Congatec Smarc conga-smx8-x User manual

SMARC®conga-SMX8-X

SMARC 2.0 module based on the NXP® i.MX 8QuadXPlus, 8DualXPlus, and 8DualX applications processors

User’s Guide

Revision 0.1 (Preliminary)

Revision History

Revision Date (yyyy-mm-dd) Author Changes

0.1 2020-03-27 BEU •Preliminary release

Preface

This user’s guide provides information about the components, features and connectors available on the conga-SMX8-X. It is one of ﬁve

documents that should be referred to when designing a SMARC®application.

The other reference documents that should be used include the following:

conga-SMX8-X Pinout Description (https://git.congatec.com/arm-nxp/imx8-family/doc/cgtimx8_pinlist/tree/cgtsx8x_pinlist)

SMARC®Design Guide 2.0 (https://sget.org)

SMARC®Hardware Speciﬁcation 2.0 (https://sget.org)

i.MX 8DualX/8DualXPlus/8QuadXPlus Applications Processor Reference Manual (www.nxp.com)

Disclaimer

The information contained within this user’s guide, including but not limited to any product speciﬁcation, is subject to change without notice.

congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims

any implied warranties of merchantability or ﬁtness for any particular purpose with regard to any of the foregoing. congatec AG assumes

no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for

discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or

exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information

contained herein or the use thereof.

Intended Audience

This user’s guide is intended for technically qualiﬁed personnel. It is not intended for general audiences.

Lead-Free Designs (RoHS)

All congatec AG designs are created from lead-free components and are completely RoHS compliant.

Electrostatic Sensitive Device

All congatec AG products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary

packaging (protective packaging). The secondary packaging does not provide electrostatic protection.

Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store

electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive ﬁelds unless the device is contained within its original

packaging. Be aware that failure to comply with these guidelines will void the congatec AG Limited Warranty.

Symbols

The following symbols are used in this user’s guide:

Warning

Warnings indicate conditions that, if not observed, can cause personal injury.

Caution

Cautions warn the user about how to prevent damage to hardware or loss of data.

Note

Notes call attention to important information that should be observed.

without written permission from congatec AG. congatec AG has made every attempt to ensure that the information in this document is

accurate yet the information contained within is supplied “as-is”.

Trademarks

Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property

of their respective trademark holders. These trademark holders are not afﬁliated with congatec AG, our products, or our website.

Warranty

congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited warranty

(“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and conditions can

be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and from time to time.

The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license agreements,

which are available at www.congatec.com and/or upon request.

Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the

products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or

due to non conformance to the agreed upon speciﬁcations, will be repaired or exchanged, at congatec’s option and expense.

Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight

prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.

Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged

or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to

congatec’s direct customer only and is not assignable or transferable.

Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either express

or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of ﬁtness for a

particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.

congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be liable

for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive remedy

against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the product only.

Certiﬁcation

congatec AG is certiﬁed to DIN EN ISO 9001 standard.

Technical Support

congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products

can be easily used and implemented. We request that you ﬁrst visit our website at www.congatec.com for the latest documentation, utilities and

drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical support

department by email at [email protected].

