AST Peva-450I User manual

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Standard Operating Manual
___________________________________________________________
AST Peva-450I E-Beam Evaporation System

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Contents
1. Picture and Location
2. Process Capabilities
2.1 Cleanliness Standard
2.2 Available Deposition Materials
2.3 Performance of the AST Peva-450I
3. Contact List and How to Become a Qualified User
3.1 Emergency Responses and Communications
3.2 Training to Become a Qualified AST Peva-450I User
4. Operating Procedures
4.1 System Description
4.2 Safety Warnings
4.3 Operation Rules
4.4 Initial System Checks
4.5 Status Checks
4.6 Venting the Chamber (Before Loading Wafers)
4.7 Inspecting the Chamber Before Use
4.8 Load Wafers
4.9 Pump Down
4.10 Deposition
4.11 Venting and Unloading
4.12 Pump Down and Shutdown
5. Appendix

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1. Picture and Location
Granville‐PhillipsVacuum
Gauge
TouchScreenPanel
Logsheet
MAXTEKMDC‐360C
DepositionController
Telema r k XYSweep
Viewport
Main,E‐GunandHeating
Power Breakers
TT‐3High Voltage DC
Power Su
pp
l
y

Fig 1: AST Peva-450I E-Beam Evaporation System
This tool is located at NFF Enterprise Center Cleanroom Room 4162
2. Process Capabilities
2.1 Cleanliness Standard
AST Peva-450I E-Beam Evaporation System is “Non-Standard” equipment for metal
evaporation process use.
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2.2 Available Deposition Materials
The following sources are available in AST Peva-450I E-Beam Evaporation System.
AST Peva-450I: Al, Ti, Ni and Au
NOTE: Consult a NFF EC staff member prior to do new materials other than above listed materials.
Hazardous or Radioactive materials are not allowed to be deposited in AST Peva-450I.
2.3 Performance of the AST Peva-450I E-Beam Evaporation System
What the AST Peva-450I CAN do
It can provide thin films (≤3000A thick) of various metal and semi-conductors
with precision measurement of film thickness via crystal monitoring.
It provides very directional evaporation particularly useful for lift-off metal
patterning.
It has a single vacuum chamber for METAL evaporation processes.
Deposition on up to 2” and 4” wafers at once.
Deposition on pieces, which are fixed to a 2” or 4” dummy via HB 836
Anti-static polyimide film silicone adhesive tape.
Deposition rate is fixed on 1A/s.
What the AST Peva-450I CANNOT do
Thick film deposition is not allowed because of too long processing time, wear
on the system, expense of materials, and adhesion issues with your sample.
Evaporation of dielectrics is not allowed.

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3. Contact List and How to Become a User
3.1 Emergency Responses and Communications
Security Control Center: 2358-8999 (24hr) & 2358-6565 (24hr)
Safety Officer: Mr. Wing Leong CHUNG 2358-7211 & 64406238
Deputy Safety Officer: Mr. Man Wai LEE 2358-7900 & 9621-7708
NFF EC Technician: Mr. Peter Yiu Cheong PUN 2358-7225 & 2358-7218
NFF Phase 2 Technician: Mr. Wilson Pui Keung YIP 2358-7894
3.2 Training to Become a Qualified AST Peva-450I User
Please follow the procedure below to become a qualified user of the AST Peva-450I.
1. Read all materials on the NFF website concerning the AST Peva-450I.
2. Send an e-mail to NFF requesting AST Peva-450I safety operation training.
Scheduling can take up to several weeks due to the many requests coming in
for this tool.
4. Operating Procedures
4.1 System Description
AST Peva-450I is consisted of a single vacuum chamber for METAL evaporation
processes that use an electron beam to heat the metal sources. There are 4-pocket
E-Beam evaporator used for depositing Ti, Al, Au and Ni. The materials are put into
crucible liners for better heat uniformity throughout the source material and to allow

