Congatec COM Express conga-TR4 User manual

Copyright © 2018 congatec AG TR44m17 1/65
COM Express™ conga-TR4
COM Express Type 6 Basic module based on 4th Generation AMD Embedded V- and R-Series SoC
User’s Guide
Revision 1.7

Copyright © 2018 congatec AG TR44m17 2/65
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2018.01.15 BEU •Preliminary release
1.0 2018.10.15 BEU •Updated “Electrostatic Sensitive Device” information on page 3
•Corrected single/dual channel MT/s rates for two variants in table 2
•Updated section 2.2 “Supported Operating Systems”
•Added values for four variants in section 2.5 "Power Consumption"
•Added values in section 2.6 "Supply Voltage Battery Power"
•Updated images in section 4 "Cooling Solutions"
•Added note about requiring a re-driver on carrier for USB 3.1 Gen 2 in section 5.1.2 "USB" and 7.4 "USB Host Controller"
•Added Intel® Ethernet Controller i211 as assembly option in table 4 "Feature Summary" and section 5.1.4 "Ethernet"
•Corrected section 7.4 "USB Host Controller"
•Added section 9 "System Resources"
1.1 2019.03.19 BEU •Corrected image in section 2.4 "Supply Voltage Standard Power"
•Updated section 10.4 "Supported Flash Devices"
1.2 2019.04.02 BEU •Corrected supported memory in table 2, 3, and added information about supported memory in table 4
•Added information about the new industrial variant in table 3 and 7
1.3 2019.07.30 BEU •Updated note in section 4 "Cooling Solutions"
•Changed number of supported USB 3.1 Gen 2 interfaces to two throughout the document
•Added note regarding USB 3.1 Gen 2 in section 7.4 "USB Host Controller"
1.4 2020.01.07 BEU •Updated title page
•Updated CPU clock speed of variant 041603 in table 2
•Added variants 041620 and 041621 to table 3 and 7
•Updated section 4 "Cooling Solutions"
•Updated references for power supply implementation guidelines in section 5.1.12 "Power Control"
•Added reference to BIOS Setup Description application note in section 10 "BIOS Setup Description"
•Updated section 10.3 "Updating the BIOS"
•Updated supported flash device in section 10.4 "Supported Flash Devices"
•Added note to several button signals in table 24
•Updated section 11 "Industry Specifications"
1.5 2020.03.04 BEU •Added power consumption values and updated existing ones in table 7
1.6 2020.06.02 BEU •Corrected product name in section 4 "Cooling Solutions"
1.7 2020.11.19 BEU •Added note to section 5.1.8 "LVDS"
•Added PWR_OK implementation recommendation to section 5.1.12 "Power Control"
•Removed section 11 "Industry Specifications"

Copyright © 2018 congatec AG TR44m17 3/65
Preface
This user’s guide provides information about the components, features and interfaces available on the conga-TR4. It is one of three documents
that should be referred to when designing a COM Express™ application. The other reference documents that should be used include the
following:
COM Express™ Design Guide
COM Express™ Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec AG Limited Warranty.

Copyright © 2018 congatec AG TR44m17 4/65
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2018, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

Copyright © 2018 congatec AG TR44m17 5/65
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
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Copyright © 2018 congatec AG TR44m17 6/65
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mbit Megabit
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
PCH Platform Controller Hub
SM System Management
N.C Not connected
N/A Not available
TBD To be determined