Terminology

Term Description

°C Degrees Celsius

µA Microamp

µs Microsecond

A Ampere

AN Application Note

ARM Advanced RISC Machine

AVB Audio Video Bridging

BT Bluetooth

CAAM Cryptographic Acceleration and

Assurance Module

CMOS Complementary Metal Oxide

Semiconductor

COM Computer-on-Module

CPU Central Processing Unit

CSI Camera Serial Interface

CSP Cooling Solution Passive

DDR Double Data Rate

DP DisplayPort

DP++ DisplayPort Dual-Mode

DRAM Dynamic Random Access Memory

DSI Digital Serial Interface

D-SUB D-Subminiature

eMMC embedded Multi-Media Controller

FlexCAN Flexible Controller Area Network

GB Gigabyte

GbE Gigabit Ethernet

GHz Gigahertz

GND Ground

GPIO General-Purpose Input/Output

GPU Graphics Processing Unit

GTps Gigatransfers per second

HDMI High-Deﬁnition Multimedia Interface

HW Hardware

HAB High Assurance Boot

HSP Heat Spreader

Hz Hertz

I/O Input/Output

I²C (I2C) Inter-Integrated Circuit

I²S (I2S) Inter-Integrated Circuit Sound

IEEE Institute of Electrical and Electronics

Engineers

JEIDA Japan Electronic Industries

Development Association

JTAG Joint Test Action Group

KS Key State

LPDDR Low-Power Double Data Rate

LVDS Low-Voltage Differential Signaling

Mbps Megabits per second

MBps Megabytes per second

MHz Megahertz

mm Millimeter

MMU Memory Management Unit

mVpp Millivolts Peak to Peak

MXM Mobile PCI Express Module

NC Not Connected

Nm Newton metre

NXP NeXt exPerience

OS Operating System

OTG On-The-Go

PCB Printed Circuit Board

PCI Express Peripheral Component Interconnect

Express

PHY Physical Layer

PMIC Power Management Integrated

Circuit

PN Part Number

QSPI Quad Serial Peripheral Interface

RGMII Reduced Gigabit-Media Independent

Interface

RS-232 Recommended Standard 232

RTC Real-Time Clock

SAI Synchronous Audio Interface

SD Secure Digital

SDIO Secure Digital Input Output

SDR Single Data Rate

SDRAM Synchronous Dynamic Random

Access Memory

SDXC Secure Digital eXtended Capacity

SGET Standardization Group for Embedded

Technologies e.V

SMARC Smart Mobility ARChitecture

SoC System on Chip

SPI Serial Peripheral Interface

TBD To Be Deﬁned

UART Universal Asynchronous Receiver-

Transmitter

U-Boot Universal Boot Loader

UHS Ultra High Speed

USB Universal Serial Bus

uSDHC ultra Secured Digital Host Controller

V Volt

Vdc Volts direct current

VESA Video Electronics Standards

Association

W Watt

Wi-Fi Wireless Fidelity

Contents

1 Introduction ............................................................................... 9

1.1 SMARC®Concept ...................................................................... 9

1.2 conga-SMX8-X........................................................................... 9

1.2.1 Options Information................................................................. 10

1.2.2 Accessories .............................................................................. 11

2 Speciﬁcations........................................................................... 12

2.1 Feature List .............................................................................. 12

2.2 Supported Operating Systems ................................................ 13

2.3 Mechanical Dimensions ........................................................... 13

2.4 Standard Power........................................................................ 14

2.4.1 Supply Voltage......................................................................... 14

2.4.2 Electrical Characteristics .......................................................... 14

2.4.3 Rise Time ................................................................................. 14

2.5 Power Consumption ................................................................ 15

2.6 Supply Voltage Battery Power ................................................. 16

2.7 Environmental Speciﬁcations................................................... 16

3 Block Diagram.......................................................................... 17

4 Cooling Solutions..................................................................... 18

4.1 CSP Dimensions....................................................................... 19

4.2 HSP Dimensions....................................................................... 20

5 Connector Rows....................................................................... 21

5.1 Display Interfaces..................................................................... 21

5.1.1 LVDS/DSI.................................................................................. 21

5.1.2 HDMI........................................................................................ 21

5.2 Camera Inteface (MIPI®CSI) .................................................... 22

5.3 SDIO Card (4 bit) Interface....................................................... 22

5.4 SPI............................................................................................ 22

5.5 Audio (I2S)................................................................................ 22

5.6 I2C Interfaces........................................................................... 23

5.7 Serial Ports ............................................................................... 23

5.8 CAN Bus .................................................................................. 23

5.9 USB Interfaces.......................................................................... 24

5.10 PCI Express™........................................................................... 24

5.11 Ethernet ................................................................................... 25

5.12 GPIO ........................................................................................ 25

5.13 Boot Select .............................................................................. 25

5.14 Power Control .......................................................................... 26

6 Onboard Interfaces and Devices ............................................. 28

6.1 DRAM....................................................................................... 28

6.2 eMMC ...................................................................................... 28

