Congatec COM Express conga-TCA5 User manual

Copyright © 2017 congatec AG TA50m10 1/72
COM Express™ conga-TCA5
COM Express Type 6 Compact module based on the Intel®Atom™, Pentium™and Celeron®Apollo Lake SoC
User's Guide
Revision 1.0

Copyright © 2017 congatec AG TA50m10 2/72
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2017.03.23 AEM •Preliminary release
1.0 2017.10.04 AEM •Removed Android from supported OS in section 2.2 "Supported Operating Systems"
•Updated security features in table 1 "Feature Summary" and section 6.5 "Security Features"
•Updated tables 5 "Power Consumption Values" and 6 "CMOS Battery Power Consumption"
•Updated section 4 "Block Diagram"
•Added content to sections 9 "System Resources", 10 "BIOS Description" and 11 "Additional BIOS Features"
•Official release

Copyright © 2017 congatec AG TA50m10 3/72
Preface
This user's guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TCA5. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™ Design Guide
COM Express™ Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user's guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user's guide or any other information contained herein and hereby expressly disclaims any
implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes no liability
for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for discrepancies
between the product and the user's guide. In no event shall congatec AG be liable for any incidental, consequential, special, or exemplary
damages, whether based on tort, contract or otherwise, arising out of or in connection with this user's guide or any other information contained
herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatec AG products near strong electrostatic, electromagnetic,
magnetic, or radioactive fields unless the device is contained within its original manufacturer's packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2017 congatec AG TA50m10 4/72
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2017, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user's guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

Copyright © 2017 congatec AG TA50m10 5/72
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner's license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec's option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec's direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
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Copyright © 2017 congatec AG TA50m10 6/72
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected].
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mbit Megabit
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
DDC Display Data Channel
SoC System On Chip
LVDS Low-Voltage Differential Signaling
Gbe Gigabit Ethernet
eMMC Embedded Multi-media Controller
HDA High Definition Audio
cBC congatec Board Controller
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2017 congatec AG TA50m10 7/72
Contents
1 Introduction ............................................................................. 10
1.1 COM Express™ Concept......................................................... 10
1.2 Options Information................................................................. 11
2 Specifications........................................................................... 13
2.1 Feature List .............................................................................. 13
2.2 Supported Operating Systems ................................................ 14
2.3 Mechanical Dimensions ........................................................... 15
2.4 Supply Voltage Standard Power .............................................. 15
2.4.1 Electrical Characteristics .......................................................... 16
2.4.2 Rise Time ................................................................................. 16
2.5 Power Consumption ................................................................ 16
2.6 Supply Voltage Battery Power ................................................. 18
2.7 Environmental Specifications................................................... 18
3 Block Diagram.......................................................................... 19
4 Cooling Solutions..................................................................... 20
4.1 CSP Dimensions....................................................................... 21
4.2 Heatspreader Dimensions........................................................ 23
5 Connector Rows....................................................................... 25
5.1 Primary Connector Rows A and B............................................ 25
5.1.1 PCI Express™........................................................................... 25
5.1.2 Gigabit Ethernet ..................................................................... 25
5.1.3 SATA ........................................................................................ 26
5.1.4 USB 2.0 .................................................................................... 26
5.1.5 LVDS......................................................................................... 26
5.1.6 VGA.......................................................................................... 27
5.1.7 High Definition Audio (HDA) Interface .................................... 27
5.1.8 UART........................................................................................ 27
5.1.9 ExpressCard™ ......................................................................... 27
5.1.10 SD Card ................................................................................... 27
5.1.11 GPIOs....................................................................................... 28
5.1.12 LPC Bus.................................................................................... 28
5.1.13 I²C Bus ..................................................................................... 28
5.1.14 SPI............................................................................................ 28
5.1.15 Power Control .......................................................................... 28
5.1.16 Power Management................................................................. 30
5.2 Secondary Connector Rows C and D....................................... 31
5.2.1 USB 3.0 .................................................................................... 31
5.2.2 Digital Display Interface........................................................... 31
5.2.2.1 HDMI........................................................................................ 32
5.2.2.2 DVI ........................................................................................... 32
5.2.2.3 DisplayPort (DP) ....................................................................... 32
6 Additional Features.................................................................. 33
6.1 Onboard Interfaces.................................................................. 33
6.1.1 Optional eMMC 5.0................................................................. 33
6.1.2 Low Voltage Memory (DDR3L)................................................. 33
6.1.3 congatec Board Controller (cBC) ............................................. 33
6.1.3.1 Board Information.................................................................... 33
6.1.3.2 General Purpose Input/Output................................................ 33
6.1.3.3 Fan Control .............................................................................. 34
6.1.3.4 Power Loss Control.................................................................. 34
6.1.3.5 Watchdog ................................................................................ 34
6.1.3.6 I2C Bus...................................................................................... 34
6.2 OEM BIOS Customization........................................................ 35
6.2.1 OEM Default Settings .............................................................. 35
6.2.2 OEM Boot Logo....................................................................... 35
6.2.3 OEM POST Logo ..................................................................... 35
6.2.4 OEM BIOS Code/Data............................................................. 36
6.2.5 OEM DXE Driver...................................................................... 36
6.3 congatec Battery Management Interface ................................ 36
6.4 API Support (CGOS) ................................................................ 37
6.5 Security Features...................................................................... 37
6.6 Suspend to Ram....................................................................... 37
7 conga Tech Notes .................................................................... 38
7.1 Intel®Apollo Lake SoC Features.............................................. 38
7.1.1 Processor Core......................................................................... 38