Copyright © 2018 congatec AG TR44m17 7/65
Contents
1 Introduction ............................................................................. 10
2 Specifications........................................................................... 13
2.1 Feature List .............................................................................. 13
2.2 Supported Operating Systems ................................................ 14
2.3 Mechanical Dimensions ........................................................... 14
2.4 Supply Voltage Standard Power .............................................. 15
2.4.1 Electrical Characteristics .......................................................... 15
2.4.2 Rise Time ................................................................................. 16
2.5 Power Consumption ................................................................ 16
2.6 Supply Voltage Battery Power ................................................. 17
2.7 Environmental Specifications................................................... 18
3 Block Diagram.......................................................................... 19
4 Cooling Solutions..................................................................... 20
4.1 CSA Dimensions ...................................................................... 21
4.2 CSP Dimensions....................................................................... 22
4.3 Heatspreader Dimensions........................................................ 23
5 Connector Rows....................................................................... 24
5.1 Primary Connector Rows A and B............................................ 24
5.1.1 Serial ATA™ (SATA).................................................................. 24
5.1.2 USB .......................................................................................... 24
5.1.3 High Definition Audio (HDA) ................................................... 24
5.1.4 Ethernet ................................................................................... 25
5.1.5 LPC Bus.................................................................................... 25
5.1.6 I²C Bus ..................................................................................... 25
5.1.7 PCI Express™ (PCIe) ................................................................ 26
5.1.8 LVDS......................................................................................... 26
5.1.9 Optional eDP ........................................................................... 27
5.1.10 GPIO ........................................................................................ 27
5.1.11 UART........................................................................................ 27
5.1.12 Power Control .......................................................................... 28
5.1.13 Power Management................................................................. 30
5.2 Secondary Connector Rows C and D....................................... 31
5.2.1 PCI Express™ Graphics (PEG).................................................. 31
5.2.2 Digital Display Interface (DDI).................................................. 31
6 Additional Features.................................................................. 32
6.1 congatec Board Controller (cBC) ............................................. 32
6.1.1 Board Information.................................................................... 32
6.1.2 Fan Control .............................................................................. 32
6.1.3 Power Loss Control.................................................................. 32
6.1.4 Watchdog ................................................................................ 33
6.2 OEM BIOS Customization........................................................ 33
6.2.1 OEM Default Settings .............................................................. 33
6.2.2 OEM Boot Logo....................................................................... 33
6.2.3 OEM POST Logo ..................................................................... 34
6.2.4 OEM BIOS Code/Data............................................................. 34
6.2.5 OEM DXE Driver...................................................................... 34
6.3 congatec Battery Management Interface ................................ 34
6.4 API Support (CGOS) ................................................................ 35
6.5 Security Features...................................................................... 35
6.6 Suspend to Ram....................................................................... 35
7 conga Tech Notes .................................................................... 36
7.1 AMD Processor Features ......................................................... 36
7.2 Thermal Management ............................................................. 37
7.3 ACPI Suspend Modes and Resume Events.............................. 37
7.4 USB Host Controller................................................................. 39
8 Signal Descriptions and Pinout Tables..................................... 40
8.1 A-B Connector Signal Descriptions ......................................... 41
8.2 C-D Connector Signal Descriptions......................................... 51
9 System Resources .................................................................... 61
9.1 I/O Address Assignment.......................................................... 61
9.1.1 LPC Bus.................................................................................... 61
9.2 PCI Configuration Space Map ................................................. 62
9.3 I²C Bus ..................................................................................... 63
9.4 SM Bus..................................................................................... 63

Copyright © 2018 congatec AG TR44m17 8/65
10 BIOS Setup Description........................................................... 64
10.1 Navigating the BIOS Setup Menu ........................................... 64
10.2 BIOS Versions........................................................................... 64
10.3 Updating the BIOS................................................................... 65
10.4 Supported Flash Devices ......................................................... 65

Copyright © 2018 congatec AG TR44m17 9/65
List of Tables
Table 1 COM Express™ 3.0 Pinout Types............................................ 10
Table 2 conga-TR4 Commercial Options ............................................. 11
Table 3 conga-TR4 Industrial Options .................................................. 12
Table 4 Feature Summary..................................................................... 13
Table 5 Electrical Characteristics .......................................................... 15
Table 6 Measurement Description........................................................ 16
Table 7 Power Consumption Values ..................................................... 17
Table 8 CMOS Battery Power Consumption ........................................ 17
Table 9 Cooling Solution Variants......................................................... 20
Table 10 Wake Events............................................................................. 38
Table 11 Signal Tables Terminology Descriptions .................................. 40
Table 12 Connector A-B Pinout.............................................................. 41
Table 13 High Definition Audio Link Signal Descriptions....................... 42
Table 14 LPC Signal Descriptions........................................................... 43
Table 15 Serial ATA Signal Descriptions................................................. 43
Table 16 USB 2.0 Signal Descriptions..................................................... 43
Table 17 PCI Express Signal Descriptions (general purpose) ................. 45
Table 18 Gigabit Ethernet Signal Descriptions....................................... 46
Table 19 LVDS Signal Descriptions......................................................... 47
Table 20 UART Interface Signal Descriptions ......................................... 47
Table 21 SPI BIOS Flash Interface Signal Descriptions........................... 48
Table 22 General Purpose I/O Signal Descriptions ................................ 48
Table 23 Miscellaneous Signal Descriptions........................................... 48
Table 24 Power and System Management Signal Descriptions ............. 49
Table 25 Power and GND Signal Descriptions....................................... 50
Table 26 Connector C-D Pinout ............................................................. 51
Table 27 SuperSpeed USB Signal Descriptions...................................... 53
Table 28 PCI Express Signal Descriptions (general purpose) ................. 53
Table 29 PCI Express Signal Descriptions (x16 Graphics)....................... 54
Table 30 DDI Signal Description............................................................. 56
Table 31 HDMI/DVI Signal Descriptions................................................. 57
Table 32 DisplayPort (DP) Signal Descriptions ....................................... 59
Table 33 Module Type Definition Signal Description ............................. 60
Table 34 Power and GND Signal Descriptions....................................... 60
Table 35 PCI Configuration Space Map ................................................. 62