6.3 SPI NOR Flash.......................................................................... 28

6.4 Wi-Fi and Bluetooth................................................................. 28

6.5 RTC .......................................................................................... 29

6.6 Console and Debug Interfaces ................................................ 29

6.6.1 A35 Console and SCU Debug ................................................. 29

6.6.2 JTAG Debug ............................................................................ 30

7 Pinout Table and Signal Descriptions ...................................... 31

8 Software Documentation ......................................................... 32

List of Tables

Table 1 Commercial Variants ................................................................ 10

Table 2 Industrial Variants..................................................................... 10

Table 3 conga-SMX8-X Adapters ......................................................... 11

Table 4 Measurement Description........................................................ 15

Table 5 Power Consumption Values ..................................................... 15

Table 6 CMOS Battery Power Consumption ........................................ 16

Table 7 Cooling Solution Variants......................................................... 18

Table 8 Display Combination ............................................................... 21

Table 9 I2C Interfaces........................................................................... 23

Table 10 USB Combination .................................................................... 24

Table 11 A35 and SCU Connector (X2) Pinout Description.................... 29

Table 12 JTAG Debug Connector (X1) Pinout Description .................... 30

1 Introduction

1.1 SMARC®Concept

The Standardization Group for Embedded Technologies e.V (SGET) deﬁned the SMARC standard for small form factor computer modules

that target applications with low power, low cost and high performance. The SMARC connector and interfaces are optimized for high-speed

communication, and are suitable for ARM SoCs and low power x86 SoCs.

The SMARC standard bridges the gap between the COM Express standard and the Qseven standard by offering most of the interfaces deﬁned

in the COM Express speciﬁcation at a lower power. With a footprint of 82 mm x 50 mm or 82 mm x 80 mm, the SMARC standard promotes the

design of highly integrated, energy efﬁcient systems.

Due to its small size and lower power demands, PC appliance designers can design low cost devices as well as explore a huge variety of product

development options—from compact space-saving designs to fully functional systems. This solution allows scalability, product diversiﬁcation

and faster time to market.

1.2 conga-SMX8-X

The conga-SMX8-X is based on the SMARC 2.0 Speciﬁcation and features an NXP®i.MX 8QuadXPlus, 8DualXPlus, or 8DualX applications

processor. With a maximum power consumption of TBD W, the conga-SMX8-X is a low power module with high computing performance.

By offering most of the functional requirement for any SMARC application, the conga-SMX8-X provides manufacturers and developers with a

platform to jump-start the development of systems and applications based on SMARC speciﬁcation. Its features and capabilities make it an

ideal platform for designing compact, energy-efﬁcient, performance-oriented embedded systems.

1.2.1 Options Information

The conga-SMX8-X is available in six commercial and four industrial variants:

Table 1 Commercial Variants

PN 051100 051101 051102 051103 051104 051105

Processor i.MX 8QuadXPlus i.MX 8DualXPlus i.MX 8DualX i.MX 8QuadXPlus i.MX 8QuadXPlus i.MX 8QuadXPlus

Cortex®-A35 4x 1.2 GHz 2x 1.2 GHz 2x 1.2 GHz 4x 1.2 GHz 4x 1.2 GHz 4x 1.2 GHz

SDRAM 4 GB LPDDR4 @

1200 MHz (32 bit)

2 GB LPDDR4 @

1200 MHz (32 bit)

1 GB LPDDR4 @

1200 MHz (16 bit)

2 GB LPDDR4 @

1200 MHz (32 bit)

4 GB LPDDR4 @

1200 MHz (32 bit)

4 GB LPDDR4 @

1200 MHz (32 bit)

Ethernet 2x 1 Gigabit 2x 1 Gigabit 1x 1 Gigabit

1x 10/100 Mbps

2x 1 Gigabit 2x 1 Gigabit 2x 1 Gigabit

Wi-Fi/BT Assembly Option Assembly Option Assembly Option Assembly Option Yes Assembly Option