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7.1.1.1 Intel Virtualization Technology................................................. 38
7.1.1.2 AHCI ........................................................................................ 39
7.1.1.3 Thermal Management ............................................................. 39
7.2 ACPI Suspend Modes and Resume Events.............................. 40
7.3 USB Port Mapping ................................................................... 41
8 Signal Descriptions and Pinout Tables..................................... 42
8.1 A-B Connector Signal Descriptions ......................................... 43
8.2 A-B Connector Pinout.............................................................. 53
8.3 C-D Connector Signal Descriptions......................................... 55
8.4 C-D Connector Pinout ............................................................. 64
9 System Resources .................................................................... 66
9.1 I/O Address Assignment.......................................................... 66
9.1.1 LPC Bus.................................................................................... 66
9.2 PCI Configuration Space Map ................................................. 67
9.3 I²C Bus ..................................................................................... 68
9.4 SM Bus..................................................................................... 68
9.5 congatec System Sensors ........................................................ 69
10 BIOS Setup Description ........................................................... 70
10.1 Navigating the BIOS Setup Menu ........................................... 70
10.2 BIOS Versions........................................................................... 70
10.3 Updating the BIOS................................................................... 70
10.4 Supported Flash Devices ......................................................... 71
11 Industry Specifications ............................................................. 72