Copyright © 2018 congatec AG TR44m17 10/65
1 Introduction
COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84mm x 55mm
•Compact 95mm x 95mm
•Basic 125mm x 95mm
•Extended 155mm x 110mm
Table 1 COM Express™ 3.0 Pinout Types
Types Connector Rows PCIe Lanes PCI IDE SATA Ports LAN ports USB 2.0 / USB 3.0 Display Interfaces
Type 1 A-B Up to 6 - 4 1 8 / 0 VGA, LVDS
Type 2 A-B C-D Up to 22 32 bit 1 4 1 8 / 0 VGA, LVDS, PEG
Type 3 A-B C-D Up to 22 32 bit - 4 3 8 / 0 VGA,LVDS, PEG
Type 4 A-B C-D Up to 32 1 4 1 8 / 0 VGA,LVDS, PEG
Type 5 A-B C-D Up to 32 - 4 3 8 / 0 VGA,LVDS, PEG
Type 6 A-B C-D Up to 24 - 4 1 8 / 4* VGA,LVDS/eDP, PEG, 3x DDI
Type 7 A-B C-D Up to 32 - 2 5 (1x 1 G, 4x 10 G) 4 / 4* -
Type 10 A-B Up to 4 - 2 1 8 / 2* LVDS/eDP, 1xDDI
* The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Up to 4 of the USB 2.0 ports can support SuperSpeed USB.
The conga-TR4 modules use the Type 6 pinout definition and comply with COM Express 3.0 specification. They are equipped with two high
performance connectors that ensure stable data throughput and support high bandwidth networking.
The COM (computer on module) integrates all the core components of a common PC and is mounted onto an application specific carrier
board. COM modules are legacy-free (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any
application. These functions include, but are not limited to, a rich complement of contemporary high bandwidth serial interfaces such as PCI
Express, Serial ATA, USB 3.0/2.0, and 10 Gigabit Ethernet.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.

Copyright © 2018 congatec AG TR44m17 11/65
conga-TR4 Options Information
The conga-TR4 is available in five variants. This user’s guide describes these variants. The table below shows the different configurations available.
Check the Part No. that applies to your product. This will tell you what options described in this user’s guide are available on your particular module.
Table 2 conga-TR4 Commercial Options
Part-No. 041600 041601 041602 041603
SoC V1807B V1756B V1605B V1202B
CPU Clock Speed 3.35 GHz (3.8 GHz Turbo) 3.25 GHz (3.6 GHz Turbo) 2.0 GHz (3.6 GHz Turbo) 2.3 GHz (3.2 GHz Turbo)
L2 Shared Cache 2 MB 2 MB 2 MB 1 MB
Memory (DDR4) 2400 MT/s dual channel,
single/dual rank
3200 MT/s dual channel,
single rank only
2400 MT/s dual channel,
single/dual rank
3200 MT/s dual channel,
single rank only
2400 MT/s dual channel,
single/dual rank
2400 MT/s dual channel,
single/dual rank
Graphics Engine AMD Radeon™ Vega 11 AMD Radeon™ Vega 8 AMD Radeon™ Vega 8 AMD Radeon™ Vega 3
GPU Clock Speed 1300 MHz
(11 Compute Units)
1300 MHz
(8 Compute Units)
1100 MHz
(8 Compute Units)
1000 MHz
(3 Compute Units)
PCIe 1x PCIe Gen 3 (x8/x4)
4x PCIe Gen 3 (x4/x2/x1)
4x PCIe Gen 2 (x1)
1x PCIe Gen 3 (x8/x4)
4x PCIe Gen 3 (x4/x2/x1)
4x PCIe Gen 2 (x1)
1x PCIe Gen 3 (x8/x4)
4x PCIe Gen 3 (x4/x2/x1)
4x PCIe Gen 2 (x1)
1x PCIe Gen 3 (x8/x4)
4x PCIe Gen 3 (x4/x2/x1)
4x PCIe Gen 2 (x1)
USB Up to:
2x USB 3.1 Gen 2
2x USB 3.1 Gen 1
4x USB 2.0
Up to:
2x USB 3.1 Gen 2
2x USB 3.1 Gen 1
4x USB 2.0
Up to:
2x USB 3.1 Gen 2
2x USB 3.1 Gen 1
4x USB 2.0
Up to:
2x USB 3.1 Gen 2
2x USB 3.1 Gen 1
4x USB 2.0
DDI 2x Dedicated DDI
1x DDI multiplexed with
USB port
2x Dedicated DDI
1x DDI multiplexed with
USB port
2x Dedicated DDI
1x DDI multiplexed with
USB port
2x Dedicated DDI
1x DDI multiplexed with
USB port
LVDS 1x LVDS (default) or
1x eDP (optional)
1x LVDS (default) or
1x eDP (optional)
1x LVDS (default) or
1x eDP (optional)
1x LVDS (default) or
1x eDP (optional)
SoC TDP 35-54W 35-54W 12-25W 12-25W