USB 1x USB 2.0 OTG

2x USB 2.0

2x USB 3.0

1x USB 2.0 OTG

2x USB 2.0

2x USB 3.0

1x USB 2.0 OTG

4x USB 2.0

1x USB 2.0 OTG

2x USB 2.0

2x USB 3.0

1x USB 2.0 OTG

1x USB 2.0

2x USB 3.0

1x USB 2.0 OTG

2x USB 2.0

2x USB 3.0

HDMI Assembly Option Assembly Option Assembly Option Assembly Option Assembly Option Yes

Audio 2x I²S (default) 2x I²S (default) 2x I²S (default) 2x I²S (default) 2x I²S (default) 1x I²S

Table 2 Industrial Variants

PN 051110 051111 051112 051113

Processor i.MX 8QuadXPlus i.MX 8DualXPlus i.MX 8DualX i.MX 8QuadXPlus

Cortex®-A35 4x 1.0 GHz 2x 1.0 GHz 2x 1.0 GHz 4x 1.0 GHz

SDRAM 4 GB LPDDR4 @

1200 MHz (32 bit)

2 GB LPDDR4 @

1200 MHz (32 bit)

1 GB LPDDR4 @

1200 MHz (16 bit)

2 GB LPDDR4 @

1200 MHz (32 bit)

Ethernet 2x 1 Gigabit 2x 1 Gigabit 1x 1 Gigabit

1x 10/100 Mbps

2x 1 Gigabit

Wi-Fi/BT Assembly Option Assembly Option Assembly Option Assembly Option

USB 1x USB 2.0 OTG

2x USB 2.0

2x USB 3.0

1x USB 2.0 OTG

2x USB 2.0

2x USB 3.0

1x USB 2.0 OTG

4x USB 2.0

1x USB 2.0 OTG

2x USB 2.0

2x USB 3.0

HDMI No No No No

Audio 2x I²S 2x I²S 2x I²S 2x I²S

1.2.2 Accessories

Table 3 conga-SMX8-X Adapters

PN 48000023

Product RS-232 adapter cable for conga-ARM modules

Description Adapter cable for ARM console. MOLEX PicoBlade 6 circuit to two D-SUB 9 connectors.

2 Speciﬁcations

2.1 Feature List

Form Factor SMARC®form factor speciﬁcation, revision 2.0 (82 mm x 50 mm)

SoC NXP®i.MX 8QuadXPlus, 8DualXPlus, or 8DualX

Memory 1, 2 or 4 GB onboard LPDDR4 memory @ 1200 MHz

Storage SPI NOR ﬂash memory with up to 256 Mbit (64 Mbit assembled by default)

eMMC™ 5.1 HS400 with up to 128 GB (16 GB assembled by default)

Audio Up to 2x I2S (only 1x I2S with HDMI)

Ethernet Up to 2x GbE with support for IEEE 1588 (i.MX 8DualX SoC only supports 10/100 Mbps on GBE1)

Display

Interfaces

Support for up to two independent displays:

2x Single channel LVDS/DSI or 1x Dual channel LVDS/DSI (default)

or 1x Single channel LVDS/DSI and 1x HDMI (assembly option for commercial variants only; default on PN: 051105)

Peripheral

Interfaces

1x MIPI CSI-2 with four lanes

1x SD/SDIO Card Interface

2x SPI

I²C

Up to 4x Serial Ports (SER3 instead of CAN1 via assembly option)

2x CAN with support for CAN FD (FlexCAN)

1x USB 2.0 OTG

Up to 2x USB 2.0 (Wi-Fi/BT instead of USB4 via assembly option)

Up to 2x USB 3.0/2.0 (i.MX 8DualX SoC only supports USB 2.0)

1x PCI Express x1 Gen3

12x GPIOs

1x Onboard JTAG Debug Connector (assembly option)

