Blu STUDIO 5.0 S User manual

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BLU Studio 5.0S
Service Manual

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Table of Contents
INTRODUCTION........................................................................................................................................................................4
1 .HARDWARE SYSTEM INTRODUCTION..................................................................................................................................5
1.1 The framework of the hardware system .......................................................................................................................5
1.2 Studio 5.0S Main Components ......................................................................................................................................6
2. The detail of system’s modules ...........................................................................................................................................9
2.1 RF module ......................................................................................................................................................................9
2.1.1 Transceiver..............................................................................................................................................................9
2.1.2 GSM signal’s path....................................................................................................................................................9
2.1.3 WCDMA signal’s path ...........................................................................................................................................11
2.2 PMU .............................................................................................................................................................................14
2.2.1 The timing of system’s boot..................................................................................................................................14
2.2.2 The voltages put out from PMU ...........................................................................................................................14
2.3 Memory .......................................................................................................................................................................15
2.4 Audio module...............................................................................................................................................................16
2.4.1 Microphone circuit................................................................................................................................................16
2.4.2 Earpiece circuit......................................................................................................................................................17
2.4.3 Speaker circuit ......................................................................................................................................................17
2.4.4 Audio Jack circuit ..................................................................................................................................................18
2.5 Other peripherals.........................................................................................................................................................19
2.5.1 Vibrator.................................................................................................................................................................19
2.5.2 Touch panel circuit................................................................................................................................................19
2.5.3 Camera interface circuit........................................................................................................................................20
2.5.4 Light sensor circuit................................................................................................................................................21
2.5.5 G-sensor circuit.....................................................................................................................................................21
2.5.6 BT&WIFI module circuit........................................................................................................................................21
2.5.7 GPS........................................................................................................................................................................23
2.5.8 LCD ........................................................................................................................................................................24
2.6 Peripheral interface circuit .......................................................................................................................................25
2.6.1 USB interface ........................................................................................................................................................25
2.6.2 Volume key ...........................................................................................................................................................25
2.6.3 T-flash card and USIM card interface ...................................................................................................................25

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ATTENTION
Boards, which contain Electrostatic Sensitive Device(ESD), art indicated. Following information is
ESD handling:
- Service personnel should ground themselves by using a wrist strap when exchange system
boards.
- When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
- Use a suitable, grounded soldering iron.
- Keep sensitive parts in these protective packages until these are used.
- When returning system boards or parts like EEPROM to the factory, use the protective packages as describe.

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INTRODUCTION
This document, is the maintenance work guide for the BLU Studio 5.0S. The
compile objective is to describe the detail theory of the Studio 5.0S and to offer a
maintenance guide for the later mass production and after service.
The readers of the document should be the debug worker of SMT and
after-service. It will be the work guide for them. At the same time, the other
members of the Studio 5.0S project group can also refer to the document.

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1 .HARDWARE SYSTEM INTRODUCTION
1.1 The framework of the hardware system
The picture1 is the Studio 5.0S framework of hardware system, which is used on
TBW5933。
Figure 1 Studio 5.0S framework of hardware system
Studio 5.0S has several main modules as below:
1. Baseband module
This module include the mobile phone’s core of BB and AP. Such as system’s
processor, memory, power manager unit and so on.
2. Radio Frequency module
This module include the mobile phone’s RF, it mainly include the transceiver RF6285
and other devices on the radio path as power amplifier, filter, diplexer, antenna switch,
low noise amplifier and so on.

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3. Peripherals module
This module include all the mobile phone’s modules except the RF module and audio
module. This module has USB, BT, WIFI, GPS, T-flash, dual SIM、G-senor、Light
sensor, LCD, Touch panel, Front camera、Main camera and so on.
4. Audio module
This module include the mobile phone’s audio devices, such as microphone, speaker,
Earpiece and headphone.
1.2 Studio 5.0S Main Components
Studio 5.0S hardware circuits mainly include main board, sub board of earpiece, main
camera’FPCA, the reset button’s FPC and ANT’s sub board。
1. Components of main board
U101: it’s complex processor which includes AP and BP. It mainly was used to
control the BB’s RF module, audio and other peripheral devices such as TP, LCD,
volume key, back light driver, G-sensor, Light-sensor, motor, camera and T-flash
card.
U202: EMMC+SDRAM memory。The EMMC was used to save AP&BP’s code,
and SDRAM was used to run the system’s program。
U802：Power manager unit. It mainly provides all the power voltage for system,
manager the system’s charge and discharge, manager the timing of boot and
shutdown ,be used as SIM card’s voltage shifter, provided ADC and DAC
functions for system.