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for easy removal and refilling. Wafers are loaded on a rotating planetary and pumped
to below 1.0e-7 Torr using a cryopump. Pump down time is typically 30 minutes for
base pressure 3.0e-6 Torr. Deposition thickness is controlled via a crystal monitor.
The evaporator has three distinct sub-systems: the vacuum system, the deposition
thickness control & monitoring, and electron-gun control. AST Peva-450I has three
control consoles:
1. Master console, Touch Screen Panel – AST Peva-450I Touch Screen Panel on
the front side.
2. MAXTEK MDC-360C Deposition Controller - in the middle side, with a
backlit LCD screen.
3. TELEMARK TT-3 control - power supply (below the “MAIN PWR”,
“E-GUN PWR” and “HEATING PWR” breakers).
Fig 2: Touch Screen Panel – Menu
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Fig 3: MAXTEK MDC-360C Deposition Controller
Fig 4: TELEMARK TT-3 High Voltage DC Power Supply
4.2 Safety Warnings
This equipment can cause injury if not used in a cautious manner.
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1. The operator can inhale particles while handling the chamber and is advised to
cover the mouth or wear a protective respirator mask with fine filter.
2. The system can also be easily damaged if the electron beam is misplaced or is
allowed to drift out of position.
3. Hot targets can cause burns.
4. While the amount of X-ray escaping the machine should be safe, we do not
have current measurements of the level of exposure. Do not operate this
machine if you could be pregnant.
5. Intense light will be emitted from the evaporation materials. Always use dark
safety goggles when you look in the chamber.
4.3 Operation Rules
1. If an equipment failure while being used, never try to fix the problem by
yourself. Please contact NFF staff.
2. Do not operate equipment unless you are properly trained and approved by
NFF staff.
3. Do not leave an on-going experiment unattended.
4. Do not do the evaporation process over ten minutes per run.
5. Should be at least ten minutes for target cooling after evaporation process.
6. Do not change the e-beam focus of the system.
4.4 Initial system checks
1. Touch screen panel will show the equipment is under high vacuum mode due
to “high vacuum valve, HV” and “cryopump, CP” are ON.
2. Chamber ion gauge pressure reads less than 1.0e-7 Torr on the vacuum gauge

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controller, unless the system was recently used. (Chamber ion gauge reading is
found on the Vacuum Gauge Controller.)
3. The cryopump temperature is 12K or less.
4. The chamber temperature is 20°C or less (reading is found on touch screen
panel)
5. The crystal health is greater than 80%. (Readout on MAKTEK controller.)
4.5 Status checks
1. Check the NFF website for reservations, problems and to see if it is already
enabled by another user.
2. Check for an EMPTY sign attached to the machine. Do not use if an IN USE
sign or MAINTENANCE sign is there. Check for problem notes.
3. The system is available if the initial system and status checks are normal.
Check-in the equipment and enable the system on NFF Machine Reservation
System. Place sign “IN USE” on the machine.
4.6 Venting the chamber (before loading wafers)
1. Make sure TELEMARK TT-3 power supply main power is turned off.
2. Wait 10 minutes for cooling after evaporation process.
3. Press the “VENT” button on the touch screen panel.
4. Wait until the 307 Granville-Phillips Vacuum Gauge Controller is displayed
7.6e+2 Torr (about 4 minutes).
5. Verify the main chamber door seal has decompressed.
6. The chamber door can be opened.