1x Onboard A35 Console and SCU Debug Connector1

1x Onboard Wi-Fi/BT M.2 1216 Module (assembly option; default on PN: 051104)

NOTE:

1 Requires RS-232 adapter cable PN: 48000023 (See Table 3).

Features Watchdog timer Onboard Discrete Real-Time Clock (RTC)

Bootloader U-Boot

Virtualization Multiple domains with hardware virtualization

Multiple Operating Systems

System MMU

Resource partitioning and split GPU

Security High Assurance Boot (HAB)

TrustZone®

Cryptographic Acceleration and Assurance Module (CAAM)

2.2 Supported Operating Systems

The conga-SMX8-X supports the following operating systems:

•Linux®(Yocto Project®)

•Android™

2.3 Mechanical Dimensions

•82.0 mm x 50.0 mm

The height of the module, heatspreader and stack is shown below:

Top Side Component

Carrier Board PCB

SMARC Module PCB

Heatspreader

Carrier Connector

Bottom Side Component

All dimensions are in millimeters

Height depends on the

connector height used

Height depends on the

connector height used

1.2

3.2

2.8

2.4 Standard Power

2.4.1 Supply Voltage

•4.75 V – 5.25 V

2.4.2 Electrical Characteristics

Characteristics Min. Typ. Max. Units Comment

5V Voltage ± 5% 4.75 5.00 5.25 Vdc

Ripple - - ± 50 mVPP 0-20 MHz

Current

2.4.3 Rise Time

The input voltages shall rise from 10 percent of nominal to 90 percent of nominal at a minimum slope of 250 V/s. The smooth turn-on requires

that, during the 10 percent to 90 percent portion of the rise time, the slope of the turn-on waveform must be positive.

Nominal Static Range

Dynamic Range

Absolute Minimum

Absolute Maximum5.25V

4.75V

5.05V

4.95V

2.5 Power Consumption

The power consumption values were measured with the following setup:

•Input voltage +5 V

•conga-SMX8-X

•conga-SEVA carrier board

•conga-SMX8-X cooling solution

The power consumption values were recorded during the following operating modes:

Table 4 Measurement Description

System State Description Comment

KS1 Standby mode For more information about the key states, refer to the Application Note “i.MX 8M Mini Power

Consumption Measurement” available on the NXP website www.nxp.com.

KS3 User idle mode

100% Workload 100% CPU workload The CPU was stressed to its maximum frequency.

Peak Power

Consumption

100% CPU workload at approximately

100°C peak power consumption

Consider this value when designing the system’s power supply to ensure that sufﬁcient power is

supplied during worst case scenarios.

Note

The peripherals did not inﬂuence the measured values because they were powered externally.

The table below provides the power consumption values of each conga-SMX8-X variant during different operating modes:

Table 5 Power Consumption Values

PN Memory

Size

Revision

U-Boot OS CPU Current (A) @ 5 V

KS1 KS3 100% Workload Peak Power Consumption

51100 4 GB TBD TBD TBD i.MX 8QuadXPlus TBD TBD TBD TBD

51101 2 GB TBD TBD TBD i.MX 8DualXPlus TBD TBD TBD TBD

51102 2 GB TBD TBD TBD i.MX 8DualX TBD TBD TBD TBD

51103 2 GB TBD TBD TBD i.MX 8QuadXPlus TBD TBD TBD TBD

51104 4 GB TBD TBD TBD i.MX 8QuadXPlus TBD TBD TBD TBD

51105 4 GB TBD TBD TBD i.MX 8QuadXPlus TBD TBD TBD TBD

51110 4 GB TBD TBD TBD i.MX 8QuadXPlus TBD TBD TBD TBD

51111 2 GB TBD TBD TBD i.MX 8DualXPlus TBD TBD TBD TBD

51112 2 GB TBD TBD TBD i.MX 8DualX TBD TBD TBD TBD

51113 2 GB TBD TBD TBD i.MX 8QuadXPlus TBD TBD TBD TBD

2.6 Supply Voltage Battery Power

Table 6 CMOS Battery Power Consumption

RTC @ Voltage Current

-10oC 3V DC TBD µA

20oC 3V DC TBD µA

70oC 3V DC TBD µA

Note

1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.