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List of Tables
Table 1 Feature Summary..................................................................... 13
Table 2 Display Combination ............................................................... 31
Table 3 Signal Tables Terminology Descriptions .................................. 42
Table 4 Intel®High Definition Audio Link Signals Descriptions............ 43
Table 5 Gigabit Ethernet Signal Descriptions....................................... 43
Table 6 Serial ATA Signal Descriptions ................................................. 44
Table 7 PCI Express Signal Descriptions (general purpose) ................. 45
Table 8 ExpressCard Support Pins Descriptions................................... 46
Table 9 LPC Signal Descriptions........................................................... 46
Table 10 USB Signal Descriptions........................................................... 46
Table 11 CRT Signal Descriptions........................................................... 47
Table 12 LVDS Signal Descriptions ......................................................... 48
Table 13 SPI BIOS Flash Interface Signal Descriptions........................... 49
Table 14 Miscellaneous Signal Descriptions........................................... 49
Table 15 General Purpose I/O Signal Descriptions ................................ 50
Table 16 Power and System Management Signal Descriptions ............. 50
Table 17 General Purpose Serial Interface Signal Descriptions ............. 51
Table 18 Power and GND Signal Descriptions....................................... 52
Table 19 Connector A-B Pinout.............................................................. 53
Table 20 PCI Express Signal Descriptions (general purpose) ................. 55
Table 21 USB Signal Descriptions........................................................... 55
Table 22 PCI Express Signal Descriptions (x16 Graphics)....................... 56
Table 23 DDI Signal Description............................................................. 58
Table 24 HDMI Signal Descriptions........................................................ 60
Table 25 DisplayPort (DP) Signal Descriptions ....................................... 61
Table 26 Module Type Definition Signal Description ............................. 63
Table 27 Power and GND Signal Descriptions....................................... 63
Table 28 Connector C-D Pinout ............................................................. 64

Copyright © 2017 congatec AG TA50m10 10/72
1 Introduction
1.1 COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84mm x 55mm
•Compact 95mm x 95mm
•Basic 125mm x 95mm
•Extended 155mm x110mm
Table 1 COM Express™ 2.1 pinout types
Types Connector Rows PCIe Lanes PCI IDE SATA Ports LAN ports USB 2.0/ USB 3.0 Display Interfaces
Type 1 A-B Up to 6 - 4 1 8 / 0 VGA, LVDS
Type 2 A-B C-D Up to 22 32 bit 1 4 1 8 / 0 VGA, LVDS, PEG/SDVO
Type 3 A-B C-D Up to 22 32 bit - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 4 A-B C-D Up to 32 1 4 1 8 / 0 VGA,LVDS, PEG/SDVO
Type 5 A-B C-D Up to 32 - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 6 A-B C-D Up to 24 - 4 1 8 / 4* VGA,LVDS/eDP, PEG, 3x DDI
Type 10 A-B Up to 4 - 2 1 8 / 0 LVDS/eDP, 1xDDI
* The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Up to 4 of the USB 2.0 ports can support SuperSpeed USB.
The conga-TCA5 modules use the Type 6 pinout definition and comply with COM Express 2.1 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.

Copyright © 2017 congatec AG TA50m10 11/72
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
1.2 Options Information
The conga-TCA5 is available in six variants (two commercial and four industrial). The table below shows the different configurations available.
Check for the Part No. that applies to your product. This will tell you what options described in this user's guide are available on your particular
module.
Table 2 Commercial Variants
Part-No. 048530 048531
Processor Intel®Celeron®N3350
Dual Core 1.1 GHz
Intel®Pentium®N4200
Quad Core, 1.1 GHz
L2 Cache 2 MB 2 MB
Burst Frequency 2.3 GHz 2.5 GHz
Graphics Intel®HD Graphics 500 Intel®HD Graphics 505
GFX Base/Burst 200 MHz / 650 MHz 200 MHz / 750 MHz
Memory (DDR3L) 1866 M/T Dual Channel 1866 M/T Dual Channel
LVDS Single/Dual 18/24 bpp Single/Dual 18/24 bpp
Optional VGA Yes Yes
Default PCIe Lanes 3x PCIe lanes 3x PCIe lanes
DDI DP 1.2 / HDMI 1.4b / DVI DP 1.2 / HDMI 1.4b / DVI
eMMC (SLC/MLC) Up to 32 GB MLC (optional) Up to 32 GB MLC (optional)
SD Card Yes Yes
Max. TDP 6 W 6 W