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4.7 Inspecting the chamber before use
1. Inspect the planetary for any “real” wafers belonging to other users. If any are
found, keep them in a labeled box.
2. Press “SH1” button on touch screen panel for shutter open.
3. Press “POCKET” button to entry E-Gun Pocket Control page and toggle
yellow button “OFF/ON” for crucible select and verify each source is
sufficient for process.
4. During toggle “OFF/ON” button to rotate the crucible to each position and
inspect for splattering, contamination, cracking or other problems. Be sure the
crucible assembly rotates freely. Don’t use crucibles in poor condition. Report
any problems to NFF staff.
5. Inspect the chamber for peeling, particles, and material splatters. Vacuum and
wipe if necessary. Thorough cleaning of the equipment every time will aid in
reproducible results long term.
6. Make sure the view port is clear, if not; please clean it firstly before close the
chamber door.
7. Load source into the correct crucible position posted on the front of the control
panel. NOTE: some materials are allowed in multiple crucibles. Making sure
they are clean and fit with the correct height and shape (snug not tight).
Correct height would be 60% to 100% of the crucibles original Height or
original weight.
8. If more pellets are needed, be careful not to overfill. Pellets must not protrude
above crucible or Hearth may get stuck or jam.
9. Return the shutter to the closed position.
10. If a new crystal monitor is needed (80% or less), change it now.

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11. Press “ABORT” button and replace a new crystal
12. Press “RESET” for verify crystal health is achieved to 98-99%
Single Vacuum Chamber
Source Material Correct Crucible
Al C1
Ti C2
Ni C3
Au C4
4.8 Load wafers
1. Load samples on to wafer holders or wafers face down on the planetary. The
outer circle of planetary is recommended for better uniformity.
2. To verify thickness load a bare Si wafer with a mask partially covering it for a
step height thickness monitor. The mask can be a partial wafer or Anti-static
polyimide film silicone adhesive tape.
3. Last chance to check you put inside samples and change crystal.
4.9 Pump down
1. When finish your samples load, close the chamber door and it will
automatically start to pump down.
2. DON’T GO AWAY YET!
3. Monitor the pump down to be sure the chamber door was correctly closed:
a. Verify that the roughing pump and roughing valve turn on within

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10-20 seconds.
b. Wait for the pressure to drop to the crossover pressure, i.e. for the
cryopump to take over at about 150 mTorr. This will take 5 minutes
4. Typically around one hour for the chamber to pump down to about 9.0e-7 Torr
or below.
4.10Deposition
On the MAXTEK MDC-360C Deposition Controller console:
1. Power “ON” deposition controller.
2. Press “ABORT” and “RESET” for clear previous user’s process record.
3. Select “VIEW/EDIT PROCESS” and entry to make your process for E-Beam
process.
4. The material library is located in “VIEW/EDIT MATERIAL”, we do not open
to public for modify and with a password for protection.
5. Select correct process number (available process number 2 for Au, 3 for Ti, 4
for Al and 6 for Ni, 1, 5, 7-8 are empty).
6. Set deposition thickness (e.g. key 1.234 = 1234A)
7. Deposition Rate is fixed on 1A/s.
8. Check that the correct parameters (e.g. process number & name [=NOTE
column], thickness and material) are displayed at the top of the screen.
9. Back to “MAIN MENU” by “<-“button in Arrow Keys.

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On TELEMARK TT-3 control console:
10. Power “ON” the E-GUN PWR breaker for TT-3 supply.
11. Press TELEMARK TT-3 power supply, Main Power breaker “ON”.
12. Wait 5 minutes for (cut back) fans to spin up and stop flashing.
On TELEMARK sweep power supply:
13. Verify sweep controller power supply green light is on.
14. Make sure 5 interlocks green lights are on, e.g. Zero, Water, Doors, VAC and
Ready.
15. Switch CONTROL/SWEEP SELECT switch to “SWEEP SELECT” and
“AUTO” position.
16. Switch POWER SUPPLY CONTROLLER switch to “ON” position.
17. JOYSTICK/SWEEP CONTROL BOX: spiral/triangle/manual, switch to
“spiral”.
18. Pre-center E-Beam position using the “fine tune” button for position
adjustment and readouts from the LAT/LONG position.
On the master console touch screen panel:
19. Press “BACK” button to return “Menu” page.
20. Select “RECIPE” button.
21. Press “↑” or “↓” buttons for “RECIPE NUMBER” and “RECIPE NAME”
columns selection.
22. Make sure “PROCESS” number column is equivalent to “RECIPE