2. Measure the CMOS battery power consumption in your customer speciﬁc application in worst case conditions (for example, during high

temperature and high battery voltage).

3. Consider the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application

note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.

4. We recommend to always have a CMOS battery present when operating the conga-SMX8-X.

2.7 Environmental Speciﬁcations

Temperature (commercial variants) Operation: 0° to 60°C Storage: -40° to +85°C

Temperature (industrial variants) Operation: -40° to 85°C Storage: -40° to +85°C

Humidity Operation: 10% to 90% Storage: 5% to 95%

Caution

The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating

temperature refers to any measurable spot on the heatspreader’s surface.

Humidity speciﬁcations are for non-condensing conditions.

3 Block Diagram

NXP i.MX 8X

Applications Processor

USB_SS*¹

USB4*

SDIO*

conga-SMX8-X

SMARC 2.0

PCIE_A*

SER2*

PHY

JTAG*

DSI-HDMI

Bridge*

*²

* Assembly option

*¹ i.MX 8DualX SoC does not support USB 3.0.

*² HDMI by default on PN: 051105. Not available for industrial variants.

*³ i.MX 8DualX SoC only supports 10/100 Mbps on GBE1.

*4Wi-Fi/BT by default on PN: 051104 and USB4 therefore not available.

LPDDR4

SDRAM

eMMC 5.1

I2C Expander

A35 Console

SCU Debug

RS-232

Transceiver

GPIO[7:11]

SPI0

I2C

CAN0 (FlexCAN)

DP0

PCIE_[B:D]

SATA

CSI0

HDMI*

*²

LVDS1/DSI1

LVDS0/DSI0

PCIE_A (PCIe Gen3)

GBE1 (up to GbE)*³

GBE0 (GbE)

I2S0

SDIO

SER0 (4 wire)

SER3* (2 wire)

I2S2

CAN1 (FlexCAN)

+Vin

I2CPWR

PMIC

RTC

Wi-Fi/

Module*

GPIO[0:6]

USB Hub

USB1 (USB 2.0)

USB2 (USB 3.0/2.0)*¹

USB3 (USB 3.0/2.0)*¹

USB4 (USB 2.0)*⁴

USB0 (USB 2.0 OTG)

SER1 (2 wire)

SER2 (4 wire)

SPI1

SPI NOR

Flash Memory

CSI1 (4 lanes)

4 Cooling Solutions

congatec AG offers the following cooling solutions for the conga-SMX8-X variants. The dimensions of the cooling solutions are shown in the

sub-sections. All measurements are in millimeters.

Table 7 Cooling Solution Variants

Cooling Solution PN Description

CSP 051150 Passive cooling with 2.7 mm borehole standoffs.

HSP 051151 Heatspreader with 2.7 mm borehole standoffs.

Note

1. We recommend a maximum torque of 0.4 Nm for carrier board and module mounting screws.

2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental

conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap

pad material manufacturer’s speciﬁcation.

Caution

1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your

application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating

temperature of the module is maintained at all times. This may require additional cooling components for your ﬁnal application’s thermal

solution.

2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking ﬂuid on

the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-

threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.

3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with ﬁxing post. Without

the ﬁxing post feature, the thermal stacks may move.

4. Do not exceed the recommended maximum torque. Doing so may damage the module or the carrier board, or both.

4.1 CSP Dimensions

3.2

7 (2x)

4.2 (4x)

2.7 (2x)

R4 (4x)

0 4 78 82

21.4

33.6

8 7457.8

2.7 x 6 mm

non-threaded standoff

for borehole version

15°

2.8

10.8

1.5

A-A

1.6

0.2

4.2 HSP Dimensions

249

2.7 x 6 mm

non-threaded standoff

for borehole version

3.2

M3 (4x)

A-A (2 : 1)

1.6

0.2

0.1

0.2

2.8

21.4

57.9

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