Copyright © 2018 congatec AG TR44m17 12/65
Table 3 conga-TR4 Industrial Options
Part-No. 041610 041620 041621
SoC V1404I R1606G R1505G
CPU Clock Speed 2.0 GHz (3.6 GHz Turbo) 2.6 GHz (3.5 GHz Turbo) 2.4 GHz (3.3 GHz Turbo)
L2 Shared Cache 2 MB 1 MB 1 MB
Memory (DDR4) 2400 MT/s dual channel,
single/dual rank
2400 MT/s dual channel,
single/dual rank
2400 MT/s dual channel,
single/dual rank
Graphics Engine AMD Radeon™ Vega 8 AMD Radeon™ Vega 3 AMD Radeon™ Vega 3
GPU Clock Speed 1300 MHz
(8 Compute Units)
1200 MHz
(3 Compute Units)
1000 MHz
(3 Compute Units)
PCIe 1x PCIe Gen 3 (x8/x4)
4x PCIe Gen 3 (x4/x2/x1)
4x PCIe Gen 2 (x1)
1x PCIe Gen 3 (x4)
3x PCIe Gen 3 (x1)
4x PCIe Gen 2 (x1)
1x PCIe Gen 3 (x4)
3x PCIe Gen 3 (x1)
4x PCIe Gen 2 (x1)
USB Up to:
2x USB 3.1 Gen 2
2x USB 3.1 Gen 1
4x USB 2.0
Up to:
2x USB 3.1 Gen 2
1x USB 3.1 Gen 1
4x USB 2.0
Up to:
2x USB 3.1 Gen 2
1x USB 3.1 Gen 1
4x USB 2.0
DDI 2x Dedicated DDI
1x DDI multiplexed with
USB port
2x Dedicated DDI 2x Dedicated DDI
LVDS/eDP 1x LVDS (default) or
1x eDP (optional)
1x LVDS (default) or
1x eDP (optional)
1x LVDS (default) or
1x eDP (optional)
SoC TDP 12-25W 12-25W 12-25W