Copyright © 2017 congatec AG TA50m10 12/72
Table 3 Industrial Variants
Part-No. 048510 048511 048512 048513 (with PCIe Switch)
Processor Intel®Atom™ x7-E3950
Quad Core, 1.6GHz
Intel®Atom™ x5-E3940
Quad Core, 1.6GHz
Intel®Atom™ x5-E3930
Dual Core, 1.3GHz
Intel®Atom™ x7-E3950
Quad Core, 1.6GHz
L2 Cache 2 MB 2MB 2MB 2 MB
Burst Frequency 2.0 GHz 1.8 GHz 1.8 GHz 2.0 GHz
Graphics Intel®HD Graphics 505 Intel®HD Graphics 500 Intel®HD Graphics 500 Intel®HD Graphics 505
GFX Base/Burst 500 MHz / 650 Mhz 400 MHz / 600 MHz 400 MHz / 550 MHz 500 MHz / 650 Mhz
Memory (DDR3L) 1866 M/T Dual Channel 1866 M/T Dual Channel 1866 M/T Dual Channel 1600MT/s dual channel
LVDS Single/Dual 18/24 bpp Single/Dual 18/24 bpp Single/Dual 18/24 bpp Single/Dual 18/24 bpp
Optional VGA Yes Yes Yes Yes
Default PCIe Lanes 3x PCIe lanes 3x PCIe lanes 3x PCIe lanes 5x PCIe lanes
DDI DP 1.2 / HDMI 1.4b / DVI DP 1.2 / HDMI 1.4b / DVI DP 1.2 / HDMI 1.4b / DVI DP 1.2 / HDMI 1.4b / DVI
eMMC (SLC/MLC) Up to 32 GB MLC (optional) Up to 32 GB MLC (optional) Up to 32 GB MLC (optional) Up to 32 GB MLC (optional)
SD Card Yes Yes Yes Yes
Max. TDP 12 W 9 W 6.5 W 12 W

Copyright © 2017 congatec AG TA50m10 13/72
2 Specifications
2.1 Feature List
Table 1 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Compact size 95 x 95 mm)
Processor Intel®Atom™, Pentium®and Celeron SoC
Memory Two memory sockets (located on the top and bottom side). Supports
-SO-DIMM non-ECC DDR3L modules
-Data rates up to 1866 MT/s
-Maximum 8 GB capacity
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I2C bus,
Power loss control
Chipset Integrated in SoC
Audio High Definition Audio interface with support for multiple codecs
Ethernet Gigabit Ethernet (Intel®i210-IT / i211-AT controller)
Graphics
Options
Next Generation Intel® HD (500/505). Supports:
-API (DirectX 12, OpenGL 4.3, OpenCL 2.0, OpenGL ES 3.0)
-Intel®QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-Up to 3 independent displays (must be two DDI’s (DP, HDMI/DVI) and one eDP/LVDS)
1x LVDS *1
2x DDIs *2 with support for:
-2x DisplayPort++ (DisplayPort 1.2a)
-2x HDMI 1.4b*3
-2x DVI port *3
-Resolutions up to 4K
Optional Interface (assembly option):
-1x eDP 1.3 *1
-1x VGA *2
NOTE:
*1 Variants that feature optional eDP interface do not support LVDS
*2 Variants that feature optional VGA interface support only 1x DDI
*3 Requires an external level shifter on the carrier board
Peripheral
Interfaces
USB Interfaces:
-4x USB 2.0
-4x USB 3.0/2.0
Buses
-LPC
-I²C (fast mode, multi-master)
-SMB
-SPI
2x SATA®(6 Gbps)
2x UART
GPIOs
3x PCI Express®Gen. 3 lanes *1 *2
NOTE:
*1 5x PCIe lanes for variants that feature PCIe switch
*2 4x PCIe lanes for variants without Gigabit Ethernet controller and PCIe
switch
BIOS AMI Aptio®UEFI 5.x firmware, 8 or 16 MByte serial SPI with congatec Embedded BIOS features
Storage Optional eMMC 5.0 onboard flash, with up to 32 GB storage capacity

