Beckhoff EPI1 Series User manual

Documentation | EN
EPI1xxx, ERI1xxx
IO-Link box modules with digital inputs
2021-06-07 | Version: 1.5

Table of contents
EPI1xxx, ERI1xxx 3Version: 1.5
Table of contents
1 Foreword ....................................................................................................................................................5
1.1 Notes on the documentation..............................................................................................................5
1.2 Safety instructions .............................................................................................................................6
1.3 Documentation issue status ..............................................................................................................7
2 Product overview.......................................................................................................................................8
2.1 EPI1xxx, ERI1xxx Module overview ..................................................................................................8
2.2 EPI1008-000x, ERI1008-000x...........................................................................................................9
2.2.1 Introduction ........................................................................................................................ 9
2.2.2 Technical Data................................................................................................................. 10
2.2.3 Process image ................................................................................................................. 11
2.3 EPI1809-002x, ERI1809-002x.........................................................................................................12
2.3.1 Introduction ...................................................................................................................... 12
2.3.2 Technical data ................................................................................................................. 13
2.3.3 Process image ................................................................................................................. 14
3 IO-Link basics ..........................................................................................................................................15
3.1 IO-Link system configuration ...........................................................................................................15
3.2 Establishment of IO-Link communication ........................................................................................17
3.3 Device description IODD .................................................................................................................18
3.4 Parameter server.............................................................................................................................18
3.5 Data transfer rate.............................................................................................................................18
4 Mounting and connection.......................................................................................................................20
4.1 Mounting..........................................................................................................................................20
4.1.1 Dimensions EPIxxxx-xx0x and ERIxxxx-xx0x.................................................................. 20
4.1.2 Dimensions EPIxxxx-xx2x and ERIxxxx-xx2x.................................................................. 21
4.1.3 Fixing ............................................................................................................................... 22
4.1.4 Tightening torque for connectors ..................................................................................... 23
4.2 IO-Link connection...........................................................................................................................24
4.2.1 IO-Link master connection............................................................................................... 24
4.2.2 Connection IO-Link Device .............................................................................................. 25
4.2.3 IO-Link status LED........................................................................................................... 26
4.3 Status LEDs for power supply .........................................................................................................26
4.4 Signal connection ............................................................................................................................27
4.4.1 Digital inputs M8 and M12 ............................................................................................... 27
4.5 UL Requirements.............................................................................................................................28
4.6 Cabling ............................................................................................................................................28
5 Commissioning/configuration of IO-Link master/device.....................................................................30
5.1 IO-Link master .................................................................................................................................30
5.1.1 Offline configuration settings - TwinCAT (master) ........................................................... 30
5.1.2 Online configuration settings - TwinCAT (master) ........................................................... 36
5.1.3 Configuration via TwinCAT - explanation tabs................................................................. 42
5.1.4 Restoring the delivery state of an EtherCAT device ........................................................ 52
5.2 Accessing IO-Link parameters ........................................................................................................52
5.3 IO-Link device..................................................................................................................................55

Table of contents
EPI1xxx, ERI1xxx4 Version: 1.5
5.3.1 Configuration of the IO-Link devices................................................................................ 55
5.3.2 EPI1xxx, ERI1xxx - Process data .................................................................................... 64
5.3.3 Settings of the IO-Link devices ........................................................................................ 64
5.3.4 EPIxxxx, ERIxxxx - Setting of the IO-Link device parameters ......................................... 66
5.3.5 EPI1xxx, ERI1xxx - Set up the parameters of the IO-Link device ................................... 72
5.3.6 EPI1xxx, ERI1xxx - Input debouncing and input signal extension................................... 75
5.3.7 Object Overview - EPI1809-0021 .................................................................................... 77
5.3.8 EPI1008-000x, ERI1008-000x - Object description and parameterization ...................... 78
5.3.9 EPI1809-002x, ERI1809-002x - Object description and parameterization ...................... 81
5.3.10 Firmware update of the IO-Link device............................................................................ 84
6 Appendix ..................................................................................................................................................86
6.1 General operating conditions...........................................................................................................86
6.2 Accessories .....................................................................................................................................87
6.3 Support and Service ........................................................................................................................88