Copyright © 2018 congatec AG TR44m17 13/65
2 Specifications
2.1 Feature List
Table 4 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 (Basic size 95 x 125 mm)
SoC 4th Generation AMD Embedded V- and R-Series (FP5) SoC. NOTE: R-Series is not available yet.
Memory Two memory sockets (located on the top and bottom side of the conga-TR4). Supports:
-SO-DIMM ECC and non-ECC DDR4 memory modules
-Data rates up to 3200 MT/s with single rank memory
-Maximum 32 GB capacity (16 GB on each socket)
Chipset Integrated in the SoC
Audio High Definition Audio (HDA) interface with support for up to three codecs.
Ethernet 1x Gigabit Ethernet PHY or via the onboard Intel®Ethernet i210 Controller (i211 available as assembly option).
Graphics Options AMD Radeon™ Vega Graphics Core (GFX9). Supports:
-DirectX® 12, EGL 1.4, OpenCL® 2.1, OpenGL®ES (1.1, 2.x and 3.x), OpenGL®Next, OpenGL®4.6
-Video Core Next (VCN): H.265/HEVC HW encode and decode, 10b HEVC and VP9 decode, MS compliant JPEG encode and decode
-Up to four independent displays (three in R-Series)
1x PCIe Gen 3 (x8/x4) (Only x4 in R-Series)
1x LVDS (default) or 1x eDP (optional)
2x Dedicated DDI (DP/HDMI/DVI)
1x DDI (DP/HDMI/DVI) (N/A in R-Series) multiplexed with USB 3.1 Gen 2
NOTE: HDMI/DVI requires an external level shifter on carrier board.
Peripheral Interfaces USB up to:
-2x USB 3.1 Gen 2
-2x USB 3.1 Gen 1 (Only 1x in R-Series)
-4x USB 2.0
2x SATA®6 Gb/s ports
4x PCIe Gen 3 (x4/x2/x1) (Only 3x PCIe Gen3 (x1) in R-Series)
4x PCIe Gen 2 (x1)
2x UART
Fan control
GPIOs
Buses:
-SPI
-LPC
-SM
-I²C
BIOS AMI Aptio®UEFI 5.x firmware; 8 MByte serial SPI with congatec Embedded BIOS features
Security Infineon LPC TPM 2.0 on module. Integrated TPM 2.0 in SoC.
Power Management ACPI 5.0 compliant with battery support. Also supports Suspend to RAM (S3).
cBC Multi-stage watchdog, manufacturing and board information, board statistics, I2C bus, Power loss control.
Note
Some of the features mentioned in the table above are optional. See Table 2 and Table 3 for available features on each module variant.

Copyright © 2018 congatec AG TR44m17 14/65
2.2 Supported Operating Systems
The conga-TR4 supports the following operating systems.
•Microsoft®Windows®10 (64-bit)
•Microsoft®Windows®10 IoT Enterprise (64-bit)
•Linux (32/64-bit)
Note
To improve the graphic performance of conga-TR4 after installing Microsoft®Windows®Operating System, congatec AG recommends the
installation of AMD catalyst driver.
2.3 Mechanical Dimensions
•95.0 mm x 125.0 mm (3.74” x 4.92”)
•Height approximately 18 or 21 mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm (height)
carrier board connector is used then approximate overall height is 18 mm. If the 8 mm (height) carrier board connector is used then
approximate overall height is 21 mm.

Copyright © 2018 congatec AG TR44m17 15/65
2.4 Supply Voltage Standard Power
•12V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Table 5 Electrical Characteristics
Power Rail Module Pin
Current Capability
(Amps)
Nominal
Input (Volts)
Input
Range
(Volts)
Derated
Input (Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

Copyright © 2018 congatec AG TR44m17 16/65
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
2.5 Power Consumption
The power consumption values were measured with the following setup:
•conga-TR4 module
•modified congatec carrier board
•conga-TR4 cooling solution
•Microsoft Windows®10 (64-bit)
Note
The SoC was stressed to its maximum workload with the AMD APU Validation Toolkit (AVT).
Table 6 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak value Highest current spike during the measurement of “S0: Maximum
value”. This state shows the peak value during runtime.
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios.
S3 COM is powered by VCC_5V_SBY.
S5 COM is powered by VCC_5V_SBY.
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

Copyright © 2018 congatec AG TR44m17 17/65
The tables below provide additional information about the power consumption data for each of the conga-TR4 variants offered. The values are
recorded at various operating modes.
Table 7 Power Consumption Values
Part
No.
Memory Size H.W
Rev.
BIOS
Rev.
OS
(64-bit)
CPU Current (Amp.) S0 @12V and S3/S5 @5V
Variant Cores Clock Speed
(Turbo) in GHz
S0:
Min
S0:
Max
S0:
Peak
S3 S5
041600 2x2 GB DDR4-2400 B.1 TR44R010 Windows 10 V1807B 4 3.35 (3.75) 0.35 4.25 6.43 0.16 0.08
041601 2x2 GB DDR4-2400 B.1 TR44R010 Windows 10 V1756B 4 3.25 (3.6) 0.34 4.08 7.02 0.16 0.08
041602 2x2 GB DDR4-2400 B.1 TR44R010 Windows 10 V1605B 4 2.0 (3.6) 0.37 2.17 3.29 0.16 0.08
041603 2x2 GB DDR4-2400 B.1 TR44R010 Windows 10 V1202B 2 2.5 (3.4) 0.35 2.18 2.58 0.16 0.08
041610 2x4 GB DDR4-2400 C.0 TR44R205 Windows 10 V1404B 4 2.0 (3.6) 0.42 2.29 3.47 0.17 0.08
041620 2x4 GB DDR4-2400 C.0 TR44R205 Windows 10 R1606G 2 2.6 (3.5) 0.38 2.22 2.57 0.16 0.08
041621 2x4 GB DDR4-2400 C.0 TR44R205 Windows 10 R1505G 2 2.4 (3.3) 0.37 2.09 2.19 0.16 0.08
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 8 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 2.25 µA
20oC 3V DC 2.41 µA
70oC 3V DC 3.08 µA
Note
Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
We recommend to always have a CMOS battery present when operating the conga-TR4.