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NUMBER” of MAXTEK MDC-360C Deposition Controller.
23. Press “LOAD” for recipe load.
24. Press “BACK” button to return “Menu” page.
25. Select “PROCESS” button to return “Process” page.
26. Check that the base pressure is about 3.0e-6 Torr or below. Record the pump
down time, pressure and your deposition thickness in the logsheet.
27. Press “START” button for E-Beam process start.
28. Observe the electron beam each time the power is increased and adjust the
position as necessary using the “LAT/LONG POS” in the SWEEP SELECT.
29. Verify that the E-Beam is directed into the center of the crucible.
IMPORTANT!
30. Don’t let the E-Beam go outside the source area and ruin the crucible!
31. Check that the rate of deposition is normal for the power applied (In general,
deposition power is not over 40%). If not, Press “STOP” button to stop
running process immediately, please contact to NFF staff.
On the MAXTEK MDC-360C Deposition Controller console:
32. When process is started, be sure that the DC amps gauge does not exceed
0.4A.
33. Check that the Kilovolts meter reads at -6.82kV, not exceed -7kV.
34. If so, press “STOP” button in “Touch Screen Panel”
35. Report these problems to NFF staff.
On the master console touch screen panel:
36. To deposit another type of material let the crucible cool for 5-10 minutes.

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37. Rotate to the new crucible. Follow instructions starting at Step 1 in the
“Deposition” section.
38. Selected correct crucible, it may take a moment to rotate. See position/material
list posted on E-Gun Pocket Control page.
39. If finish the process, make sure wait at least 10 minutes for all materials firstly,
this cools the targets before venting, which prevents oxidizing them.
40. Press TELEMARK TT-3 power supply, Main Power breaker “OFF”.
41. DO NOT VENT UNTIL COOLED FOR 10 MINUTES.
4.11 Venting and unloading
1. Make sure TELEMARK TT-3 power supply main power is turned off.
2. Wait 10 minutes for cooling after evaporation process.
3. Press the “VENT” button on the touch screen panel.
4. Wait until the 307 Granville-Phillips Vacuum Gauge Controller is displayed
7.6e+2 Torr (about 10 minutes).
5. Verify the main chamber door seal has decompressed.
6. The chamber door can be opened.
7. Remove wafers and inspect visually. You’ll be responsible if damage
has occurred and you didn’t report it.
8. Put the Al dummy back to substrate holder.
9. Perform the required crucible, shutter, and chamber inspections and clean as
per previous instructions.
10. If process finish, please check-out the equipment and disable the system on

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NFF Machine Reservation System. Place sign “EMPTY” on the machine.
4.12 Pump down and shutdown
1. When finish samples unloading, close the chamber door and it will
automatically start to pump down.
2. DON’T GO AWAY YET!
3. Monitor the pump down to be sure the chamber door was correctly closed:
a. Verify that the roughing pump and roughing valve turn on within
10-20 seconds.
b. Wait for the pressure to drop to the crossover pressure, i.e. for the
cryopump to take over at about 150 mTorr. This will take 5 minutes.
4. RECORD RESULTS in the logbook.
5. Be sure the crossover pressure is met and that the cryopump valve opened.
6. Clean up the area and return items to their proper locations.
7. Place an EMPTY sign on the machine.
8. Write down any problems or comments in the logbook.

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Appendix
Touch Screen Panel – Start, Stop and
Vent buttons
Touch Screen Panel – Process Number
Selection
Touch Screen Panel – E-GUN Pocket
Control
MAIN PWR, E-GUN PWR and
HEATING PWR Breakers
MDC360C – Deposition Rate, Power,
Thickness and Process Time
Parameters
MDC-360C – Alpha and Number
Keypad
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TT-3 Control – Interlocks TT-3 Control – XY Sweep (Long and
Lat)
MDC-360C – Main Menu MDC-360C – Select Process
MDC-360C – Material and Thickness
Input
MDC-360C – Display, e.g. Deposition
Rate, Power, Thickness, etc…
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