Foreword
EPI1xxx, ERI1xxx 5Version: 1.5
1 Foreword
1.1 Notes on the documentation
Intended audience
This description is only intended for the use of trained specialists in control and automation engineering who
are familiar with the applicable national standards.
It is essential that the documentation and the following notes and explanations are followed when installing
and commissioning these components.
It is the duty of the technical personnel to use the documentation published at the respective time of each
installation and commissioning.
The responsible staff must ensure that the application or use of the products described satisfy all the
requirements for safety, including all the relevant laws, regulations, guidelines and standards.
Disclaimer
The documentation has been prepared with care. The products described are, however, constantly under
development.
We reserve the right to revise and change the documentation at any time and without prior announcement.
No claims for the modification of products that have already been supplied may be made on the basis of the
data, diagrams and descriptions in this documentation.
Trademarks
Beckhoff®, TwinCAT®, TwinCAT/BSD®, TC/BSD®, EtherCAT®, EtherCATG®, EtherCATG10®, EtherCATP®,
SafetyoverEtherCAT®, TwinSAFE®, XFC®, XTS® and XPlanar® are registered trademarks of and licensed by
Beckhoff Automation GmbH. Other designations used in this publication may be trademarks whose use by
third parties for their own purposes could violate the rights of the owners.
Patent Pending
The EtherCAT Technology is covered, including but not limited to the following patent applications and
patents: EP1590927, EP1789857, EP1456722, EP2137893, DE102015105702 with corresponding
applications or registrations in various other countries.
EtherCAT® is registered trademark and patented technology, licensed by Beckhoff Automation GmbH,
Germany.
Copyright
© Beckhoff Automation GmbH & Co. KG, Germany.
The reproduction, distribution and utilization of this document as well as the communication of its contents to
others without express authorization are prohibited.
Offenders will be held liable for the payment of damages. All rights reserved in the event of the grant of a
patent, utility model or design.

Foreword
EPI1xxx, ERI1xxx6 Version: 1.5
1.2 Safety instructions
Safety regulations
Please note the following safety instructions and explanations!
Product-specific safety instructions can be found on following pages or in the areas mounting, wiring,
commissioning etc.
Exclusion of liability
All the components are supplied in particular hardware and software configurations appropriate for the
application. Modifications to hardware or software configurations other than those described in the
documentation are not permitted, and nullify the liability of Beckhoff Automation GmbH & Co. KG.
Personnel qualification
This description is only intended for trained specialists in control, automation and drive engineering who are
familiar with the applicable national standards.
Description of instructions
In this documentation the following instructions are used.
These instructions must be read carefully and followed without fail!
DANGER
Serious risk of injury!
Failure to follow this safety instruction directly endangers the life and health of persons.
WARNING
Risk of injury!
Failure to follow this safety instruction endangers the life and health of persons.
CAUTION
Personal injuries!
Failure to follow this safety instruction can lead to injuries to persons.
NOTE
Damage to environment/equipment or data loss
Failure to follow this instruction can lead to environmental damage, equipment damage or data loss.
Tip or pointer
This symbol indicates information that contributes to better understanding.

Foreword
EPI1xxx, ERI1xxx 7Version: 1.5
1.3 Documentation issue status
Version Comment
1.5 • Dimensions updated
• UL requirements updated
1.4 • Status LEDs for power supply updated
1.3 • Chapter "process data" added
1.2 • ERI1xxx added
• Introduction updated
• Technical Data updated
• Connection IO-Link Master updated
• Cabling updated
• Update chapter IO-Link Master and IO-Link Device
• Update structure
• Corrections
1.1.2 • EPI1008-000x - Technical Data updated
• EPI1802-002x - Technical Data updated
1.1.1 • Status LEDs for power supply updated
• Firmware update of the IO-Link device updated
1.1.0 • EPI1008-000x - Object description and parameterization updated
• EPI1809-002x - Object description and parameterization updated
1.0.0 • First publication
0.6 • Corrections
0.5 • First preliminary version
Firm and hardware version
The documentation refers to the firm and hardware status that was valid at the time it was prepared.
The properties of the modules are subject to continuous development and improvement. Modules having
earlier production statuses cannot have the same properties as modules with the latest status. Existing
properties, however, are always retained and are not changed, so that these modules can always be
replaced by new ones.
The firmware and hardware version (delivery state) can be found in the batch number (D number) printed at
the side of the IO-Link box module.
Syntax of the batch number (D number)
D: WW YY FF HH
WW - week of production (calendar week)
YY - year of production
FF - firmware version
HH - hardware version
Example with D No. 29 10 02 01:
29 - week of production 29
10 - year of production 2010
02 - firmware version 02
01 - hardware version 01