Copyright © 2018 congatec AG TR44m17 18/65
2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -40° to +85°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -40° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

Copyright © 2018 congatec AG TR44m17 19/65
3 Block Diagram
Embedded V-Series SOC
Compute Unit
AES
Core #1 Core #2
Core #3 Core #4
SSE4.2 AVX
Memory
high performance ECC low power
2MB Shared L2
Graphics Unit
OpenGL 4.6 OpenCL 2.1 DirectX 12
Interfaces
DisplayPort HDMI/DVI
Integrated
SATA USB 2.0
LPC BusPCIe
Integrated I/O Interfaces
GPIOs
USB 3.0
MPEG-4 WMV-9 VC-1 MPEG-2
MVCH.265 H.264
Multimedia Features
MJPEG
Platform Security
AESRSA SHA TRNG
Connector
220 pos
COM Express AB
congatec
Board
Controller
Dual Channel
DDR4 SODIMM
up to 16GB
Dual Channel
DDR4 SODIMM
up to 16GB
opt.
TPM
2.0
SPI
ROM
eDP-LVDS
NXP PTN3460
USB Hub
Microchip USB2514b
PCIe switch
LVDS (default) or
eDP (optional)
Connector
220 pos
COM Express CD
LPC
HDA I/F
USB Port 0-4
SATA Port 0
SATA Port 2
SATA Port 1
SATA Port 3
GPIOs
SM Bus
I2C Bus
Serial Port 1-0
FAN Control
VGA
USB-SS Port 0
USB-SS Port 2
DDI 1
DDI 2
DDI 3
(N/A in R-Series)
PEG x4
USB 3.1 Gen 2 Port 1
USB-SS Port 1
USB 3.1 Gen 2 Port 2
USB-SS Port 3
(N/A in R-Series)
USB 3.1 Gen 1 Port 4
(N/A in R-Series)
DP3
DP2
(N/A in R-Series)
PCIe x1
PCIe
Port 4
PCIe x1
(N/A in
R-Series)
DP1
LPCLPC
USB 2.0
Port 0-4
PCIe Port 0-1
SPI bus
PCIe Port 0-1
SPI
PCIe Port 2
PCIe Port 2
PCIe Port 5
(in R-Series)
opt.
PCIe Port 3
PCIe Port 3
(N/A in R-Series)
PCIe x1
PCIe x1
PCIe x1
GBE
opt.
Ethernet
PCIe Port 5
PCIe Port 4
UART 0-1
USB Port 5-7
USB 2.0
Port 5
3x USB 2.0
SATA Gen3
SATA Gen3
SATA Gen3
SATA Gen3
DP0
SATA 0
SATA 1
eDP (optional)
PEG Lane 0-3
PEG x4
(N/A in R-Series)
PEG Lane 4-7
(N/A in R-Series)
PEG Lane 8-15
PCIe Port 7
(N/A in R-Series)
PCIe Port 6
MUX
MUX
USB3.1 Gen 1 Port 3
opt.
LS
SW
Intel
i210
SM Bus
I2C Bus
(in R-Series)
opt.

Copyright © 2018 congatec AG TR44m17 20/65
4 Cooling Solutions
congatec AG offers the cooling solutions listed in Table 9 for conga-TR4. The dimensions of the cooling solutions are shown in the sub-sections.
All measurements are in millimeters.
Table 9 Cooling Solution Variants
Cooling Solution Part No Description
1 HSP 041651 Heatspreader with 2.7 mm bore-hole standoffs.
041652 Heatspreader with M2.5 mm threaded standoffs.
2 CSP 041653 Passive cooling with 2.7 mm bore-hole standoffs.
041654 Passive cooling with M2.5 mm threaded standoffs.
3 CSA 048555 Active cooling with 2.7 mm bore-hole standoffs.
048556 Active cooling with M2.5 mm threaded standoffs.
Note
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws and 0.5 Nm for module mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on
the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-
threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.
3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.