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U804：DC-DC, Provide the core power for cpu.
U203 、U204：load switch ，in charge of memory’s power voltages.
X1101：System’s main clock. Provide clock signal on 19.2MHZ when system was
working。
U1101：RF’s transceiver。It‘s in charge of system’s RF signal’tx and rx under
cpu’s controller。
U1207：Antenna select switch. Under cpu’s control, through the switch, it can
select different frequencies. And on the time, it can amplify the qual-band GSM
radio signal.
U1206：The saw filter on the rx path of GSM1800 and GSM1900.
U5605：The saw filter on the rx path of GSM850 and EGSM900.
U1205：The saw filter on the WCDMA BAND 1‘s signal tx path before PA.
U1203：WCDMA BAND 1‘s PA。
U1210：WCDMA BAND 1‘s diplexer.
U1202：The saw filter on the WCDMA BAND 8‘s signal tx path before PA.
U1209：WCDMA BAND 8‘s PA.
U1201: WCDMA BAND 8‘s diplexer.
U1602: BT&WIFI‘s antenna switch.
U1604：WIFI chipset.
U1607：BT chipset, in charge of Bluetooth and FM function.
J1702：LCD’s connector.
J1704：TP’s connector.

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U1320：LCD back light led’s driver.
U1708：G-sensor.
J5401：The connector between mainboard and ant subboard.
U1115：USB’VBUS power signal’s over voltage protection.
J5402：T-flash connector.
U5403、U5404：SIM card connector.
J1504：The connector between mainboard and main camera FPC.
J5732：The connector between mainboard and front camera FPC.
J1401：JTAG’s connector.
U1403 U1404：The common mode filter of front camera’s MIPI_CSI interface.
U1405、U1406、U1407：The common mode filter of main camera’s MIPI_CSI
interface.
U1401：The main camera’s flash led
U1801，U1803：The saw filter of GPS signal.
U1802：The LNA of GPS signal.
U501：Speaker PA。
U5630：Gyroscope.
J5460：volume’s key+ and key -
J5351：headphone’s connector.

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2. The detail of system’s modules
U101 is AP&BP complex processor，U202 is a complex memory which includes ddr
and rom and be shared for AP and BP. Only they all work normally，the system can boot
normally.
2.1 RF module
2.1.1 Transceiver
U1101 is the transceiver which supports GSM and WCDMA mode.
Figure 2 RF transceiver
2.1.2 GSM signal’s path
1. Tx path
As the figure 3，the high band (1900/1800) and low band(850/900) come from U1101
Figure 3 GSM’s high and low bands signals come out from the U1101

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When GSM’s high and low bands come out from U1101, after a resistor attenuator
network, enter the U1207 from PIN3 and PIN4，then they come out again from U1207’s
PIN20 after they be amplified in it.
Figure 4 GSM high and low bands signals arrive J1203 after be amplified in U1207
GSM high and low bands signals after through the J1203, then through the RF cable and
arrive the J1203 which is on antenna subboard, then after through the antenna match
network，were radiated by the antenna.
Figure 5 GSM high and low bands signals arrive antenna subboard through the RF cable
2. Rx path
GSM’s signal was received by antenna，and reach the J1203 on main board after through
the path on Figure 5 and the RF cable .Then the signal enter the U1207 from PIN20（path
on the figure 4 ‘s left part）。 GSM high and low bands signals were divided in U1207 and
came out from U1207’PIN15 and PIN14 respectively , and then they arrived the saw
filter .The high band signal entered in U1206，The low band signal entered in U5605。
When they came out from the saw filter, they have become the differential signals .These
differential signals enter in the U1101 after they through the match network. The path