Product overview
EPI1xxx, ERI1xxx8 Version: 1.5
2 Product overview
2.1 EPI1xxx, ERI1xxx Module overview
Digital input modules
Module Signal con-
nection
Number of in-
puts
Filter (Default
setting)
Housing
EPI1008-0001 [}9] 8 x M8 8 3.0ms Industrial housing
ERI1008-0001 [}9] 8 x M8 8 3.0ms Zinc die-cast housing
EPI1008-0002 [}9] 4 x M12 8 3.0ms Industrial housing
ERI1008-0002 [}9] 4 x M12 8 3.0ms Zinc die-cast housing
EPI1809-0021 [}12] 16 x M8 16 3.0ms Industrial housing, wide body
ERI1809-0021 [}12] 16 x M8 16 3.0ms Zinc die-cast housing, wide body
EPI1809-0022 [}12] 8 x M12 16 3.0ms Industrial housing, wide body
ERI1809-0022 [}12] 8 x M12 16 3.0ms Zinc die-cast housing, wide body

Product overview
EPI1xxx, ERI1xxx 9Version: 1.5
2.2 EPI1008-000x, ERI1008-000x
2.2.1 Introduction
Fig.1: EPI1008-0001, ERI1008-0001
Fig.2: EPI1008-0002, ERI1008-0002
8 digital inputs, 24VDC
The EPI1008 IO-Link box module with digital inputs acquires binary control signals from the process level,
and transfers them, electrically isolated, to the controller. The status of the signal is displayed by light
emitting diodes; the signal connection is made optionally through M8 connectors (EPI1008-0001,
ERI1008-0001) or M12 connectors (EPI1008-0002, ERI1008-0002). The sensors are supplied from US1
(derived from L+)

Product overview
EPI1xxx, ERI1xxx10 Version: 1.5
The IO-Link box modules with zinc die-cast housing (ERIxxxx) are ready for use in harsh industrial and
process environments. With the fully sealed design and metal surfaces the ERI series is ideal for
applications requiring enhanced load capacity and protection against weld spatter, for example.
Quick links
Installation
2.2.2 Technical Data
Technical data EPI1008-0001 ERI1008-0001 EPI1008-0002 ERI1008-0002
Communication IO-Link
Data transfer rate 230,4kBaud (COM 3)
IO-Link connection 1 x M12 connector a-coded
Specification version IO-Link V1.1, Class A
Requirements IO-Link Master V1.1
Number of inputs 8
Input connections [}27] M8 M12
Nominal input voltage 24VDC (-15%/+20%)
Input filter (adjustable) 3,0ms (default), adjustable between 0ms and 20ms
Input signal extension time
(adjustable)
0ms (default), adjustable between 0ms and 100ms
"0" signal voltage -3V...+5V (EN 61131-2, Type 3)
"1" signal voltage +11V...+30V (EN 61131-2, Type 3)
Input current typically 3 mA (EN 61131-2, Type 3)
Module electronic supply L+
Module electronic current
consumption
typically 100mA from L+
Sensor current consumption max. 0.5A total, short-circuit proof
Sensor supply US1 (derived from L+)
Process image 8 input bits
Housing Industrial housing
(polyamide) PA6
Zinc die-cast Industrial housing
(polyamide) PA6
Zinc die-cast
Permissible ambient
temperature during operation
-25°C ... +60°C
Permissible ambient
temperature during storage
-40°C ... +85°C
Vibration / shock resistance conforms to EN 60068-2-6 / EN 60068-2-27
EMC resistance/emission conforms to EN 61000-6-2 / EN 61000-6-4
Protection class IP65, IP66, IP67 (conforms to EN 60529)
Please also note the chapter general operation conditions [}86]
Installation position variable
Approvals CE, UL

Product overview
EPI1xxx, ERI1xxx 11Version: 1.5
2.2.3 Process image
Input 0 to Input 7
The IO-Link device is connected to IO-Link Port1 of the IO-Link master (EP6224-2022).
You will find the 8 digital inputs of the module (here using the EPI1008-0001 as an example) under Input 0
to Input 7.
Fig.3: EPI1008-000x, Process image
Also see about this
2EPI1xxx, ERI1xxx - Process data [}64]

Product overview
EPI1xxx, ERI1xxx12 Version: 1.5
2.3 EPI1809-002x, ERI1809-002x
2.3.1 Introduction
Fig.4: EPI1809-0021, ERI1809-0021
Fig.5: EPI1809-0022, ERI1809-0022
16 digital inputs, 24VDC
The IO-Link box modules EPI1809-002x and ERI1809-002x with digital inputs acquire the binary control
signals from the process level and transmit them, in an electrically isolated form, to the controller. The state
of the signals is indicated by light emitting diodes. The signals are connected via M8 connectors
(EPI1809-0021, ERI1809-0021) or M12 connectors (EPI1809-0022, ERI1809-0022).
The sensors are supplied from US1 (derived from L+).
The IO-Link box modules with zinc die-cast housing (ERIxxxx) are ready for use in harsh industrial and
process environments. With the fully sealed design and metal surfaces the ERI series is ideal for
applications requiring enhanced load capacity and protection against weld spatter, for example.