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Power
Management
ACPI 4.0 compliant with battery support. Also supports Suspend to RAM (S3) and Intel AMT 10
Configurable TDP
Ultra low standby power consumption, Deep Sx
Security Firmware TPM 2.0 (Intel®PTT)
Discrete LPC TPM 2.0 (Infineon SLB9665) or LPC TPM 1.2 (Infineon SLB9660) support via assembly option
Note
Some of the features mentioned above are optional (assembly option). To determine the features on your particular module, compare the part
number of your module to the options information list on page 11 and 12. For more information, contact congatec support.
2.2 Supported Operating Systems
The conga-TCA5 supports the following operating systems
•Microsoft®Windows® 10
•Microsoft®Windows®8.1
•Microsoft®Windows®7
•Microsoft®Windows®Embedded Compact 2013
•Linux
Note
Intel does not currently provide validated eMMC and SD drivers for Windows 7.
Microsoft®recommends a minimum storage capacity of 16 GB for Windows 32-bit OS and 20 GB for 64-bit OS. congatec does not offer
installation support for systems which do not meet the recommended storage capacity.

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2.3 Mechanical Dimensions
•95.0 mm x 95.0 mm (3.75” x 3.75”)
•Height approximately 18 or 21mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm (height)
carrier board connector is used then approximate overall height is 18mm. If the 8mm (height) carrier board connector is used then approximate
overall height is 21mm
2.4 Supply Voltage Standard Power
•12V DC ± 5%
The dynamic range shall not exceed the static range.
4.00
Heatspreader
Module PCB
Carrier Board PCB
7.00
5.00 1.60
4.50
13.00
18.00
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

Copyright © 2017 congatec AG TA50m10 16/72
2.4.1 Electrical Characteristics
Power supply pins on the module's connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin
Current Capability
(Amps)
Nominal
Input (Volts)
Input
Range
(Volts)
Derated
Input (Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
2.5 Power Consumption
The power consumption values were measured with the following setup:
•conga-TCA5 COM
•modified congatec carrier board
•conga-TCA5 cooling solution
•Microsoft Windows 10 (64 bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool

Copyright © 2017 congatec AG TA50m10 17/72
Table 4 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle.
The CPU was stressed to its maximum frequency.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak value Highest current spike during the measurement of “S0: Maximum
value”. This state shows the peak value during runtime
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios.
S3 COM is powered by VCC_5V_SBY.
S5 COM is powered by VCC_5V_SBY.
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.
Table 5 Power Consumption Values
The tables below provide additional information about the power consumption data for each of the conga-TCA5 variants offered. The values
are recorded at various operating modes.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64 bit)
CPU Current (Amp.)
Variant Cores Freq/Turbo
(GHz)
S0:
Min
S0:
Max
S0:
Peak
S3 S5
048510 2 x 4 GB A.1 R117 Windows 10 Intel®Atom™ x7-E3950 4 1.6 / 2.0 0.14 1.66 1.85 0.07 0.06
048511 2 x 4 GB TBD TBD Windows 10 Intel®Atom™ x5-E3940 4 1.6 / 1.8 0.16 1.34 1.44 0.12 0.10
048512 2 x 4 GB A.0 R117 Windows 10 Intel®Atom™ x5-E3930 2 1.3 / 1.8 0.11 0.97 1.02 0.12 0.10
048513 2 x 4 GB TBD TBD Windows 10 Intel®Atom™ x7-E3950
(with PCIe Switch)
4 1.6 / 2.0 0.23 1.75 1.92 0.12 0.11
048530 2 x 4 GB A.0 R117 Windows 10 Intel®Celeron™ N3350 2 1.1 / 2.3 0.12 1.05 1.53 0.08 0.06
048531 2 x 4 GB A.0 R117 Windows 10 Intel®Pentium® N4200 4 1.1 / 2.5 0.12 1.04 1.85 0.11 0.10
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.

