Copyright © 2013 congatec AG QMX6m12 8/63
Contents
1 INTRODUCTION...................................................................... 11
2 Specifications........................................................................... 14
2.1 Feature List .............................................................................. 14
2.2 Supported Operating Systems ................................................ 15
2.3 Mechanical Dimensions ........................................................... 15
2.4 Supply Voltage Standard Power .............................................. 16
2.4.1 Electrical Characteristics .......................................................... 16
2.4.2 Rise Time ................................................................................. 16
2.5 Power Consumption ................................................................ 17
2.5.1 NXP®i.MX6 Cortex A9 1.0 GHz Single Core 512kB L2 cache 18
2.5.2 NXP®i.MX6 Cortex A9 1.0 GHz Dual Lite 512kB L2 cache ..... 18
2.5.3 NXP®i.MX6 Cortex A9 1.0 GHz Dual Core 1MB L2 cache...... 18
2.5.4 NXP®i.MX6 Cortex A9 1.0 GHz Quad Core 1MB L2 cache .... 19
2.5.5 NXP®i.MX6 Cortex A9 1.0 GHz Quad Core 1MB L2 cache .... 19
2.5.6 NXP®i.MX6 Cortex A9 800 MHz Single Core 512kB L2 cache
(2GB eMMC) ............................................................................ 19
2.5.7 NXP®i.MX6 Cortex A9 800 MHz Dual Lite 512kB L2 cache (2GB
eMMC) ..................................................................................... 20
2.5.8 NXP®i.MX6 Cortex A9 800 MHz Dual Core 1MB L2 cache (2GB
eMMC) ..................................................................................... 20
2.5.9 NXP®i.MX6 Cortex A9 800 MHz Quad Core 1MB L2 cache (2GB
eMMC) ..................................................................................... 20
2.6 Supply Voltage Battery Power ................................................. 21
2.6.1 CMOS Battery Power Consumption ........................................ 21
2.7 Environmental Specifications................................................... 21
3 Block Diagram.......................................................................... 22
4 Heatspreader ........................................................................... 23
4.1 Heatspreader Dimensions........................................................ 24
5 Connector Subsystems ............................................................ 26
5.1 PCI Express™........................................................................... 27
5.2 UART/RS-232 ........................................................................... 27
5.3 Gigabit Ethernet ...................................................................... 28
5.4 SATA ........................................................................................ 28
5.5 USB 2.0 .................................................................................... 28
5.6 SD/SDIO/MMC ........................................................................ 29
5.7 HDA/I2S/AC’97........................................................................ 29
5.8 LVDS......................................................................................... 29
5.9 HDMI........................................................................................ 30
5.10 LPC/GPIO ................................................................................ 30
5.11 SPI............................................................................................ 31
5.12 CAN Bus .................................................................................. 31
5.13 Manufacturing/JTAG Interface................................................. 31
5.14 Power Control .......................................................................... 31
5.15 Power Management................................................................. 33
5.16 Watchdog ................................................................................ 33
5.17 I2C Bus..................................................................................... 34
6 Additional Features.................................................................. 35
6.1 High Assurance Boot (HAB) ..................................................... 35
6.2 Dedicated Hardware Accelerators ........................................... 35
6.3 Power Management................................................................. 35
6.4 Dynamic Voltage and Frequency Scaling ................................ 35
6.5 Smart Speed Technology......................................................... 36
6.6 Suspend Mode......................................................................... 36
7 ARM Technologies ................................................................... 37
7.1 Media Processing Engine (MPE-NEON) ................................. 37
7.2 Jazelle DBX.............................................................................. 37
7.3 TrustZone ................................................................................. 37
7.4 Floating Point Unit ................................................................... 37
8 conga Tech Notes .................................................................... 38
8.1 NXP®i.MX6 Processor Features............................................... 38
8.1.1 Temperature Monitor (TEMPMON).......................................... 38
8.2 Thermal Management ............................................................. 38
8.3 Audio Mux ............................................................................... 39
8.4 LVDS Bridge............................................................................. 39
8.5 USB Port Connections.............................................................. 39