Product overview
EPI1xxx, ERI1xxx 13Version: 1.5
Quick links
Installation
2.3.2 Technical data
Technical data EPI1809-0021 ERI1809-0021 EPI1809-0022 ERI1809-0022
Communication IO-Link
Data transfer rate 230,4kBaud (COM 3)
IO-Link connection 1 x M12 connector, a-coded
Specification version IO-Link V1.1, Class A
Requirements IO-Link Master V1.1
Number of inputs 16
Input connections [}27] M8 M12
Nominal input voltage 24VDC (-15%/+20%)
Input filter (adjustable) 3,0ms (default), adjustable between 0ms and 20ms
Input signal extension time
(adjustable)
0ms (default), adjustable between 0ms and 100ms
"0" signal voltage -3V...+5 V (similar to EN 61131-2, Type 3)
"1" signal voltage +11V...+30 V (similar to EN 61131-2, Type 3)
Input current typically 3mA (similar to EN 61131-2, Type 3)
Module electronic supply L+
Module electronic current
consumption
typically 100mA from L+ (without sensor current)
Sensor current consumption max. 0.5A total, short-circuit proof
Sensor supply US1 (derived from L+)
Process image 16 input bits
Housing Industrial housing
(polyamide) PA6
Zinc die-cast
housing
Industrial housing
(polyamide) PA6
Zinc die-cast
housing
Permissible ambient temperature
during operation
-25°C ... +60°C
Permissible ambient temperature
during storage
-40°C ... +85°C
Vibration / shock resistance conforms to EN 60068-2-6 / EN 60068-2-27
EMC resistance / emission conforms to EN 61000-6-2 / EN 61000-6-4
Protection class IP65, IP66, IP67 (conforms to EN 60529)
Please note the chapter General operation conditions [}86]
Installation position variable
Approvals CE, UL

Product overview
EPI1xxx, ERI1xxx14 Version: 1.5
2.3.3 Process image
Input 0 to Input 15
The IO-Link device is connected to IO-Link Port1 of the IO-Link master.
You will find the 16 digital inputs of the module (here using the EPI1809-0021 as an example) under Input 0
to Input 15.
Fig.6: EPI1809-002x, Process image

IO-Link basics
EPI1xxx, ERI1xxx 15Version: 1.5
3 IO-Link basics
IO-Link represents a communication system for the connection of intelligent sensors and actuators to an
automation system in the IEC61131-9 standard under the designation "Single-drop digital communication
interface for small sensors and actuators" (SDCI).
The electrical connection data and the communication protocol are standardized and summarized in the IO-
Link specification.
IO-Link specification
The development of the EP6224-xxxxxx was based on IO-Link specification 1.1. At the time of the
preparation of this documentation, the IO-Link specification is entering the IEC standardization and
will be adopted in extended form as IEC61131-9. The new designation SDCI will be introduced at
the same time. As a member of the respective committee, Beckhoff supports the development of
IO-Link and reflects changes to the specification in its products.
3.1 IO-Link system configuration
An IO-Link system consists of an IO-Link master, one or more IO-Link devices and sensors or actuators. The
IO-Link master provides the interface to the higher-level controller and controls the communication with the
connected IO-Link devices. The EP6224-xxxx IO-Link master module from Beckhoff has four IO-Link ports,
each of which can be connected to an IO-Link-Device. IO-Link is therefore not a fieldbus, but a peer-to-peer
connection (see figure below).

IO-Link basics
EPI1xxx, ERI1xxx16 Version: 1.5
Fig.7: IO-Link overview: Peer-to-peer communication
The connected IO-Link devices have individual parameter information, which is detected during automatic
scanning with TwinCAT and transferred to the System Manager (see chapter "Basic function principles",
integration of IO-Link devices). Module-specific information can be imported offline in the form of an IO-Link
Device Description (IODD) and transferred to TwinCAT.
• How to manually configure (physically non-existent) IO-Link masters and devices in TwinCAT is
described under the following two links: Offline configuration settings - TwinCAT (master) [}30], 1.
Importing the device description IODD [}58]

