The illustration
shows a 3-pin jumper whose pin1 and pin2 are
“Short” when jumper cap is placed on these 2
pins.
Panel Power Select (LCD_VCC)
(5-pin PNL_PWR1)
(see p. 4 No. 7)
Use this to set up the VDD power of the LVDS connector.
Setting Description
1-2 +3V (Default)
2-3 +5V
3-4 +5V
4-5 +12V
1
5
Backlight Power Select
(LCD_BLT_VCC)
(5-pin BKT_PWR1)
(see p. 4 No. 9)
Use this header to set up the backlight power of the LVDS connector and the panel backlight
power of BLT_PWM1.
Setting Description
1-2 LCD_BLT_VCC : +5V
(Default)
2-3 LCD_BLT_VCC : +12V
4-5 LCD_BLT_VCC : DC_IN
CON_LBKLT_CTL Voltage Level
(3-pin BLT_PWM2)
(see p. 4 No. 11)
Brightness Control Mode
(3-pin BLT_PWM1)
(see p. 4 No. 12)
Please set to 1-2 when adjusting brightness by Brightness Control bar under OS.
Please set to 2-3 when adjusting brightness by BLT_VOL1.
Setting Description
1-2 From eDP PWM to CON_
LBKLT_CTL
2-3 From LVDS PWM to CON_LBKLT_CTL
(Default)
Setting Description
1-2 3V Level (Default)
2-3 5V Level
1 2 3
1
5

13
SBC-260
Clear CMOS Header
(3-pin CLRMOS1)
(see p. 4, No. 19)
NOTE: CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system param-
eters to default setup, please turn o the computer and unplug the power cord from the power
supply. Aer waiting for 15 seconds, use a jumper cap to short pin2 and pin3 on CLRMOS1
for 5 seconds. However, please do not clear the CMOS right aer you update the BIOS. If you
need to clear the CMOS when you just nish updating the BIOS, you must boot up the system
rst, and then shut it down before you do the clear-CMOS action. Please be noted that the
password, date, and time will be cleared only if the CMOS battery is removed.
Auto Clear CMOS Header
(2-pin CLRMOS2)
(see p. 4, No. 20)
NOTE: CLRMOS2 allows you to clear the data in CMOS automatically when AC power on.
e data in CMOS includes system setup information such as system password, date, time,
and system setup parameters. To clear and reset the system parameters to default setup, please
turn o the computer and unplug the power cord, then use a jumper cap to short the pins on
CLRMOS2.
Chassis Intrusion Header
(2-pin CI1)
(see p. 4 No. 17)
is motherboard supports CASE OPEN detection feature that detects if the chassis cover has
been removed. is feature requires a chassis with chassis intrusion detection design.
Setting Description
Open Normal (Default)
Short Active Case Open
Setting Description
1-2 Normal (Default)
2-3 Clear CMOS
1
2
3
1 2
1 2
Setting Description
1-2 Normal (Default)
2-3 Auto Clear CMOS
when AC Power On
ATX/AT Mode Jumper
(2-pin SIO_AT1)
(see p. 4 No. 21)
Setting Description
Open ATX Mode (Default)
Short AT Mode
1 2

14
1 2 3
GPIO Default Setting
(3-pin JGPIO_SET1)
(see p. 4 No. 23)
e header is used for GPIO default value setting for either pull high or pull low. Pulling the
header to a high/low value means the voltage is anchored to VCC/GND, in a stable, non-
oating state.
Setting Description
1-2 Pull-High (Default)
2-3 Pull-Low
COM Port Pin9 PWR Setting Jumpers
(3-pin PWR_COM1 (For COM Port1),
PWR_COM2 (For COM Port2))
(see p. 4 No. 25)
e maximum current for per port is 1A, and the power supply is either 5V or 12V. Use the
jumpers to set the power for COM port pin 9.
Setting Description
1-2 +5V (Default)
2-3 +12V
1 2 3
Digital Input/Output Power Select
(3-pin JGPIO_PWR1)
(see p. 4 No. 29)
e maximum current JGPIO_PWR1 provides is 1A.
Setting Description
1-2 +12V
2-3 +5V (Default)
1
2
3
DACC1
(2-pin DACC1)
(see p. 4 No. 22)
Auto clear CMOS when system boot improperly.
Setting Description
Open No ACC
Short ACC (Default)
1 2

15
SBC-260
2.6 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these
headers and connectors. Placing jumper caps over the headers and connectors will cause per-
manent damage of the motherboard!
2W Audio AMP Output Wafer
(4-pin SPEAKER1)
(see p. 4, No. 1)
Pin Signal Name
1SPK L-
2 SPK L+
3 SPK R+
4SPK R-
4
1
Front Panel Audio Header
(8-pin HD_AUDIO1)
(see p. 4 No. 2)
is is line out/microphone interface for front panel audio cable that allows jack detection,
convenient connection and control of audio devices.
Pin Signal Name Signal Name Pin
1 MIC1_L GND 2
3 MIC1_R 4
5 OUT2_R MIC1_RET 6
7 J_SENSE 8
9 OUT2_L OUT_RET 10
9
1
10
2
CPU_Fan Connector (+12V)
(4-pin CPU_FAN1)
(see p. 5, No. 3)
Pin Signal Name
1 GND
2 +12V
3 CPU_FAN_SPEED
4 FAN_SPEED_CONTROL
e board oers three 4-pin CPU fan (Smart Fan) connectors which are compatible with
3-pin CPU fan. If you connect a 3-pin CPU fan to the CPU fan connector on this mother-
board, please connect it to pin 1-3. e maximum current is 1A.
4 1