Copyright © 2017 congatec AG TA50m10 18/72
2.6 Supply Voltage Battery Power
Table 6 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 2.17 µA
20oC 3V DC 2.37 µA
70oC 3V DC 3.37 µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-TCA5.
2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +80°C
Temperature (industrial variants) Operation: -40° to 60°C Storage: -45° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times.
Humidity specifications are for non-condensing conditions.

Copyright © 2017 congatec AG TA50m10 19/72
3 Block Diagram
stuffing option
stuffing option
stuffing option
stuffing option
stuffing option
SO-DIMM
DDR 3L
3rd Gen congatec
System Management
Controller
(Watchdog, EEProm...)
AB Connector
Type 6
COM Express 2.1
eDP to
LVDS
PCIe Switch *
2
PCIe GBE
FWH
MUX
LPC to UART *
1
TPM *
1
HDA I/F
SATA Port 0
SATA Port 1
SATA Port 2
SATA Port 3
SM Bus
SPI
UART1
UART0
LPC Bus
I2C Bus
GPIOs
LID# / SLEEP#
FAN control
Ethernet
VGA
USB Port 0..7
LCD I/ F (LVDS)
DDI1
DDI2
eDP
Dual Channel
DDR3L 1864 MT/s
eMMC 5.0
*
1
Not available by default (assembly option)
*
2
Available only on product variant with PN: 048513
Note:
Feature
connector *
1
eMMC
flash *
1
MIPI CSI
SuperSpeed 0
SuperSpeed 1
SuperSpeed 2
SuperSpeed 3
PCIe0 x1
PCIe1 x1
PCIe2 x1
PCIe3 x1
8x USB 2.0
HDA
SATA0
SATA1
SM Bus
SPI
UART
UART
SD-Card
GPIOs
I2C
LID# / SLEEP#
FAN
LPC
LVDS
PCIe Port 3
PCIe Port 4
PCIe Port 5
PCIe Port 2
PCIe Port 1
PCIe Port 0
CD Connector
Type 6
COM Express 2.1
DDI0
DDI1
DDI2
USB 3.0 Port 0
USB 3.0 Port 1
USB 3.0 Port 2
USB 3.0 Port 3
PEG x16
PCIe Port 7
PCIe Port 6
DDI to VGA *
1
Intel
®
ApolloLake Soc
CPU Platform
Integrated Intel
®
HD Graphics Gen 8
Hardware Graphics Accelerators
3D
Intel
®
64
EIST
AES-NI
XD
2D
Gfx with Burst Technology
H.265/HEVC
HDCP 1.4 (wired)
HDA
Video Codecs
OpenCL 2.0
OpenGL 4.3
Audio Interface
Display Interface
HDMI
PCIe
SATA
SPI MIPI SDIO
eMMCUSB 2.0 USB 3.0
eDPDisplayPort
I/O Interfaces
HDCP 2.0 (wireless)
HEVC
VP9
PAVP 2.0
DirectX 12
OpenGLES 3.0

Copyright © 2017 congatec AG TA50m10 20/72
4 Cooling Solutions
congatec AG offers the following cooling solutions for the conga-TCA5 commercial and industrial variants:
•Passive cooling solution (CSP)
•Heatspreader
The heatspreader acts as a thermal coupling device to the module and is thermally coupled to the CPU via a thermal gap filler. On some
modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers.
Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered
as a heatsink. It has been designed as a thermal interface between the module and the application specific thermal solution. The application
specific thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal solutions
may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat dissipater.
The dimensions of the cooling solutions are shown below. All measurements are in millimeters. The mechanical system assembly mounting
shall follow the valid DIN/ISO specifications. The recommended maximum torque specification for all screws is 0.3 Nm.
Note
The gap pad material used on all congatec heatspreaders contains silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.
Caution
The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on the
screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-threading,
use non-threaded carrier board standoffs to mount threaded cooling solutions.
For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without the
fixing post feature, the thermal stacks may move.
Also, do not exceed the maximum torque specified for the screws. Doing so may damage the module or/and the carrier board.