IO-Link basics
EPI1xxx, ERI1xxx 17Version: 1.5
• How to configure physically existent IO-Link masters and devices in TwinCAT is described under the
following two links: Online configuration settings - TwinCAT (master) [}36], 2. Automatic scanning of
the IO-Link ports [}60]
3.2 Establishment of IO-Link communication
Establishment of IO-Link communication
The establishment of the IO-Link communication is illustrated in Fig. Establishment of IO-Link
communication. This illustrates in particular the sequence when automatically scanning [}60] the IO-Link
port.
Fig.8: Establishment of IO-Link communication
• If an IO-Link device is connected to a master port, the master attempts to establish communication. A
defined signal level, the WakeUp pulse, signals to the slave that UART bytes are to be sent from now
on.
From this point on, all data will be interpreted by the IO-Link slave as UART bytes.
• The master runs through all baud rates [}18], starting with the fastest baud rate (COM3 = 230
kbaud). A successful connection has been established when the slave responds to the WakeUp pulse.
• First of all the master reads the basic parameters (Vendor ID, Device ID, process data length,
telegram type and cycle time) and compares them with the existing configuration.
• If no connection could be established to the slave, or if the saved parameters differ from those read,
the corresponding error is output.

IO-Link basics
EPI1xxx, ERI1xxx18 Version: 1.5
• If the saved parameters differ from those read, the IO-Link device changes to the PREOP state.
If the IO-Link device specification is V1.1, the parameter server [}18] is now executed. If the IO-Link
device specification is V1.0, this step is omitted and the device changes directly to OP.
• Finally the cycle time is written and the device changes to OP. After that the master cyclically
exchanges data with the slave.
3.3 Device description IODD
IO-Link devices possess individual system information in the form of an IO device description (IODD), which
contains:
• Communication features
• Device parameters with value range and default values
• Identification, process and diagnostic data
• Device data
• Text description
• Picture of the device
• Vendor's logo
If the IODD is imported, then the device data are automatically detected during automatic scanning [}60]
with TwinCAT and adopted in the System Manager (cf. integration of the IO-Link devices).
3.4 Parameter server
In order to be able to use the functionality of the parameter server, both the IO-Link master and the IO-Link
device must be specified to V1.1. The IO-Link revision of the device can be read for the individual port under
Settings [}64]. The Beckhoff IO-Link master supports specification V1.1 from FW 07.
• The parameter server in the IO-Link master contains parameter data that are saved in the IO-Link
device. The memory capacity is max. 2kbyte (including header).
If the IO-Link-Device is exchanged, then the data are loaded from the parameter server into the new
device. The requirement for this is that the device is of the same type (VendorID & DeviceID must be
the same).
• If a new IO-Link-Device is configured, then the IO-Link master loads the parameters from the IO-Link-
Device into the parameter server when starting for the first time.
Data from other IO-Link devices that are already configured (VendorID & DeviceID do not correspond
to the configured device) are overwritten.
• At each further start the IO-Link master uses a checksum to check whether the data in the parameter
server correspond to those on the IO-Link-Device and if necessary downloads them to the device.
• If the parameters change during the device runtime, this can be reported via the Master's special
event. The master then starts the parameter server with an upload.
• By default the event is not set each time the parameters are written, therefore the end of the
parameterization procedure has to be reported to the IO-Link device.
The IO-Link-Device then sends the corresponding event to the master. The data are loaded into the
parameter server.
• In the case of a pre-programmed IO-Link-Device, no download takes place from the parameter server
to the device.
3.5 Data transfer rate
An IO-Link master according to specification V1.1 supports all three transmission types and automatically
adjusts the data transfer rate to that of the IO-Link device.
An IO-Link device usually supports only one data transfer rate. IO-Link devices with different data transfer
rate can be connected to the various ports of the master.

IO-Link basics
EPI1xxx, ERI1xxx 19Version: 1.5
• COM1 = 4.8kbaud
• COM2 = 38.4kbaud
• COM3 = 230.4kbaud

Mounting and connection
EPI1xxx, ERI1xxx20 Version: 1.5
4 Mounting and connection
4.1 Mounting
4.1.1 Dimensions EPIxxxx-xx0x and ERIxxxx-xx0x
30
126
119
26.5
23
13.5
Ø 3.5
All dimensions are given in millimeters.
The drawing is not true to scale.
Housing features
Housing material PA6 (polyamide)
Sealing compound polyurethane
Mounting two fastening holes Ø 3.5 mm for M3
Metal parts brass, nickel-plated
Contacts CuZn, gold-plated
Installation position variable
Protection class IP65, IP66, IP67 (conforms to EN 60529) when screwed together
Dimensions (H x W x D) approx. 126 x 30 x 26.5 mm (without connectors)